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2030 results about "Plastic packaging" patented technology

Detection system and method for packaging box production and processing

The invention discloses a detection system and method for packaging box production and processing, and belongs to the technical field of packaging production quality detection. The invention discloses a detection system and method for packaging box production and processing. The system comprises a dual-polarization-angle imaging module, a structured light three-dimensional reconstruction module, a temperature compensation module, a defect judgment module and a sorting execution module. According to the method, dual-polarization images and three-dimensional point clouds are synchronously collected, qualified standard values are dynamically calibrated in combination with temperature, accurate recognition and grading judgment of surface and internal defects of the transparent plastic packaging boxes are achieved, and finally unqualified products are removed through a high-speed sorting mechanism. The method solves the problem of misjudgment caused by reflective interference and temperature drift of the transparent material, and is suitable for online detection of a high-speed production line.
Owner:TAICANG HEFENG ARTS & CRAFTS CO LTD

Anti-aging plastic packaging material and preparation method thereof

The invention relates to the technical field of plastic packaging preparation, in particular to an anti-aging plastic packaging material and a preparation method thereof.The anti-aging plastic packaging material is prepared from, by mass, 100-140 parts of polylactic acid, 60-80 parts of PBAT, 2-5 parts of a composite anti-aging agent, 1-2 parts of a lubricant, 2-4 parts of a flame retardant and 3-6 parts of a compatilizer; the composite anti-aging agent comprises a modified anti-aging agent obtained by compounding functionalized montmorillonite and modified silicon dioxide, the functionalized montmorillonite is carnosic acid grafted rare earth ion modified montmorillonite, and the modified silicon dioxide is epoxy methyl oleate grafted silicon dioxide. According to the anti-aging plastic packaging material provided by the invention, a plastic material system with multiple protection mechanisms is constructed through the synergistic effect of all the components, and the prepared plastic packaging material not only keeps good biodegradability, but also has excellent ultraviolet light resistance and oxidation resistance.
Owner:浙江一鸣包装印刷有限公司

Stretch resistance detection device for plastic packaging bag

The invention relates to the technical field of plastic packaging bag tensile detection, and discloses a plastic packaging bag tensile detection device which comprises a processing platform, a storage cabinet is arranged in the processing platform, supporting legs are fixedly connected to the four corners of the bottom of the processing platform, and a tensile detection mechanism is arranged at the top of the processing platform; the four corners of a plastic bag are stably clamped through a screw rod, a movable clamping plate and a fixed clamping plate, cooperative movement of a motor sliding rail, a linear motor, a movable frame, a sliding rod and a first sliding block is matched, pulling force on the two sides is converted into pulling force in four directions through an inclined sliding groove and a second sliding block, and stretching resistance detection in the four directions is conducted on the plastic bag. According to the design, the limitation that only two-side stretching detection is adopted in the prior art is overcome, the tensile data of the plastic bag in different directions can be obtained, the tensile performance of the plastic bag can be comprehensively evaluated, a more accurate basis is provided for quality evaluation, it is ensured that the plastic bags with different purposes can bear the tensile force in the corresponding direction in actual use, and the detection precision is improved.
Owner:JIANSHI SUPER PLASTIC IND CO LTD

Plastic packaging barrel online defect detection method and system based on machine vision and deep learning

The invention provides a plastic packaging barrel online defect detection method and system based on machine vision and deep learning. According to the method, visible light and thermal image data, aligned in time, of the surface of the plastic packaging barrel are collected, the dynamic range of a thermal image is expanded to enhance the identification degree, then highlight interference is compensated through the mapping relation between a thermal image stable area and a visible light reflection area, and surface reflection suppression is achieved; superposing the processed dual-mode data to generate a multi-mode fusion image, dynamically adjusting the temperature reference value of the fusion image based on the thermal conductivity of the material and the environment temperature of the production line, and positioning an abnormal temperature region; and finally, extracting topological contours and temperature diffusion characteristics of the regions, and inputting a deep learning model to judge material structure attributes and spatial positions of the defects so as to finish online detection. According to the method, thermal and visual data are fused to enhance the perception capability on fine structure defects, and the precision and robustness of online detection of the plastic packaging barrel in a complex illumination environment are remarkably improved.
Owner:JIANGSHAN XINBAIFENG PLASTIC PACKAGE CO LTD

Pyrolysis recovery method for plastic packaging bags

The invention provides a pyrolysis recovery method of a plastic packaging bag, and belongs to the technical field of plastic packaging bag recovery, the pyrolysis recovery method of the plastic packaging bag comprises the following steps: removing impurities from the waste plastic packaging bag, cleaning and drying, and controlling the moisture to be below 5%; the packaging bag is crushed into small blocks with the diameter smaller than 20 mm, so that the pyrolysis efficiency is improved; feeding the crushed plastic into a pyrolyzing furnace through a spiral feeder, adding an auxiliary pyrolyzing component, heating to 300-600 DEG C under an oxygen-free or oxygen-deficient condition, and carrying out thermal cracking; oil gas obtained after pyrolysis is condensed through a cooling system and classified, and solid residues are subjected to tempering treatment; flue gas generated after combustion is subjected to high-temperature degradation through a secondary combustion chamber and then subjected to multistage treatment through a quench tower, dust removal, alkali spraying and activated carbon adsorption, and it is ensured that the flue gas reaches the standard and is discharged; the problems that in the existing pyrolysis recycling process of the plastic packaging bags, the treatment efficiency is low, and the environment is still polluted can be solved.
Owner:QINGDAO BEIGUO PLASTIC PACKAGING CO LTD

Batch dust-free sealing device for power semiconductor devices and use method of batch dust-free sealing device

The invention relates to the technical field of semiconductor packaging, in particular to a batch dust-free packaging device for power semiconductor devices and a using method of the batch dust-free packaging device for the power semiconductor devices, and the batch dust-free packaging device comprises a plastic packaging machine main body, a plastic packaging mold and a side frame, an upper plastic packaging mold and a lower plastic packaging mold are installed at the upper end and the lower end of the plastic packaging machine body respectively, a side frame is fixedly connected to one side of the plastic packaging machine body, a cleaning roller storage box is installed on one side of the side frame, and an electric push rod and an air supply and negative pressure unit are arranged in the cleaning roller storage box. Three-step dust-free cleaning of blowing, sucking and shaking is automatically carried out on a mold cavity after each time of plastic packaging; during air blowing, air is expanded and cooled twice through a conical barrel, the mold is synchronously cooled, and stubborn particles are stripped; negative pressure is formed on the surface of the cotton layer during air suction, and all residual scraps are sucked away; after cleaning is finished, the roller body returns to the storage box, the blocking block collides with the toothed plate to enable the roller body to jolt at high frequency, and attachments are shaken off into the box and are sealed and collected.
Owner:JIANGSU QUANLI MICROELECTRONICS CO LTD

Bamboo-plastic packaging material and preparation method thereof

The invention relates to the technical field of materials, and discloses a bamboo-to-plastic packaging material and a preparation method thereof, and the bamboo-to-plastic packaging material comprises the following components by weight: 60-70 parts of bamboo powder, 2-4 parts of maleic anhydride modified bamboo powder, 20-30 parts of polyethylene, and 2-3 parts of chitosan modified polyhedral oligomeric silsesquioxane. Adding the bamboo powder, the maleic anhydride modified bamboo powder, polyethylene and chitosan modified polyhedral oligomeric silsesquioxane into a double-screw extruder, blending for 10-15 minutes at the temperature of 180-185 DEG C, carrying out extrusion molding, and cooling to room temperature, so as to obtain the bamboo-to-plastic packaging material. The bamboo-instead-plastic packaging material disclosed by the invention has relatively good flame-retardant, antibacterial and stretch-proof effects.
Owner:SHENZHEN HUIYIFENG INTELLIGENT PACKAGING TECH CO LTD

Packaging box placing device for nutritious food production

The invention relates to the technical field of packaging box production, and discloses a packaging box placing device for nutritious food production, the device comprises a bottom plate, a plastic packaging box main body and supporting legs symmetrically and fixedly mounted at the bottom of the bottom plate, and side plates are symmetrically and fixedly connected to the front side and the rear side of the top of the bottom plate; a conveying belt is fixedly mounted below the interiors of the two side plates, placing mechanisms are uniformly arranged on the outer side surface of the conveying belt, and drying mechanisms are arranged on the sides, close to the conveying belt, of the side plates; the placing mechanism comprises a base plate and an arc-shaped block which are fixedly connected with the conveying belt, the drying mechanism comprises a driving unit and a drying unit, the driving unit comprises a rack, a gear part and a guide inclined plate slidably installed on one side of the interior of a side plate, and one side of the gear part is fixedly connected with a connecting rod; the problem that the plastic packaging boxes are adhered to the conveying belt or the patterns fall off due to the fact that the patterns of the plastic packaging boxes are not uniformly dried in an auxiliary mode during placing and conveying is solved.
Owner:YANTAI SAICHUN BIOTECHNOLOGY CO LTD

Photoelectric coupler

An optocoupler packaging support comprises a first support body and a second support body, the first support body comprises a first base island and a first pin, a first glue grabbing hole is formed between the first base island and the first pin, shading glue can be solidified and penetrate through the first glue grabbing hole, and the second support body comprises a second base island and a second pin. A second glue grabbing hole for curing and penetrating the shading glue is formed between the second base island and the second pin; in the plastic packaging process of the photoelectric coupler, the shading glue can flow through the first glue grabbing hole of the first bracket, so that the combinability between the shading glue and the first bracket is improved; the shading glue can flow through a second glue grabbing hole of the second bracket, so that the bonding property between the shading glue and the second bracket is improved; the sealing performance of the photoelectric coupler can be improved, and delamination failure caused by poor combination performance is avoided.
Owner:SHENZHEN ORIENT COMPONENTS CO LTD

Plastic packaging container conveying device for food production

The invention relates to the technical field of production and conveying, in particular to a plastic packaging container conveying device for food production, which comprises a conveying table, a surface treatment assembly and a negative pressure treatment assembly, a cleaning treatment groove is formed in one side of the upper end of the conveying table, and negative pressure suction grooves are formed in the upper ends, located on the two sides of the cleaning treatment groove, of the conveying table; according to the scheme, by means of the mode that negative pressure conveying and spiral interval conveying are combined, interval treatment and more stable conveying operation are carried out on plastic bottles, meanwhile, under the cooperative control effect of the control assembly, the surface treatment assembly and the negative pressure treatment assembly are made to be in one-to-one correspondence with the surface treatment assembly, the surface treatment assembly and the surface treatment assembly are made to be in one-to-one correspondence with the surface treatment assembly, and the surface treatment assembly and the surface treatment assembly are made to be in one-to-one correspondence with the surface treatment assembly. The surface quality of the conveying belt is effectively treated, the air pollution blocking problem possibly caused during negative pressure air draft is effectively maintained, and the conveying stability and applicability of produced and machined plastic bottles are improved.
Owner:TAIZHOU CHENGYANGJI FOOD MANUFACTURING CO LTD

Casting CPE composite membrane material and preparation method thereof

The invention relates to the technical field of plastic packaging films, in particular to a casting CPE composite film material and a preparation method thereof.The casting CPE composite film material is characterized in that a corona layer is prepared from, by weight, 72-75 parts of LLDPE, 18-22 parts of LDPE, 5-6 parts of EVA and 1.5-2 parts of an opening slipping agent; the middle core layer is prepared from the following components in parts by weight: 70 to 75 parts of LLDPE (Linear Low Density Polyethylene), 20 to 25 parts of HDPE (High Density Polyethylene), 5 to 8 parts of mPE, 3 to 5 parts of modified nano silicon dioxide and 1 to 3 parts of processing aid; the heat sealing layer is prepared from the following components in parts by weight: 25 to 30 parts of mLLDPE, 68 to 72 parts of LDPE, 0.3 to 0.5 part of antistatic agent and 1 to 2 parts of processing aid. The prepared composite film material has multiple functions of flame retardance, aging resistance, static electricity resistance and the like on the basis of keeping excellent heat sealing performance and mechanical strength.
Owner:QINGDAO WEIDONG PACKAGING CO LTD

Plastic package material defect detection method and system in radiation environment based on machine vision

The invention relates to the technical field of image processing, and discloses a plastic package material defect detection method and system in a radiation environment based on machine vision. The method comprises the following steps: acquiring an anti-radiation image in a gamma-ray environment through a lead-tungsten alloy shielding high-radiation tolerance type image sensor, and performing adaptive contrast enhancement. Defect features including microcracks, bubbles, deformation and chromatic aberration are extracted by using dual-tree complex wavelet transform and an HSV color space; and inputting the multi-dimensional features into an AR-DCNN network to carry out multi-task learning, identifying defect types and carrying out scoring. Based on Weibull distribution and a random forest algorithm, the radiation-resistant life of the plastic package material is predicted, and a material degradation curve and safety threshold early warning are obtained. According to the invention, standardized processing of the radiation damage quantitative index is realized, and the prediction accuracy is effectively improved.
Owner:GUILIN UNIV OF ELECTRONIC TECH +1

Quality analysis method of plastic packaging product

The invention relates to the technical field of quality analysis of plastic packaging materials, and particularly discloses a quality analysis method of a plastic packaging product, which comprises the following steps of: acquiring chemical composition information of a target material by adopting Fourier transform infrared spectroscopy and thermogravimetric analysis, and constructing an atomic-scale three-dimensional molecular model on the basis of polymer types and auxiliary ratio; auxiliary agent diffusion behaviors are simulated and tracked through molecular dynamics, and key transmission parameters are obtained; importing the parameters into a finite element model, establishing a multi-physics field coupling migration simulation model, and simulating the migration trends of the assistants under different environmental conditions; establishing a quantitative correlation model to predict the long-term stability of the material by combining accelerated aging experiment data; according to the method, the prediction precision of the service life and the function stability of the plastic packaging material is improved, the research and development cost is reduced, and the product quality consistency and the market competitiveness are improved.
Owner:XUZHOU HAITIAN PETROCHEM

Chip packaging structure and packaging method of copper-cylinder-free wafer

The embodiment of the invention discloses a chip packaging structure and packaging method of a copper-cylinder-free wafer. The chip packaging structure comprises a plastic packaging layer and a chip packaged in the plastic packaging layer. The chip surface of the chip is provided with metal pins, and the metal pins are electrically connected with multiple layers of circuits exposed out of the plastic packaging layer; and the metal pins are electrically connected with the multiple layers of circuits through metal ball structures manufactured by a ball mounting process. According to the chip packaging structure of the copper-cylinder-free wafer provided by the invention, Buffing packaging is replaced by ball mounting, and the metal ball structure is manufactured on the metal pin of the chip through a ball mounting process before circuit manufacturing, so that the manufacturing and connection of a subsequent circuit are not influenced, the problem that a small-size chip copper cylinder cannot be manufactured by Buffing packaging can be solved, the copper-cylinder-free wafer can be stably packaged, and the production efficiency of the copper-cylinder-free wafer is improved. The ball mounting process is completed during packaging, the overall production efficiency of the wafer is improved, and the packaging cost can be reduced by combining with PLP packaging.
Owner:CHENCHENCHEN TECH CO LTD

High-toughness plastic packaging film material and preparation method thereof

The invention provides a high-toughness plastic packaging film material and a preparation method thereof, and belongs to the field of metallocene polyolefin plastics. The high-toughness plastic packaging film material is prepared from the following chemical raw materials: 80 to 90 parts of metallocene polyethylene resin, 5 to 8 parts of supramolecular cross-linking agent, 6 to 10 parts of core-shell type modifier, 3 to 5 parts of ethylene-vinyl acetate copolymer, 2 to 4 parts of stearic acid modified nano calcium carbonate, 2 to 3 parts of polyolefin elastomer, 0.2 to 0.5 part of di (3, 4-dimethyldibenzylidene) sorbitol, 2 to 5 parts of thermotropic liquid crystal polymer and 0.4 to 0.7 part of antioxidant. 0.8 to 1.2 parts of a lubricant and 0.5 to 1.0 part of an antistatic agent. Through the compatibility design of a toughening mechanism, the synergistic balance of an enhancing mechanism and the optimization of transparency guarantee, the functions of all the components in a metallocene polyethylene resin matrix are complemented, and the ultrahigh toughness, high strength and high transparency of the film material are achieved.
Owner:HUBEI JINDE PACKAGING CO LTD

Conveying device for plastic packaging film production

The invention discloses a conveying device for plastic packaging film production, and relates to the technical field of plastic packaging film conveying. The conveying device for plastic packaging film production comprises a workbench, a guide rail beam installed on a ceiling of a workshop and two roller frame plates fixedly connected to the upper end face of the workbench in a bilateral symmetry mode, and a static electricity eliminator used for eliminating static electricity on the surface of a packaging film in the conveying process in a multiple mode is jointly arranged between the two roller frame plates. According to the packaging film winding device, the two ends of a packaging bag are automatically and evenly stuffed into the film roll while the packaging film roll is clamped through the clamping mechanism, pause caused by manual operation is eliminated, continuous operation of a production line is guaranteed, the production efficiency is improved, and the production efficiency is improved. The packaging standardization and consistency are ensured, the static electricity elimination in a larger range and more thorough mode is achieved through the multi-mode static electricity elimination mode of the static electricity eliminator, local static electricity residues are avoided, and it is ensured that the packaging film is conveyed smoothly.
Owner:CANGZHOU YUNFENG PACKAGING PROD CO LTD

Chip packaging structure and preparation method

The invention discloses a chip packaging structure and a preparation method, and relates to the technical field of chip packaging, and the method comprises the steps: providing a substrate, and forming a boss on a first surface of the substrate; a bridging circuit is formed on the top surface of the boss, and the bridging circuit and the boss form a bridging chip; forming a plurality of first conductive columns on the surface of the bridging circuit, and forming a plurality of second conductive columns on the etched first surface around the boss; a first plastic packaging layer is formed, a first interconnection circuit is formed on the surface of the first plastic packaging layer, and the top surfaces of the conductive columns are electrically connected with the first interconnection circuit; fixing a chip on the first interconnection circuit; forming a second plastic package layer; and thinning the second surface, removing other parts of the substrate except the boss, and exposing the bottom surface of the second conductive column. The bridging chip is directly and integrally formed on the substrate, so that the problem of overlay offset of the first interconnection circuit in the chip packaging process is solved, a debonding process is not needed, and meanwhile, high-density arrangement of the conductive columns is realized.
Owner:NAT CENT FOR ADVANCED PACKAGING CO LTD

Wide single rib sealing bag

The utility model discloses a wide single rib sealing bag which comprises a bag body (1), a first sealing rib (11) is arranged at the position of a bag opening of the bag body (1), the first sealing rib (11) comprises a first rib piece (2) and a second rib piece (3) which are located on the two sides of the bag body (1) respectively and connected with each other in a matched mode, and the first rib piece (2) comprises a connecting groove formed by a first keel (21) and a second keel (22). At least one separation strip (23) is arranged in the connecting groove and divides the connecting groove into at least two parts, and the second rib piece (3) comprises at least two rib strips connected with the connecting groove in a one-to-one correspondence mode. The plastic packaging bag has the advantages of being high in sealing performance and not prone to being torn.
Owner:TONGLU D UNIVERSE PLASTIC PRODS

Antistatic plastic packaging film and process for the production thereof

The application relates to the technical field of packaging films, and discloses an antistatic plastic packaging film and a preparation process.The antistatic plastic packaging film comprises 100 parts by weight of polyethylene, 1-6 parts by weight of phenolic resin polyaniline antistatic agent and 0.2-0.3 parts by weight of an antioxidant.The dodecyl succinic anhydride esterified phenolic resin contains carboxyl groups, can be used as a protonic acid, is doped into polyaniline through an in-situ polymerization reaction, makes imine nitrogen atoms of the polyaniline protonate, forms a charged excited state polaron, and thus the conductivity of the polyaniline is improved, the resistance of the polyethylene is reduced, and the antistatic performance of the packaging film is improved.The dodecyl succinic anhydride esterified phenolic resin and the doped polyaniline have good compatibility with the polyethylene, have a certain reinforcing effect on the polyethylene, and make the film material have higher tensile strength and elongation at break.
Owner:DONGGUAN SHUANGLONG PLASTIC PROD CO LTD

High-filling type II anhydrite / polyethylene composite packaging material and preparation method thereof

The invention discloses a high-filling type II anhydrite polyethylene composite packaging material and a preparation method thereof, and belongs to the technical field of plastic packaging materials. The composite material comprises modified gypsum which is coated by nano SiO2 and is synergistically modified by double coupling agents, and polyethylene serving as a base material, wherein the addition amount of the modified gypsum is 60%; a gradient temperature control twin-screw extruder is adopted for processing, during extrusion processing, the front-section temperature is 155-165 DEG C, the middle-section temperature is 185-195 DEG C, the rear-section temperature is 205-215 DEG C, and a gradient filler distribution material is formed after extrusion; the problems that under the condition of 60% high doping, II type anhydrite is difficult to disperse in a polyethylene base material, and under the condition of high doping, the material surface is rough are solved.
Owner:ZHONGKE XIANGRUI (YUNNAN) NEW PACKAGING MATERIALS CO LTD

Detection device for plastic packaging bag production

The invention discloses a detection device for plastic packaging bag production, and belongs to the field of plastic packaging bag production, and the detection device comprises a first threaded cylinder, the interior of the first threaded cylinder is rotatably connected with a threaded rod in a threaded manner, the two sides of the first threaded cylinder are fixedly connected with first baffles, and the end, away from a rotating handle, of the threaded rod is rotatably connected with a second threaded cylinder. The bottom end of the second threaded cylinder is fixedly connected with a circular bottom support, the end, away from the second threaded cylinder, of the telescopic rod is fixedly connected with the circular bottom support, the bottom end of the circular bottom support is fixedly connected with a first tension sensor, the lower side of the first tension sensor is fixedly connected with a fixing plate, and the fixing plate is slidably connected with the first tooth-shaped clamping plate. And a lower clamping assembly is assembled at the bottom end of the inner wall of the box body. According to the plastic packaging bag tensile strength testing device, the tooth-shaped clamping plates are arranged to clamp a plastic packaging bag, and meanwhile, the tooth-shaped clamping plates are matched with the hydraulic assembly, so that the effects of clamping the plastic packaging bag and testing the tensile strength of the plastic packaging bag by using mechanical force instead of manpower are achieved.
Owner:YINGKOU PAT TECHNOLOGY CO LTD

A device for detecting the tenacity of a plastic packaging bag

The present application relates to the technical field of plastic packaging bag production, and particularly relates to a plastic packaging bag tenacity detection device. The device comprises a fixing unit, which is provided with a multidirectional detection unit at the bottom; the multidirectional detection unit comprises a lower installation cylinder, which is communicated with an operation cylinder at the bottom; the diameter of the operation cylinder is larger than that of the lower installation cylinder, and the ports at the upper and lower ends of the operation cylinder are both provided with arc surfaces; a plurality of groups of plate feeding mechanisms are arranged in annular array on the arc surfaces. The present application allows each group of radiation pressing plates to spread radially to each direction and support the plastic packaging bag from the inside. When the fourth slide group at the bottom is lowered, the lower pressing strip is pushed down, and the plastic packaging bag is given a pushing force from the bottom, and the radially spread plastic packaging bags are combined to realize omnidirectional pressing of the plastic packaging bag. The detection busy point is avoided, and the detection accuracy is improved.
Owner:NANTONG MIKE PACKAGING TECH CO LTD

High-precision short-wave infrared hyperspectral imaging soil plastic in-situ detection method and device

The invention discloses a high-precision short-wave infrared hyperspectral imaging soil plastic in-situ detection method and a high-precision short-wave infrared hyperspectral imaging soil plastic in-situ detection device. The device is carried on an unmanned aerial vehicle or an indoor detection platform, large-range short-wave infrared hyperspectral imaging is carried out on soil, data are input into a multi-scale three-dimensional convolution instance segmentation network, space-spectrum dual-mode feature extraction is fused in the network, pixel-level classification of a plastic target under the complex soil background can be achieved, and the detection accuracy is improved. Even if the plastic is partially blocked or fragmented, the plastic can be effectively identified. And performing statistics on types, densities, spatial distribution and material traceability information of plastics in the soil area, and generating a plastic distribution space diagram for environmental plastic recovery path planning. Through the recognition technology, the efficient sorting capacity of the plastic packaging waste is improved, and the defect that in-situ classification recognition precision of mixed, colored or polluted plastic is poor in a traditional recycling method is overcome.
Owner:ZHEJIANG UNIV

Plastic wrap container

A wrap container having a body including a front wall, a rear wall, a top wall, and a bottom wall forming an enclosure. A roll of wrap is disposed within the enclosure. The top wall has a perforated section. A folding surface has a top surface and a bottom surface with a cutter assembly including a track and a slidable cutter attached to the bottom surface of the folding surface. The cutter assembly has a first retracted position in the enclosure and a second deployed positon folded out of the opening.
Owner:CUTTING EDGE PACKAGING SOLUTIONS LLC

Packaging method of power diode

The invention relates to the technical field of electronic device packaging, in particular to a power diode packaging method which comprises the following steps: S1, pretreating silica gel into a fluid state and adjusting the dynamic viscosity value of the silica gel to a preset range; s2, adding fluid protection glue into the coating system for dispensing, and performing thinning operation and leveling operation by using a scraper to form a flexible packaging layer; s3, judging whether the flexible packaging layer has defects or not and the specific types of the defects, repairing the defects and adjusting operation parameters of a coating system to obtain a gluing assembly; s4, the gluing assembly is placed in a curing chamber to be heated and cured, and a packaged product is obtained; and S5, performing rib cutting forming on the packaged product to obtain the packaged power diode. According to the packaging method of the flexible packaging layer, the overall thickness of the power diode is controlled to be below 0.8 mm, meanwhile, mechanical stress in the plastic packaging process is avoided, and the packaging defect rate is reduced.
Owner:NANTONG BAIKEXIN ELECTRONIC TECH CO LTD

Degradable antibacterial plastic packaging bag and preparation method thereof

The application belongs to the technical field of plastics, and particularly relates to a degradable antibacterial plastic packaging bag and a preparation method thereof. The degradable antibacterial plastic packaging bag comprises the following raw materials in parts by weight: polycaprolactone 70-90 parts; polybutylene adipate terephthalate 20-40 parts; Cr and Cu co-modified ZIF-8 5-20 parts; and cerium oxide tannic acid material 2-6 parts. The Cr and Cu co-modified ZIF-8 synergistically improves the antibacterial performance of the packaging bag, and the addition of the cerium oxide tannic acid material further improves the antibacterial performance of the packaging bag. Moreover, the degradable antibacterial plastic packaging bag prepared by the application has excellent mechanical properties.
Owner:GUANGZHOU SENJIAN NEW MATERIAL TECHNOLOGY CO LTD

Vehicle gauge chip integrated packaging and manufacturing process based on etching technology

The invention discloses a vehicle gauge chip integrated packaging manufacturing process based on an etching technology. The vehicle gauge chip integrated packaging manufacturing process comprises the following steps: step 1, designing and preparing a substrate; step 2, preprocessing the chip; step 3, chip mounting and interconnection are carried out; step 4, plastic packaging and molding; 5, heat dissipation and reinforcement are carried out; step 6, image rotation correction and defect detection; step 7, performing post-working procedures and testing; high-density interconnection such as TSV (through silicon vias), RDL (redistribution layer) and micro bumps is realized by using an etching technology, the interconnection density is remarkably improved, the RDL wiring layer manufactured by using the etching technology has the line width less than 2 microns, high-density interconnection on the surface of a chip is realized, the integration level is further improved, the micro-channel is manufactured in the plastic package layer by using the etching technology, and the packaging efficiency is improved. And the copper radiating fins are embedded, so that the radiating efficiency is effectively improved, the problem of local heat accumulation caused by integration of the power chip and the logic chip is solved, a gap between the chip and the radiating cover plate is filled with a thermal interface material with high thermal conductivity, and the thermal resistance is reduced.
Owner:HUBEI UNIV OF AUTOMOTIVE TECH

Plug-in type plastic packaging box

The utility model relates to a plug-in type plastic packaging box which comprises a box body, the top of the box body is open, the bottom of the box body is sealed, a plug-in part is further arranged at the bottom of the box body, the diameter of the plug-in part is smaller than that of the top opening of the box body so that the plug-in part can be plugged in the top opening of the box body to be stacked, and ribs are further arranged at the bottom of the inner side wall of the box body. The box bodies are connected with packaging inner cores in a clamping mode through ribs, the packaging inner cores are inserted into the box bodies and are in clearance arrangement with the inner walls of the box bodies, and the clamping frames are connected to the bottoms of the two box bodies in a clamping mode so that the two adjacent box bodies can form a whole. The box has the advantages that when the two box bodies are stacked, the inserting portion at the bottom of the upper box body can be inserted into the opening of the lower box body, the first table top is attached to the second table top after inserting is completed, the supporting effect is achieved, the stacking stability can be improved, meanwhile, the clamping frame is clamped between the two box bodies, the box bodies are integrated, and the box is convenient to use. Therefore, the forklift is not prone to toppling over during unloading.
Owner:QUANZHOU HONGYUAN PLASTIC PROD CO LTD

Kitchen waste treatment device

The utility model relates to the technical field of kitchen waste treatment, in particular to a kitchen waste treatment device which comprises a machine body, a kitchen waste throwing opening and a plastic packaging box throwing opening are formed in the machine body, a recycling frame, a bearing frame and a crushing shell are fixedly installed in the machine body, and a liquid treatment bin is fixedly installed on the lower inner wall of the machine body. The liquid treatment bin is communicated with the bottom of the recovery frame, and a compression assembly is arranged in the machine body; a filter screen is fixedly installed in the recycling frame, a pushing assembly is arranged on the recycling frame and comprises an electric push rod fixedly installed on the inner wall of one side of the machine body, and the driving end of the electric push rod is fixedly connected with a push plate. The activated carbon filter layer can filter gas, prevent peculiar smell air from drifting to the outside air and prevent air pollution, and is beneficial to recycling of the packaging plastic box and treatment of kitchen waste.
Owner:QINGDAO XINHAOYU TECH CO LTD

Vertical packaging bag bagging machine

The invention relates to the field of packaging machinery, and discloses a vertical packaging bag bagging machine which comprises a working platform, an inserting plate with a power source is arranged above the working platform, a plastic packaging bag stock bin is arranged on the other side of the working platform, a swing arm with a suction nozzle is arranged below the stock bin, and a bag body clamping and moving device is further arranged below the working platform. The bag body clamping and moving device is provided with clamping plates and further provided with a power source enabling the clamping plates to move up and down, the clamping plates clamp plastic bags filled with materials when ascending to the high position, top bag openings of the plastic bags can be located at heat sealing heads of the heat sealing device when the clamping plates descend to the low position, and the clamping plates shuttle in a receding channel formed by the heat sealing heads. And the plastic bag filled with the materials is subjected to heat sealing at the second position clamped by the clamping plates. A bag body is fixed in the whole process from the time when a material bag enters a plastic bag to the time when a bag opening is sealed through the clamping and moving device, so that the bag surface of the plastic bag is flatly sealed, and bottom wrinkles caused by the fact that a traditional stop block drags the bag bottom are avoided.
Owner:WENZHOU JIACHENG MACHINERY