4511results about How to "Improve yield" patented technology

The invention provides a method and system for analyzing defects in wafer manufacturing based on big data, and relates to the technical field of big data, and the method comprises the steps: collecting technological parameter information, defect scanning images and manufacturing process data information, and carrying out multi-scale feature pyramid network processing and fusion to obtain fusion features; the fusion features are analyzed through a deep learning network, the deep learning network adopts a multi-task learning framework to complete a defect classification task, a defect segmentation task and a defect evolution prediction task at the same time, consistency loss based on graph matching is introduced, and a defect type recognition result and a feature map of defect space distribution are obtained; based on the characteristic spectrum, when it is detected that the process parameters are abnormal, analyzing historical defect data by using a graph neural network containing a time sequence attention mechanism; technological parameter constraint conditions are set in combination with an expert knowledge base, and technological parameters are adaptively adjusted through a reinforcement learning method. According to the invention, the accuracy of defect detection and classification is improved.

The invention provides a wafer factory-level real-time scheduling method in semiconductor manufacturing based on deep reinforcement learning, which relates to the technical field of semiconductors, and comprises the following steps: constructing a state space vector by collecting equipment state, batch information and process flow information based on deep reinforcement learning, inputting a pre-trained deep reinforcement learning network model, and constructing a state space vector; the model includes a value assessment network and a policy network. The model generates matching probability distribution of batches and devices, a hierarchical reinforcement learning method is adopted to decompose the distribution into two sub-tasks of batch selection and device allocation, and a plurality of candidate matching schemes are generated. And then evaluating the candidate schemes by applying a multi-target reward and punishment function, selecting an optimal scheduling scheme in combination with a Monte Carlo tree search algorithm, and issuing a processing instruction. And real-time processing data is collected in the working procedure processing process to update the state space vector, so that real-time scheduling is realized.

The invention discloses an AI-driven gold bonding wire process parameter optimization method and system, and relates to the technical field of semiconductor packaging, and the method comprises the steps: building a dual-channel deep learning network of a bonding process; the dual-channel deep learning network comprises a dynamic parameter optimization channel and a static parameter optimization channel; inputting bonding process dynamic data collected in real time and preset bonding process static data into the dynamic parameter optimization channel to obtain a dynamic process evaluation index; inputting preset bonding process static data into the static parameter optimization channel to obtain a static process evaluation index; and fusing the dynamic process evaluation index and the static process evaluation index through an adaptive weight fusion algorithm to obtain a comprehensive evaluation index, and optimizing the bonding process parameters. According to the invention, dynamic and static data are integrated through a dual-channel deep learning network architecture, intelligent and accurate optimization of bonding process parameters is realized in combination with an adaptive weight fusion algorithm, and the bonding quality and process stability are significantly improved.

The invention provides a high-speed communication storage electric connector, which comprises an insulating body, the insulating body is provided with a lengthwise slot which is concavely arranged downwards from the top surface and is used for inserting an electronic module, and a plurality of terminal slots are respectively arranged in lengthwise side walls on two sides of the slot; the plurality of terminals are respectively accommodated in the corresponding terminal grooves in the two lengthwise side walls in a one-to-one correspondence manner, at least one part of the terminal grooves are internally provided with double-layer terminals, and the other terminal grooves are internally provided with single-layer terminals; the double-layer terminal comprises a lower-layer terminal and an upper-layer terminal, the upper-layer terminal of the double-layer terminal is downwards inserted and fixed in the terminal groove from the top of the insulating body, and the lower-layer terminal of the double-layer terminal is upwards inserted and fixed in the terminal groove from the bottom of the insulating body; the single-layer terminals are inserted and fixed in the terminal grooves upwards from the bottom of the insulation body or inserted and fixed in the terminal grooves downwards from the top of the insulation body. According to the high-speed communication storage electric connector, signal transmission channels can be increased, so that the signal transmission speed is greatly improved, and high-speed automatic plug end production can be realized.

The invention relates to the technical field of part typesetting, in particular to a nesting typesetting mixed common-edge analysis method and system based on laser cutting. The method comprises the following steps: obtaining initial typesetting part structure data, and carrying out part common-edge relation analysis to obtain part common-edge relation data; common-edge path optimization is carried out according to the initially-typeset part structure data, and optimized part cutting path data is obtained; performing laser cutting simulation based on the optimized part cutting path data to obtain laser cutting simulation data; performing typesetting heating balance optimization according to the laser cutting simulation data so as to obtain optimized part typesetting data; and performing cutting waste rate evaluation on the optimized part typesetting data to obtain typesetting cutting waste rate data, and performing minimum cutting waste rate optimization on the optimized part typesetting data based on the typesetting cutting waste rate data to obtain optimal part typesetting data. The cutting efficiency and precision are improved.

The invention relates to the technical field of screen printing, in particular to a PCB screen printing ink layer thickness uniformity control method, system and device and a medium. The method comprises the following steps: firstly, collecting ink layer actual thickness data and screen tension data of a PCB screen printing area, then analyzing the relevance between the two data to obtain an ink layer uniformity analysis result, further determining proper compensation parameters through process compensation analysis, finally dynamically adjusting screen printing pressure, scraper angle and printing speed, bringing screen tension into a control system, and finally, controlling the screen printing uniformity. Compared with the prior art, the method has the advantages that the adaptability and the reliability are higher, and the product yield can be improved.

The embodiment of the invention relates to the field of photovoltaic technology, and provides a solar cell and a preparation method thereof, so as to improve the photoelectric conversion efficiency of the solar cell comprising a fragmented cell, greatly reduce the mechanical damage of the fragmented cell, greatly reduce the hidden crack possibility of a photovoltaic module comprising the fragmented cell, and improve the production efficiency of the photovoltaic module. And the product yield is further improved. The preparation method of the solar cell comprises the following steps: providing a whole solar cell; a first laser device is adopted to form positioning grooves in the two ends of the to-be-segmented area respectively; a second laser device is adopted to heat the to-be-segmented area from the positioning groove until the other positioning groove is finished; spraying cooling liquid to the heated to-be-segmented area by adopting a spraying device, so that the whole solar cell is cracked in the to-be-segmented area along the first direction to form at least two segmented cells; the cooling liquid comprises oxidizing substances, and the cross section is a surface hydroxylated silicon surface; and forming a passivation layer on the fracture surface.

The invention discloses an automatic control method and system for water-based gravure ink production, and relates to the technical field of production control. An automatic control system for water-based gravure ink production comprises a formula acquisition module, a raw material configuration module, a dynamic adjustment module, a performance detection module, a finished product detection module and a record optimization module. The production batches in the production schedule are automatically obtained, the corresponding ink formula is matched, it is guaranteed that the raw material demand quantity of each production batch is accurately calculated, human errors are reduced through automatic configuration and accurate metering of the raw materials, and high efficiency and consistency of production are guaranteed; the temperature and the viscosity are monitored in real time in the mixing process, and the stirring time and the stirring power are dynamically adjusted according to the standard curve, so that the mixing process is optimized, the stability and the consistency of product performance are ensured, and meanwhile, the production period is shortened.

The invention relates to the technical field of machine vision, in particular to a stainless steel pipe production intelligent detection system based on machine vision, which comprises a shape evaluation module, a welding quality detection module, a welding quality analysis module, a pipe surface evaluation module, a cutting evaluation module, a process evaluation module and a management database, the system obtains the shape conformity degree of the stainless steel pipe according to the shape parameters of the stainless steel pipe, obtains the weld quality evaluation coefficient of the stainless steel pipe according to the weld defect parameters of the stainless steel pipe, and obtains the surface smoothness degree of the stainless steel pipe according to the surface parameters of the stainless steel pipe. The cutting evaluation coefficient of the stainless steel pipe is obtained according to the appearance parameters of the cutting face of the stainless steel pipe, then the procedure evaluation index of the stainless steel pipe is obtained through comprehensive analysis, the procedure evaluation index is fed back, unqualified products can be reduced, the yield is increased, and it is guaranteed that the performance of the produced pipe is consistent in all aspects.

The invention discloses a forming mold of a hand bag and a forming mold assembly. The forming mold comprises a mold body, two first side walls, two second side walls, a bottom wall and two bag body limiting assemblies, wherein the two first side walls, the two second side walls, the bottom wall and the two bag body limiting assemblies are arranged on the mold body. Wherein the two first side walls are matched with the two front faces of the hand bag respectively, the two second side walls are matched with the two side faces of the hand bag respectively, the bottom wall is matched with the bottom face of the hand bag, and the two bag body limiting assemblies are matched with the two first side walls respectively, so that the bag opening of the hand bag can be folded and inserted; when the device is applied to forming equipment of the hand bag, synchronous forming of a bag body and a bag opening folded edge can be achieved, and the production efficiency and the yield of the hand bag can be improved at the same time.

The invention discloses a die-casting process parameter adjusting method and device, electronic equipment and a storage medium. The method comprises the steps that a current die in the die casting process is obtained, whether the current die is replaced or not is detected, and a die replacement detection result is obtained; according to the die replacement detection result, whether die-casting process parameters are adjusted or not is judged; when the die casting interruption is monitored, acquiring interruption duration; according to the interruption duration, whether the die-casting process parameters are adjusted or not is judged; the real-time molten metal temperature is obtained; according to the real-time molten metal temperature, whether the die-casting process parameters are adjusted or not is judged; the real-time ladle casting frequency of the current casting is obtained; according to the real-time ladle casting times, whether the die-casting process parameters are adjusted or not is judged; and die-casting at least one casting by adopting the die-casting process parameters. According to the embodiment of the invention, the stability and production efficiency of die-casting products can be improved.

The invention provides an optical proximity correction method which is applied to the technical field of semiconductors. In the invention, aiming at some special areas in the target layout, such as the condition that only one auxiliary graph can be added between adjacent main graphs, a new auxiliary graph adding mode and the auxiliary graph after shape adjustment are provided; specifically, an initial auxiliary graph with the width equal to that of a main graph is added between adjacent main graphs of a target main graph group, the graph density of the main graphs in a target layout is changed, sparse graphs also have the characteristics of dense graphs, then the added initial auxiliary graph is adjusted, and the graph density of the main graphs in the target layout is changed. And changing the initial auxiliary pattern into a target auxiliary pattern with a plurality of spacing gaps inside, so as to reduce the actual width of the target auxiliary pattern by using the spacing gaps, reduce the light intensity value of diffracted light at the target auxiliary pattern during exposure and development, improve the normalized logarithmic slope of the main pattern, reduce the edge placement error (EPE) and enlarge the process window.

The invention relates to the technical field of mold machining optimization, and discloses a mold machining optimization method, system and device and a storage medium. The method comprises the steps that design parameters of a mold are obtained and input into simulation software, and a mold product model is generated; performing parameter optimization through mold flow analysis to obtain optimized design parameters; actual production parameters are calculated according to the optimized parameter values, and key parameter values in the production process are recorded; and finally exporting and displaying an optimization result, and determining an optimal design value. The method has the following effects that through simulation analysis and multiple iterative optimization, the efficiency of mold design and the injection molding process is effectively improved, the precision and quality of product forming are ensured, and intelligent monitoring and optimized display of the production process are achieved.

The invention relates to the technical field of industrial intelligent manufacturing, in particular to a flexible production line appearance defect optical detection method. Comprising the steps of performing image acquisition on semi-finished products and finished products on a production line; carrying out preprocessing and spatial transformation on the collected image; performing feature extraction and clustering analysis on the positive sample image of the to-be-detected product by using unsupervised learning to form a feature library; comparing the feature vector of the to-be-detected image with a feature library, and outputting the defect position and type of the sample; an improved RTDETR model with supervised learning is adopted, a sample judged as a defect is used for training, and the improved RTDETR model adopts a ResNet and Visual Transform network structure; and performing real-time detection and result feedback on the deployment model. According to the technical scheme, the appearance defect detection efficiency and the product quality of products manufactured on the flexible production line can be improved.

The invention provides a superlattice infrared detector chip manufacturing method, and belongs to the technical field of infrared detector manufacturing. The problem that the product performance or the product yield is low due to the fact that the precision fluctuation of the photoetching technology when the hard mask is removed is not considered in the current hard mask removing scheme is solved; comprising the following steps: forming a hard mask: growing the hard mask with a certain thickness on the surface of a wafer made of a superlattice material; photoetching an upper electrode table top; etching a hard mask: taking the photoresist as a mask, and etching the hard mask by adopting an ICP (Inductively Coupled Plasma) technology to obtain an upper electrode mesa mask pattern; degumming and cleaning an upper electrode table board; photoetching a lower electrode table board: adopting photoresist as a mask of a lower electrode table board area, and manufacturing the lower electrode table board area through a photoetching technology; carrying out ICP etching on the table board; performing wet etching on the table board; degumming and cleaning a lower electrode table board; forming a passivation layer film; opening holes in the passivation layer; manufacturing a gold electrode; the method is applied to preparation of the superlattice infrared detector chip.

The invention discloses a conformal antenna component manufacturing system and method based on cross-scale space-time frequency shaping femtosecond laser, and belongs to the technical field of micro-nano machining. The system comprises an ultrafast laser excitation module, a laser pulse time / frequency shaping module, a pulse detection module, an online monitoring module and a focusing high-speed scanning galvanometer module. By means of the system, high-selectivity, large-breadth and three-dimensional precision machining of conformal antenna circuit patterns is achieved, and it is ensured that a substrate is not damaged. The femtosecond laser time-frequency shaping technology is combined in the machining process, layered scanning and accurate removal of the heterogeneous multilayer structure are achieved through an adjustable pulse sequence and a high-speed galvanometer system, and the problems that in the prior art, materials are damaged, and the size precision is low are solved. The device further integrates an on-line depth monitoring function, the machining efficiency and the forming quality are remarkably improved, and the device is suitable for high-precision patterning machining of complex curved surface heterogeneous thin film materials.

The utility model discloses a film tearing mechanism which comprises a driving assembly, a first clamping piece, a second clamping piece, a first supporting piece and a second supporting piece. The first clamping piece and the second clamping piece are connected with the driving assembly and are oppositely arranged, and the first clamping piece and the second clamping piece are driven by the driving assembly to clamp or loosen the pasting film and tear off the pasting film under the driving of the driving assembly when the pasting film is clamped; the first supporting piece is arranged on the first clamping piece and extends towards the second clamping piece, and the first supporting piece is provided with a first supporting part; the second supporting piece is arranged on the second clamping piece and extends towards the first clamping piece, the second supporting piece is provided with a second supporting part, the first supporting part and the second supporting part are oppositely arranged, and the first supporting part and the second supporting part are far away from each other when the first clamping piece and the second clamping piece get close to each other so as to support the torn film; and when the first clamping piece and the second clamping piece are far away from each other, the first clamping piece and the second clamping piece get close to each other to break away from the torn film. The film tearing mechanism can improve the film tearing efficiency and the film tearing yield.

The invention discloses a negative electrode slurry cracking reduction method, which specifically comprises the following steps: S1, negative electrode slurry formula improvement: on the basis of original raw materials of negative electrode slurry: graphite, a conductive agent, a thickening agent, a binder and deionized water, adding a specific additive-N-methyl pyrrolidone accounting for 0.5% of the total weight of the raw materials; the invention relates to the technical field of battery manufacturing. According to the method for reducing the cracking of the negative electrode slurry, coating cracking is remarkably reduced: by adding NMP in a specific proportion, the problem of coating cracking of the negative electrode slurry is effectively improved, and the yield and quality of a negative electrode plate are improved; the cracking-free negative plate can maintain better structure and performance stability, and is beneficial to improving the overall performance and prolonging the service life of the lithium ion battery; the rejection rate and the rework rate caused by cracking are reduced, and the production cost and resource waste are reduced; nMP is used as a common solvent and is widely applied to the battery manufacturing industry.

The invention provides a display device and a manufacturing method thereof, the display device comprises a supporting layer, an adhesive layer, a protective film, a display panel, a polarizing layer, an optical adhesive layer and a cover plate which are sequentially stacked, and the supporting layer is a composite material layer formed by hot pressing of a metal layer and a carbon fiber layer; according to the flexible module, the supporting layer is arranged to be the composite material layer of the metal layer and the carbon fiber layer, the surface flatness of the flexible module can be improved, and meanwhile due to the fact that the rigid material such as the metal layer is added, the front face impact resistance of the module can be improved; the thickness of one adhesive layer can be removed, the purpose of module thinning is achieved, the composite adhesive force between the metal layer and the carbon fiber layer is better than the effect that the metal layer and the carbon fiber plate are assembled through single body attachment, and the risk of module stripping can be reduced. According to the display device and the manufacturing method thereof, the structure is simple, manufacturing is convenient, stability is high, cost is low, the product weight can be effectively reduced, and meanwhile the display effect is improved.

The invention relates to the technical field of solar cells, in particular to a back contact solar cell, a preparation method thereof and a cell assembly, a mixed metal electrode structure is adopted, a fine gate electrode in an overlapping area of a main gate electrode and the fine gate electrode is removed, and a metal composite layer below the fine gate electrode is used for replacing a traditional fine gate electrode, so that the back contact solar cell is obtained. A cross structure in space between the fine gate electrode and the main gate electrode is avoided, poor short circuit caused by insufficient effective insulation thickness is reduced, improvement of the yield of the battery is facilitated, meanwhile, the discontinuous length of the fine gate electrode and the width of the main gate electrode are limited, a more abundant error range is provided for welding of a welding strip, and the welding quality of the battery is improved. By limiting the ratio of the thickness of the composite conductive layer to the width of the composite conductive layer in the first direction, the linear resistivity of the composite conductive layer is guaranteed, and extra power loss caused by too high resistivity is avoided; a fine gate electrode is replaced by the flat composite conductive layer, so that the thickness of the insulating layer is greatly reduced, and the material cost of the insulating layer is saved.

The invention discloses a miniature lens with a large target surface and a large aperture. Comprising a first lens with negative focal power, a second lens with positive focal power, a third lens with positive focal power, a fourth lens with negative focal power, a fifth lens with positive focal power, a sixth lens with negative focal power and a seventh lens with positive focal power which are sequentially arranged from an object side to an image side, the large-target-surface large-aperture miniature lens comprises a second lens with positive focal power, a third lens with negative focal power, an eighth lens with negative focal power and a ninth lens with positive focal power, and further comprises an aperture diaphragm which is located between the second lens and the third lens or located between the third lens and the fourth lens. And by reasonably setting the proportional relation of key parameters, the total optical length is within 30mm under the condition of ensuring a large aperture of at least F1.05 and a large target surface of IH6.5 mm, and the effect of a miniature lens is obtained.

The invention discloses a method for optimizing ion implantation process parameters of an integrated circuit, which comprises the following steps of: simulating a front-end process of a CMOS (Complementary Metal Oxide Semiconductor) device by utilizing Sensor Process of Sensor TCAD (Technology Computer Aided Design) software, and changing process parameters in a Halo ion implantation step to obtain a simulated CMOS device; then, carrying out numerical solution on the electrical property of the simulation CMOS device by utilizing a Sensor Device in the software, so as to obtain electrical data; and training, verifying and testing the residual neural network model by using the process parameters and the electrical data, optimizing parameters of the residual neural network model, and finally obtaining optimized process parameters. The method not only improves the optimization efficiency and precision of the ion implantation process parameters, but also realizes the automation and intelligence of process optimization through the combination of the deep learning algorithm and the TCAD simulation technology.

The invention discloses continuous titanium alloy atomization powder making equipment, which belongs to the technical field of powder metallurgy and comprises a feeding mechanism, a preheating unit, a smelting unit, a restraint device and an atomization unit. And the feeding mechanism can be used for continuously conveying the bars. The preheating unit is used for preheating the bars conveyed by the feeding mechanism. The smelting unit is used for smelting the preheated bar to form liquid flow or liquid drops. And the constraining device generates an alternating electromagnetic field to magnetically constrain the liquid flow or the liquid drop. The atomization unit crushes and atomizes liquid flow or liquid drops flowing out of the restraint device, and powder is formed after cooling and solidification. A titanium alloy bar is heated and molten through the preheating unit and the smelting unit, molten titanium falls into the restraint device and then is guided to form liquid flow with the uniform diameter under the restraint effect of a magnetic field, then the liquid flow is broken into fine liquid drops through spraying of high-pressure argon, and the liquid drops are cooled and solidified to obtain the spherical titanium alloy powder.

The invention discloses a photovoltaic cell preparation method for improving ALD passivation and a photovoltaic cell, and belongs to the technical field of photovoltaic cells. The preparation method comprises the following steps: performing texturing, front boron diffusion, oxidation, back etching and polishing on a silicon wafer, preparing a back tunneling oxide layer and an amorphous silicon layer, performing acid pickling, removing the tunneling oxide layers on the back and the side surfaces through cleaning, preparing front and back passivation films, printing electrodes and the like, washing with water: washing with a cleaning solution containing potassium hydroxide and hydrogen peroxide, washing with water, pickling, and washing with water; repeating the steps; and cleaning with the oxidizing liquid again, and washing with water. According to the invention, through the improvement of the processing technology of the tunneling oxide layer and the amorphous silicon back winding plating, the yield of the battery production line is improved, the control of the production line is simpler and more convenient, the promotion of the passivation of the oxide layer before ALD is more stable, and the battery conversion efficiency of the production line is further improved.

The invention provides a chip lamp bead and a lamp, and relates to the technical field of lamp beads, the chip lamp bead comprises a packaging body and a lamp bead body packaged in the packaging body; wherein the lamp bead body comprises a substrate, and a first luminous body, a second luminous body and a control chip which are arranged on the substrate. The white light illuminant and the illuminant of the preset color system are integrated in one lamp bead, different lamp beads and different colors of the lamp beads can be controlled in a unified mode through the control chip, and the functionality and flexibility of the illumination and decoration lamp system are improved. On the basis of the white LED, the color temperature adjustment of the preset color system from the warm color tone to the cold color tone can be realized by adjusting the proportion of white LEDs (such as warm white and cold white) with different color temperatures. Moreover, the color of single-color blue light is purer, the color of single-color white light or warm white light is more consistent, and the yield can be increased to 99% or above.

The invention relates to the field of chip production, and mainly relates to a visual system compensation method and device in a high-temperature environment and a storage medium, and the method comprises the following steps: S1, obtaining a visual system input image in the high-temperature environment; s2, detecting an image through an image processing algorithm; s3, the detected visual distortion is compensated; and S4, post-processing the compensated image, and outputting a final image. According to the invention, an image processing algorithm is adopted to detect visual distortion caused by a high-temperature effect in an image, a compensation model is introduced, and visual characteristic data of the model based on a high-temperature environment is trained, so that thermal deformation and optical distortion of an optical system, equipment offset and alignment errors caused by high temperature are compensated; the visual system is an effective method capable of realizing image quality compensation, optical deformation correction and alignment error in a high-temperature environment.

The invention relates to a glue printing screen. The glue printing screen plate comprises a screen plate and a flexible layer, and a plurality of meshes are formed in the screen plate; the flexible layer is arranged on the bottom surface of the screen plate, a plurality of through holes are formed in the flexible layer, and one through hole is correspondingly formed in each mesh hole; the flexible layer can generate telescopic deformation in the axial direction of the meshes. According to the glue printing screen plate, the flexible layer is arranged on the bottom face of the screen plate, the flexible layer can generate telescopic deformation in the axial direction of the meshes, flexible contact can be achieved, certain buffering deformation can be provided, the hidden crack problem occurring in the glue printing process is solved, glue feeding during printing is facilitated, and the glue printing effect is improved; in addition, a debugging window between the subfissure and the glue printing effect can be widened, the debugging difficulty of field equipment personnel at the initial stage of glue printing process switching is reduced, popularization of the glue printing technology at the mass production end is accelerated, poor glue printing is reduced, and the yield and the productivity of the photovoltaic module are improved.

The invention provides ceramic binder slurry, a preparation method thereof and a gas sensor chip. The ceramic binder slurry comprises the following components in percentage by mass: 65-73% of yttrium-stabilized zirconia powder, 15-21% of an organic solvent, 4-6% of a binder, 1-3% of a plasticizer, 1-2% of a dispersant, 1-2% of a thixotropic agent and 1-2% of a lubricant. The ceramic binder slurry provided by the invention can effectively enhance the binding force between zirconium oxide substrates, thereby reducing the probability of layering and cracking of a ceramic layer of a sintered gas sensor chip due to inconsistent sintering temperature and shrinkage rate in the co-sintering process of the zirconium oxide substrates and an aluminum oxide insulating layer; and the yield of the gas sensor chip is improved.

The invention discloses a device and a method for low-thermal-damage laser stripping and cutting of transparent materials, the device comprises a laser, and a first half-wave plate, a linear polarizer, a beam expander, a second half-wave plate, a vortex wave plate and a processing objective lens which are sequentially arranged along the laser transmission direction, and emergent light of the processing objective lens enters a processing material; a machining material is adsorbed and fixed to the cooling suction cup, and the cooling suction cup is installed on the three-dimensional moving platform. Light subjected to polarization modulation is focused into a material through the objective lens to be modified, a complete modified layer is formed along with movement of the three-dimensional platform, the device and the method have the advantages of low thermal damage and high precision when being used for stripping and cutting, and material loss caused in the laser machining process can be reduced.