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768results about How to "Reduce tensile stress" patented technology

Air and water hybrid cooling high-speed permanent-magnet motor

The invention discloses an air and water hybrid cooling high-speed permanent-magnet motor and belongs to the technical field of motors. The large-power high-speed permanent-magnet motor comprises a casing, a cooling water jacket, a stator core, a stator radial air duct, a stator inner air duct, a motor rotor, an outer rotor axial fan, an outer rotor fan fixing frame and two sliding bearings. The stator core is divided into two sections, the radial air duct is reserved in the middle, and the inner air duct is reserved in a stator slot close to the air gap position. The cooling water jacket is arranged outside the stator casing, a spiral water way is arranged in the water jacket, and water flows into the water way from the middle of the water way and flows out from a left spiral water outlet and a right spiral water outlet which are arranged at two ends of the water way. The air and water hybrid cooling high-speed permanent-magnet motor can mechanically solve the problem that a permanent magnet is broken when bearing large pulling stress during high-speed rotating, further solves the problems that the large-power high-speed motor is large in loss density, difficult in heat dissipation and over high in temperature rising, and prevents the permanent magnet from having irreversible demagnetization easily at high temperature.
Owner:SHENYANG POLYTECHNIC UNIV

Recycled concrete and preparation method thereof

The invention relates to recycled concrete and a preparation method thereof, and belongs to the technical field of concrete. The recycled concrete comprises (by weight): 150-280 parts of cement, 90-130 parts of water, 800-950 parts of modified recycled coarse aggregate, 400-530 parts of fine aggregate, 40-85 parts of fly ash, 80-100 parts of mineral powder, 50-140 parts of zeolite powder, 30-60 parts of epoxy resin, 4-10 parts of a water reducing agent and 2-6 parts of an air entraining agent. The preparation method of the modified recycled coarse aggregate comprises the following steps: S1, crushing and screening waste concrete to obtain recycled coarse aggregate; S2, soaking the recycled coarse aggregate obtained in the step S1 in an acetic acid solution with the mass concentration of 2-7%, and airing; S3, stirring 80-110 parts of polyvinyl alcohol, 60-110 parts of silica fume, 40-80 parts of sodium silicate and 800-1,000 parts of water to obtain a modified liquid; and S4, soaking the recycled coarse aggregate obtained in the step S2 in the modified liquid obtained in the step S3, taking out the soaked recycled coarse aggregate, and baking the recycled coarse aggregate to obtainthe modified recycled coarse aggregate. The recycled concrete provided by the invention has a good compressive strength effect.
Owner:泸州临港思源混凝土有限公司

Semiconductor structure and forming method thereof

Provided are a semiconductor structure and a forming method thereof. The forming method comprises the steps that a semiconductor layer is formed in a source region and a drain region of a first fin part, covers the top surface and part of the side wall surface of the first fin part and is provided with protruded first ridge corners and second ridge corners, the first ridge corners are located on the top surface of the first pin part, and the second ridge corners are located on the surface of a side wall of the first fin part; a barrier layer is formed on a substrate, the first fin part and the surface of the semiconductor layer and fills a space between the adjacent second ridge corners, so that the adjacent second ridge corners are connected through the barrier layer; a dielectric layer is formed on the surface of the barrier layer, a first opening in the dielectric layer is exposed out of the barrier layer on the surfaces of at least two adjacent first ridge corners, the position of a side wall of the first opening in contact with the barrier layer is higher than the horizontal positions of the second ridge corners; the barrier layer at the bottom of the first opening is etched until the barrier layer is exposed out of the surface of the semiconductor layer, and a first conductive layer is formed on the surface of the semiconductor layer in the first opening. The performance of a formed semiconductor device is improved.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Paving method of steel box girder bridge deck payment layer

The invention belongs to the field of building materials, in particular to a paying method of a steel box girder bridge deck payment layer. The paying method of the steel box girder bridge deck payment layer is characterized by comprising the following steps: (1) bridge deck pre-cleaning; (2) welding of shearing rivets; (3) binding of reinforcing mats; (4) payment of a high-toughness high-strengthlight aggregation concrete layer: paying high-toughness high-strength light aggregation concrete on steel plates of a steel box girder bridge deck and forming the high-toughness high-strength light aggregation concrete layer, wherein the high-toughness high-strength light aggregation concrete is higher than the shearing rivets by 1-2 cm and the thickness of the high-toughness high-strength lightaggregation concrete is 5-8 cm; (5) payment of a waterproof bonding stress absorbing layer, wherein the thickness of the waterproof bonding stress absorbing layer is 1-2 cm; and (6) payment of a payment layer for resisting slipping, reducing noise and draining: preparing the payment layer for resisting slipping, reducing noise and draining, wherein the thickness of the pavement layer is 3-5 cm. The payment layer has the characteristics of stress absorption, lightness and excellent slipping resistance.
Owner:WUHAN MUNICIPAL CONSTR GROUP

Thickened frame type ballastless track plate

Provided is a thickened frame type ballastless track plate. The track plate comprises a base plate, bosses and track bearing tables. The base plate is of a cuboid, the two bosses are symmetrically arranged on one face of the base plate along the axis of the cuboid in the length direction, and the track bearing tables are evenly distributed in the length direction of the upper surfaces of the bosses. A through hole is formed in the base plate and is located between the two bosses symmetrically arranged on the base plate, and a frame structure connected between the two bosses through a transverse reinforcement concrete structure is formed. The thickened frame type ballastless track plate can effectively reduce track plate warping caused by temperature stress, eliminate a pull cracking phenomenon, and enhance running safety and comfort. The thickened frame type ballastless track plate is reasonable in structural stress, light, high in structural strength and capable of effectively improving the stress condition of a sleeper structural system, prolonging the service life of the structure and optimizing rack circuit parameters, improves the circuit transmission characteristic of a resonant track, can be directly and effectively connected with a current high-speed railway CRTS-I ballastless track plate, and is suitable for industrial production.
Owner:CENT SOUTH UNIV
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