The invention relates to the technical field of sensors, and provides a six-dimensional
force sensor based on a planar
semiconductor process and a preparation method thereof, and the six-dimensional
force sensor comprises a central bearing platform, a housing, an
elastic beam and a buffer beam. One end of the
elastic beam is connected to the center bearing table, the other end of the
elastic beam is connected to the buffer beam, the buffer beam and the elastic beam are orthogonally arranged, and the end, away from the elastic beam, of the buffer beam is connected to the shell. Wherein the surfaces of the elastic beam and the buffer beam are provided with six groups of strain gauges, and the six groups of strain gauges are respectively used for measuring forces in three directions and moments in three directions. According to the method, the multi-load-step-based least square method
linear matrix decoupling is adopted, so that the inter-dimensional
coupling error of the six-dimensional
force sensor is reduced to below 2%. According to the invention, the six-dimensional force sensor is prepared by adopting a planar
semiconductor process, the difficulties of side surface attachment and side wall lead binding of the strain gauges are avoided, and the six-dimensional force sensor has the advantages of simple process, low manufacturing cost and small
crosstalk error.