292results about How to "Improve production yield" patented technology

The invention discloses a hollow-core optical fiber microstructure size dynamic nondestructive measurement and control system, which is characterized in that a spectral confocal detection module acquires spectral signals reflected by each interface of the cross section of a hollow-core optical fiber from the side surface of the hollow-core optical fiber by using a dispersion confocal principle in a hollow-core optical fiber drawing process, and converts the spectral signals into spectral data; the data analysis module outputs an axial peak value calculated value by using a neural network model according to the spectral data, and converts the axial peak value calculated value into the diameter of a nested glass tube in the nested structure unit; the regulation and control module outputs an airflow regulation instruction according to the difference between the diameter of the nested glass tube and a preset value; the airflow control module adjusts the size of airflow entering the hollow-core optical fiber according to the airflow adjusting instruction, and then the diameter of the nested glass tube is adjusted. According to the invention, the diameter of the nested structure unit in the hollow-core optical fiber can be accurately measured in the production process, and the technological parameters can be adjusted in time according to the product state.

The invention discloses a microalloyed high-toughness martensitic stainless steel cutter head as well as a preparation method and a preparation mold thereof. Stainless steel comprises the following components in percentage by weight: 0.3%-0.7% of C, 0.3%-1.0% of Si, 0.5%-1.5% of Mn, 16%-18.5% of Cr, 1%-2% of Ni, 0.3%-0.8% of Mo, 0.1%-0.35% of V, 0.1%-0.25% of Nb, less than or equal to 0.02% of S, less than or equal to 0.02% of P and the balance of Fe. Firstly, raw materials are smelted into molten iron; then adding a deoxidizing agent and precoated sand into the molten iron for molding, and performing sand mold casting and pouring to obtain a cutterhead blank; carrying out heat treatment on the cutter head blank; and finally, shot blasting and polishing are conducted on the cutterhead subjected to heat treatment. The martensitic stainless steel cutterhead has a metallographic structure which takes a martensitic structure as a main structure, takes austenite as an auxiliary structure and dispersedly distributes CrC, VC and NbC particles, the hardness of the martensitic stainless steel cutterhead is 40-45 HRC, the impact toughness of the martensitic stainless steel cutterhead reaches 92-95 J / cm < 2 >, the abrasion resistance of the cutterhead is longer, the service life of the cutterhead is longer, and the abrasion loss of the martensitic stainless steel cutterhead is reduced by 70% compared with a cutterhead without alloy elements.

The invention provides an FCBGA chip support plate process parameter optimization method, system and device and a medium, and belongs to the technical field of PCB production, the method comprises the following steps: collecting and preprocessing a historical data set in the FCBGA chip support plate production process, and screening data subsets with correlation greater than a preset threshold based on target features of a to-be-optimized production task; training a machine learning prediction model capable of mapping the process parameters to the quality indexes; constructing a multi-objective optimization function by taking a machine learning prediction model as a core; a multi-objective optimization algorithm is adopted to search in the process parameter constraint space, and a Pareto optimal solution set is solved; and selecting a final optimal process parameter according to a preset decision strategy, applying the final optimal process parameter to an actual production line of the FCBGA chip carrier plate, then collecting actual production result data, and feeding back the actual production result data to a historical data set. The method is based on historical data machine learning multi-objective optimization, incremental learning dynamically adapts to production line changes, and quality and efficiency are improved.

The utility model provides an automatic detection device for a power-assisted gear of an automobile steering device, and the device comprises a machine which is provided with a feeding module used for feeding and conveying a gear shaft, an outer diameter detection module used for detecting the outer diameter of the shaft end of the gear shaft, a run-out detection module used for detecting the run-out of the gear shaft, and a detection module used for detecting the run-out of the gear shaft. The inner diameter detection module is used for detecting the inner diameter of a hollow channel of the gear shaft, the marking module is used for conducting laser marking on the gear shaft, and the discharging module is used for discharging and stacking the gear shaft. In this way, the shaft end outer diameter of the gear shaft, the inner diameter of the hollow channel, run-out tolerance detection and the like are integrated, and the working efficiency is effectively improved.

This invention discloses a method for enhancing and controlling the radiation of an LPP-EUV light source based on dual-pulse spatiotemporal co-constraint, belonging to the field of semiconductor manufacturing technology. This invention obtains a spatiotemporal reference by real-time monitoring of a liquid metal droplet, uses a pre-pulse laser to induce target material deformation into a fogged target cloud, and combines high-speed imaging and a hydrodynamic model to predict the time and coordinates of the target cloud's energy absorption peak. It dynamically adjusts the delay time and optical axis direction of the main pulse laser to achieve dual-pulse spatiotemporal co-constraint, and constructs a closed-loop control system through a recursive least squares algorithm with a dynamic forgetting factor. This invention effectively improves the extreme ultraviolet light conversion efficiency, controls the power fluctuation of the light source within ±0.5%, and extends the maintenance cycle of optical components by 2 times. It can be widely applied to next-generation high-power extreme ultraviolet lithography light source systems, meeting the application requirements of semiconductor miniaturization processes.

The utility model provides a kind of green laser welder, it is related to full tab electric core production technical field, including machine body, the side of machine body is fixedly installed with controller, the surface of machine body is fixedly installed with support, the top of support is fixedly installed with hydraulic cylinder one, the output end of hydraulic cylinder one is fixedly connected with lifting plate, the bottom of lifting plate is fixedly installed with mounting plate.The utility model drives bidirectional screw rod to rotate by starting motor, so that sliding block drives arc clamping plate to move towards, so different size negative current collector can be clamped, cooperate arc clamping plate inside natural rubber arc-shaped protective pad to further improve clamping stability, while rotating the rotating head on fixed plate, drive screw rod to rotate, so that protruding block drives lower pressing plate to move downwards, the surface of negative tab can be compacted and fixed, ensure that welding area is closely fitted, improve welding precision and product yield.

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure, a first packaging layer and an etching barrier layer, wherein the isolation structure is arranged on one side of the substrate, a plurality of isolation openings are defined by the isolation structure, and the isolation openings are used for containing at least part of the light-emitting units; the first packaging layer is arranged on the side, away from the substrate, of the light-emitting unit; the etching barrier layer is arranged on the side, away from the substrate, of the first packaging layer. In the display panel, the first packaging layer and the light-emitting unit below are protected through the etching barrier layer, the thickness of the first packaging layer can be reduced, the production process can be accelerated, the productivity can be released, meanwhile, the photoresist thickness in the preparation process can be reduced, the photoresist stripping condition is reduced, the production efficiency and the product yield are improved, and the production cost is reduced. And the processing property of the display panel is improved.

The invention relates to the technical field of semiconductor equipment, and provides a pipeline structure identification method, a pipeline structure identification device and semiconductor equipment, and the method comprises the steps: identifying a pipeline control set from each visual element contained in a graphical interface for displaying a pipeline diagram; wherein the types of the pipeline controls comprise pipelines, multi-way pipe fittings and valves; the pipeline control of the pipeline type has a pipeline flow direction; on the basis of the control connection judgment sub-process, determining that each pipeline control in the pipeline control set has a subsequent pipeline control with connected ports or overlapped controls in the pipeline flow direction, so as to obtain a pipeline connection structure; identifying each pipeline path in the pipeline connection structure to form a pipeline path set; and determining an effective path in the pipeline path set based on the flow direction relation between the ends of the pipeline control of the multi-way pipe fitting type in different pipeline paths. Therefore, the connection and the upstream and downstream relation between the pipeline nodes can be automatically extracted according to the displayed pipeline diagram, and the node control efficiency is effectively improved.

The utility model discloses a kind of metal intelligent chip card packaging structures, including card base and chip module connected on card base, the card base at least includes upper structural layer, antenna layer and lower structural layer which are thin sheet and are sequentially laminated, the antenna layer is equipped with radio frequency antenna, the radio frequency antenna has at least two conductive contact parts, the card base is equipped with the mounting groove for accommodating chip module in the upper of conductive contact part, the mounting groove groove bottom is equipped with the conductive connection groove extending to conductive contact part downwards, the chip module bottom has the chip contact exposed after packaging, the conductive connection groove is equipped with the conductive material column in the lower part and conductive contact part conductive connection, upper part protrudes upwards and is connected with chip contact conductive connection, the utility model aims at overcoming the deficiency of prior art, provide a kind of metal intelligent chip card packaging structure with compact structure, strong stability.

The utility model relates to a kind of lead-acid battery plate production technical field, specifically related to a kind of lead-acid battery plate coating device. Including frame, two symmetrical coating mechanisms of upper and lower setting are installed in frame one side, and roller mechanism is installed on the frame of coating mechanism side, it is characterized in that, two supporting rollers are rotatably arranged on the frame of roller mechanism side, outer smearing edge mechanism, inner smearing edge mechanism and cleaning mechanism are sequentially arranged between the two supporting rollers. The device integrates coating, rolling, smearing and cleaning functions, and the full-process treatment of coating can be completed by single pass of the grid, avoiding deformation or pollution of lead paste caused by multiple handling, significantly improving the production yield and efficiency of the plate.

This utility model relates to the field of photovoltaic technology, and more particularly to a photovoltaic encapsulant film and a photovoltaic module. The photovoltaic encapsulant film includes a first encapsulant film body, a second encapsulant film body, and a third encapsulant film body connected sequentially along a first direction. The first and third encapsulant film bodies have identical structures. The first encapsulant film body includes at least an inner layer and an outer layer, which are stacked along a second direction perpendicular to the first direction. The pre-crosslinking degree of the inner layer is greater than that of the outer layer. The inner layer is configured to be bonded to the solder strip at the edge of the photovoltaic module along the first direction, and the outer layer is configured to be bonded to the backsheet of the photovoltaic module. This photovoltaic encapsulant film can reduce solder strip misalignment in the edge region of the photovoltaic module, improving the safety and product yield of the photovoltaic module.

This invention discloses a method for mechanically compensating for the fiberglass yarn count after fiber fly, belonging to the field of fiberglass technology. It solves the defect in existing technologies where, due to the low temperature of the spinneret after fiber fly, the first yarn cake after reloading results in a low inner layer count, leading to product defects. The method includes the following steps: 1. Investigating the impact of the stopping time of the drawing equipment on the change in fiber tex after fiber fly, determining the stopping time and the stopping compensation curvature a1 for the inner layer count of the yarn cake; 2. Calculating the average stopping time T1 for on-site workers, and determining the change in the first yarn cake count after the stopping time T1, determining the curve number compensation curvature a2; 3. Deriving the formula for compensating the yarn count change based on the curve change parameters obtained in steps 1 and 2; 4. Verifying whether the formula for compensating the yarn count change based on the drawing machine speed is applicable to the actual product yarn count compensation after fiber fly. This invention is mainly used in the fiberglass industry.

The present disclosure relates to a solar cell string, a solar cell module, and a method of manufacturing a solar cell string, the solar cell string comprising a wiring member and at least two back contact solar cells, the wiring member connecting the back contact solar cells in series, the wiring component comprises a conductive inner core and an electrically insulated organic weldable protective layer covering the outer surface of the conductive inner core; wherein the back surface of the back contact solar cell is provided with a plurality of dispersed soldering paste points, the organic solderable protection layer is provided with a plurality of openings which are arranged at intervals along the extension direction of the wiring component and are used for exposing local parts of the conductive inner core, and the soldering paste points are in contact with the electrodes and are in contact with the conductive inner core through the openings. The solar cell string disclosed by the invention is relatively low in production cost, relatively excellent in safety and relatively high in yield.

The utility model discloses a battery cell cover plate assembly, a battery and power equipment, the battery cell cover plate assembly comprises a cover plate, the cover plate is provided with a communication hole, and the inner wall of the communication hole is provided with a first thread; the polar column is detachably connected with the cover plate, the polar column is accommodated in the communicating hole, and a second thread matched with the first thread is formed on the polar column; the tab is placed on the pole and located between the pole and the cover plate, and the tab abuts against the outer peripheral wall of the cover plate and the outer peripheral wall of the pole so as to limit the movement of the tab relative to the cover plate. According to the battery cell cover plate assembly, the connection of the pole and the cover plate is realized through the matching of the first thread and the second thread, the tabs are respectively propped against the peripheral wall of the cover plate and the peripheral wall of the pole so as to limit the movement of the tabs relative to the cover plate, welding is not needed in the process of connecting the tabs, the pole and the cover plate, and the cost is reduced. The risks of short circuit failure and the like caused by the fact that metal chips enter the battery cell in the welding process are effectively prevented, and the production yield of the battery is improved.

The utility model discloses an SIM card tray detection device which comprises a workbench, two supporting plates are fixedly connected to the top of the workbench, two rotating rollers are rotationally connected between the two supporting plates, a conveying belt is arranged on the outer sides of the two rotating rollers, and a plurality of fixing seats are fixedly connected to the outer side of the conveying belt at equal intervals. The beneficial effects of the utility model are that: it is novel in structure, simple to operate, easy to master, not only compact in structure, but also stronger in practicality, and more convenient to use. Compared with a traditional device, by arranging the fixing base, the rotating shaft, the electromagnet, the magnet, the connecting rod, the clamping base, a first spring, a touch switch, a gear ring, a touch rod and a rack, the electromagnet can be controlled to be powered on by triggering the touch switch after the fixing base moves to the clamping position, then the touch switch generates repulsive force on the magnet, and the clamping effect is achieved. In this way, the first spring is compressed and the clamping seat is driven to clamp the SIM card support.

The invention discloses an axial flux permanent magnet synchronous reluctance motor rotor based on modular harmonic counteracting, the rotor is designed in a three-in-one mode of structure modularization, magnetic barrier gradient and phase computable dislocation, a rotor assembly is formed by splicing N fan-shaped rotor modules along the circumference, and the adjacent modules are provided with optimal dislocation angles calculated according to the harmonic counteracting principle. The sum of target harmonic magnetic field vectors generated by each module is zero; a U-shaped magnetic barrier array of which geometric parameters are monotonically changed in a gradient manner is arranged in the fan-shaped rotor module, and a permanent magnet group is embedded in the fan-shaped rotor module; main electromagnetic harmonic waves are offset from the source, magnetism gathering and resistance increasing functions are decoupled, the mechanical robustness and the electromagnetic performance of the motor are improved, meanwhile, overall machining is converted into standardized module assembling, the manufacturing cost and the maintenance difficulty are reduced, different motor pole numbers can be flexibly adapted, and the service life of the motor is prolonged. The method is suitable for high-end application scenes such as new energy automobiles, industrial driving and aerospace.

A method for forming a semiconductor structure includes: providing a substrate, the substrate including a base and a layer to be etched, the substrate including a first region and a second region; forming a plurality of first initial mask structures on the first region, and forming a plurality of second mask structures on the second region, the initial first mask structures having a first width deviation dimension, and the second mask structures having a second width deviation dimension; forming a first sacrificial layer on the layer to be etched and the second mask structures; and etching the first initial mask structures to form a first mask structure based on a first advanced process control technology, the first mask structure having a second width dimension and a third width deviation dimension, wherein the third width deviation dimension is equal to the second width deviation dimension. By using the first advanced process control technology for algorithm optimization, the third width deviation dimension is made equal to the second width deviation dimension, eliminating the process step of forming an additional sacrificial layer and then covering the first mask structure.

The laser type milk box edge cutting and grinding machine comprises a rack, the rack comprises a workbench, a dividing plate capable of rotating is installed on the workbench, and a plurality of jigs used for containing milk boxes and distributed in an annular array are arranged on the surface of the dividing plate; a calibration assembly and an edge cutting assembly with a laser cutting head are arranged on the portion, on one side of the index plate, of the workbench, and the direction from the calibration assembly to one side of the edge cutting assembly is the autorotation direction of the index plate. The jig comprises a positioning unit for positioning the milk box and a calibration limiting unit capable of finely adjusting the position of the milk box, and the positioning unit and the calibration limiting unit are clamped on the two sides of the milk box. A positioning plate is arranged at the bottom between the positioning unit and the calibration limiting unit and fixed to the surface of the index plate. The flash is in a to-be-machined posture through clamping and fine adjustment, the flash is accurately cut off through laser after being positioned through the calibration assembly, the trimming precision and efficiency are improved, and the appearance quality and the yield are remarkably improved.

The application discloses a kind of semiconductor colorless plating film uniformity detection equipment, including plating film box, the target material is arranged in the plating film box, the semiconductor tray corresponding with the target material is arranged below the target material, heating mechanism is arranged in the semiconductor tray, semiconductor by the target material sputtering plating film is placed on the semiconductor tray;The infrared camera mechanism and post-processing mechanism acting on the semiconductor are arranged on the outside of the plating film box, adjusting mechanism is arranged below the semiconductor tray.The semiconductor colorless plating film uniformity detection equipment provided in the application is arranged by infrared camera mechanism on the side of plating film box, utilizes infrared thermal imaging technology to capture the temperature distribution change caused by the difference of film layer thickness on the surface of semiconductor, realizes non-contact, on-line real-time detection to the uniformity of colorless plating film, effectively solves the problem that colorless transparent film layer is difficult to detect by visible light.

The utility model is suitable for photovoltaic technical field provides a kind of battery component and photovoltaic system, battery component includes: several cell strings, cell string includes the several cell piece connected in series by welding band, and the several cell piece includes the first cell piece located at the end of cell string, the second cell piece adjacent to first cell piece;Busbar is set on the back of second cell piece;Along first direction, second cell piece includes oppositely arranged first edge and second edge, and second edge is set away from first cell piece compared with first edge, and the back of second cell piece is provided with several thin grids;The distance of busbar to first edge is d1, and 0.1mm The utility model discloses a battery component can reduce the risk of cell piece hidden crack and crack in lamination process, and can reduce short-circuit risk, to improve battery component production yield.

This invention discloses a method and apparatus for testing the coating performance of grid-free solar cells, comprising: acquiring a sample to be tested; the sample to be tested includes a grid-free solar cell, a thin film disposed on at least one side of the grid-free solar cell, and a solder ribbon sandwiched between the grid-free solar cell and the thin film; performing a peel tensile strength test on the thin film and / or a pull-out tensile strength test on the solder ribbon according to the stage state of the sample to be tested; and determining the coating performance of the sample to be tested based on the tensile strength test results. This invention realizes coating performance testing for grid-free solar cell structures, which can effectively avoid the problems of solder ribbon misalignment and incomplete soldering in the subsequent lamination process of grid-free solar cells, and improve the production yield of grid-free solar cells.

A printing ink supply quantity control method and system of a printing machine relates to the field of general control systems.The method comprises the steps that ink area distribution analysis is conducted on image data of current printing operation, and basic printing ink supply data are determined; in the printing process, sensor data of one or more physical dimensions are collected in real time, and real-time operation state data are obtained; calculating to obtain a state deviation value of each physical dimension, calculating to obtain an ink supply compensation amount for counteracting the influence of the state deviation on the printing ink color, and generating a target ink supply instruction at the current moment; and the target ink supply instruction serves as an optimization target, the physical stroke and the response rate of the printing machine serve as constraint conditions, a control value of the current time step is extracted, the control value is converted into a target set value of a corresponding ink supply executing mechanism, and the target set value is sent to the ink supply executing mechanism to execute ink supply. By means of the printing ink supply control method and device, the printing ink supply amount in the printing process can be accurately controlled under complex conditions.

The utility model discloses a kind of flexible trepanning devices of circuit board, it is related to circuit board processing technical field.The utility model includes bottom plate, the bottom plate top is provided with driving motor, driving motor output end is fixedly connected with drill bit;The drill bit bottom is provided with support mechanism.The utility model passes through the support of support mechanism Shell design, drill bit when penetrating circuit board will not directly contact operation platform, avoid drill bit abrasion and operation platform damage, while support shell provides real-time support to circuit board trepanning position, prevent circuit board from bending or breaking due to down pressure, significantly improve processing precision and product yield, dust collection mechanism is matched by air blower, dust hood and fixed box, can quickly adsorb and concentrate the chip generated by drilling, avoid chip flying and scattering Pollution equipment or affect the normal operation of screw thread transmission structure.The design of detachable sealing plate further facilitates the regular cleaning of chip, prolongs the service life of equipment.

The utility model discloses a simplified structure of a TYPE-C female joint for transmitting audio signals and an earphone. The simplified structure comprises an insulating body, a TYPE-C female joint terminal group and a housing. The TYPE-C female head terminal group is an integrated TYPE-C female head terminal group and comprises a first terminal group and a second terminal group, the first terminal group comprises a terminal B6, a terminal B7 and a terminal B8 which are arranged from right to left, and the second terminal group comprises a terminal A6, a terminal A7 and a terminal A8 which are arranged from left to right; the rear ends of the B6 terminal, the B7 terminal and the B8 terminal are all used as connecting ends of the main material belt, the rear end of the B6 terminal is also used as a first connecting end of the expansion material belt, and the rear ends of the A6 terminal, the A7 terminal and the A8 terminal are all used as second connecting ends of the expansion material belt, so that the expansion material belt can be integrally connected between the rear end of the B6 terminal and the rear ends of the A6 terminal, the A7 terminal and the A8 terminal; therefore, the upper row of terminals and the lower row of terminals are ingeniously combined into one, the number of parts is reduced, and the production difficulty of products is reduced.

The utility model relates to compacting equipment technical field especially relates to a module base plate quick change elastic compacting mechanism, its technical scheme includes mechanism chassis, be provided with sliding rail on the mechanism chassis, the sliding rail is installed respectively with left side elastic quick change pressure head and right side elastic quick change pressure head, be provided with module positioning tool between left side elastic quick change pressure head and right side elastic quick change pressure head, module board is installed on the module positioning tool. The utility model is provided with the mechanism that can carry out motion control and compacting to guarantee the stability of motion, and avoid the interference to compacting, whole control clamping is more stable, guarantees that copper base plate each pressure point position can be compacted more evenly, and the elastic pressure head structure is designed, can change according to pressure point height, and the pressure head height is adjusted automatically.

The invention provides a display device, which comprises a display panel, a first circuit board, a second circuit board, a flexible connecting piece for connecting the first circuit board and the second circuit board, a first switch unit, a second switch unit, a third switch unit and a third switch unit, the second switch unit and the third switch unit are arranged on the second circuit board, in a first state, the first switch unit and the second switch unit are in a conducting state, the third switch unit is in a cut-off state, the detection signal end, the first switch unit, the flexible connecting piece and the second switch unit form a conducting detection loop, and in a second state, the second switch unit is in a cut-off state. The first switch unit and the second switch unit are in a cut-off state, the third switch unit is in a conducting state, and the flexible connecting piece transmits a function signal to the signal output end through the third switch unit. According to the technical scheme, oblique insertion detection and circuit protection can be realized under the condition that a signal line of the flexible connecting piece is not additionally occupied.

The application relates to the technical field of batteries, in particular to a battery cell shell and a battery cell. The battery cell shell comprises a shell body with a bottom wall and a side wall; a pressure relief piece is formed as a groove-shaped structure arranged in the interior of the shell body and is formed by inwardly recessing the bottom wall, and the thickness dimension of the side wall in a first direction is g; the distance between the end of the pressure relief piece facing the side wall and the surface of the side wall away from the accommodating cavity in the first direction is w1, and 5*g<=w1<=6*g. In the application, the shell body can protect the pressure relief piece, the risk of external contamination is reduced, the pressure relief piece is directly formed on the bottom wall of the shell body, the processing and molding are facilitated, the welding process is omitted, the cost is saved, the production yield of the battery cell is improved, a sufficient safety distance is formed between the pressure relief piece and the side wall, the pressure relief area of the pressure relief piece after opening is sufficient, and the production quality and safety performance of the battery cell are improved.

The utility model discloses a display module structure capable of improving a bonding abnormity detection effect, which comprises display glass and a module FPC, a bonding connection end of the module FPC is connected to a single-layer area of the display glass in a bonding manner, solid copper wires formed by etching are respectively formed on the left side and the right side of the bonding connection end of the module FPC, and the solid copper wires are arranged on the left side and the right side of the bonding connection end of the module FPC. The solid copper wire is tightly attached to the lower edge of a pressing contact area of the module FPC and the display glass, and the solid copper wire has a preset width and a preset length. According to the utility model, the solid copper wire is arranged at the lower edge of the lamination contact area of the module FPC and the display glass in an etching manner, so that the solid copper wire can be used for judging that green oil is suitable for qualification after silk-screen printing of the green oil in a single-layer area, AOI automatic equipment and manual inspection are facilitated, the detection efficiency and the product yield are improved, and products with abnormal bonding are prevented from flowing to the downstream.

The application discloses a 3D memory device and a manufacturing method thereof. The 3D memory device comprises a chip storage area, the chip storage area comprises: a stack structure on a semiconductor substrate; a plurality of gate line gaps penetrating through the stack structure, part of the gate line gaps divide the chip storage area into a plurality of block storage areas, the plurality of gate line gaps are arranged along a first direction, and a plurality of channel columns penetrating through the stack structure are arranged between adjacent gate line gaps, the chip storage area comprises a central area and at least one edge area arranged along the first direction, and the minimum distance between at least one gate line gap and its adjacent channel column in the at least one edge area is greater than the minimum distance between at least one gate line gap and its adjacent channel column in the central area. By increasing the minimum distance between the gate line gap and its adjacent channel column in the edge area, the influence of stress and load effect on the 3D NAND device is avoided, and the low reliability and low yield of the 3D NAND device are avoided.

This invention discloses a method, device, and medium for detecting 3D display modules. The method includes the following steps: transferring the 3D display module to a platform and powering it on; measuring and photographing the illuminance of the 3D display module through a measuring lens to obtain an illumination image; analyzing the illumination image to determine whether the 3D display patch is incorrectly pasted; if incorrectly pasted, identifying the first incorrectly pasted 3D display patch; positioning the 3D display module through a positioning lens and photographing it to obtain a positioning image; calculating the coordinates of the first 3D display patch based on the positioning image; and controlling a marking mechanism to mark the first 3D display patch based on the coordinates. This invention can automatically detect 3D display modules, accurately identify and mark incorrectly pasted 3D display patches, eliminating the need for manual inspection. It not only effectively improves detection efficiency and accuracy but also significantly increases the yield of 3D display modules and reduces production costs.