Polymer-based pads useful for
polishing objects, particularly integrated circuits, having
interconnected porosity which is uniform in all directions, and where the
solid portion of said pad consists of a uniform continuously interconnected
polymer material of greater than 50% of the gross volume of the article, are produced directly to final shape and dimension by pressure
sintering powder compacts of
thermoplastic polymer at a temperature above the
glass transition temperature but not exceeding the
melting point of the
polymer and at a pressure in excess of 100 psi in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower
melting point than the other. When pressure sintered at a temperature
not to exceed the
melting point of the lower melting
powder, the increased stiffness afforded by incorporation of the higher melting polymer component gives improved
mechanical strength to the sintered product. Conditions for producing the pads of this invention are such that the polymer
powder particles from which the pads are produced essentially retain their original shape and are point bonded to form the pad.