217results about How to "Improve production yield" patented technology

A high-performance liquid crystal display device is provided that can be manufactured at a low cost and a high production yield. In this liquid crystal display device, a liquid crystal composition comprising liquid crystal molecules and a polymerizable compound that can be polymerized by ultraviolet rays or by a combination of ultraviolet rays and heat is disposed between a pair of substrates; the polymerizable compound is polymerized, forming a liquid crystal layer, by an operation including irradiation of ultraviolet rays that do not contain wavelength components of not higher than 313 nm; and uneven portions are installed on the liquid crystal layer contacting surface, or a slit pattern is installed in an electrode, or uneven portions are installed on the liquid crystal layer contacting surface, and a slit pattern is installed in the electrode.

A semiconductor package includes an interconnect component surrounded by a molding compound. The interconnect component comprises a first RDL structure. A second RDL structure is disposed on the interconnect component. A plurality of first connecting elements is disposed on the second RDL structure. A polish stop layer covers a surface of the interconnect component. A plurality of second connecting elements is disposed on and in the polish stop layer. At least one semiconductor die is mounted on the second connecting elements.

The invention provides a multilayer secondary battery in which a positive electrode having a positive electrode active substance layer formed on a flat sheet-form collector and a negative electrode having a negative electrode active substance layer formed on a flat sheet-form collector are stacked together in opposite relation via a separator. The positive electrode active substance layer differs in area from the negative electrode active substance layer. Active substance-free portions with no active substance layer coated on them are formed on at least adjoining two sides of the outer periphery of a collector of a smaller area electrode having a smaller active substance layer area. The surface of the collectors at the active substance-free portions is covered with an insulating substance layer. The end face of the insulating substance layer that faces away from a side contiguous to an active substance layer and the end face of a larger area electrode having a larger active substance layer area are located and stacked together on the same plane that intersects vertically an electrode plane.

A dual panel-type active matrix organic electroluminescent device includes: first and second substrates spaced apart from each other; a driving thin film transistor on an inner surface of the first substrate; a connection electrode layer connected to the driving thin film transistor and formed of a first conductive material having a first hardness; a first electrode on an inner surface of the second substrate; an organic electroluminescent layer on the first electrode; and a second electrode on the organic electroluminescent layer, the second electrode connected to the connection electrode layer and formed of a second conductive material having a second hardness, wherein the first hardness is different from the second hardness.

A liquid crystal panel for a color filter on thin film transistor (COT) type liquid crystal display (LCD) device includes: first and second substrates facing each other and having a display area and a non-display area, the non-display area is at a periphery of the display area; a gate line and a data line on the first substrate, the gate line and the data line crossing each other to define a pixel region in the display area; a thin film transistor connected to the gate line and the data line; a color filter layer over the thin film transistor; a black matrix on the color filter layer; a pixel electrode contacting the thin film transistor on the color filer layer; a common electrode on the second substrate; a first alignment key on the second substrate in the non-display area; a sealant between the first and second substrates at a boundary between the display area and the non-display area; and a liquid crystal layer between the pixel electrode and the common electrode.

A method of manufacturing a quad flat non-leaded semiconductor package is provided. A metal plate is prepared and is defined with predetermined positions of a plurality of electrically conductive pads. A resist layer is formed on the metal plate, and a plurality of openings are formed in the resist layer and correspond to the predetermined positions of the electrically conductive pads. A solderable metal plated layer is formed in each of the openings of the resist layer. The resist layer on the metal plate is removed. A portion of the metal plate, which is not covered by the metal plated layers, is etched using the metal plated layers as a mask. A chip is mounted on the metal plate and is electrically connected to the electrically conductive pads. A molding process is performed such that the chip and the metal plate are encapsulated by an encapsulant.

Semiconductor wafer dicing methods are disclosed. These methods include forming etch patterns between adjacent semiconductor dice to be separated. Various etch processes can be used to form the etch patterns. The etch patterns generally reach a pre-determined depth into the wafer substrate significantly beyond the wafer top layer where pre-fabricated semiconductor dice are embedded. Semiconductor dice may be separated from a post-etch, large-sized, frangible wafer through wafer grinding, mechanical cleaving, and laser dicing approaches. Preferred embodiments result in reduced wafer-dicing related device damage and improved product yield.

A stepwise capacitor structure includes at least one stepwise conductive layer. The stepwise capacitor represents a feature of multiple capacitors. When currents flow through the stepwise capacitor, different current paths are presented in between an upper conductor and a bottom conductor of the stepwise capacitor in response to different current frequency; different inductor is induced in each path and decoupled by a stepwise capacitor structure as disclosed herein.

In order to provide a battery in which a molded section can be fixed to a battery cell, a battery comprises a battery cell, a circuit board which is attached to the battery cell, an electrode terminal which connects the battery cell and the circuit board electrically, a molded section which adheres the circuit board and the electrode terminal to the battery cell as an entire unit, adhesion strengthened areas which are formed between the electrode terminal and the battery, and electrode terminal inner surface resin sections which are formed in a part of the molded section of the adhesion strengthened area.

A dual panel-type organic electroluminescent device includes first and second substrates spaced apart from each other, a gate line, a data line, and a power line formed over the first substrate, a switching thin film transistor connected to the gate and data lines, a driving thin film transistor connected to the power line and the switching thin film transistor, the driving thin film transistor including a driving semiconductor layer, a driving source, a driving drain, a first driving gate underneath the driving semiconductor layer, and a second driving gate above the driving semiconductor, an electrical connector over the first substrate, the electrical connector including a connection electrode layer connected to the driving thin film transistor, first and second thin film transistor connectors connecting the switching thin film transistor to the driving thin film transistor, and an organic electroluminescent diode on the second substrate, the organic electroluminescent diode connected to the electrical connector.

A continuous method of making dry-stretch microporous membrane battery separators from polypropylene (PP) or polyethylene (PE) or both benefits to the manufacturers in the production efficiency. The precursor-film extrusion in this invention is accomplished by multiple small film-extrusion lines at a compatible line speed with the followed oven processes (annealing and stretching). The overall production process starts continuously from film extrusion to annealing and to stretching. The benefits of the inventive continuous process includes a higher product yield, more effective oven-time usage, no need to handle and manage the intermediate products, less need in labor and machine maintenance, and potentially more stable product quality.

The dry-stretch membrane separators made with this inventive continuous method include (1) single-ply PP or PE separators having a thickness ranging from 0.2 mil to 2.0 mil; (2) PP/PE/PP trilayer microporous membrane separators having a thickness ranging from 0.6 mil to 4.0 mil. The PP/PE/PP trilayer can be accomplished in the early extrusion via either co-extrusion or extruding separately and then interposing PE layer between two PP layers, continuously, right before annealing/bonding and stretching process.

A method for producing a solid electrolytic capacitor, involving a step of loading a metal oxide on at least a part of the surface in the anode part of a capacitor element having a valve-acting metal substrate having there on a solid electrolyte, the valve-acting metal substrate having a dielectric film obtained by the electrochemical forming, and a solid electrolytic capacitor obtained by stacking two or more single plate capacitor elements having a metal oxide on at least a part of the surface in the anode part of a capacitor element comprising a valve-acting metal substrate having thereon a solid electrolyte, the valve-acting metal substrate having a dielectric film obtained by the electrochemical forming.

A method for storing image information in a digital pixel sensor is disclosed for reducing the size of the memory needed to facilitate multiple sampling. An image sensor includes a sensor array of pixel elements generating pixel data in k bits and a data memory for storing pixel data of each pixel element. In one embodiment, the data memory in the digital pixel sensor stores an m-bit time index value and the lower k−1 bits of the pixel data for pixel data exceeding the predetermined threshold level in all exposure times except the last. When pixel data in the last exposure time is captured, the data memory stores the time index value in less than m bits and stores the k-bit pixel data. The size of the data memory is minimized while preserving the image quality. The method of the present invention provides the benefits of reducing manufacturing cost and improving production yield.

The embodiments of the invention disclose an array substrate, a touch control line repairing method thereof and a display panel. The array substrate comprises a plurality of touch control electrodes, a plurality of touch control lines, a first repairing line, a second repairing line and at least one third repairing line. The plurality of touch control lines are in one-to-one correspondence with the plurality of touch control lines and are electrically connected with the touch control electrodes. The first repairing line and the second repairing line are arranged in the same layer and are not in the same layer with the touch control lines. The projection of the first repairing line is crossed with the first end of each touch control line in the light transmitting direction of the array substrate. The projection of the second repairing line is crossed with the second end of each touch control line in the light transmitting direction of the array substrate. The at least one third repairing line is in the same layer with the touch control lines. The projection of the third repairing line is respectively crossed with the first repairing line and the second repairing line in the light transmitting direction of the array substrate. According to the technical scheme of the invention, disconnected touch control lines on the array substrate can be effectively repaired by the repairing lines, so that the production yield is increased.

A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

Provided are a preparation method of a resist composition which enables stabilization of a dissolution performance of a resist film obtained from the resist composition thus prepared; and a resist composition obtained by the preparation process and showing small lot-to-lot variations in degradation over time. The process of the present invention is for preparing a chemically amplified resist composition containing a binder, an acid generator, a nitrogenous basic substance and a solvent and it has steps of selecting, as the solvent, a solvent having a peroxide content not greater than an acceptable level, and mixing constituent materials of the resist composition in the selected solvent.

An organic electroluminescent device includes: first and second substrates facing each other and spaced apart from each other, the first and second substrates having a central portion and a peripheral portion; an array layer on the first substrate, the array layer including a thin film transistor; an organic electroluminescent diode on the second substrate; a connection pattern between the first and second substrates, the connection pattern electrically connecting the thin film transistor and the organic electroluminescent diode; and a seal pattern in the peripheral portion, the seal pattern including a metallic material for attaching the first and second substrates.

The invention discloses a display panel, a fabrication method thereof and a display device. The display panel is provided with a display region and a non-display region, wherein the non-display regionis arranged around the display region, a groove structure is arranged at a part, corresponding to the non-display region, of the display panel, and a cooling layer is arranged in at least one part ofthe groove structure. In the display panel disclosed by the embodiment of the invention, the groove structure is arranged at the part, corresponding to the non-display region, of the display panel, the transfer of mechanical stress at the non-display region can be reduced, so that a crack generated by cutting of the display panel is prevented from extending to the display region in the display panel; and by arranging the cooling layer in the groove structure, heat generated by a cutting line is absorbed and dissipated by the cooling layer during cutting of the display panel, separation of aninorganic layer and an organic layer in the display panel caused by factors such as thermal diffusion, thermal expansion and thermal stress generated by the cutting line is prevented, the fabricationyield of the display panel is improved, and the service lifetime of the display panel is prolonged.

A transfer base substrate comprises: a substrate; a plurality of transfer thin film circuits formed on the substrate via removing layer; a test circuit formed on the substrate for checking circuit operation; and a wiring coupling each of transfer thin film circuits with a test circuit.

A light guide plate is adapted for use with at least one light source that is capable of providing source light beams. The light guide plate includes a plate body, and a plurality of light-guiding structures that are distributed on the plate body. Each of the light-guiding structures is in a substantially quadrilateral pyramidal form, and includes a quadrilateral lower end that has four corners, and a tapered upper end that is disposed opposite to the lower end. Each of the light-guiding structures further includes four sides, each of which is defined by the upper end and a corresponding adjacent pair of the corners, adjacent ones of the sides being interconnected.

This invention provides an effective and a method of laser processing for separating semiconductor devices formed on a single substrate (6) or separating high thickness, hard and solid substrates (6), which is rapid. During preparation of the device or substrate (6) for the cleaving/breaking/dicing procedure an area of damage (8, 11) is achieved by obtaining deep and narrow damage area along the intended line of cleaving. The laser processing method comprises a step of modifying a pulsed laser beam (1) by an focusing unit (1), such as that an “spike”-shaped beam convergence zone, more particularly an above workpiece material optical damage threshold fluence (power distribution) in the bulk of the workpiece (6) is produced. During the aforementioned step a modified area (having a “spike”-type shape) is created. The laser processing method further comprises a step of creating a number of such damage structures (8, 11) in a predetermined breaking line by relative translation of the workpiece (6) relative the laser beam (1) condensation point.

A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.

An elastic structure made by plastic injection molding comprises an elastic body and a connecting member. The elastic body includes two oppositely-connected half members which are made by plastic injection molding. The connecting member is formed around the circumference of the elastic body by injection molding and seals the two half members. While the connecting member is formed by injection molding, gas will be filled into the elastic body to make the elastic body have buffer elasticity. The half members made by plastic injection molding can be changed in shape as desired by changing the mold and can be formed with a mark portion with a brand slogan or mark during the plastic injection molding, thus making the production more convenient while controlling the yield. Furthermore, the application range of the elastic structure can be widened since the elastic structure can be made into different shapes.

The invention provides a touch display panel and a touch display device. A first transparent conductive layer, an insulating layer and a second transparent conductive layer are configured on the same side of a color filter substrate, and a touch scanning line and a touch sensing line are configured on one side of an active element array substrate to improve the manufacture yield of the touch display panel.

The invention discloses a copper foil production conjoint machine and a high-bonding strength copper foil technology for a lithium ion battery. The copper foil production conjoint machine comprises a foil production machine and a post-treatment machine. The post-treatment machine is connected to the back of the foil production machine. A straight-line distance between a treatment tank copper foil input roller of the post-treatment machine and a copper foil stripping roller of the foil production machine is less than or equal to 3m. A rough treatment anode plate and a curing treatment anode plate are arranged along two surfaces of copper foil in a pre-treatment tank of the post-treatment machine. A post-treatment process comprises carrying out double-surface rough treatment, curing treatment, passivation treatment and washing treatment on copper foil which is fed by the foil production machine and has double-surface roughness vales of Rz less than 1.7 micrometers and Ra less than 0.25 micrometers. Through utilization of a copper sulphate solution as a roughing solution and a curing solution, the production flow is simplified; the control process is simple and can be operated simply; and a yield is improved. The copper sulphate solution does not contain an arsenic compound, reduces pollutant discharge, is conducive to environmental protection, and has obvious economic and social benefits.

An optical proximity correction method is provided. A target pattern is provided, and then the target pattern is decomposed to a first pattern and a second pattern. The first pattern and the second pattern are alternately arranged in a dense region. Then, a compensation pattern is provided and it is determined whether the compensation pattern is added into the first pattern to become a first revised pattern, or into the second pattern to become a second revised pattern. Finally, the first revised pattern is output onto a first mask and the second revised pattern is output onto a second mask.

A single-layer multi-point capacitive touch screen comprises multiple electrode units, wherein each electrode unit comprises multiple first electrodes and multiple second electrodes. In at least one electrode unit, each first electrode of at least one part of first electrodes corresponds to at least two second electrodes. The first electrodes and the second electrodes comprise two types of electrodes. The first-type first electrodes and the first-type second electrodes are independent and are not connected. The second-type first electrodes and the second-type second electrodes are respectively connected at least one of the other second-type first electrodes and the other second-type second electrodes, and the second-type first electrodes and the second-type second electrodes which are connected are not adjacent. The connected second-type first electrodes do not correspond to the same-type first electrodes, and the connected second-type second electrodes do not correspond to the same-type first electrodes. In addition, the connected second-type first electrodes and the connected second-type second electrodes are not provided with corresponding portions, or only one of the connected second-type first electrodes is in one-to-one correspondence with one of the connected second-type second electrodes. The touch screen production yield is improved.

The invention provides a circuit repairing method used for a printed circuit board, comprising the following steps: firstly detecting a circuit on the printed circuit board, marking a position of a defect on the circuit, comparing the defect with a circuit design drawing, and obtaining coordinate values of the defect; then detecting a shape of the defect, designing and carving a to-be-repaired region according to the shape of the defect, and carving and removing a copper foil in a copper-rich region by using a carving machine; and finally referring to the circuit design drawing, determining aglue extrusion path and a glue extrusion technology according to the position and shape of the to-be-repaired region, extruding slurry into the to-be-repaired region according to the glue extrusion path and the glue extrusion technology, and solidifying the slurry. The provided circuit repairing method used for the printed circuit board has the advantages that the position and shape of the defectare detected, the copper-rich region and a copper-deficient region are carved, a short circuit defect is eliminated, then the to-be-repaired region is filled by using the slurry, repairing on the defects such as circuit breakage and a pit is realized, and production yield of the printed circuit board is improved.

The invention discloses a method for preventing low yield of a wafer edge device. In a regional medium layer of the wafer edge, the yield is reduced by excessive CMP (chemical mechanical polishing). The method comprises the following steps: forming a material layer to be polished on a semiconductor wafer; and performing CMP on the material layer to be polished, wherein the polishing removal rate of the wafer edge is less than that of the wafer central area. According to the invention, excessive polishing of the wafer edge is avoided, and the production yield of the wafer edge device is improved.

Methods for assembling a reciprocating body, such as a piston, within a bore using a design are described. The piston is substantially centered within the bore and then connected at one end through a rotational coupling to a substantially laterally fixed structure connected to the bore such that during normal operation the piston can rotate within the bore along the bore axis of symmetry but can no longer move laterally. Before fixing the rotational coupling, the piston is connected to an external gas source and substantially aligned along the bore axis of symmetry by a gas bearing having one or more gas bearing ports disposed toward the bore. During normal operation, the gas bearing provides a rotational force sufficient to realize a non-frictional bearing between the piston and the bore. The method of assembly is particularly useful in the assembly of Stirling cycle cryocooler comprising a piston, a compressor bore, adapted to contain the piston, a gas inlet to the piston, a plurality of gas bearing ports located within the piston and disposed toward the compressor bore, the gas inlet being in fluid communication with the gas bearing ports, a rotational coupling structure attached to one end of the piston, and a substantially laterally fixed structure affixed to the compressor bore and the rotational coupling structure.