The invention discloses a multi-layer circuit
board structure based on an AMB technology and a preparation technology, and relates to the field of circuit board preparation, and the preparation technology comprises the following steps: providing a plurality of substrates with
coating surfaces, and scanning the
coating surfaces through a second
laser beam to preheat the substrates, spraying
welding flux on the
coating surface through a spray head with a first ultrasonic generation module to form a
welding flux layer; the surface of the solder layer is scanned through a third
laser beam, so that the surface of the solder layer is softened, the solder layer is automatically spread and leveled, and a semi-
solid solder layer is formed after cooling; and a plurality of substrates are stacked and fixed through a positioning clamp, then each solder layer is scanned through a fourth
laser beam, the solder
layers are vibrated by a second ultrasonic generation module, and after the solder
layers are cooled and solidified to form
welding spots, the multilayer circuit
board structure is obtained. Through combination of laser and ultrasonic
waves, the thickness of the solder layer is uniform, and the surface is smooth; bubbles and impurities in the solder layer are eliminated through laser and ultrasonic combined melting, and the problems of uneven coating and accumulation and bubbling are avoided.