There are provided image
pickup devices capable of significantly increasing production yield and ensuring long-term reliability and a method for manufacturing the image
pickup devices. This invention is characterized in that it has a large number of light-receiving portions 2 formed at a surface portion of a
wafer 1 and a
microlens 3 formed for each of the light-receiving portions, through electrodes 4 for performing supply of power to the light-receiving portions 2 and passing and reception of an electrical
signal are provided all over the periphery of the
wafer 1, one end of each through
electrode 4 is connected to an
electrode pad 4a which is connected to a wire leading to a light-receiving element at the surface portion of the
wafer 1, the other end is connected to a wire through a back
electrode 5, a rib 7 which serves as a partition portion arranged to surround the microlenses 3 on four sides is provided on the surface of the wafer 1, a transparent plate 8 of
optical glass or the like is bonded to an upper surface of the rib 7 with
adhesive, and a protective frame 10 is provided at a junction between the rib 7 and the transparent plate 8.