The invention relates to the technical field of
electronic packaging materials, in particular to a thermosetting resin composition for packaging a high-
reliability semiconductor device. The composition comprises multifunctional
epoxy resin, XYLOK phenolic resin, a curing accelerator, a modifier and an
inorganic filler, and the modifying agent is
eugenol phthalonitrile polysiloxane. The modifier has good mechanical compatibility and
dispersity in matrix resin; and when being applied to a thermosetting resin
system, the
epoxy resin can improve the processability and effectively enhance the
toughness of a cured product. The composition provided by the invention accords with the
processing and forming process of the existing
epoxy molding compound; according to the present invention, the
spiral flow length of the molding compound is substantially increased, the
processing performance is good, the cured product has advantages of good
thermal stability, low bending modulus, good
impact property and good heat and
humidity resistance, and the
glass transition temperature is increased. The resin is significantly improved in comprehensive performance, and is suitable for packaging
semiconductor devices with high requirements on reliability and
environmental stability.