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3177results about How to "Reduce thermal stress" patented technology

Honeycomb filter for exhaust gas decontamination, adhesive, coating material and process for producing honeycomb filter for exhaust gas decontamination

An object of the present invention is to provide a honeycomb filter for purifying exhaust gases which makes it possible to alleviate a thermal stress generated due to occurrence of a local temperature change and which is less likely to generate cracks and superior in strength and durability, an adhesive that has a low thermal capacity and is capable of alleviating the thermal stress, a coating material that has a low thermal capacity with a superior heat insulating property and is capable of alleviating the thermal stress, and a manufacturing method of the honeycomb filter for purifying exhaust gases that can improve precision in the outside dimension, and reduce damages in the manufacturing processes.
The present invention relates to a honeycomb filter for purifying exhaust gases, having a structure in that a plurality of column-shaped porous ceramic members, each having a number of through holes that are placed side by side in the length direction with partition wall interposed therebetween, are combined with one another through adhesive layers so that the partition wall that separate the through holes are allowed to function as a filter for collecting particulates, and in this structure, the thermal expansion coefficient αL of the adhesive layer and the thermal expansion coefficient αF of the porous ceramic member are designed to have the following relationship:
0.01<|αL−αF|/αF<1.0.
Owner:IBIDEN CO LTD

Honeycomb filter for purifying exhaust gases, adhesive, coating material, and manufacturing method of honeycomb filter for purifying exhaust gases

An object of the present invention is to provide a honeycomb filter for purifying exhaust gases which makes it possible to alleviate a thermal stress generated due to occurrence of a local temperature change and which is less likely to generate cracks and superior in strength and durability, an adhesive that has a low thermal capacity and is capable of alleviating the thermal stress, a coating material that has a low thermal capacity with a superior heat insulating property and is capable of alleviating the thermal stress, and a manufacturing method of the honeycomb filter for purifying exhaust gases that can improve precision in the outside dimension, and reduce damages in the manufacturing processes.The present invention relates to a honeycomb filter for purifying exhaust gases, having a structure in that a plurality of column-shaped porous ceramic members, each having a number of through holes that are placed side by side in the length direction with partition wall interposed therebetween, are combined with one another through adhesive layers so that the partition wall that separate the through holes are allowed to function as a filter for collecting particulates, and in this structure, the thermal expansion coefficient αL of the adhesive layer and the thermal expansion coefficient αF of the porous ceramic member are designed to have the following relationship:0.01<|αL−αF| / αF<1.0.
Owner:IBIDEN CO LTD

Pressure wave generator and process for manufacturing the same

Even when compression stress is generated because a volume of a thermal insulation layer 2 is expanded due to oxidized by oxygen in the air, occurrence of cracks and fractures of the thermal insulation layer and a heating conductor 3 caused by the cracks are prevented by dispersing the compression stress. A pressure wave generator comprises a substrate 1, the thermal insulation layer 2 of porous material which is formed on a surface of the substrate 1 in thickness direction, and the heating conductor 3 of thin film formed on the thermal insulation layer 2, and generates pressure waves by heat exchange between the heating conductor 3 and a medium. When a thickness at the center of the thermal insulation layer 2 in width direction W is used as a reference thickness, and it is assumed that distribution of thickness of thermal insulation layer in the width direction is averaged with the reference thickness, porosity in an outer peripheral portion of the thermal insulation layer is made smaller than porosity in the center portion. By making the porosity in the outer peripheral portion of the thermal insulation layer 2 smaller, a number of immovable points on the outer periphery of the thermal insulation layer 2 restricted by the substrate 1 is increased and the positions of them are dispersed, so that the compression stress compressed in the outer peripheral portion of the thermal insulation layer 2 can be dispersed.
Owner:MATSUSHITA ELECTRIC WORKS LTD

System for utilizing solar step developing heat

The invention relates to a cascade-developed heat utilization system of solar energy, which adopts that: in a low temperature section, a complex parabolic condenser is matched with a normal temperature receiver and the normal temperature receiver is output to an intermediate temperature section; in the intermediate temperature section, a parabolic trench-typed condenser is matched with an intermediate temperature receiver which is output to a high temperature section through a gas-water separator; in the high temperature section, a disk-typed condenser is matched with a high-temperature receiver which is output to a steam turbine. The cascade-developed heat utilization system of solar energy of the invention solves the defects that disk type is too expensive in manufacturing, and the trench type incurs the conflict between the reliability and the efficiency at high temperature, and the like. The effects of the cascade-developed heat utilization system of solar energy of the invention lie in that: the low temperature section adopts the complex parabolic condenser, the intermediate temperature section adopts the parabolic trench-typed condenser and the high temperature section adopts the parabolic disk-typed condenser; the three heat collecting sections are connected in series and respective advantages thereof are utilized while respective defects thereof are avoided; the three heat collecting sections are led to be combined dynamically to produce synergistic effects.
Owner:NANJING UNIV OF TECH

Polyceramic e-chuck

The present invention discloses an electrostatic chuck for clamping work substrates, said chuck comprising three layers, where the dielectric constant of included non-conductive layers is selected to provide overall lower capacitance to the chuck. In the chuck assembly of the present invention, the top dielectric layer that is in contact with a substrate, such as, for example, a wafer, has a dielectric constant that is preferably greater than about 5, with a resistivity that is preferably greater than about 1E6 ohm.m, whereas the bottom dielectric layer has a dielectric constant that is preferably less than about 5 and a resistivity that is preferably greater than about 1E10 ohm.m. The intermediate layer preferably has a conductive layer where the resistivity is less than about 1 ohm.m. The electrostatic chuck may be bonded to heat sinks coated with anti-arc dielectrics. The heat sink can also be used as an RF electrode. The heat sink may have provisions for coolants and gas channels to feed a cooling gas to the backside of a wafer. The heat sink may have feed thrus to power the segmented electrodes in the electrostatic chuck. The passages for the feed thrus, gas feed holes and lift pins may be lined with ceramics or polymers to prevent any discharge to the heat sink. The electrostatic chuck is for clamping work substrates like Si, GaAs, SiO2, etc. used in semiconductor tools.
Owner:FM INDS
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