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4118 results about "Plastic packaging" patented technology

Technology for full classification recycling treatment on household waste

The invention discloses a technology for full classification recycling treatment on household waste and relates to the field of recycling integrated utilization of household waste. A main process route of the technology comprises that household waste is homogenized by a homogenizer, is subjected to large object sorting (wherein large objects comprise large combustibles and inorganic matters), is treated by a bag breaking device (for scratching a plastic packaging bag), is treated by a magnetic separator (for separating out magnetic materials), is treated by an eddy sorting machine (for separating out nonferrous metals), is subjected to artificial sorting, then is broken, is fed into a hydrothermal degradation tank, is treated by a light material separator (for separating out papers and plastics), and then is crushed; then mixed organic matters and percolate are mixed and then are subjected to methane fermentation so that methane is produced; and methane residues and a methane liquid are prepared into an organic fertilizer and inorganic matters are prepared into a building material and the combustibles are prepared into a refuse derived fuel (RDF). The technology really realizes reduction, harmlessness and recycling of waste.
Owner:张希曾 +1

Wafer level fan-out chip packaging method

The invention relates to a wafer level fan-out chip packaging method, comprising the following technological processes: a stripping foil and a film dielectric layer I are sequentially covered on the surface of the wafer of a carrier, a photoetching pattern opening I is formed on the film dielectric layer I; a metal electrode and a re-wiring metal routing wire which are connected with a base plate end are arranged on the photoetching pattern opening and the surface thereof, a film dielectric layer II is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II is formed on the film dielectric layer II; a metal electrode connected with a chip end is arranged on the photoetching pattern opening II, after a chip is arranged on the metal electrode connected with the chip end in an inverting way, the injection molding of packaging material and solidification are carried out, so as to form a packaging body with plastic-packaging material; the wafer of the carrier and the stripping foil are separated from the packaging body with plastic-packaging material, so as to form a plastic-packaging wafer; a welding sphere back returns to form a welding ball salient point; cutting is carried out by uniwafers for forming the final structure of the fan-out chip. The method has low cost and a carrying function, and can well solve the problem that the chip is shifted in the technological process.
Owner:JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD

Base island lead frame structure and production method thereof

The invention relates to a base island lead frame structure and a production method thereof. The structure comprises a base island (1) and pins (2), wherein a first metal layer (4) is arranged on the front sides of the base island (1) and the pins (2); a second metal layer (5) is arranged on the rear sides of the base island (1) and the pins (2); the front sides of the pins (2) extend to the side of the base island (1) as much as possible; non-filler plastic packaging materials (3) are embedded in the peripheral regions of the pins (2), the region between the base island (1) and the pins (2) and the region between the pin (2) and the pin (2); and the non-filler plastic packaging materials (3) can connect the lower peripheral parts of the pins, the lower parts of the pins (2) and the lower part of the base island (1), as well as the lower part of the pin (2) and the lower part of the pin (2) into a whole and make the size of the back sides of the base island (1) and the pins (2) less than that of the front sides of the base island (1) and the pins (2) so as to form a structure, with a bigger upper part and a smaller lower part, of the base island and the pins. The base island lead frame structure and the production method thereof have the advantages of large restraint capacity of the plastic packaging body and the pins, reduction in cost, energy conservation and carbon reduction and reduction in waste.
Owner:JCET GROUP CO LTD

Full-automatic paper money clearing and packaging assembly line

The invention provides a full-automatic paper money clearing and packaging assembly line, structurally comprising a clearing and binding machine, a paper money sorting and transmitting mechanism, a stacking and wrapping machine, a paper money plastic packaging machine, a follow-up detecting and tidying mechanism, transmission belts and assorted sensors, wherein the clearing and binding machine, the paper money sorting and transmitting mechanism, the stacking and wrapping machine, the paper money plastic packaging machine and the follow-up detecting and tidying mechanism are sequentially arranged according to a technique flow order and are controlled by a main control management unit; and the transmission belts and the assorted sensors are arranged among the mechanisms. According to the main points, the paper money sorting and transmitting mechanism between the clearing and binding machine and the staking and wrapping machine refers to a sorting and transmitting channel formed by a middle transmission belt and parallel-connected double-channel transmission belts through bridge type connection. With the adoption of the automatic assembly line, paper money returned back to a bank can be automatically distinguished into ATM (Automatic Teller Machine) currency, circulation currency and damaged currency through a clearing and binding module according to a condition of the paper money, and then be automatically cleared up, boxed and put in storage through stamping, sorting, stacking, binding, labeling and plastically packaging without manual intervention, so that the high automation and the high production efficiency can be realized.
Owner:HEBEI HUIJIN ELECTROMECHANICAL

Small-carrier flat-four-side pin-less packaging part and preparation method thereof

The invention relates to a small-carrier flat-four-side pin-less packaging part, which comprises a lead frame carrier, a bonding sheet adhesive, an IC chip, a soldering-pan on the IC chip, a bonding line and a plastic-packaged body. The packaging part is characterized in that: before cutting separation, all inner pins extend inwards to connect with the carrier; a groove is formed between the carrier and the inner pins; the bottom parts of the inner pins are provided with grooves, and the backside of the carrier is provided with a circle of anti-flash groove. The packaging part is processed and produced through the process steps of thinning, scribing, chip loading, press welding, plastic packaging, electroplating, cutting and the like. The small-carrier flat-four-side pin-less packaging part has the characteristics that the carrier is reduced, the inner pins extend inwards to connect with the carrier before the cutting separation, the connection part of the inner pins and the carrier is provided with a 0.10 mm pit, the pin length outside the pit is 1 mm longer than that of a common QFN pin, and the lower part of the carrier is provided with a circle of the anti-flash groove which can prevent flashes from continuously dispersing towards the backside of the carrier.
Owner:TIANSHUI HUATIAN TECH

Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof

The invention discloses a multi-ring-arranged double-integrated circuit (IC) chip packaging piece and a production method thereof. The multi-ring-arranged double-IC chip packaging piece comprises a multi-ring quad flat no (QFN) lead frame with a carrier, an internal pin, IC chips and a plastic package body. The production method comprises the following steps of: thinning; scribing; adding the chips primarily; performing pressure welding; inversely adding the chips secondarily; filling the bottom and solidifying; performing plastic packaging and post solidifying; printing; separating pins; electroplating; separating products; testing the products; packing; and warehousing. Compared with a single-row lead frame with the same area as the multi-ring QFN lead frame, the multi-ring QFN lead frame increases the pins by over 40 percent, so that the requirements of high density and multiple input/output (I/O) packages are met; the chips are inversely added, so that the packaging piece has a small number of short welding lines, a short heat conduction distance and high radiation capacity; through the inverse addition of the chips, the capacitance and the inductance between protruding points and the pins are far lower than those of the welding lines between a chip welding disc and the pins, so that the influence on high frequency application is reduced; and the thickness of a QFN can be reduced to be below 0.5mm, so that the intersection and the open circuit of the welding lines are avoided and testing qualified rate and testing reliability are improved.
Owner:TIANSHUI HUATIAN TECH +1

Embedded silicon substrate fan-out type packaging structure and manufacturing method thereof

The invention discloses an embedded silicon substrate fan-out type packaging structure and a manufacturing method thereof. A silicon matrix is adopted to replace molding material to act as a fan-out matrix, and fine wiring can be manufactured by fully utilizing the advantages of the silicon matrix. Holes, grooves and other structures can be accurately etched by utilizing a mature silicon etching technology. Chips are embedded in the grooves on the silicon matrix, the gaps between the chips and the side walls of the grooves are filled by polymer glue and partial welded balls are welded at the surface of the silicon matrix in a fan-out way so that packaging reliability can be enhanced, the technology is simple and cost is low. The silicon matrix has great heat radiation and lower warping so that enhancement of packaging heat radiation is facilitated, adverse warping can be overcome and smaller wiring line width can be acquired, and thus the structure is suitable for high-density packaging. `Wafer plastic packaging and the de-bonding technology can be eliminated as for the aspect of technology so that technology difficulty can be reduced, and thus cost can be substantially reduced and yield rate can be enhanced.
Owner:HUATIAN TECH KUNSHAN ELECTRONICS

Banknote plastic packaging machine and banknote packaging method

The invention provides a banknote plastic packaging machine and a banknote packaging method. The banknote plastic packaging machine comprises a frame, an upper plastic film frame, a lower plastic film frame, a lifting mechanism, a driving system and a control system, wherein the frame is divided into a plurality of layers of mounting areas from top to bottom by a plurality of baffle plates; a primary plastic package unit is arranged in the mounting area between the upper plastic film frame and the lower plastic film frame and used for conducting primary plastic package on plastic packaged banknotes by a plastic film, and the secondary plastic package unit is parallel to the primary plastic package unit and is used for conducting the secondary plastic package on the plastic packaged banknotes by heat shrinkage films; the lifting mechanism is arranged in front of an L-shaped banknote pushing mechanism and used for conveying the plastic packaged banknotes subjected to secondary plastic package to a heat shrinkage furnace, and the heat shrinkage furnace is arranged below the lifting mechanism and used for conducting heat shrinkage treatment on the plastic packaged banknotes subjected to secondary sealing and cutting. According to the banknote plastic packaging machine, the banknote damaging rate is reduced, the banknote drawing can be avoided, the banknote storage quality is improved, the environment of the banknote storage warehouse is improved, the logistics management of the banknotes is facilitated, the volume of the machine is small, and the degree of automation is high.
Owner:ZHEJIANG ZHONGDA PACKAGING EQUIP +1
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