In the manufacture of a
semiconductor device by adopting a block molding method wherein a
semiconductor chip is fixed onto a wiring substrate through an
adhesive, the occurrence of a defect caused by flowing-out of the
adhesive is to be prevented. The
semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a
semiconductor chip fixed through an
adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the
semiconductor chip with each other, and a seal member, i.e., a
package, which covers the
semiconductor chip, the main surface of the wiring substrate and the electrodes, wherein a groove is formed between the semiconductor
chip and the electrodes and the seal member and the wiring substrate have side faces
cut by dicing. A protruding portion of the adhesive (an insulating resin) stays within the groove without getting over the groove and does not reach the electrodes. The groove is formed by removing the insulating film partially in the full
depth direction of the film so as to extend through the film.