The invention discloses a manufacturing process of a multi-layer insulation press-fit high-
voltage-resistant
printed circuit board, and relates to the technical field of high-
voltage PCBs, and the manufacturing process comprises the steps: 1, taking target
field intensity distribution and polarization response as traction, carrying out the reverse deduction of a thickness
dielectric attribute and a segmentation sequence, forming a
barrier layer stack parameter set version baseline, and taking the baseline as a manufacturing input; 2, formulating an interface activation strategy and a pressing program according to the
base line, and implementing pre-
drying, vacuumizing, isothermal
permeation, sequential curing and controlled cooling and recording; and 3, detecting the
dielectric agent amount and the
discharge agent amount by using the
verification sheet group, and comparing the baseline to generate a manufacturing release packet. 3, setting a field plate and a
voltage-sharing pattern under the condition of keeping the
base line, optimizing a conductor boundary and a via hole, and carrying out edge sealing and
coating; the device is suitable for a scene where direct-current bias and high-frequency pulse coexist, and
electric field peak clipping, interface stability, thickness uniformity and alignment control are achieved.