The invention discloses a 3D packaging structure and a manufacturing method thereof, and the method employs a glass
wafer as a first carrier plate, and solves the problems of reliability and
signal interference caused by the mismatching of
thermal expansion coefficients of an organic material adapter plate and a Si-based
silicon bridge
chip. In S1, a
blind hole is etched by taking a glass
wafer as a base material, and Cu is metallized and filled, and the
thermal expansion coefficient of glass is similar to that of a
silicon bridge, so that the risk of thermal stress deformation is reduced. And S2, through groove
etching, temporary carrier plate bonding and
thinning, a through groove hole is formed, and the
rigid structure of the glass carrier plate maintains the stability of the packaging structure during high-density integration. And S3, the
silicon bridge Die is embedded into the through groove hole, the low
thermal expansion characteristic of the glass is well matched with the silicon bridge, the interface stress is reduced, the
dielectric property of the glass support plate is excellent, the
signal dielectric loss is reduced, and the
signal integrity is improved by matching with the silicon bridge Die. And S4, after the functional
chip is mounted on the adapter plate, the glass-based adapter plate ensures reliable connection, signal attenuation
distortion is inhibited, and a reliable packaging scheme is provided for high-density integration.