927 results about "Plastic packaging" patented technology

The invention discloses a chip packaging structure and a preparation method, and relates to the technical field of chip packaging, and the method comprises the steps: providing a substrate, and forming a boss on a first surface of the substrate; a bridging circuit is formed on the top surface of the boss, and the bridging circuit and the boss form a bridging chip; forming a plurality of first conductive columns on the surface of the bridging circuit, and forming a plurality of second conductive columns on the etched first surface around the boss; a first plastic packaging layer is formed, a first interconnection circuit is formed on the surface of the first plastic packaging layer, and the top surfaces of the conductive columns are electrically connected with the first interconnection circuit; fixing a chip on the first interconnection circuit; forming a second plastic package layer; and thinning the second surface, removing other parts of the substrate except the boss, and exposing the bottom surface of the second conductive column. The bridging chip is directly and integrally formed on the substrate, so that the problem of overlay offset of the first interconnection circuit in the chip packaging process is solved, a debonding process is not needed, and meanwhile, high-density arrangement of the conductive columns is realized.

The application relates to the technical field of packaging films, and discloses an antistatic plastic packaging film and a preparation process.The antistatic plastic packaging film comprises 100 parts by weight of polyethylene, 1-6 parts by weight of phenolic resin polyaniline antistatic agent and 0.2-0.3 parts by weight of an antioxidant.The dodecyl succinic anhydride esterified phenolic resin contains carboxyl groups, can be used as a protonic acid, is doped into polyaniline through an in-situ polymerization reaction, makes imine nitrogen atoms of the polyaniline protonate, forms a charged excited state polaron, and thus the conductivity of the polyaniline is improved, the resistance of the polyethylene is reduced, and the antistatic performance of the packaging film is improved.The dodecyl succinic anhydride esterified phenolic resin and the doped polyaniline have good compatibility with the polyethylene, have a certain reinforcing effect on the polyethylene, and make the film material have higher tensile strength and elongation at break.

The application belongs to the technical field of plastics, and particularly relates to a degradable antibacterial plastic packaging bag and a preparation method thereof. The degradable antibacterial plastic packaging bag comprises the following raw materials in parts by weight: polycaprolactone 70-90 parts; polybutylene adipate terephthalate 20-40 parts; Cr and Cu co-modified ZIF-8 5-20 parts; and cerium oxide tannic acid material 2-6 parts. The Cr and Cu co-modified ZIF-8 synergistically improves the antibacterial performance of the packaging bag, and the addition of the cerium oxide tannic acid material further improves the antibacterial performance of the packaging bag. Moreover, the degradable antibacterial plastic packaging bag prepared by the application has excellent mechanical properties.

The invention discloses a vehicle gauge chip integrated packaging manufacturing process based on an etching technology. The vehicle gauge chip integrated packaging manufacturing process comprises the following steps: step 1, designing and preparing a substrate; step 2, preprocessing the chip; step 3, chip mounting and interconnection are carried out; step 4, plastic packaging and molding; 5, heat dissipation and reinforcement are carried out; step 6, image rotation correction and defect detection; step 7, performing post-working procedures and testing; high-density interconnection such as TSV (through silicon vias), RDL (redistribution layer) and micro bumps is realized by using an etching technology, the interconnection density is remarkably improved, the RDL wiring layer manufactured by using the etching technology has the line width less than 2 microns, high-density interconnection on the surface of a chip is realized, the integration level is further improved, the micro-channel is manufactured in the plastic package layer by using the etching technology, and the packaging efficiency is improved. And the copper radiating fins are embedded, so that the radiating efficiency is effectively improved, the problem of local heat accumulation caused by integration of the power chip and the logic chip is solved, a gap between the chip and the radiating cover plate is filled with a thermal interface material with high thermal conductivity, and the thermal resistance is reduced.

The invention belongs to the technical field of intelligent manufacturing of plastic packaging containers, and particularly discloses an intelligent blow molding and wall thickness closed-loop control system for PET plastic bottles, which integrates feedforward correction and closed-loop feedback, pre-corrects process parameters by acquiring characteristic parameters of raw materials, and generates point cloud data in combination with full-circumferential scanning of a non-contact three-dimensional optical measurement device. A partition three-dimensional model is constructed, and the wall thickness is accurately calculated; and based on the wall thickness deviation data, blow molding process parameters are dynamically adjusted through the mapping relation database, and a grading quality control strategy, a multivariable self-adaptive feedback mechanism and an online incremental learning mechanism are configured. The system realizes self-adaptive compensation under working conditions of raw material fluctuation, environmental disturbance and the like, improves wall thickness control precision and product consistency, reduces manual intervention, ensures high-speed continuous production, has self-learning and long-term stable regulation and control capabilities, and provides technical support for light-weight and high-precision forming of PET bottles.

The embodiment of the invention provides a chip packaging method and a packaging structure, and the method comprises the steps: forming a bridge chip, and enabling an active surface of the bridge chip to be provided with a grindable chip bonding film; providing a carrier plate and forming a molding compound conductive column on the carrier plate; bonding and fixing the bridging chip on the carrier plate through the grindable chip bonding film; forming a first plastic packaging layer on the carrier plate, and grinding and thinning the first surface of the first plastic packaging layer to expose the plastic packaging material conductive columns and the non-active surfaces of the bridging chips; removing the carrier plate and grinding the grindable chip bonding film and the second surface of the first plastic packaging layer to expose the plastic packaging material conductive columns and the active surface of the bridging chip; respectively forming a first rewiring layer and a second rewiring layer which are electrically connected with the bridging chip and the plastic package material conductive columns on the second surface and the first surface of the first plastic package layer; and mounting and fixing the plurality of chips on the second rewiring layer, and forming a second plastic package layer wrapping the plurality of cores. According to the chip packaging method, the cost is saved, the yield is improved, and the reliability is improved.

The invention provides a high-density substrate packaging structure and a preparation method thereof, and relates to the technical field of chip packaging, the packaging structure comprises a plurality of passive devices, a pseudo chip frame, a first conductive layer, a protective dielectric layer, a structural chip, a plastic packaging layer and a first wiring combination layer, the pseudo chip frame covers the plurality of passive devices; the first conductive layer is electrically connected to the plurality of passive devices at the same time; and the protective dielectric layer is positioned on the front surfaces of the pseudo chip frame and the plurality of passive devices. The structural chip is mounted on the protective dielectric layer, and the structural chip is electrically connected with the first conductive layer; the plastic packaging layer is formed on the protective dielectric layer; the first wiring combination layer is formed on the plastic packaging layer. Compared with the prior art, the passive device is effectively protected by using the pseudo chip frame, and the passive device is prevented from deviating or falling off due to the impact of a mold flow. And meanwhile, staggered-layer placement of the structural chip and a plurality of passive devices is realized, so that the influence on the transmission efficiency of the structural chip is relieved, and the performance of the chip is ensured.

The invention discloses an environment-friendly degradable plastic packaging bag and a preparation method thereof, belongs to the technical field of packaging bag preparation, and is used for solving the technical problem that the degradation capability and the mechanical property of an environment-friendly packaging bag in the prior art need to be further improved. According to the invention, the prepared carbonic acid bridged compact polyester is used as a main body skeleton to provide strength and film-forming property, silica acetal hybrid polysaccharide is introduced to form a compact and complex diffusion path inside and reduce gas and moisture permeation, and then active side chain polyamino acid is added to adjust interfacial compatibility and enhance structural stability, so that the film-forming property is improved. Through reasonable combination of the three components, the environment-friendly packaging bag keeps high tensile strength and tearing strength, meanwhile, the barrier property is remarkably improved, and gradual complete degradation is achieved in compost and soil environments.

The invention belongs to the technical field of packaging bag recycling, and particularly relates to plastic packaging bag processing waste recycling equipment. Comprising a plastic recovery extruder, a feeding mechanism is mounted at a feeding hole of the plastic recycling extruder; the feeding mechanism comprises a mounting table; a through groove is formed in the middle of the table top; a vertical cylinder is fixed to the top of the through groove. An inlet is formed in the bottom of the vertical cylinder; a first electric push rod is mounted at the top of the vertical cylinder; a pressure plate slides in the vertical cylinder; a net cylinder is fixed at the top of the pressure plate; a plurality of first suction pipes are mounted at the top of the vertical cylinder; a dehumidification assembly is arranged on the mounting table; a rotating ring is arranged at the bottom of the mounting table; concave plates are arranged on the two sides of the rotating ring; the rotating ring rotates in the concave plate; circular grooves are evenly formed in the outer ring face of the rotating ring. A loosening assembly is arranged below the rotating ring; by arranging the feeding mechanism, the problem that air holes and needle holes are formed due to air and water vapor residues in molten melt can be effectively solved.

The invention relates to the technical field of papermaking and food packaging materials, in particular to a preparation method of full-degradable plastic-substituted high-strength food packaging paper. Preparing a fiber layer by taking plant fiber as a base material; the preparation method comprises the following steps: grafting a methyl methacrylate-butyl acrylate block copolymer on nano-cellulose through an atom transfer radical polymerization technology to prepare enhanced nano-cellulose; dialdehyde starch rich in aldehyde groups and chitosan are subjected to a Schiff base reaction to form a dynamic cross-linked network, polylactic acid microspheres modified by beta-cyclodextrin are introduced to serve as supramolecular enhancement units, and functional coating liquid is prepared; and finally, coating the functional coating liquid on the fiber layer, and drying, cross-linking and curing to obtain a finished product. Through cooperation of chemical grafting, dynamic covalent bonds and supramolecular action, the packaging paper is endowed with extremely high strength and toughness and excellent oil and moisture resistance and heat sealability, meanwhile, it is ensured that the packaging paper can be completely biodegraded in the natural environment, and functional replacement of traditional plastic packaging is successfully achieved.

The invention provides an edge coupling light emitting type 3D optical co-packaging preparation method supporting plastic packaging. The method adopts a 3D stacking scheme that an electric chip is arranged on the upper portion and an optical chip is arranged on the lower portion, and comprises the steps that S1, a plurality of rewiring layers and a micro bonding pad are prepared on the upper portion of the optical chip; s2, enabling the optical chip to be electrically connected with the electric chip through the multi-layer rewiring layer and the micro bonding pad; and S3, leading out signal input and output interfaces of the electric chip, the optical chip and the ASIC / switching chip downwards through silicon through holes in the optical chip, and realizing electric connection with the ASIC / switching chip through a substrate or an adapter plate. According to the invention, plastic package can be supported, the light emitting efficiency of the optical port is not influenced by a plastic package material after RDL and EIC bonding and plastic package processes are manufactured, the adhesion of the plastic package material or PI particles on the optical port during mechanical cutting is relieved, and the coupling efficiency is ensured.

The application relates to the field of high-barrier plastic packaging, and provides a high-barrier modified PVA / acrylic composite coating liquid and a preparation method thereof. The preparation method comprises the following components in percentage by weight: 10-30% of an aqueous acrylic emulsion, 2-10% of PVA resin, 1-5% of low-molecular-weight polyolefin resin containing a hydroxyl group, 1-5% of a crosslinking agent, 2-8% of a cosolvent, and 50-80% of deionized water. The modified PVA / acrylic composite coating liquid prepared through the method of chemical crosslinking and physical mixing can be coated on plastic film substrates such as PE, BOPP and PET, has excellent water-barrier and oxygen-barrier properties, has good substrate adhesion and storage stability, and can be widely applied to the fields of high-barrier packaging of food, medicine and the like.

The utility model provides a blow molding device for edible plastic packaging bottles, and belongs to the technical field of blow molding devices. Comprising a base, a blow molding machine is fixedly installed at one end of the top of the base, two symmetrical supporting plates are fixedly installed at the top of the base, hydraulic rods are installed on the opposite faces of the two supporting plates, and a mold is fixedly installed at the other ends of the hydraulic rods. A first supporting table and a second supporting table are fixedly installed on the top of the base and located on the same side of the sliding table assembly. Plastic bottles subjected to blow molding can be placed on the material plate, the first motor drives the first threaded rod to rotate, the sliding block drives the material plate to move to the lifting assembly, the plastic bottles and the scraping assembly are kept horizontal, bottle openings and bottle bodies are cleaned through the cutting knife, and the distance between the knife handles can be adjusted due to different positions during cleaning, so that the plastic bottles are scraped off. And the cutting knife can cling to the bottle body.

The invention discloses a high-barrier antibacterial plastic packaging film and a preparation method thereof, belongs to the technical field of film processing, and aims to solve the technical problem that the antibacterial property and barrier property of a plastic packaging film need to be further improved in the prior art. The composite material specifically comprises the following components in parts by weight: 60-80 parts of linear low-density polyethylene, 10-15 parts of a modified compatibilizer, 4-6 parts of a modified antibacterial capsule and 1-3 parts of an auxiliary additive. The preparation method comprises the following steps: oxidizing 2-methyl-2-acrylic acid-2, 2, 6, 6-tetramethyl-4-piperidinyl ester with sodium hypochlorite to obtain a modified precursor, and carrying out free radical polymerization reaction on the modified precursor, low-density polyethylene, glycidyl methacrylate and vinyl heptafluorobutyrate to form a compatibilizer with a block structure. The antibacterial property and barrier property of the plastic packaging film are improved, and the mechanical property of the plastic packaging film is also improved.

The utility model discloses a plastic package mould for electronic components, which comprises a table board, a fixed block and a lower mould are fixedly connected to the top of the table board, an upper mould is arranged above the lower mould, an electric cylinder is fixedly mounted at the bottom of the table board, and a first sliding plate is fixedly connected between the movable end of the electric cylinder and the upper mould. An injection molding opening is fixedly connected to the top of the upper mold, a sealing gasket is fixedly connected between the inner walls of the injection molding opening, a vertical plate is fixedly connected to the top of the fixing block, an injection molding box is arranged on one side of the vertical plate and located above the upper mold, and a feeding opening is fixedly connected to the top of the injection molding box; the bottom of the injection molding box is fixedly connected with an injection molding head. After the plastic package work of the electronic component is completed, the lifting assembly drives the injection molding box to be far away from the upper mold, and then the electric cylinder drives the upper mold to be far away from the lower mold, so that the electronic component subjected to plastic package molding is quickly demolded, and the plastic package efficiency of the electronic component is improved.

The invention relates to the technical field of plastic packaging product manufacturing, in particular to a blow molding device for plastic film production, which comprises a blow molding device, the blow molding device is integrated with a rolling section, the rolling section is provided with a rotating rod, the rotating rod is used for sleeving a collecting roll, one side of the collecting roll is provided with a groove, and the collecting roll is provided with a rotating shaft. An inclined groove is formed in one end of the groove; a rotating rod is arranged on the base, a sliding circular ring plate is slidably connected to the rotating rod, one side of the sliding circular ring plate is used for abutting against the collecting roll, a first rack is fixedly connected to the sliding circular ring plate, and the first rack is located in the rotating rod. In the using process of the blow molding device, a plastic film can be limited through the pressing plate, so that one end of the plastic film can be limited in the groove of the collecting roll, the plastic film can be firmly wound on the collecting roll when the plastic film is wound subsequently, and continuous and stable operation of a blow molding production line is guaranteed.

The utility model discloses a kind of plastic granulating equipment for food plastic packaging bottle production and processing, belong to plastic granulator field, conveying shaft and second driving device are equipped with shroud, the protection of scraper is realized by shroud, and the rapid discharge of plastic granulating material is guided by shroud, the upper end of shroud is connected with support, hot air drier is installed on support, the lower end of hot air drier is equipped with the second connecting cylinder communicated with shroud. Hot air drier utilizes inclined guide plate, hot air is directly blown to the material below scraper, and drying efficiency and material quality are significantly improved. This drying mode ensures the uniformity of material drying. The design of guide plate not only guides hot air, but also removes dust through dust-sticking paper, keeps hot air clean, prevents material pollution, prolongs equipment life, and reduces maintenance cost. The cooperation of guide mechanism and drying mechanism ensures smooth flow of material, avoids accumulation and blockage, improves equipment operation efficiency and stability.

The application provides a plastic packaging bag forming device, and relates to the technical field of plastic packaging bag forming. The device comprises a table top, the collecting mechanism comprises a sliding groove and a screw rod, a first servo motor is fixedly installed at the other end port of the screw rod, and a suction cup is fixedly installed at the output end of the servo electric cylinder. During the working process of the device, the collecting mechanism is added, the servo electric cylinder installed on the top surface is driven to synchronously displace through the moving block, then the external negative pressure device connecting end is connected to the bottom surface connecting end of the suction cup installed at the output end of the servo electric cylinder, the suction cup with negative pressure can effectively adsorb the blow molding packaging bag, safe collection is realized, time waste is reduced, and the collecting link of the packaging bag is solved. The device mainly relies on manual taking out of the blow molding packaging bag, manual collection is not only low in efficiency, but also easy to cause time waste, and the packaging bag may be damaged due to improper operation in the collecting process, thereby affecting product quality.

This invention discloses an aluminum-plastic packaging machine with a secondary rejection function, belonging to the field of packaging equipment technology. Specifically, it includes a main body and a frame. The main body is an existing machine, and the frame has a conveyor belt connected to the output end of the main body. Protective railings are provided on both sides of the conveyor belt, and a rejection channel is opened above the conveyor belt, penetrating through the protective railings on both sides. It also includes a pushing component, a detection component, a collection box, a collection component, and a positioning conveyor component. This invention constructs a fully automatic secondary rejection system that is completely compatible with the original aluminum-plastic packaging machine. It can receive rejection signals and alarm signals from the main body in real time. When the main body's single rejection is incomplete, triggering an alarm, the system automatically starts the secondary rejection program. Through the detection of the medicine plate arrival by photoelectric sensor one, the continuous rejection action of the pushing component, and the automatic collection by the positioning conveyor component, the fully automatic removal of residual unqualified medicine plates is completed.

A power semiconductor module preparation method includes forming a power semiconductor assembly by plastic packaging a power device, forming a first heat dissipation surface on a surface of the power semiconductor assembly, heating a first material between a first heat sink and the first heat dissipation surface, and cooling the first material of the first heat dissipation surface to connect the power semiconductor assembly and the first heat sink. The power semiconductor module preparation method makes the power semiconductor module by the form of plastic packaging first and then welding, so that the power semiconductor module has better integrity, can make the power semiconductor module have stronger waterproof performance, when the first heat sink of the power semiconductor module takes away heat through liquid cooling, the cooling liquid is not easy to penetrate into the power semiconductor assembly of the power semiconductor module, and the sealing performance detection can be performed in advance, thereby improving the reliability. The application also provides a power semiconductor module.

The invention discloses a gluing and gradient low-temperature pressing process for paper-plastic packaging, which comprises the following steps: S1, pretreating a base material: inspecting a printed paper-plastic composite base material, placing in a constant-temperature and constant-humidity environment for 20-24 hours, and balancing the moisture content to 5-7%; the base material is placed on a production line of a bag making machine, and the easy-to-tear line is formed through a magnetic knife; s3, point coating type gluing is conducted, specifically, a concave-convex tooth-shaped gluing roller is adopted, the heat sealing face of the paper-plastic composite base material is coated with the POE / PLA composite hot melt adhesive, and the gluing amount is 2.2-2.6 g / m < 2 >; and S4, pre-crosslinking treatment is conducted, specifically, UV irradiation is conducted on the glued base material, the irradiation wavelength is 254 nm, the irradiation time is 0.1-0.2 s, and the surface of the glue layer is preliminarily cured. The paper-plastic packaging gluing and pressing process which is low in gluing amount and gradient in low-temperature pressing, has an antibacterial function and is matched with a thin paper base material is adopted, and the paper-plastic packaging gluing and pressing process has the advantages of being low in glue overflowing rate, high in product percent of pass, capable of improving sanitation performance, stable in bonding performance and better in environmental protection performance.

The utility model belongs to the technical field of plastic packaging bag recovery, and particularly relates to a waste material recovery device for plastic packaging bag production, which comprises a rack, the left end and the right end of the rack are both fixedly connected with fixing lugs, the inside of each fixing lug is movably connected with a bolt, the top of the inner side of the rack is fixedly provided with a hydraulic cylinder, and the hydraulic cylinder is fixedly connected with the rack. The telescopic end of the hydraulic cylinder is fixedly connected with a guide plate, the guide plate is in sliding connection with the vertical part of the rack, the lower end of the guide plate is fixedly connected with a compression block, the guide plate and the rack are jointly provided with a positioning mechanism, and the rack is provided with a jacking mechanism. Through the arrangement of the hydraulic cylinder, the compression block and other structures, plastic packaging bags can be compressed, compacted and used, the plastic packaging bags can be conveniently recycled, under the action of the movable plate, the clamping hole, the clamping rod and other structures, the guide plate can be movably limited, and then the compression block is positioned and used.

The utility model provides a packaging box hot press forming device for food processing, which relates to the technical field of plastic packaging box processing and comprises a bottom support, the top end of the bottom support is connected with a supporting plate, and the bottom end of the supporting plate is fixedly connected with a top cooling component; a uniform cooling assembly; the uniform cooling assembly comprises a water pump fixedly connected to the bottom support, the output end of the water pump is fixedly connected with a water conveying pipe, the end, away from the water pump, of the water conveying pipe is fixedly connected with a fixed mold box, and a cooling cavity is formed in the fixed mold box. By means of the design, efficient heat absorption and dissipation are achieved, it is ensured that the whole packaging box body and the movable module can be evenly and stably cooled, a large amount of heat is absorbed and circulated through the cooling liquid circulation system and the cooling cavity, and then through the heat dissipation design that the top cooling assembly is combined with the fins, the heat dissipation plate and the condensation pieces, the heat dissipation efficiency is improved. And heat can be distributed more uniformly, so that the problem of insufficient heat dissipation of the top due to the fact that the heat conduction pipe can only cool on the side surface is avoided.

The application discloses a kind of integrated device and method of chip surface defect detection, sorting and tube packing, the integrated device includes chip flow pipe, flow pipe chip jam device, flow pipe block device, flow pipe separation device, chip flow pipe is inclinedly arranged, the flow pipe chip jam device, flow pipe block device, flow pipe separation device are spaced apart and installed in the side of chip flow pipe from high to low direction in turn along chip flow pipe, the end of the highest place of chip flow pipe is connected with the last end of chip production line, the end of the lowest place of chip flow pipe is connected with plastic packaging tube, chip flow pipe is installed with a movable rotating side door in corresponding position of flow pipe separation device, unqualified chip collection box is installed below side door, machine vision detection module is installed in the other side of chip flow pipe.The integrated device of the application can detect, sort and tube pack chips, realize high integration.

The invention provides a gallium oxide high-power device with efficient comprehensive heat dissipation performance and a manufacturing method of the gallium oxide high-power device. According to the invention, by thinning the substrate, the thermal resistance when heat flows through the substrate is reduced, the structure is more compact, and the packaging volume is reduced. And a double-sided packaging structure is used, and the anode and the cathode of the chip are simultaneously connected with the substrate by using solder, so that high heat conduction paths on the upper side and the lower side of the device are provided, an efficient double-sided heat dissipation channel is formed, and the junction-to-case thermal resistance and the junction temperature of the device are remarkably reduced. And meanwhile, the high-thermal-conductivity plastic packaging material is used, so that the heat dissipation capability is improved, and the packaging material is flexible after being cured, can effectively absorb and buffer thermal stress generated by mismatching of thermal expansion coefficients among materials, and is suitable for protecting ultrathin and brittle gallium oxide chips and preventing the ultrathin and brittle gallium oxide chips from being fractured and layered under stress. The device package can have lower junction temperature and thermal resistance and low stress, so that the gallium oxide device with excellent performance is obtained.

The invention discloses a CoWoS packaging technology for a GPU chip, and the technology comprises the following steps: S1, forming a glass substrate with a glass wafer as a temporary carrier, and coating a temporary bonding glue layer; s2, using a deep reactive ion etching technology to form a copper through silicon via, depositing an insulating layer and a barrier layer, patterning a metal wiring layer, and using a Cu Pin process to optimize TSV manufacturing to form a copper column interconnection structure; s3, forming a first EMC layer by using an epoxy molding compound; s4, the first EMC layer is thinned and flattened, the upper end face of the copper column is exposed, and the composition is defined as an intermediate layer; s5, making micro-bumps on the front surface of the interposer, and forming an insulating layer on the surface; and S6-S13, sequentially completing chip stacking, plastic packaging, glass substrate removal, C4 bump manufacturing, film pasting, cutting, butt joint and BGA ball implantation. According to the process, the TSV process is simplified through the CuPin process, the equipment investment is reduced by 40%, the productivity is improved by 30%, the process is compatible with the existing CoWoS-S process, and core equipment does not need to be transformed.

The utility model provides a packaging structure for preventing glue overflow of a PCB coil. The packaging structure comprises a frame main body, and a plurality of base islands, pins, the PCB coil and a plastic packaging layer which are arranged on the frame main body. The base islands are connected with the pins, the front surfaces of the base islands comprise mounting areas and half-etching areas, the half-etching areas are formed at the edges of the front surfaces of the base islands, and the half-etching areas and the mounting areas have height difference to form a stepped structure; the PCB coil is arranged in a mounting area on the front surface of the base island through an adhesive, the base island is not arranged below the middle part of the PCB coil, and the half-etching area is a glue overflowing area; and the PCB coil and the base island are coated by the plastic packaging layer. In the packaging structure disclosed by the utility model, when the PCB coil is mounted, redundant adhesive overflows towards the half-etching region; and after a plastic packaging layer of the packaging structure is formed in the later period, the phenomenon of layering of the packaging structure is avoided, the quality of the packaging structure is ensured, the efficiency is high, the packaging period of a product can be shortened, and the packaging cost of the product can be reduced.

The invention discloses a double-glove plastic packaging machine, and relates to the technical field of automatic packaging machinery, the double-glove plastic packaging machine comprises a conveying belt, and the top of the conveying belt is provided with a stacking mechanism for stacking gloves in pairs; an integrated system for automatically packaging gloves is arranged on the outer side of the conveying belt and comprises an upper discharging roller and a lower discharging roller which are symmetrically distributed on the upper side and the lower side of the conveying belt, an upper packaging film is wound on the outer side of the upper discharging roller, and a lower packaging film is wound on the outer side of the lower discharging roller. The end of the upper packaging film and the end of the lower packaging film are attached in a turning mode around a plurality of rotating shafts and penetrate through the middle of a pre-sealing machine, and a plastic packaging machine and a splitting machine are sequentially and horizontally distributed on the side face of the pre-sealing machine. The double-glove plastic packaging machine disclosed by the invention has the effects of high integration degree, multifunctionality and high operation completeness.

The utility model discloses a fry packing device which comprises a carriage body, walking wheels are arranged at the bottom of the carriage body, a fish outlet is formed in the upper section of the surface of the front end of the carriage body, a sliding way used for guiding fry to flow is obliquely arranged at the top in the carriage body, the sliding way is communicated with the fish outlet, and an oxygenation mechanism and a water collecting tank are further arranged in the carriage body. A film guide pipe communicated with the fish outlet is arranged at the front end of the outer surface of the trolley box body in the vertical direction, the film guide pipe is a hollow pipeline, and a film pulling mechanism used for providing a film is arranged at the front end of the top of the trolley box body; an upper plastic packaging mechanism and a roller mechanism are sequentially arranged at the front end of the vehicle box body below the fish outlet and on the two sides of the film guide pipe, and a lower plastic packaging mechanism is arranged below the roller mechanism to seal and cut the film; fry can be automatically packaged, manual operation is not needed, and intelligence of the fry breeding industry is promoted.

The utility model discloses an electric control system for preheating before starting, and belongs to the technical field of plastic package production auxiliary equipment. The system comprises a main power supply loop and a local control loop. In the main power supply loop, a live wire and a zero wire are connected to a contactor through a main switch, and the output end of the contactor is connected to a glue box; in the local control loop, the time relay is connected in parallel between the main switch and the contactor, and the time relay can control the on-off of the contactor; the glue box preheating device effectively solves the problem that the productivity is wasted as the glue box can be preheated only after a worker goes to work and cannot be started in the process of waiting for the completion of preheating at present.