751results about "Coupling for high frequency" patented technology

An electrical connector with electrically lossy materials bridging ground members. The lossy conductive members may be formed by filling a settable binder with conductive particles, allowing the partially conductive members to be formed through an insert molding process. Connectors assembled from wafers that contain signal conductors held within an insulative housing may incorporate lossy conductive members by having filled thermal plastic molded onto the insulatative housing. The lossy conductive members may be used in conjunction with magnetically lossy materials. The lossy conductive members reduce ground system do resonance within the connector, thereby increasing the high frequency performance of the connector.

An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.

An implantable passive or active electronic network component or component network is provided which is suitable for prolonged direct body fluid exposure and is attachable to a conductive surface, circuit trace, lead or electrode. The electronic network component or component network includes (1) a non-conductive body of biocompatible and non-migratable material, (2) a conductive termination surface of biocompatible and non-migratable material, associated with the body, and (3) a connection material of biocompatible and non-migratable material, for conductively coupling the termination surface to the conductive surface, circuit trace, lead or electrode. The electronic network component may include a capacitor, a resistor, an inductor, a diode, a transistor, an electronic switch, a MEMs device, or a microchip. A biocompatible and non-migratable adhesive is utilized to conductively couple components of the individual components of the electronic network, such as the conductive surface, circuit trace, lead or electrode.

Provided is a signal transmission cable with a connector, including: a shielded cable having a shielding layer and an insulating coating layer, which cover a periphery of a plurality of insulated wires, and a magnetic powder compound layer interposed between the shielding layer and the insulating coating layer; a connector which is electrically and mechanically connected to at least one end of the shielded cable, and which has a shielding metal cover extending from a housing part to a cable end, the housing part holding terminals to be connected to the insulated wires; and a closed magnetic path core which is fitted on a separated part of the insulating coating layer at the end of the shielded cable. The shielding layer is folded back so as to cover outside of the closed magnetic path core, an insulating tape is wound around the shielding layer in a peripheral portion of the closed magnetic path core, and a tip portion of the shielding layer is connected to the shielding metal cover in a state where the closed magnetic path core is housed in the shielding metal cover. Thus, a coil of one turn is formed.

The present invention is directed to a system and method for reducing crosstalk caused by compensation schemes used in a connector to reduce crosstalk. The system provides for balancing crosstalk in an electrical connector having three or more pairs of conductors, wherein two pairs of conductors form a pair combination. The connector also has at least one compensating coupling device connected between conductor pairs of a first pair combination. The compensating coupling device disturbs the crosstalk balance of a second pair combination. The system for balancing crosstalk in the second pair combination includes a corrective coupling device that is connected between the conductor pairs of the second pair combination. In addition, compensating coupling devices in the second pair combination can be adjusted to counteract any crosstalk disturbances caused by the corrective coupling device.

A method and an apparatus for upgrading an existing service outlet (e.g. LAN, telephone, power or CATV outlet) in a house by adding functionality thereto. The functionality is added by an add-on module, connected electrically and secured mechanically to the existing outlet. Several attachment devices are exampled, including surface attachment, side clamping, snap locking, strap securing and fastening screws. The add-on module may include a service connector for retaining the basic existing outlet function. The module may be attached in a permanent way or by using a detachable solution.

An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

A communications connector with a flexible printed circuit board is provided. The flexible printed circuit board is electronically and mechanically connected to the plug interface contacts of the jack near the plug/jack interface, in order to provide effective crosstalk compensation. The flexible printed circuit board has fingers at one end allowing it to flex as individual plug interface contacts are depressed when a plug is installed into the jack. The flexible printed circuit board, or a flexible portion of a printed circuit board, is provided with elongated extensions for certain conductors to accommodate the connection of six-contact or eight-contact plugs to the connector.

An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.

The present invention relates to a connector which includes a plug unit and a receptacle. The plug unit includes a housing board and a transmission path board. The housing board has a housing board body and first connection terminals and second connection terminals. The transmission path board has a transmission path board body, plural differential signal patterns which are connected to the first connection terminals and the second connection terminals of the housing board, and high pass filters which are connected to each of the differential signal patterns. The receptacle has a receptacle body and pin contacts. According to the present invention, a low-frequency component of a digital signal is attenuated. Thus, since an attenuation factor of the high-frequency component and an attenuation factor of the low-frequency component of the digital signal can be set substantially the same, the digital signal can be transmitted surely.

A insulation displacement connector (IDC) patch panel includes a circuit (PC) board with interdigitated capacitance for balancing out inherent capacitance found within IDCs of the panel. Unwanted cross-talk signals are reduced as a consequence.

A jack with a flexible printed circuit board (FPC) is provided. The FPC is connected to the plug interface contacts and has a compensation circuit to compensate for near-end crosstalk (NEXT) and far-end crosstalk (FEXT). Capacitive and inductive compensation in the compensation circuit are of opposite polarity and are substantially equal in magnitude. The compensation circuit has a FEXT compensation zone containing compensation for the FEXT. Inductive and capacitive compensation in the FEXT compensation zone are distributed.

The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters. The various embodiments of component carriers provide increased physical support and protection to differential and common mode filters and substantially improve the electrical characteristics of the filters due to the increased shielding provided by the carriers. Embodiments of the carrier energy conditioning assembly include integrated circuit construction for a differential and common mode filter coupled to the power bus of an integrated circuit.