9649results about "Fixed connections" patented technology

A chip assembly for use in a surgical stapler is provided. The chip assembly includes a housing assembly and a plug assembly. The housing assembly includes a base member, seal member, and a circuit board assembly. The base member defines a cavity for receipt of the circuit board assembly and the seal member is configured to be received about an open end of the base member. The plug assembly is configured to selectively engage the open end of the base member. The plug assembly includes a plug member and first and second contact members extending from the plug member. The first and second contact members are configured to be received within the cavity defined by the base member and engage the circuit board assembly when the plug assembly engages the housing assembly.

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

An electrical connector according to the invention includes a linear contact array of electrically conductive contacts and a lead frame into which the contacts at least partially extend. The contacts may be selectively designated as either ground or signal contacts such that, in a first designation, the contacts form at least one differential signal pair comprising a pair of signal contacts, and, in a second designation, the contacts form at least one single-ended signal conductor.

An electrical connector system has two connectors, one of which is included in a module mateable with the other connector in a pluggable manner. The other connector includes an elongated guide rail and a connector block in which are retained two or more electrical contacts. Signal connections can be made in a predetermined sequence when the module is plugged into the other connector because the contact pads of the module are of different lengths. For example, sequencing the connection of power and ground signals with respect to data signals provides hot-pluggability. Also, a grounding contact on the module is engaged by a spring clip on the other connector to provide an additional or alternative grounding path.

A method for fabricating an IC support for supporting a first IC die connected in series with a second IC die; the IC support comprising a stack of alternating layers of copper features and vias in insulating surround, the first IC die being bondable onto the IC support, and the second IC die being bondable within a cavity inside the IC support, wherein the cavity is formed by etching away a copper base and selectively etching away built up copper.

Control modules having connectors with compliant pin terminals for connection to a printed circuit board (PCB) are provided. The module housing can be made of a die cast metal to withstand harsh environments and have at least one open bay area for receiving a connector having compliant pin contacts for connecting the module to a PCB. A plurality of compliant pin terminal can have a push shoulders for providing an engagement surface for insertion of the terminals through passages in a connector housing, for positioning the connector relative to the die cast housing during the mounting the connector to the die cast housing, and to transfer the force away from the connector housing applied in connecting the PCB to the compliant pin tips. The connectors can be linear and exposed terminal surfaces can be sealed against the elements by a sealant. The passages of the connector housing can have at one end of the passages cross shaped portions to allow for a strengthened die tool which forms the small passages and chamfered sides at the opposite end of the passages for tight engagement with the terminals to prevent leak of sealant. The connectors can include a three-pronged compliant pin grounding terminal to increase the current flow.

An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

A cable assembly (1000) includes a housing (1) has a receiving space (10), said receiving space including a hollow portion and a mating port located in front of the hollow portion; a spacer (4) located in the receiving space; a first and second printed circuit boards (31, 32) partially enclosed within the spacer and arranged apart from one another, both the first and second printed circuit boards having mating interfaces extending into the mating port and mounting portions disposed in the hollow portion; a metallic plate (2) assembled to the spacer and disposed between the pair of first and second printed circuit boards; a plurality of cables (7) coupled to the mounting portions of the pair of first and second printed circuit boards, respectively.

An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that generates contact force as it is compressed against a wall of the connector housing. The mating contact portion has multiple segments, each with a contact region extending from the wall, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Additionally, each signal path through the mating interface portions of the connectors can be narrow and has a relatively uniform cross section to provide a uniform impedance. Additional size reduction may be achieved by mounting a ground contact on an exterior surface of a connector housing in alternating rows. Additionally, embodiments in which a wavy contact is used in a cantilevered configuration are also described.