167results about How to "Reduce thermal stress" patented technology

The application discloses a kind of carbon ceramic brake pad for grinding carbon ceramic brake disc, belong to brake pad technical field, solve the poor heat dissipation performance of existing ceramic brake pad, insufficient connection strength, leading to the problem of poor friction performance, it includes carbon ceramic lining plate and the carbon ceramic friction surface installed on carbon ceramic lining plate, multiple mortise grooves are set on the upper surface of carbon ceramic lining plate, multiple tenon heads matched with mortise groove are set on the lower surface of carbon ceramic friction surface, tenon head is embedded into mortise groove and forms mortise and tenon structure, connects carbon ceramic lining plate and carbon ceramic friction surface, ear plate is set on the circumference of carbon ceramic lining plate, and mounting hole is formed in ear plate;In the application, the friction coefficient is adjusted by designing ceramic phase composition and density of carbon ceramic friction surface and carbon ceramic lining plate, and carbon ceramic lining plate and carbon ceramic friction surface are connected by RMI process and mortise and tenon structure to improve the mechanical properties of connecting place, ensure braking safety, reduce thermal stress generated in braking process, so as to improve the friction performance, effectively guarantee braking effect, and prolong service life.

This invention provides an unmanned aerial vehicle (UAV) image transmission system and image transmission method. The system includes: a radio frequency (RF) transceiver, a balanced amplifier circuit, a low-noise amplifier, and an RF switch. The balanced amplifier circuit includes at least two parallel power amplifiers configured to superimpose the amplified signals from each power amplifier in phase to synthesize the output power. The RF transceiver generates a time-division duplex control signal to synchronously control the switching of each component between transmit and receive modes. By employing a balanced amplifier circuit, this invention enables each power amplifier to operate in a region with better linearity, thereby improving transmit power while ensuring the signal quality required for high-order modulation, thus balancing long-distance transmission and high-definition image quality.

The utility model relates to a kind of MEMS accelerometer, including substrate and multiple sensitive structures being set on the substrate, multiple the sensitive structure is connected by elastic coupling beam structure each other between, each the sensitive structure includes mass and the sensitive capacitor being set on the mass, the mass of adjacent two the sensitive structure is connected by the elastic coupling beam structure each other.The MEMS accelerometer provided by the utility model solves the problem that the existing MEMS accelerometer improves sensitivity and signal-to-noise ratio and leads to the problem of large spring beam thermal stress.

The application provides a high-hypersonic wind tunnel piece water-cooled hinge torque balance measurement system and belongs to the technical field of wind tunnel test measurement.The application aims to solve the problem that the rudder surface is difficult to be externally cooled due to thin structure and the hinge torque is difficult to be measured in the prior art.The aircraft fuselage is connected with the aircraft wing and the piece water-cooled hinge torque balance in the application.The top and bottom of the piece water-cooled hinge torque balance are respectively provided with a balance upper cover plate and a balance lower cover plate.The upper end surface of the balance lower cover plate is flush with the aircraft fuselage.The balance free end, the balance measurement element and the fuselage mounting base of the piece water-cooled hinge torque balance are sequentially connected.The balance free end is connected with the measured rudder surface through an angle ear.The balance measurement element is pasted with a strain gauge, and the balance measurement element is internally provided with a water-cooled groove circuit.The application solves the problem that the measurement precision is greatly reduced due to high temperature in the high-hypersonic wind tunnel test, and the rudder surface is difficult to be externally cooled due to thin structure and the hinge torque is difficult to be measured.

The invention relates to the technical field of metal heat treatment, in particular to a high-temperature alloy strip automatic switching water-cooling annealing device and an annealing method thereof.The high-temperature alloy strip automatic switching water-cooling annealing device comprises a main body frame, a sliding seat is slidably arranged on the main body frame, a mounting seat and an adjusting seat are slidably arranged on the sliding seat, the mounting seat is fixed to the sliding seat, and the adjusting seat is slidably arranged on the sliding seat; a bearing table used for containing strips is arranged on the mounting base, a spring is connected between the mounting base and the spring, two lead screws are rotationally arranged on the main body frame, the lead screws penetrate through the sliding base, the mounting base and the adjusting base and are in threaded connection with the adjusting base, a top frame is arranged on the main body frame, and a water supply pipe is arranged on the main body frame. The single driving source is used for sequentially and automatically completing strip conveying positioning and gradual flow adjustment from small to large, shock cooling is effectively avoided, the annealing quality and uniformity are improved, the structure is compact, the automation degree is high, and operation is easy and convenient.

This invention relates to transition layer materials and welding processes for welding dissimilar steel and aluminum materials, belonging to the field of welding technology. The transition layer material for welding dissimilar steel and aluminum materials of this invention comprises a copper layer, a copper alloy layer, and a zinc alloy layer arranged sequentially; the copper layer is adjacent to the steel base material, and the zinc alloy layer is adjacent to the aluminum base material; the copper content in the copper alloy layer is 62.0%-64.0%; the zinc content in the zinc alloy layer is 89.0%-91.0%; the mass ratio of the copper layer, copper alloy layer, and zinc alloy layer is (0.9-1.1):(2.3-2.7):(1.8-2.2). By sequentially setting the copper layer, copper alloy layer, and zinc alloy layer between the steel base material and the aluminum base material, a gradual transition from the steel base material to the aluminum base material is achieved, effectively avoiding the formation of brittle Fe-Al intermetallic compounds during direct welding, and enhancing the mechanical properties and durability of the welded joint.

The utility model relates to long water gap related technical field especially relates to a glaze anti -crack type long water gap, the inside of long water gap ladle end, long water gap middle transition section and long water gap tundish end all is equipped with buffer composite component, the inner wall of long water gap ladle end, long water gap middle transition section and long water gap tundish end is provided with anchor assembly. The utility model discloses through the setting of buffer composite component, through the gradient change's honeycomb hole and hole, the nanometer heat conduction coating of dynamic adjustment heat conduction efficiency, realizes thermal stress dispersion and temperature regulation, and buffer composite component cooperates anchor assembly and anchors gradually complementary, and the destruction of heat stress to glaze layer is reduced to heat dissipation and buffer structure, and the anchor structure guarantees that glaze layer does not fall off under certain thermal stress and external force effect, and the anti -crack of long water gap glaze is realized together, and the overall performance and service life of long water gap are improved.

The invention relates to the technical field of shredding machine cutter machining, and discloses a forming machine tool for a shredding machine tooth-shaped blade, which comprises a machine tool main body, the machine tool main body comprises a forming mechanism, the forming mechanism comprises a controller, a laser cutting head is arranged above the machine tool main body, and a laser generator is fixedly mounted on the outer surface of the machine tool main body. The laser cutting head is electrically connected with the laser generator through a wire, and an isolation assembly is arranged in the machine tool body. According to the forming machine tool for the tooth-shaped blade of the shredding machine, through the arrangement of the isolation assembly, the device moves along with a laser cutting head through the arrangement of an isolation cover, so that a sealed environment is provided for blade cutting, external oxygen is isolated, meanwhile, nitrogen is sprayed to the cutting position through a spray head through an air pump, and the cutting efficiency is improved. Therefore, outside oxygen is further isolated through inert gas, formation of an oxide layer is avoided, the phenomenon that the oxide layer falls off when the blade is used is avoided, and the service life of the blade is guaranteed.

This invention discloses a solid oxide fuel cell system, including a burner, a heat exchanger, and multiple power generation stacks. The heat exchanger is a vertically arranged annular component, and the power generation stacks are solid oxide fuel cell stacks. The burner is located in the middle of the heat exchanger annulus. Multiple power generation stacks are spaced apart along the annulus between the burner and the heat exchanger. Each power generation stack has an air inlet, an air outlet, a fuel inlet, and a fuel outlet. The burner has an air inlet, a fuel inlet, and an exhaust gas outlet. Multiple air outlets are connected to the air inlet, and multiple fuel outlets are connected to the fuel inlet. The heat exchanger has at least three heat exchange channels, and the exhaust gas outlet, multiple air inlets, and multiple fuel inlets are each connected to at least one heat exchange channel. The heat exchanger is used to preheat the air and fuel separately using the waste heat of the exhaust gas. By arranging multiple power generation stacks between the heat exchanger and the burner, the internal and external parts of the power generation stacks can be heated synchronously with a small internal temperature difference.

The utility model discloses a PTC heater structure, including a plurality of PTC heating tube, a plurality of radiating fins and mounting seat, a plurality of PTC heating tube installation is positioned on mounting seat, and a plurality of radiating fins interval arrangement sets up on PTC heating tube, still be provided with corrugated elastic metal sheet between a plurality of radiating fins and mounting seat, the corrugated elastic metal sheet is nickel base alloy material quality, a plurality of radiating fins and mounting seat are all aluminum material quality, the contact surface of a plurality of radiating fins is close to PTC heating tube and has coated nano alumina heat conduction coating, like this, through the elastic deformation absorption vibration energy, and gradient thermal expansion design, reduce the thermal stress, reduce the mechanical stress between mounting seat and fin aluminum pipe, prevent the connection loose after long -term use.

The application discloses a kind of TGV glass substrate processing equipment and processing method, the TGV glass substrate processing method is, preheating is carried out to the point to be punched before punching, so that the temperature of the point to be processed and surrounding area is increased to form preheating zone, preheating can make the local temperature of glass substrate more uniform, so that when punching, the heat applied by laser cutting is not easy to cause sharp temperature difference, thereby effectively reducing the thermal stress generated in the material, and then eliminating or reducing the occurrence of crack or rough surface condition;The TGV glass substrate processing equipment is connected by the light path of cutting head and preheating head, and the laser beam of cutting head is partially reflected into the preheating head by the beam splitter, so that punching of glass substrate and preheating of the next processing point are carried out at the same time, which saves the processing time of glass substrate.

This invention relates to the field of polyaryletherketone (PAEK) material modification technology, specifically to an ultra-low temperature resistant PAEK composite material and its preparation method, comprising the following materials: PAEK resin, polyethersulfone resin, aramid fibers with surface carboxylation pretreatment, sheet-like thermally conductive filler with a thermal conductivity of at least 400 W / m·K, and a coupling agent; this invention, through the synergistic blending modification of sheet-like thermally conductive filler with polyethersulfone (PES) microspheres and aramid fibers, achieves the advantages of high strength, high toughness, and low thermal stress in the composite material under extreme low temperature environments.

The utility model discloses a kind of preheating flattening structure for solventless laminator, belong to solventless laminator technical field.It solves the problem that plastic film as base material is wrinkled before entering laminating mechanism and two base materials are poor in glue flowability and poor in infiltration when laminating.It mainly includes two side frames of relative arrangement, flattening roller is rotatably installed between two side frames, upper preheating roller and lower preheating roller are rotatably installed respectively on the upper and lower sides of flattening roller.

This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.

The application belongs to the technical field of household appliances, and particularly relates to a fan rotating speed control method and a heat pump equipment. The fan rotating speed control method provided by the application comprises the following steps: obtaining suction temperature T s of a compressor suction port of a heat pump air conditioner, defrosting temperature T ev of an evaporator of the heat pump air conditioner, and liquid pipe temperature T li of a pipeline between a condenser and an expansion valve of the heat pump air conditioner; when the heat pump air conditioner is in a heating mode or a cooling mode, the running rotating speed of a fan is adjusted according to at least two of the suction temperature T s , the defrosting temperature T ev , the liquid pipe temperature T li , a running frequency f nom of the compressor of the heat pump air conditioner, and a maximum running frequency f max . The fan rotating speed control method and the heat pump equipment provided by the application reduce the energy consumption of the heat pump air conditioner.

The application discloses a semiconductor structure and a manufacturing method thereof. The structure comprises a glass substrate having opposite first and second surfaces, a via hole arranged on the glass substrate and penetrating through the first and second surfaces of the glass substrate, an outer shielding layer arranged on the inner wall of the via hole, a dielectric insulation layer arranged on the side of the outer shielding layer away from the inner wall of the via hole, a first conductive seed layer arranged on the side of the dielectric insulation layer away from the inner wall of the via hole, and an internal signal conductor filled in the via hole and located in the area enclosed by the dielectric insulation layer. The semiconductor structure constitutes a vertical interconnection structure, which can greatly shorten the interconnection path between radio frequency modules, provide excellent electromagnetic shielding capability, and reduce transmission delay and loss.

The utility model belongs to the field of electrical technology, and particularly relates to a contact assembly and a circuit breaker, and the contact assembly comprises a moving contact which is provided with a moving contact, and the moving contact is located at one end of the moving contact; the static contact is provided with at least two static contact points, the at least two static contact points are sequentially arranged at one end of the static contact at intervals, and the static contact points and the movable contact points are arranged oppositely; wherein the moving contact can move towards the side close to or away from the static contact, so that the moving contact is in contact with the at least two static contacts. Contact resistance can be reduced, the heating phenomenon can be reduced, local energy accumulation can be avoided, and therefore the service life of the circuit breaker is prolonged, and the breaking capacity of the circuit breaker is improved.

The application provides a middle shaft bowl set surface grinding device capable of reducing noise, relates to the technical field of middle shaft bowl set grinding, and comprises a fixed base, one side of the fixed base is provided with a fixed support plate, the top of a sealing cover is provided with an air pump, an output end of the air pump is provided with a main flow pipe, the sealing cover is located on the outer side of a positioning cover, the side of the main flow pipe is connected with a branch flow pipe, the branch flow pipe penetrates through the side of the sealing cover and is provided with a cleaning pipe, the cleaning pipe is installed on the inner side of the sealing cover, a groove is formed in the cleaning pipe, and the cleaning pipe is located at the bottom of a sound-absorbing plate. High-pressure airflow is guided to the cleaning pipe through the main flow pipe and the branch flow pipe, the high-pressure airflow sprayed from the groove of the cleaning pipe is used for cleaning the metal dust attached to the sound-absorbing plate, the problem that the metal dust is accumulated on the sound-absorbing plate is effectively avoided, and the problem that the metal dust generated in the grinding process is diffused along with airflow and attached to the surface of the sound-absorbing material, thereby seriously weakening the noise reduction effect is solved.

The invention discloses an OFPGA chip packaging structure, which comprises an OFPGA silicon chip main body and a glass substrate, TGV through holes, fine pitch waveguides and coupling gratings are arranged on the glass substrate, and the OFPGA silicon chip main body and the glass substrate are bonded through micro salient points and covalent bonds to realize mechanical fixation and signal interconnection; the glass substrate realizes vertical electrical interconnection through high-density TGV through holes, optical signal transmission is realized through fine-pitch waveguides and coupling gratings, and the micro convex points are metal convex structures formed on the glass substrate. The space utilization rate is greatly increased; ultra-short-distance electric signal transmission in the vertical direction is achieved through the high-density TGV through holes, and signal delay is greatly reduced; the thermal stress after bonding is effectively reduced by means of the similar thermal expansion coefficient characteristic of the glass substrate and the silicon chip, and the stability of photoelectric signal separation transmission is ensured by combining high-precision matching interconnection of the TGV through holes and the micro convex points.

The application relates to the technical field of semiconductor optoelectronic devices, and discloses a low-crosstalk Micro-LED epitaxial wafer, a preparation method and a Micro-LED display system. The low-crosstalk Micro-LED epitaxial wafer comprises a driving backboard, a light-emitting structure and a photonic lattice isolation structure layer which are sequentially stacked, the light-emitting structure comprises a P-type semiconductor layer, a multi-quantum well light-emitting layer and an N-type semiconductor layer which are sequentially stacked on the driving backboard; a groove array arranged periodically is formed on the photonic lattice isolation structure layer, so that the Micro-LED epitaxial wafer is divided into a plurality of independent pixel units, the pixel units comprise a transmission unit and a conversion unit, and the light-emitting colors of the transmission unit and the conversion unit are different; quantum dot materials are filled in the grooves corresponding to the conversion units and are used for realizing light-emitting color conversion. According to the application, multicolor pixels can be directly realized on the driving backboard, the crosstalk rate is reduced, and the color purity, yield and light-emitting efficiency are improved.

This utility model relates to the field of incinerator technology and provides a vertical waste treatment incinerator, including a furnace body; a feeding structure located on the side wall of the furnace body; and a slag discharge structure located at the lower part of the furnace body. The slag discharge structure includes a slag discharge channel located on the outer side wall of the furnace body, and an annular heat absorption groove is provided on the outer side of the slag discharge channel, which is filled with a heat source for heat absorption. A drying chamber and a fan are sequentially arranged on the upper part of the furnace body adjacent to the slag discharge channel. By setting an annular heat absorption groove and heat-conducting plates on the outside of the slag discharge channel, this utility model can not only efficiently recover the heat released during the slag discharge process for drying the waste about to enter the incinerator, thereby improving incineration efficiency and reducing external energy input, but also effectively extend the service life of key system components and maintain the stability and energy utilization efficiency of the system by reducing the temperature of the slag discharge channel, preventing heat backflow, and ensuring the safe discharge of ash and slag.

The application relates to the technical field of metal matrix composites, and particularly discloses a high-entropy alloy binder phase gradient cemented carbide tool material and a preparation method thereof. The high-entropy alloy binder phase gradient cemented carbide tool material comprises a surface layer, a transition layer and a core layer, and the surface layer comprises WC powder 60-70 parts, high-entropy alloy binder phase 0.5-2.0 parts, high-entropy carbide precursor 5-10 parts and composite grain inhibitor 0.3-0.8 parts in terms of mass parts; the transition layer comprises WC powder 45-55 parts and high-entropy alloy binder phase 5-10 parts. In the application, the WC powder, the high-entropy alloy binder phase, the high-entropy carbide precursor, the composite grain inhibitor and the carbon black are matched in the surface layer, the transition layer and the core layer, the carbon black content in each layer presents a gradient distribution, and the high-entropy carbide precursor generates nanoscale high-entropy carbide precipitated phases in situ under the driving of carbon potential, so that the abnormal growth of WC grains is inhibited.

A lead-free packaged all-quartz resonant pressure sensor comprises a 3J21 alloy shell cover, the 3J21 alloy shell cover is connected with a 3J21 alloy shell in a sealed mode, and a quartz island film pressure conversion unit, a quartz resonant layer element and a quartz base component which are connected through a vacuum glass frit sealing technology are arranged in an inner cavity formed by the 3J21 alloy shell cover and the 3J21 alloy shell. Glass frit dielectric layers are arranged between the quartz island film pressure conversion unit and the quartz resonance layer element as well as between the quartz resonance layer element and the quartz base part; three quartz layers and two glass frit dielectric layers are connected to form an all-quartz pressure chip; the all-quartz pressure chip, the 3J21 alloy shell and the gold-plated lead column are connected through sintering of glass silver paste, and a chip electrode signal is led out through the gold-plated lead column; according to the invention, the long-term stability of the sensor is significantly improved, the mechanical strength and reliability of electrical connection are enhanced, real-time and homologous sensing of temperature signals is realized, and the compensation precision of the sensor in a full temperature range is effectively improved.

The invention provides a method and device for casting a metallized ceramic matrix and the metallized ceramic matrix, and relates to the field of electronic ceramic surface metallization. The method comprises the following steps: pre-punching ceramic substrates, carrying out surface treatment, and fixing a plurality of ceramic substrates in a mold cavity; then pressing the liquid metal into a mold cavity provided with the ceramic matrix through pressure, and cooling the mold cavity and an internal contained object to room temperature under the protection atmosphere of inert gas; and finally, after the mold is removed, the required multi-layer interconnected metallized ceramic matrix can be prepared. Compared with the prior art, the process is simple and convenient, the multiple layers of ceramic matrixes and the metal layers are integrally cast through the casting technology, interconnection of any layers of the multiple layers of ceramic matrixes is achieved by pressing in the liquid metal, and the metallized ceramic matrixes of any three-dimensional structure which are interconnected in a three-dimensional mode are obtained through the liquid metal.

The application provides a precision preformed soldering piece and a preparation method thereof. By arranging a graphene layer between the preformed soldering piece and a flux layer, the welding quality and efficiency can be improved, the energy consumption and environmental pollution in the welding process can be reduced, the welding strength and corrosion resistance can be improved, the oxidation and thermal stress in the welding process can be reduced, the cavity rate can be reduced, the precision can be improved, fullerene is added in the alloy raw material, the fullerene has high chemical stability and strong mechanical properties, can form strong bonding with rare earth metals, has high heat conduction performance, can effectively dissipate heat, avoids overheating of the welding part to cause failure, significantly reduces the cavity rate, improves the precision of the welding, reduces the welding temperature required by the preformed soldering piece, and has excellent oxidation resistance, which can effectively prevent the oxidation of the metal surface.

The application discloses an engine with a built-in sodium-filled heat superconducting element cylinder cover and a structure thereof, and relates to the technical field of vehicle engines.The engine cylinder cover is characterized in that the bottom surface of the engine cylinder cover is shaped into a cylinder cover combustion chamber, the inside of the engine cylinder cover is provided with a cylinder cover water jacket, and at least one closed sodium-filled heat superconducting element is embedded in the solid inside between the cylinder cover combustion chamber and the cylinder cover water jacket of the engine cylinder cover; the inside of the sodium-filled heat superconducting element is provided with a vacuumized sodium-filled cavity, the sodium-filled cavity is filled with a heat transfer medium, one end of the sodium-filled heat superconducting element close to the cylinder cover combustion chamber is provided with a heat absorbing end, and the other end of the sodium-filled heat superconducting element close to the cylinder cover water jacket is provided with a heat dissipating end.The application reduces the physical peak temperature of a local area, reduces structural thermal stress, and eliminates a local high-temperature surface that can cause engine knock.

This invention discloses a compact prefabricated metal enclosed ring main unit, relating to the field of ring main unit technology. It solves the problems of existing technologies, such as difficulty in balancing heat dissipation and protection, inconvenient disassembly and maintenance, and high maintenance costs. The invention includes an outer protective cover; a ring main unit housed within the outer protective cover; an electric lifting cylinder fixedly mounted on the top surface of the outer protective cover, with its piston rod connected to the top surface of the ring main unit for driving the ring main unit to extend or retract into the outer protective cover; and a heat dissipation device comprising a curved heat dissipation pipe fixed within the outer protective cover and movably embedded in the bottom surface of the outer protective cover. Through the coordinated design of the lifting structure and the heat dissipation device, this invention achieves automatic heat dissipation during operation and protection during non-operational states. It features a compact structure, high heat dissipation efficiency, and good protective performance, making it suitable for compact outdoor power distribution scenarios.

This invention provides a heat insulation component for a battery pack, a battery device having the same, and a vehicle. The heat insulation component is adapted to be disposed at the front end of the battery pack. The heat insulation component includes a body extending in a left-right direction, and the upper end of the body is adapted to connect with the vehicle floor to seal the gap between the battery pack and the vehicle floor. According to the heat insulation component for a battery pack of this invention, by providing a body with its upper end connected to the vehicle floor to seal the gap between the battery pack and the vehicle floor, the heat radiation from hot air to the battery pack can be reduced, the thermal stress caused by temperature changes in the battery pack can be reduced, and the service life of the battery pack can be improved.

The invention discloses a resonant dual-active bridge converter and a control method, and the converter comprises a primary full-bridge circuit, a secondary full-bridge or half-bridge circuit, a transformer, and an LC resonant network composed of a resonant inductor and a resonant capacitor which are connected in series. The control method comprises the following steps: acquiring parameters of an input voltage V1, an output voltage V2, a transmission power P, a transformer turn ratio N, a resonant inductance Lm and a resonant capacitance Cr of the converter; and calculating a primary fundamental wave equivalent voltage and a secondary fundamental wave equivalent voltage, and calculating an inner phase shift angle alpha between a first bridge arm and a second bridge arm in the primary full-bridge circuit through the primary fundamental wave equivalent voltage and the secondary fundamental wave equivalent voltage. The LLC converter has the beneficial effects that the inherent defects that the gain range of a traditional LLC converter is narrow (generally only 0.8-1.2) and the circulating current is sharply increased and the efficiency is sharply reduced when the voltage is seriously mismatched in the traditional phase-shifting DAB are fundamentally overcome.

The utility model discloses a polishing device for high-precision screw machining, which comprises an operating platform, a groove is arranged on the operating platform, two threaded blocks are slidably arranged in the groove and connected through an elastic component, a first clamping component is arranged on the two threaded blocks, a driving mechanism is arranged in the groove, and a second clamping component is arranged on the driving mechanism. A second clamping assembly is further installed on the operation table and comprises an installation ring, second springs are symmetrically arranged on the inner wall of the installation ring, the ends of the second springs are connected with a limiting plate, a heating plate is arranged in a transverse plate where the limiting plate is located, and a grinding device body is arranged on the operation table. According to the grinding device for machining the high-precision screw, the stability of the screw in the machining process is improved through cooperation between the first clamping assembly and the second clamping assembly, the heating plate is arranged in the limiting plate of the second clamping assembly, thermal stress caused by temperature difference in the grinding process of the screw can be effectively reduced, and the grinding quality of the screw is improved. The service life is prolonged.