1247results about How to "Improve yield" patented technology

The invention relates to the technical field of electron microscopic imaging, in particular to a correction method and device for geometric distortion in scanning electron microscope measurement, computer equipment, a storage medium and a computer program product. The method comprises the following steps: acquiring a scanning electron microscope image of a standard sample; calculating an orthogonal included angle parameter and a length-width ratio parameter of the scanning electron microscope image; iteratively adjusting the angle correction parameter and the gain correction parameter under a fixed scanning rotation angle until a preset local calibration constraint condition is met; verifying the orthogonal included angle parameter and the length-width ratio parameter under each scanning rotation angle; and when the orthogonality included angle parameter and the length-width ratio parameter do not meet a preset global stability constraint condition, adjusting a relative gain coefficient, and re-executing calibration verification under each scanning rotation angle until a full-angle correction requirement is met. By adopting the method, high precision and stability of imaging correction can be kept in a full-angle range.

The invention discloses an Mg + Nb co-doped TiO2 giant dielectric ceramic material and a preparation method thereof, and relates to the technical field of giant dielectric materials. The (Mg + Nb) co-doped TiO2 ceramic is successfully prepared by adopting a traditional solid phase method, the performance of the TiO2-based giant dielectric ceramic is regulated and controlled through a new doping strategy, the raw material is single, the preparation process is simple, the cost is low, the repeatability is good, the yield is high, the obtained ceramic material has giant dielectric performance, and the preparation method is suitable for industrial production. The (Mg + Nb) co-doped TiO2 novel giant dielectric ceramic can meet the requirements of a dielectric material with high dielectric constant, low dielectric loss and good temperature and frequency stability, and compared with other widely applied giant dielectric materials, the titanium dioxide-based giant dielectric ceramic has the characteristics of simplicity in preparation and excellent dielectric property.

The invention belongs to the technical field of ceramic materials, and particularly discloses whisker toughened zirconium oxide-aluminum oxide composite ceramic and an additive manufacturing method thereof, the composite ceramic comprises the following components by mass: 94 parts of zirconium oxide toughened aluminum oxide ceramic and 5 parts of silicon carbide whisker; the zirconium oxide toughened aluminum oxide ceramic is prepared from the following components in parts by mass: 76 parts of aluminum oxide and 24 parts of zirconium oxide, and 3mol% of yttrium oxide is added into the zirconium oxide. According to the whisker toughened zirconium oxide-aluminum oxide composite ceramic and the additive manufacturing method thereof, the preparation method has unique design of components and process, and the preparation of a high-density and high-performance ceramic-based composite material part based on a fused deposition modeling technology is successfully realized. Further, the prepared silicon carbide whisker toughened zirconium oxide-aluminum oxide-based composite ceramic has relatively high density and excellent obdurability.

The invention belongs to the technical field of copper rod machining, and particularly discloses a copper rod machining device and a machining process thereof.The copper rod machining device comprises a base, two sets of workpiece supporting frames, a lifting frame, two sets of cutting machines and a transverse embracing mechanism, and the two sets of workpiece supporting frames are symmetrically installed on the upper surfaces of the two sides of the base; the two sets of workpiece supporting frames are correspondingly connected with sliding blocks through bidirectional driving pieces correspondingly arranged in the two sets of workpiece supporting frames, assembling rods are fixedly installed on the outer sides of the two sets of sliding blocks correspondingly, and a first guide frame and a second guide frame are arranged between the two assembling rods with the opposite end faces correspondingly. According to the copper rod cutting and polishing integrated machining device, copper rod cutting and polishing integrated machining is achieved, the cutting position is accurately controlled, end face burrs are effectively removed, the equipment investment and the operation cost are reduced, the machining efficiency is improved, and the machining quality is improved. And the machining efficiency and the yield are improved, and the production requirements of small and medium-sized copper material machining enterprises are met.

An integrated cleaning and liquid supply device and online cleaning method for polyurethane polishing pads are disclosed. The device includes a base, a rotating seat, a swing arm, an independent liquid supply pipeline system and cleaning pipeline, a high-pressure nozzle array, and a positioning sensor assembly. During the polishing stage, polishing liquid is dripped through the liquid supply outlet. During the cleaning stage, the swing arm moves centripetally to a preset position aligned with the center of the polishing pad. The positioning sensor triggers a high-pressure pump, causing pure water to be sprayed as an atomized jet along the diameter of the pad surface through the high-pressure nozzle array. Simultaneously, the polishing pad rotates at a low speed, utilizing the synergistic effect of centrifugal force and high-pressure water flow to thoroughly remove residual contaminants within the micropores of the polyurethane. This invention integrates liquid supply and deep cleaning functions into the same motion mechanism, eliminating the need for machine shutdown or manual intervention. It offers advantages such as non-contact, non-destructive, thorough cleaning, and high automation, extending the life of the polishing pad and improving the stability of the CMP process.

The invention discloses a curved surface film covering flatness self-adaptive control method based on machine vision, and relates to the technical field of mechanical arm control. The system comprises a machine vision sensing module, a robot end effector, a composite controller and a distributed clamping jaw array. The method comprises the following steps: acquiring a fringe projection image sequence and dynamic trajectory data of an end effector; performing phase calculation and three-dimensional reconstruction on the image sequence, constructing a digital elevation model and calculating flatness error data; inputting the dynamic trajectory data into a feedforward controller to generate a compensation instruction, inputting the flatness error data into a feedback controller to generate a correction instruction, and superposing to obtain a comprehensive correction instruction; and acquiring a strain sensitivity matrix, distributing the comprehensive correction instruction into displacement execution parameters of each clamping jaw by utilizing pseudo inverse operation, and issuing and executing the displacement execution parameters. According to the method, real-time sensing and active intervention of dynamic deformation are realized, and the yield and batch consistency of curved surface film coating are remarkably improved.

The invention discloses a real-time prediction and control method and system for the deformation state of a superplastic forming part based on digital twinning, and belongs to the technical field of intelligent manufacturing. The method aims at solving the technical problems that in the superplastic forming process, the deformation state of a part is invisible, control depends on experience, and quality is unstable due to open-loop control. The core lies in that a multi-task learning artificial intelligence prediction model taking air inflow time sequence data as input and taking pressure in a mold cavity and a part full-field deformation state as output is constructed by fusing parameterized finite element simulation and physical experiment data in an offline stage; in the online stage, the model is utilized to dynamically predict deformation states such as a strain field and a thickness field in the part according to air inflow data collected in real time, and process transparency is achieved; and a model prediction control algorithm is further combined, a prediction state is compared with an ideal path, the air inlet pressure is reversely optimized and adjusted in real time, and a closed-loop intelligent control system is formed. According to the method, perspective and active accurate control of the internal state in the black box forming process are achieved, and the quality consistency and the yield of parts can be improved.

The embodiment of the invention discloses a manufacturing method of a semiconductor structure and the semiconductor structure, and the method comprises the steps: providing a substrate which comprises an NMOS (N-channel Metal Oxide Semiconductor) device region and a PMOS (P-channel Metal Oxide Semiconductor) device region; forming a high dielectric constant dielectric layer covering the NMOS device region and the PMOS device region above the substrate; forming a gate stack structure above the high dielectric constant dielectric layer, wherein the gate stack structure is located in the NMOS device region and the PMOS device region; patterning the high-dielectric-constant dielectric layer to reserve the high-dielectric-constant dielectric layer in the NMOS device region and the high-dielectric-constant dielectric layer covered by the gate stack structure in the PMOS device region; and after isolation side walls are formed on the side walls of the gate stack structure to define boundaries of sigma trenches, forming the sigma trenches between the isolation side walls of the gate stack structure in the PMOS device region by using an etching process by taking the patterned high-dielectric-constant dielectric layer as a mask. According to the embodiment of the invention, the height difference between the pseudo gate of the PMOS device region and the pseudo gate of the NMOS device region is eliminated.

Embodiments of the present application provide a display panel and a display device; the display panel comprises a display area and a non-display area, the non-display area comprises a gate drive circuit area and a winding area, the winding area is arranged between the gate drive circuit area and the display area, the display panel comprises a data line and a first light shielding pattern, the data line is arranged in the winding area and the display area, and the first light shielding pattern is arranged in the non-display area; in the top view, the first light shielding pattern is located outside the winding area, and the first light shielding pattern is arranged at intervals with the part of the data line located in the winding area, so that the light shielding pattern does not overlap with the data line in the winding area, thereby reducing the risk of static electricity burn between the light shielding pattern and the data line, and improving the yield of the display panel.

This invention discloses a manufacturing process for composite 7-series aluminum alloy sheets. The composite 7-series aluminum alloy sheets are formed by laminating and rolling multiple layers of 7-series aluminum alloy sheets and multiple layers of 1-series aluminum alloy connecting plates. The 7-series aluminum alloy sheets are composed of the following components by weight percentage: Si: ≤0.22%, Cr: ≤0.23%, Fe: ≤0.35%, Cu: 2.0-3.5%, Mg: 3.5-4.5%, Zn: 6.5-10.0%, Ti: 0.015-0.2%, Zr: 0.05-0.15%, rare earth cerium alloy: 0.015-0.05%, total impurities ≤0.1%, and the remainder being aluminum. This invention uses a lamination method to roll multiple layers of 7-series aluminum alloy sheets and multiple layers of 1-series aluminum alloy connecting plates, which effectively improves plasticity, toughness, and strength. Compared with existing single 7-series materials, it has higher material strength, better impact resistance and weldability, can adapt to corrosion resistance in complex environments, and extends service life.

The invention relates to the technical field of silicon-based OLED (Organic Light Emitting Diode) product preparation processes, and discloses a process method for improving Pad opening of a silicon-based OLED, which comprises the following steps of: treating an initial substrate; depositing an organic material; packaging with a thin film; coating a photoresist; etching the Pad region; and demolding the substrate. According to the invention, the evaporation mask is designed, during the evaporation process, the AA area and the Pad area are evaporated with the organic material at the same time, during film packaging of the Pad area, the organic layer material is located between the packaging layer and Pad metal, the organic layer material is relatively loose and plays a buffering role during dry etching, the process window of the dry etching process is enlarged, and the production efficiency of the dry etching process is improved. The problems of unclean dry etching and over etching are avoided, the process difficulty of the dry etching process is reduced, and the mass production yield and reliability of the device are improved.

The application relates to the technical field of film drying, and discloses a drying and forming device for films, which comprises a shell, two groups of cooling cylinders are rotatably installed in the opposite inner walls of the shell, rotary joints are installed at the two ends of the two groups of cooling cylinders, connecting pipes are installed on the sides, away from the corresponding cooling cylinders, of each rotary joint, and the two cooling cylinders are staggeredly arranged, the two groups of staggeredly rotating cooling cylinders are arranged in the shell, drying mechanisms are arranged on the two sides of the corresponding cooling cylinders, and the film material can be subjected to regional and adjustable drying treatment during movement; when the film passes through the staggeredly arranged cooling cylinders, film sections with different thicknesses can obtain differential heat dissipation effects due to the difference in contact area with the cooling cylinders; in cooperation with the drying mechanisms, the thin-wall region can be prevented from being damaged due to excessive heating, and the thick-wall region can be ensured to be fully dried, so that the uniformity and yield of film material drying and forming are improved, and the problem of poor adaptability of traditional devices to film thickness changes is effectively solved.

This utility model discloses a precision preforming machine with a residual adhesive recovery structure, comprising: a molding box and a molding template, with a base installed below the molding box; the molding template is tightly fitted to the right side of the molding box, and the molding template is mounted on the molding box via a connecting mechanism that facilitates the recovery of residual adhesive; a cutting mechanism for preventing uneven cut surfaces is provided on the upper right side of the base. The connecting mechanism includes a mounting block, a support spring, a mounting rod, and a mounting cap; the outer end of the molding template is tightly fitted to the mounting block, and a support spring is installed on the left side of the mounting block; the molding template and the mounting block are both internally connected to the mounting rod via slots. This precision preforming machine with a residual adhesive recovery structure allows for quick assembly and disassembly of the template, cleaning of internal residual adhesive, prevention of residual adhesive mixing with processed adhesive reducing yield, and uniform cutting, ensuring a smooth cut surface.

The utility model discloses a one-way valve part, flow path switching subassembly, heat exchanger, air conditioning system and air conditioner, one-way valve part includes: one-way valve, first pipe section and second pipe section. One-way valve includes first casing, second casing and valve core, and first casing and second casing are directly welded and are connected and are limited to one-way flow channel, is equipped with the export on first casing, is equipped with the import on second casing, and the valve core is located in one-way flow channel, and one-way valve is by import to export one-way conduction, first pipe section one end is connected in the export place, and first pipe section is connected with first casing through first soldering material and is welded, and second pipe section one end is connected in the import place, and second pipe section is connected with second casing through second soldering material and is welded. According to the one-way valve part of the utility model, the quality and the yield of one-way valve part are high, and production efficiency is high and cost is low.

The application relates to a wafer drying device and a wafer drying system, the wafer drying device comprising a wafer carrying and collecting unit and a wafer drying unit, the wafer carrying and collecting unit comprising a wafer carrying table; the wafer drying unit comprising a wafer front surface drying assembly and a wafer back surface drying assembly, the wafer front surface drying assembly and the wafer back surface drying assembly each comprising a circular drying sheet and a circular ring drying sheet rotatable around the same center, the circular ring drying sheet being sleeved around the circular drying sheet, a plurality of air injection holes being arranged on the circular drying sheet, and a plurality of air suction holes being arranged on the circular ring drying sheet; when drying a wafer arranged on the wafer carrying table, the wafer back surface drying assembly and the wafer front surface drying assembly are arranged in parallel on two sides of the wafer and rotate relative to the wafer, the rotation axes of the wafer back surface drying assembly and the wafer front surface drying assembly pass through the center and extend in a direction perpendicular to the surface of the wafer, the air injection holes blow gas to the surface of the wafer, and the air suction holes absorb the blown gas, so that the probability of bubbles appearing on the edge of the wafer is reduced.

The invention relates to an environment-friendly process method for improving the surface metal cleaning efficiency of a silicon wafer, and belongs to the technical field of semiconductor silicon wafer processing, and the process method comprises the following operation steps: S1, pre-cleaning and activation: placing the silicon wafer in a first cleaning tank, introducing ozone into ultrapure water, and processing in cooperation with low-frequency ultrasound; and S2, main cleaning and complexing: placing the silicon wafer subjected to pre-cleaning and activating treatment in a second cleaning tank, and treating the silicon wafer in a dilute citric acid solution in cooperation with high-frequency ultrasound. And S3, overflow rinsing: placing the silicon wafer subjected to main cleaning and complexing treatment in a third cleaning tank. And S4, drying: carrying out drying treatment on the silicon wafer subjected to the overflow rinsing treatment. Through the synergistic effect of physical stripping, chemical oxidation and complexing dissolution, under the condition that highly toxic chemicals such as hydrofluoric acid are not used, the cleanliness of metal on the surface of the silicon wafer reaches the ppt level, and the problems that traditional RCA cleaning is serious in environmental pollution and high in operation risk are effectively solved.

This utility model discloses a tablet computer bottom shell assembly that is easy to disassemble, including a main body, a fitting component, and an auxiliary component. The fitting component includes buttons and protective parts, and the auxiliary component includes a heat sink and heat dissipation holes. With the cooperation of the above mechanisms, this device allows workers or users to quickly align internal components (such as motherboard, battery, speaker, etc.) with the installation position without repeated adjustments, making it very suitable for automated assembly lines and improving yield. In addition, this device allows users or technicians to remove parts with simple actions and supports later product replacement and functional module upgrades (such as adding a heat dissipation module or replacing the battery).

This application provides a motion control method and system for an automated battery electrolyte filling process, comprising: acquiring the position information of each joint of a robotic arm; calculating the instantaneous position and orientation of the filling needle in three-dimensional space based on the position information of each joint and the kinematic model of the robotic arm; comparing the calculated instantaneous position and orientation of the filling needle with a preset ideal motion trajectory of the filling needle; determining the deviation between the actual spatial state and the ideal spatial state of the filling needle based on the comparison result; generating compensation commands for adjusting the motion of each joint of the robotic arm based on the deviation; and sending the compensation commands to the servo driver of the robotic arm to adjust the motion of each joint of the robotic arm. This application can improve the accuracy of battery electrolyte filling and product yield.

The application discloses a kind of SMT anti-deviation patch welding method and system, method includes: obtaining the predicted offset vector of element to be mounted;Based on predicted offset vector, the theoretical mounting coordinates of element to be mounted are corrected, and actual mounting coordinates are obtained;According to actual mounting coordinates, control patch machine and mount element to be mounted on the corresponding pad of PCB board, pad is coated with tin paste by steel mesh, and the solder mask bump that does not surround setting has molten solder not wetting;After completing patch, PCB board is sent into reflow soldering furnace and is reflow soldered, and the temperature curve of reflow soldering includes self-alignment holding section, and in self-alignment holding section, molten solder is limited in pad area by solder mask bump.The application does not need to change steel mesh structure, does not depend on complex algorithm, only through patch coordinate compensation and solder mask layer design, realize to reduce welding deviation rate, significantly improve yield, reduce repair cost and change line time simultaneously.

The utility model relates to saponification device technical field, and disclose a kind of quick saponification device for laundry soap production, including shell assembly and the mixing assembly and stirring subassembly of being installed in shell assembly, and there is circulating assembly and stirring subassembly on broken subassembly, wherein the internal fatty acid is made to carry out sufficient saponification reaction by the internal circulation mixing design of mixing assembly, effectively improve saponification rate and yield, so that it can reduce the fatty acid content on initial material with small amplitude, while the design of circulating assembly cooperation broken subassembly can quickly and effectively break the internal builder and filler, so that it can improve the specific gravity of builder and filler while ensuring that soap body surface does not crack, to reach the purpose of reducing production cost, improving efficiency.

The invention relates to the technical field of martensitic steel, in particular to a 04Cr13Ni5Mo stainless steel plate rolling and temperature control process, which comprises the following steps: heating a pretreated blank to 1190-1210 DEG C at a heating rate of more than 0 DEG C and less than or equal to 5 DEG C / min, and soaking for more than or equal to 2 hours; the rolling reduction rate of the blank is controlled to be 12%-15%, and compared with the reduction rate of the pass before final rolling, the reduction rate is reduced by 20%-25%; stacking slow cooling is larger than or equal to 550 DEG C, and the plate yield is increased by 30% or Through heat treatment processes of normalizing at 1040 DEG C + / -10 DEG C, preserving heat of a plate with the thickness of 85 mm for 4 hours, preserving heat of a plate with the thickness of 115 mm for 5 hours, tempering at 620 DEG C + / -10 DEG C, preserving heat of the plate with the thickness of 85 mm for 6 hours and preserving heat of the plate with the thickness of 115 mm for 8 hours, the yield ratio is stabilized at 0.8-0.85, and the uniformity of mechanical properties is improved by 25%. The stable yield ratio reduces the deformation amplitude of plates and workpieces by more than 40% during later processing, additional repair is not needed, and the production cost is reduced.

The present disclosure relates to the technical field of display, and discloses a display panel and a display device. The display panel comprises a display area and a non-display area. The display area comprises a planar display area and a peripheral display area. The peripheral display area is arranged outside the planar display area. The peripheral display area comprises at least two side display areas and at least one corner display area. The corner display area is connected between two adjacent side display areas and a corner of the planar display area. The pixel arrangement of the planar display area is the same as that of the peripheral display area. The non-display area comprises a corner non-display area. The corner non-display area is connected to a side of the corner display area away from the planar display area. The corner non-display area is provided with an opening and a shift register. The opening is located between two adjacent shift registers. The display panel can avoid the generation of wrinkles.

This disclosure provides a light-emitting diode and a method for manufacturing the same. The light-emitting diode includes an epitaxial structure; the epitaxial structure has a plurality of protrusions located on a first surface, and the epitaxial structure also has a mesh-like isolation groove formed on a second surface and extending toward the first surface, the epitaxial structure being divided into a plurality of epitaxial units by the isolation groove; the bottom of the isolation groove is spaced apart from the first surface; in a direction perpendicular to the second surface of the epitaxial structure, the connection between the sidewall of the isolation groove and the bottom surface of the isolation groove corresponds to the middle portion of the protrusion; the first surface and the second surface are two opposite surfaces of the epitaxial structure.

The application provides a display module and a manufacturing method thereof. The manufacturing method comprises the following steps: flip-chip bonding a plurality of LED chips on a circuit board in an array; first injecting a filling material between the LED chips and the circuit board to form a filling layer; second injecting the filling material on the circuit board at a position different from the filling layer to expand the filling layer to cover the circuit board; and curing the filling layer. The application improves the stability and reliability of the connection between the LED chips and the circuit board and between each of the LED chips, reduces the occurrence of dead light, improves the product yield, and is simple in process, high in production efficiency, and low in overall production cost.

The utility model discloses a sorting machine for rice production, including the support frame, the rotatory frame is rotatably installed on the support frame, is provided with the adjusting mechanism on the support, the adjusting mechanism includes the bottom pipe, the bottom pipe is provided with a plurality of, and a plurality of bottom pipes are installed respectively on the four corners of the lower end surface of support frame, the inside rod is slidably arranged in the bottom pipe, the inside rod is provided with the semicircle cover on the same axis, and the most prominent technical advantage of the rice sorting machine lies in the unique high-precision inclination adjusting system, which completely solves the industry pain point of the traditional equipment in adjusting different batches of raw materials, the device adopts the innovative sliding rod and the tubular structure design, and cooperates the accurate friction self -locking mechanism, so that the operator can complete the accurate adjustment of the inclination angle of the sorting machine in less than 30 seconds.

The utility model relates to a material height measuring mechanism which is applied to the field of material processing and comprises a mounting frame arranged between a feeding conveying line and a discharging conveying line, a measuring frame is arranged on the mounting frame, a measuring rod is slidably connected to the measuring frame, and a fixing frame is arranged on one side of the mounting frame. The mounting frame is also provided with a driving unit for driving the fixing frame to move along the vertical direction, and the fixing frame is provided with a conversion unit for converting the moving distance of the fixing frame into the sliding distance of the measuring rod relative to the measuring frame; an image unit is arranged on the mounting frame and used for shooting position information of the measuring rod relative to the measuring frame and determining the height of the areca nuts of the feeding conveying line according to the position information. The areca nut height measuring device has the advantages that the moving distance of the fixing frame is converted into the sliding distance of the measuring rod relative to the measuring frame through the conversion unit, the position information of the measuring rod relative to the measuring frame is shot through the image unit, and the areca nut height of the feeding conveying line is determined according to the position information.

The application provides a semiconductor device and a manufacturing method thereof. The method comprises: forming a drift layer on a substrate; forming a first epitaxial layer on the drift layer, doping a partial region of the first epitaxial layer to form a shielding region, and the first epitaxial layer not doped is a first doped region; forming a second epitaxial layer on the first epitaxial layer, doping a partial region of the second epitaxial layer to form a first contact region, and the second epitaxial layer not doped is a second doped region; forming a third epitaxial layer on the second epitaxial layer, doping a first region of the third epitaxial layer to form a second contact region, doping a second region of the third epitaxial layer to form a source region, and the third epitaxial layer not doped is a body region; forming a trench gate structure, an interlayer dielectric layer and a source metal layer. The application makes the shielding region electrically connected with the source metal layer, so that the shielding region potential is clamped by the source, thereby effectively inhibiting the electric field peak at the trench corner in the blocking state.

The present application relates to a kind of composite preparation methods for metal-based ceramic composite material, as follows: one, ceramic preform production: ceramic preform mould is made;After pretreatment, ceramic particles, binder, mixed powder are mixed, filled into mould, twice solidification treatment, and ceramic preform is prepared;Two, metal-based ceramic composite material composite preparation: ceramic preform is fixed in cavity, and metal sheet is placed in the both sides of ceramic preform or between two ceramic preforms;Temperature sensor probe is inserted into cavity;After closing, it is placed in electromagnetic induction coil, and heating is carried out;When metal sheet reaches set temperature, keep warm, when ceramic preform reaches required temperature, electromagnetic induction heating system is closed;Pouring metal liquid, cooling and solidification demoulding;Three, post-processing: quenching and tempering treatment are carried out.The present application solves the problem that ceramic preform and metal liquid temperature difference is too large during metal liquid casting, resulting in poor composite effect, low product yield and unsatisfactory use effect.

The utility model relates to a kind of liquid crystal screen IC automatic film sticking machine, including carousel unit, film supply unit, film supply manipulator, correction unit, film sticking manipulator, tear film unit, detection unit and compression unit;The carousel unit has four stations of feeding, film sticking, compression, discharging;The film supply manipulator is used to place from film supply unit piece by piece suction protective film in correction unit and carry out position correction;The film sticking manipulator includes mechanical arm, suction material component with two individually liftable strip-shaped suction disc being set in the driving end of mechanical arm, for first suction corrected protective film from correction unit and send to tear film unit tear film, then send to detection unit and carry out detection, finally install to the product IC of film sticking station in two times, and tear film from protective film;The utility model can automatically film sticking to liquid crystal screen IC, with the advantages of high efficiency, high precision, while applicable to two protective film is located in the same film sticking scene of film.

This disclosure provides a wet etching system, comprising: a reaction chamber, a spray gun, a buffer tank, and a circulation pipeline. The spray gun is located inside the reaction chamber, while the buffer tank and the circulation pipeline are both located outside the reaction chamber. The circulation pipeline is connected to the spray gun. The recovery port of the reaction chamber is connected to a first buffer port of the buffer tank, and the second buffer port of the buffer tank is connected to the circulation pipeline. The recovery port is higher than the first buffer port, the first buffer port is lower than the highest point inside the buffer tank, and the second buffer port is higher than the circulation pipeline. Using this technical solution improves the atmosphere within the reaction chamber and increases product yield.