The invention discloses a method for quickly verifying packaging by replacing a frame with a substrate, which belongs to the technical field of substrate packaging, adopts a reconfigurable substrate design, realizes synchronous
verification of two packaging schemes of
surface mounting and
wire bonding on a single substrate, and breaks through the limitation that a traditional frame needs to be manufactured and verified separately. The substrate is integrated with a micron-sized functional partition and an electromagnetic isolation structure, so that characteristic comparison of two technical routes can be completely reserved in the
verification process, and the problem of
signal crosstalk is avoided. Through collaborative optimization of a
material system and a
processing technology, the packaging size is reduced by more than eight percent compared with that of a traditional scheme, a physical carrier support is provided for development of miniaturized devices, meanwhile, mold development and
material consumption costs are greatly reduced, original serial technical
verification is converted into a parallel mode, the
development period is shortened by more than 90 percent, and the development cost is greatly reduced. And the method is especially suitable for rapid iteration requirements of 5G high-frequency devices. The reconfigurable characteristic of the substrate scheme supports a multi-generation product reuse verification platform, and the
utilization rate of research and development resources is remarkably improved.