1546 results about "Plastic packaging" patented technology

The invention discloses a detection system and method for packaging box production and processing, and belongs to the technical field of packaging production quality detection. The invention discloses a detection system and method for packaging box production and processing. The system comprises a dual-polarization-angle imaging module, a structured light three-dimensional reconstruction module, a temperature compensation module, a defect judgment module and a sorting execution module. According to the method, dual-polarization images and three-dimensional point clouds are synchronously collected, qualified standard values are dynamically calibrated in combination with temperature, accurate recognition and grading judgment of surface and internal defects of the transparent plastic packaging boxes are achieved, and finally unqualified products are removed through a high-speed sorting mechanism. The method solves the problem of misjudgment caused by reflective interference and temperature drift of the transparent material, and is suitable for online detection of a high-speed production line.

The invention provides a plastic packaging barrel online defect detection method and system based on machine vision and deep learning. According to the method, visible light and thermal image data, aligned in time, of the surface of the plastic packaging barrel are collected, the dynamic range of a thermal image is expanded to enhance the identification degree, then highlight interference is compensated through the mapping relation between a thermal image stable area and a visible light reflection area, and surface reflection suppression is achieved; superposing the processed dual-mode data to generate a multi-mode fusion image, dynamically adjusting the temperature reference value of the fusion image based on the thermal conductivity of the material and the environment temperature of the production line, and positioning an abnormal temperature region; and finally, extracting topological contours and temperature diffusion characteristics of the regions, and inputting a deep learning model to judge material structure attributes and spatial positions of the defects so as to finish online detection. According to the method, thermal and visual data are fused to enhance the perception capability on fine structure defects, and the precision and robustness of online detection of the plastic packaging barrel in a complex illumination environment are remarkably improved.

The invention provides a pyrolysis recovery method of a plastic packaging bag, and belongs to the technical field of plastic packaging bag recovery, the pyrolysis recovery method of the plastic packaging bag comprises the following steps: removing impurities from the waste plastic packaging bag, cleaning and drying, and controlling the moisture to be below 5%; the packaging bag is crushed into small blocks with the diameter smaller than 20 mm, so that the pyrolysis efficiency is improved; feeding the crushed plastic into a pyrolyzing furnace through a spiral feeder, adding an auxiliary pyrolyzing component, heating to 300-600 DEG C under an oxygen-free or oxygen-deficient condition, and carrying out thermal cracking; oil gas obtained after pyrolysis is condensed through a cooling system and classified, and solid residues are subjected to tempering treatment; flue gas generated after combustion is subjected to high-temperature degradation through a secondary combustion chamber and then subjected to multistage treatment through a quench tower, dust removal, alkali spraying and activated carbon adsorption, and it is ensured that the flue gas reaches the standard and is discharged; the problems that in the existing pyrolysis recycling process of the plastic packaging bags, the treatment efficiency is low, and the environment is still polluted can be solved.

The invention relates to the technical field of semiconductor packaging, in particular to a batch dust-free packaging device for power semiconductor devices and a using method of the batch dust-free packaging device for the power semiconductor devices, and the batch dust-free packaging device comprises a plastic packaging machine main body, a plastic packaging mold and a side frame, an upper plastic packaging mold and a lower plastic packaging mold are installed at the upper end and the lower end of the plastic packaging machine body respectively, a side frame is fixedly connected to one side of the plastic packaging machine body, a cleaning roller storage box is installed on one side of the side frame, and an electric push rod and an air supply and negative pressure unit are arranged in the cleaning roller storage box. Three-step dust-free cleaning of blowing, sucking and shaking is automatically carried out on a mold cavity after each time of plastic packaging; during air blowing, air is expanded and cooled twice through a conical barrel, the mold is synchronously cooled, and stubborn particles are stripped; negative pressure is formed on the surface of the cotton layer during air suction, and all residual scraps are sucked away; after cleaning is finished, the roller body returns to the storage box, the blocking block collides with the toothed plate to enable the roller body to jolt at high frequency, and attachments are shaken off into the box and are sealed and collected.

The invention relates to the technical field of plastic packaging films, in particular to a casting CPE composite film material and a preparation method thereof.The casting CPE composite film material is characterized in that a corona layer is prepared from, by weight, 72-75 parts of LLDPE, 18-22 parts of LDPE, 5-6 parts of EVA and 1.5-2 parts of an opening slipping agent; the middle core layer is prepared from the following components in parts by weight: 70 to 75 parts of LLDPE (Linear Low Density Polyethylene), 20 to 25 parts of HDPE (High Density Polyethylene), 5 to 8 parts of mPE, 3 to 5 parts of modified nano silicon dioxide and 1 to 3 parts of processing aid; the heat sealing layer is prepared from the following components in parts by weight: 25 to 30 parts of mLLDPE, 68 to 72 parts of LDPE, 0.3 to 0.5 part of antistatic agent and 1 to 2 parts of processing aid. The prepared composite film material has multiple functions of flame retardance, aging resistance, static electricity resistance and the like on the basis of keeping excellent heat sealing performance and mechanical strength.

The invention relates to the technical field of quality analysis of plastic packaging materials, and particularly discloses a quality analysis method of a plastic packaging product, which comprises the following steps of: acquiring chemical composition information of a target material by adopting Fourier transform infrared spectroscopy and thermogravimetric analysis, and constructing an atomic-scale three-dimensional molecular model on the basis of polymer types and auxiliary ratio; auxiliary agent diffusion behaviors are simulated and tracked through molecular dynamics, and key transmission parameters are obtained; importing the parameters into a finite element model, establishing a multi-physics field coupling migration simulation model, and simulating the migration trends of the assistants under different environmental conditions; establishing a quantitative correlation model to predict the long-term stability of the material by combining accelerated aging experiment data; according to the method, the prediction precision of the service life and the function stability of the plastic packaging material is improved, the research and development cost is reduced, and the product quality consistency and the market competitiveness are improved.

The invention provides a high-toughness plastic packaging film material and a preparation method thereof, and belongs to the field of metallocene polyolefin plastics. The high-toughness plastic packaging film material is prepared from the following chemical raw materials: 80 to 90 parts of metallocene polyethylene resin, 5 to 8 parts of supramolecular cross-linking agent, 6 to 10 parts of core-shell type modifier, 3 to 5 parts of ethylene-vinyl acetate copolymer, 2 to 4 parts of stearic acid modified nano calcium carbonate, 2 to 3 parts of polyolefin elastomer, 0.2 to 0.5 part of di (3, 4-dimethyldibenzylidene) sorbitol, 2 to 5 parts of thermotropic liquid crystal polymer and 0.4 to 0.7 part of antioxidant. 0.8 to 1.2 parts of a lubricant and 0.5 to 1.0 part of an antistatic agent. Through the compatibility design of a toughening mechanism, the synergistic balance of an enhancing mechanism and the optimization of transparency guarantee, the functions of all the components in a metallocene polyethylene resin matrix are complemented, and the ultrahigh toughness, high strength and high transparency of the film material are achieved.

The invention discloses a chip packaging structure and a preparation method, and relates to the technical field of chip packaging, and the method comprises the steps: providing a substrate, and forming a boss on a first surface of the substrate; a bridging circuit is formed on the top surface of the boss, and the bridging circuit and the boss form a bridging chip; forming a plurality of first conductive columns on the surface of the bridging circuit, and forming a plurality of second conductive columns on the etched first surface around the boss; a first plastic packaging layer is formed, a first interconnection circuit is formed on the surface of the first plastic packaging layer, and the top surfaces of the conductive columns are electrically connected with the first interconnection circuit; fixing a chip on the first interconnection circuit; forming a second plastic package layer; and thinning the second surface, removing other parts of the substrate except the boss, and exposing the bottom surface of the second conductive column. The bridging chip is directly and integrally formed on the substrate, so that the problem of overlay offset of the first interconnection circuit in the chip packaging process is solved, a debonding process is not needed, and meanwhile, high-density arrangement of the conductive columns is realized.

The application relates to the technical field of packaging films, and discloses an antistatic plastic packaging film and a preparation process.The antistatic plastic packaging film comprises 100 parts by weight of polyethylene, 1-6 parts by weight of phenolic resin polyaniline antistatic agent and 0.2-0.3 parts by weight of an antioxidant.The dodecyl succinic anhydride esterified phenolic resin contains carboxyl groups, can be used as a protonic acid, is doped into polyaniline through an in-situ polymerization reaction, makes imine nitrogen atoms of the polyaniline protonate, forms a charged excited state polaron, and thus the conductivity of the polyaniline is improved, the resistance of the polyethylene is reduced, and the antistatic performance of the packaging film is improved.The dodecyl succinic anhydride esterified phenolic resin and the doped polyaniline have good compatibility with the polyethylene, have a certain reinforcing effect on the polyethylene, and make the film material have higher tensile strength and elongation at break.

The invention discloses a detection device for plastic packaging bag production, and belongs to the field of plastic packaging bag production, and the detection device comprises a first threaded cylinder, the interior of the first threaded cylinder is rotatably connected with a threaded rod in a threaded manner, the two sides of the first threaded cylinder are fixedly connected with first baffles, and the end, away from a rotating handle, of the threaded rod is rotatably connected with a second threaded cylinder. The bottom end of the second threaded cylinder is fixedly connected with a circular bottom support, the end, away from the second threaded cylinder, of the telescopic rod is fixedly connected with the circular bottom support, the bottom end of the circular bottom support is fixedly connected with a first tension sensor, the lower side of the first tension sensor is fixedly connected with a fixing plate, and the fixing plate is slidably connected with the first tooth-shaped clamping plate. And a lower clamping assembly is assembled at the bottom end of the inner wall of the box body. According to the plastic packaging bag tensile strength testing device, the tooth-shaped clamping plates are arranged to clamp a plastic packaging bag, and meanwhile, the tooth-shaped clamping plates are matched with the hydraulic assembly, so that the effects of clamping the plastic packaging bag and testing the tensile strength of the plastic packaging bag by using mechanical force instead of manpower are achieved.

The present application relates to the technical field of plastic packaging bag production, and particularly relates to a plastic packaging bag tenacity detection device. The device comprises a fixing unit, which is provided with a multidirectional detection unit at the bottom; the multidirectional detection unit comprises a lower installation cylinder, which is communicated with an operation cylinder at the bottom; the diameter of the operation cylinder is larger than that of the lower installation cylinder, and the ports at the upper and lower ends of the operation cylinder are both provided with arc surfaces; a plurality of groups of plate feeding mechanisms are arranged in annular array on the arc surfaces. The present application allows each group of radiation pressing plates to spread radially to each direction and support the plastic packaging bag from the inside. When the fourth slide group at the bottom is lowered, the lower pressing strip is pushed down, and the plastic packaging bag is given a pushing force from the bottom, and the radially spread plastic packaging bags are combined to realize omnidirectional pressing of the plastic packaging bag. The detection busy point is avoided, and the detection accuracy is improved.

A wrap container having a body including a front wall, a rear wall, a top wall, and a bottom wall forming an enclosure. A roll of wrap is disposed within the enclosure. The top wall has a perforated section. A folding surface has a top surface and a bottom surface with a cutter assembly including a track and a slidable cutter attached to the bottom surface of the folding surface. The cutter assembly has a first retracted position in the enclosure and a second deployed positon folded out of the opening.

The application belongs to the technical field of plastics, and particularly relates to a degradable antibacterial plastic packaging bag and a preparation method thereof. The degradable antibacterial plastic packaging bag comprises the following raw materials in parts by weight: polycaprolactone 70-90 parts; polybutylene adipate terephthalate 20-40 parts; Cr and Cu co-modified ZIF-8 5-20 parts; and cerium oxide tannic acid material 2-6 parts. The Cr and Cu co-modified ZIF-8 synergistically improves the antibacterial performance of the packaging bag, and the addition of the cerium oxide tannic acid material further improves the antibacterial performance of the packaging bag. Moreover, the degradable antibacterial plastic packaging bag prepared by the application has excellent mechanical properties.

The invention discloses a vehicle gauge chip integrated packaging manufacturing process based on an etching technology. The vehicle gauge chip integrated packaging manufacturing process comprises the following steps: step 1, designing and preparing a substrate; step 2, preprocessing the chip; step 3, chip mounting and interconnection are carried out; step 4, plastic packaging and molding; 5, heat dissipation and reinforcement are carried out; step 6, image rotation correction and defect detection; step 7, performing post-working procedures and testing; high-density interconnection such as TSV (through silicon vias), RDL (redistribution layer) and micro bumps is realized by using an etching technology, the interconnection density is remarkably improved, the RDL wiring layer manufactured by using the etching technology has the line width less than 2 microns, high-density interconnection on the surface of a chip is realized, the integration level is further improved, the micro-channel is manufactured in the plastic package layer by using the etching technology, and the packaging efficiency is improved. And the copper radiating fins are embedded, so that the radiating efficiency is effectively improved, the problem of local heat accumulation caused by integration of the power chip and the logic chip is solved, a gap between the chip and the radiating cover plate is filled with a thermal interface material with high thermal conductivity, and the thermal resistance is reduced.

The invention belongs to the technical field of intelligent manufacturing of plastic packaging containers, and particularly discloses an intelligent blow molding and wall thickness closed-loop control system for PET plastic bottles, which integrates feedforward correction and closed-loop feedback, pre-corrects process parameters by acquiring characteristic parameters of raw materials, and generates point cloud data in combination with full-circumferential scanning of a non-contact three-dimensional optical measurement device. A partition three-dimensional model is constructed, and the wall thickness is accurately calculated; and based on the wall thickness deviation data, blow molding process parameters are dynamically adjusted through the mapping relation database, and a grading quality control strategy, a multivariable self-adaptive feedback mechanism and an online incremental learning mechanism are configured. The system realizes self-adaptive compensation under working conditions of raw material fluctuation, environmental disturbance and the like, improves wall thickness control precision and product consistency, reduces manual intervention, ensures high-speed continuous production, has self-learning and long-term stable regulation and control capabilities, and provides technical support for light-weight and high-precision forming of PET bottles.

The utility model discloses special grabbing equipment for stacking television box bodies, which comprises a grabbing manipulator, and is characterized in that the grabbing manipulator is connected with a grabbing mechanism, and the grabbing mechanism comprises a grabbing frame; the grabbing frame is provided with a supporting plate, a first clamping plate, a second clamping plate, a first side frame, a second side frame, an opening and closing driving mechanism for driving the first side frame and the second side frame to be opened and closed and a telescopic driving unit for driving the supporting plate to stretch out and draw back, the first clamping plate, the supporting plate and the telescopic driving unit are arranged on the first side frame, and the second clamping plate is arranged on the second side frame. According to the structure, the influence of the plastic packaging film on clamping is small, grabbing of the stacking structure shaped like a Chinese character'hui 'can be achieved, and the structure is simple.

The invention discloses a 2.5 D packaging method and structure, and the method comprises the following steps: providing a glass slide, and preparing a rewiring layer on the glass slide; and providing a silicon adapter plate wafer, performing multi-chip integration on the silicon adapter plate wafer, integrally mounting the silicon adapter plate wafer on the rewiring layer, and finally performing bottom filling, plastic packaging and cutting to form a single packaging body. The rewiring layer is used for replacing a traditional organic carrier plate or substrate, dependence on the organic carrier plate or substrate can be eliminated, the packaging cost is reduced, and the risk that the carrier plate is out of stock is avoided; the thickness of a traditional ABF carrier plate for 2.5 D packaging is as high as 0.3-0.5 mm, while the thickness of the rewiring layer adopted by the invention is 1t; the packaging thickness can be obviously reduced, and the packaging body can be lightened, thinned and miniaturized; a two-time plastic packaging process is adopted, and the second-time plastic packaging is performed after the rewiring layer is mounted on the silicon adapter plate wafer, so that the protection on the periphery of the packaging structure is enhanced, and the reliability of a packaging body is improved.

The invention discloses a preparation method and application of a repulpable gallic acid-based waterproof and oil-proof agent, and belongs to the technical field of bio-based oil-proof hydrophobic paper surface coatings. The preparation method comprises the following steps: by taking alkyl gallate and epoxy chloropropane as raw materials, preparing alkyl gallate epoxy through epoxidation reaction; and uniformly mixing the alkyl gallate epoxy resin with an acid anhydride / phenol compound to obtain the alkyl gallate epoxy resin series waterproof and oil-proof agent. The structure of the bio-based waterproof and oil-proof agent prepared by the invention contains groups such as a non-polar long alkyl chain, an epoxy group and an amino group, a compact cross-linked coating can be formed on the surface and the interior of paper, and gaps between paper cellulose are filled, so that permeation of oil, water and gas is blocked, meanwhile, the adhesive force between the coating and the paper is increased, and the waterproof and oil-proof effects are improved. The fibers are more tightly combined together; non-polar long alkyl chains and benzene ring groups in the structure can endow the paper with excellent oil-proof, hydrophobic and mechanical properties, and flexible chain segments (alkyl carbon chains) with different lengths are introduced to adjust the flexibility of the coating, so that the flexibility and tensile strength of the paper can be effectively adjusted; the coating paper can be recycled and reused in an alcoholysis mode. The raw materials are easy to obtain and renewable, paper can be re-pulped after being coated, and the paper has the potential of replacing plastic packaging and meets the performance requirements of paper packaging on specific scenes such as water resistance and oil resistance.

The embodiment of the invention provides a chip packaging method and a packaging structure, and the method comprises the steps: forming a bridge chip, and enabling an active surface of the bridge chip to be provided with a grindable chip bonding film; providing a carrier plate and forming a molding compound conductive column on the carrier plate; bonding and fixing the bridging chip on the carrier plate through the grindable chip bonding film; forming a first plastic packaging layer on the carrier plate, and grinding and thinning the first surface of the first plastic packaging layer to expose the plastic packaging material conductive columns and the non-active surfaces of the bridging chips; removing the carrier plate and grinding the grindable chip bonding film and the second surface of the first plastic packaging layer to expose the plastic packaging material conductive columns and the active surface of the bridging chip; respectively forming a first rewiring layer and a second rewiring layer which are electrically connected with the bridging chip and the plastic package material conductive columns on the second surface and the first surface of the first plastic package layer; and mounting and fixing the plurality of chips on the second rewiring layer, and forming a second plastic package layer wrapping the plurality of cores. According to the chip packaging method, the cost is saved, the yield is improved, and the reliability is improved.

The invention provides a high-density substrate packaging structure and a preparation method thereof, and relates to the technical field of chip packaging, the packaging structure comprises a plurality of passive devices, a pseudo chip frame, a first conductive layer, a protective dielectric layer, a structural chip, a plastic packaging layer and a first wiring combination layer, the pseudo chip frame covers the plurality of passive devices; the first conductive layer is electrically connected to the plurality of passive devices at the same time; and the protective dielectric layer is positioned on the front surfaces of the pseudo chip frame and the plurality of passive devices. The structural chip is mounted on the protective dielectric layer, and the structural chip is electrically connected with the first conductive layer; the plastic packaging layer is formed on the protective dielectric layer; the first wiring combination layer is formed on the plastic packaging layer. Compared with the prior art, the passive device is effectively protected by using the pseudo chip frame, and the passive device is prevented from deviating or falling off due to the impact of a mold flow. And meanwhile, staggered-layer placement of the structural chip and a plurality of passive devices is realized, so that the influence on the transmission efficiency of the structural chip is relieved, and the performance of the chip is ensured.

The invention relates to the technical field of plastic packaging energy consumption evaluation, and discloses an energy consumption evaluation method based on the life cycle of a plastic packaging material. The method comprises the following steps: disassembling a target plastic packaging product into a plurality of material units, collecting energy consumption data of each unit in the stages of raw material mining, processing and forming, transportation circulation and recovery processing, and integrating the energy consumption data into a full life cycle data set; constructing a raw material mining stage basic energy consumption index and a regeneration treatment stage additional energy consumption index based on the data set, and generating an initial comprehensive energy consumption value in combination with a stage energy consumption threshold mechanism and an attenuation compensation model; performing cross-stage dynamic correction on the initial comprehensive energy consumption value according to the upstream and downstream relevance of the material unit in the industrial chain, and outputting a corrected comprehensive energy consumption value; and the corrected comprehensive energy consumption values are arranged in an ascending order to generate a priority improvement list, and a material database is associated to carry out three-dimensional visual mapping. The method can comprehensively and accurately evaluate the full life cycle energy consumption of the plastic packaging material, and is convenient for energy-saving improvement.

The invention discloses a food plastic package seal online detection method and system, and relates to the technical field of food package quality nondestructive detection.The method comprises the steps that based on a multi-physical-quantity data set, amplitude attenuation parameters in acoustic data are extracted, and food plastic package thickness distribution is scanned; dynamically correcting the amplitude attenuation parameter through a sound wave energy absorption model to obtain calibrated acoustic data; inputting the physical quantity matrix into a pre-trained convolutional neural network model, outputting a multi-scale feature map, analyzing multi-modal feature association of the physical quantity matrix through an attention fusion mechanism, and outputting a defect probability score; and according to the defect probability score, detecting the sealing state of the seal, removing the invalid food plastic package, integrating multi-source data to generate a structured detection log, and optimizing a convolutional neural network model through back propagation to generate a detection report. According to the invention, the recognition capability and classification precision of complex defects are enhanced, and precise judgment and efficient sorting of the sealing state of the seal are realized.

The invention discloses an environment-friendly degradable plastic packaging bag and a preparation method thereof, belongs to the technical field of packaging bag preparation, and is used for solving the technical problem that the degradation capability and the mechanical property of an environment-friendly packaging bag in the prior art need to be further improved. According to the invention, the prepared carbonic acid bridged compact polyester is used as a main body skeleton to provide strength and film-forming property, silica acetal hybrid polysaccharide is introduced to form a compact and complex diffusion path inside and reduce gas and moisture permeation, and then active side chain polyamino acid is added to adjust interfacial compatibility and enhance structural stability, so that the film-forming property is improved. Through reasonable combination of the three components, the environment-friendly packaging bag keeps high tensile strength and tearing strength, meanwhile, the barrier property is remarkably improved, and gradual complete degradation is achieved in compost and soil environments.

The invention belongs to the technical field of packaging bag recycling, and particularly relates to plastic packaging bag processing waste recycling equipment. Comprising a plastic recovery extruder, a feeding mechanism is mounted at a feeding hole of the plastic recycling extruder; the feeding mechanism comprises a mounting table; a through groove is formed in the middle of the table top; a vertical cylinder is fixed to the top of the through groove. An inlet is formed in the bottom of the vertical cylinder; a first electric push rod is mounted at the top of the vertical cylinder; a pressure plate slides in the vertical cylinder; a net cylinder is fixed at the top of the pressure plate; a plurality of first suction pipes are mounted at the top of the vertical cylinder; a dehumidification assembly is arranged on the mounting table; a rotating ring is arranged at the bottom of the mounting table; concave plates are arranged on the two sides of the rotating ring; the rotating ring rotates in the concave plate; circular grooves are evenly formed in the outer ring face of the rotating ring. A loosening assembly is arranged below the rotating ring; by arranging the feeding mechanism, the problem that air holes and needle holes are formed due to air and water vapor residues in molten melt can be effectively solved.

The invention discloses an epoxy resin material for electronic plastic package of a radio frequency chip and a preparation method of the epoxy resin material. The preparation method comprises the following steps: firstly, carrying out alkylation reaction on dicyclopentadiene and phenol in the presence of a catalyst boron trifluoride diethyl etherate to synthesize dicyclopentadiene phenol resin, and epoxidizing the dicyclopentadiene phenol resin through epoxy chloropropane to obtain dicyclopentadiene epoxy resin DCPDDE; then, synthesizing a poly (dicyclopentadiene) linear polymer PDCPD by taking a Pd / Ag ionic compound as a catalyst, and then reacting the PDCPD with cysteamine sulfydryl to obtain dicyclopentadiene cysteamine PDCPDAm; and finally, mixing the DCPDDE, the PDCPDAm, the filler and the coupling agent, stirring, defoaming and curing to form the thermosetting resin with a three-dimensional network structure. The synthetic process is simple, the cost is low, the mobility and polarizability of molecules are limited due to high rigidity and low polarity of the obtained resin, transmission of a radio frequency chip under a high-frequency high-speed signal is ensured, stable operation in a complex working environment is ensured, reliable packaging protection is provided for the radio frequency chip, and the service life of the radio frequency chip is prolonged. And the thermal stability and the low dielectric property of the radio frequency chip are improved to the greatest extent.

The invention belongs to the field of artillery charging design, and particularly relates to a high-density polypropylene module charging packaging barrel which comprises a barrel body (1), a barrel cover (2), an air pressure balance valve (3) and a sealing piece (4). The sizes of cavities in the barrel body (1) and the barrel cover (2) are determined according to the boundary dimension of module charging, the structural design of the packaging barrel is carried out according to the charging weight and use requirements, and structural optimization and improvement are carried out by combining simulation analysis software with a single verification test. Compared with the prior art, the packaging barrel made of the high-density polypropylene material has the advantages that compared with an original metal packaging barrel and an original plastic packaging barrel, the weight of a single barrel is greatly reduced, and the packaging barrel is convenient to carry; the material is soft in texture, can effectively buffer the impact force between the charge and the packaging barrel in the charge transportation process, reduces the charge transportation damage, and ensures the charge ballistic performance; the material is low in cost and easy to foam and form, and the production cost can be reduced.

The invention discloses a semiconductor packaging structure and a preparation method thereof, and relates to the technical field of semiconductors, the semiconductor packaging structure comprises a first chip, a second chip, a first plastic packaging body, a second plastic packaging body, a first rewiring layer and a second rewiring layer, the first plastic packaging body wraps the first chip, and the second plastic packaging body wraps the second chip. The first rewiring layer and the second rewiring layer are arranged on the two opposite sides of the first plastic package body respectively, the second chip is arranged on the side, away from the first chip, of the second rewiring layer, the second plastic package body wraps the second chip, the thermal expansion coefficient of the second rewiring layer is larger than that of the first rewiring layer, and the thermal expansion coefficient of the second rewiring layer is larger than that of the first rewiring layer. At least one bonding wire and an insulating glue layer wrapping the bonding wire are arranged in the first redistribution layer. According to the semiconductor packaging structure and the preparation method thereof, the problem of warping of a traditional packaging structure caused by differences of thermal expansion coefficients and shrinkage characteristics of materials of different levels can be solved, meanwhile, stray capacitance between wiring layers can be reduced, and therefore the device performance is improved.

The utility model discloses a stretching film packaging device for meat products, which comprises a packaging and sealing mounting box, a bucket type conveying mechanism arranged on the packaging and sealing mounting box and used for conveying the meat products to be packaged, and a packaging film mounting frame arranged on the packaging and sealing mounting box and used for mounting coiled packaging films, the material receiving pipe is arranged on the packaging and sealing mounting box and is used for receiving the meat products to be packaged conveyed by the bucket type conveying mechanism, the side sealing mechanism is arranged on the packaging and sealing mounting box and is used for carrying out plastic packaging on the side edges of the packaging films, and the end part sealing mechanism is arranged on the packaging and sealing mounting box and is used for carrying out plastic packaging on the packaging films; and the industrial personal computer is arranged on the packaging and sealing mounting box and is electrically connected with the bucket type conveying mechanism and the end part sealing mechanism. By means of the scheme, the meat packaging machine has the advantages of being simple in structure, reliable in packaging and the like, and has high practical value and popularization value in the technical field of meat product processing.

The invention discloses a manufacturing method of an embedded adapter plate and a forming structure of the embedded adapter plate, and belongs to the technical field of semiconductor packaging. The process comprises the following steps: preprocessing a packaging substrate and planting metal balls on the back surface; temporarily bonding a temporary bonding carrier plate on the front surface of the packaging substrate; carrying out plastic packaging on the back surface of the packaging substrate and the metal balls, carrying out curing, and then carrying out first thinning; de-bonding the front surface of the packaging substrate; preparing a bridging chip monomer, and arranging a first metal column group on the front surface of the bridging chip monomer; a second metal column group is arranged on the front surface of the packaging substrate, and a bridging chip monomer is positively arranged on the front surface of the packaging substrate; carrying out plastic packaging on the second metal column group and the bridging chip monomer, thinning to expose the metal column end surfaces of the first metal column group and the second metal column group, and arranging a rewiring layer to form the front surface of the embedded adapter plate; thinning the back surface of the packaging substrate for the second time until the metal balls are exposed, forming the back surface of the embedded adapter plate, and completing the structure of the embedded adapter plate. According to the invention, the difficulty of a packaging process is reduced, the product performance is improved, and the process cost is reduced.

The invention belongs to the technical field of chip packaging, and particularly relates to a stacked photoelectric sealing structure and a packaging technology thereof, and the structure comprises a lead frame which comprises a substrate adhesive tape and four independent bonding pads disposed on the substrate adhesive tape; the first glass-based chip is arranged on the two bonding pads and is electrically connected with the two bonding pads; the two first silicon-based electric chips are electrically connected and are respectively arranged on the other two bonding pads; the second glass-based chip is stacked on the first glass-based chip; the second silicon-based electric chip is stacked on the two first silicon-based electric chips and is electrically connected with the two first silicon-based electric chips and the second glass-based chip; according to the stacked photoelectric combined packaging structure and the packaging process thereof, through the stacking design of the lead frame and the chip, the occupation of a transverse space is greatly reduced; and meanwhile, the packaging step is simplified by the epoxy resin plastic packaging process, and the manufacturing cost is reduced.