10500 results about "Integrated devices" patented technology

An integrated device for poration of biological tissue, harvesting a biological fluid from the tissue, and analysis of the biological fluid. The device comprises a tissue-contacting layer having an electrically or optically heated probe to heat and conduct heat to the tissue to form at least one opening, such as a micropore to collect biological fluid from the opening, and a detecting layer responsive to the biological fluid to provide an indication of a characteristic of the biological fluid, such as the concentration of an analyte in interstitial fluid. In the embodiment in which, the probe comprises a photosensitizing assembly designed for the uniform application of a photosensitizing material, such as, for example, a dye or a pigment, to a tissue, e.g., the stratum comeum. In one embodiment, the photosensitizing assembly comprises photosensitizing material combined with a carrier, such as, for example, an adhesive or an ink, and the resulting combination is applied to a substrate, such as, for example, an inert polymeric substrate to form a photosensitizing assembly. In another embodiment, the photosensitizing assembly comprises photosensitizing material incorporated into a film-forming polymeric material.

An integrated circuit regulates current flowing from a battery to a load without requiring an external current sense resistor. The IC includes a primary charge pump; a model charge pump; a current sense circuit, a first control circuit to force a voltage level at the output of the model charge pump to be equal to a voltage level at the output of the primary charge pump; and, a second control circuit to force a model current put out by the model charge pump to be equal to a reference current. Current passing through the primary charge pump is regulated at a level established by the capacitance value of an external flying capacitor irrespective of input voltage variation of the battery power source.

A method, system, computer program product, and method of doing business by providing a secure integrated device (such as a pervasive computing device) for which operating capabilities can be dynamically yet securely selected (including, but not limited to, pluggable connection of input/output devices and/or application processors that provide selected functions). Each input/output (I/O) device and application processor to be used is plugged in to a bus of a security core, and authenticates itself to the security core using public key infrastructure techniques, thereby creating a secure multi-function device. All of the multi-function device's input and output interactions with its environment necessarily traverse an I/O bus under the sole control of the security core. The only communication path between an application processor and the external environment (such as an I/O device) is through an application processor bus, which is likewise under control of the security core. Thus a user may dynamically yet securely select the capabilities of a multi-function device, and because each I/O device and application processor in use by that multi-function device is authenticated, the security of transactions or network services performed when using such devices is improved.

A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Disclosed herein is a method of cleaning oxide from a surface in the fabrication of an integrated device using reducing radicals and UV radiation. For silicon surfaces, the cleaning may be performed at a temperature at which a hydrogen-terminated passivated surface is stable, such that the surface remains protected after loading into the chamber until the cleaning is performed. Performing the cleaning at a lower temperature also consumes a reduced portion of the thermal budget of a semiconductor device. Epitaxial deposition can then be performed over the cleaned surface.

A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device.

High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.

The present invention relates to new methods for manufacturing photovoltaic devices and an apparatus for practicing those methods of manufacture. The present invention employs a transfer-through system for advancing work piece substrates through an integrated apparatus of multiple treatment chambers that control each of the manufacturing processes.

To reduce power consumption of a semiconductor integrated circuit and to reduce delay of the operation in the semiconductor integrated circuit, a plurality of sequential circuits included in a storage circuit each include a transistor whose channel formation region is formed with an oxide semiconductor, and a capacitor whose one electrode is electrically connected to a node that is brought into a floating state when the transistor is turned off. By using an oxide semiconductor for the channel formation region of the transistor, the transistor with an extremely low off-state current (leakage current) can be realized. Thus, by turning off the transistor in a period during which power supply voltage is not supplied to the storage circuit, the potential in that period of the node to which one electrode of the capacitor is electrically connected can be kept constant or almost constant. Consequently, the above objects can be achieved.

Photonic integrated circuits on silicon are disclosed. By bonding a wafer of compound semiconductor material as an active region to silicon and removing the substrate, the lasers, amplifiers, modulators, and other devices can be processed using standard photolithographic techniques on the silicon substrate. A silicon laser intermixed integrated device in accordance with one or more embodiments of the present invention comprises a silicon-on-insulator substrate, comprising at least one waveguide in a top surface, and a compound semiconductor substrate comprising a gain layer, the compound semiconductor substrate being subjected to a quantum well intermixing process, wherein the upper surface of the compound semiconductor substrate is bonded to the top surface of the silicon-on-insulator substrate.

The movement and mixing of microdroplets through microchannels is described employing silicon-based microscale devices, comprising microdroplet transport channels, reaction regions, electrophoresis modules, and radiation detectors. The discrete droplets are differentially heated and propelled through etched channels. Electronic components are fabricated on the same substrate material, allowing sensors and controlling circuitry to be incorporated in the same device.

An integrated circuit may have separate clock control for a number of different functional units. Ancillary to some of the functional units may be an activity detector and clock control unit which monitors input to its functional unit to determine when the functional unit will be inactive. When an activity detector and clock control unit determines that a particular functional unit is or will be inactive, it may disable clocking to its functional unit while the functional unit is inactive. When activity detector and clock control unit determines that activity will resume for its functional unit, it enables clocking to its functional unit. Thus, the activity detector and clock control unit for each such functional unit functions to control clocking to its respective functional unit so that during periods of inactivity, inactive functional units are not clocked to reduce the overall static and/or dynamic power consumption for the integrated device.

A single, integrated device in which a body fluid (e.g., blood) of a human or animal can be both collected and analyzed easily and without risk of contamination is disclosed. The collection portion and analysis portion of the device are permanently joined to permit movement of small quantities of body fluid under controlled conditions, to minimize any waste of the body fluid, to ensure that no contamination reaches the main body fluid volume, and to create a permanent physical record of the results of the analysis in association with the fluid sample itself: A wide variety of different body fluid components which may be indicative of various diseases, dysfunctions and abnormalities of the human or animal or the body fluid itself can be tested for. The device includes a container for collecting human or animal body fluid, one or more testing chambers containing one or more analysis units activated by body fluid; a transfer pump or vacuum assembly to transfer one or more samples into the analysis units; and one-way valves or the equivalent to prevent any portion of the withdrawn sample from being returned to the collection container. The body fluid acted upon may be blood, blood plasma, urine, bile, pleural fluid, ascites fluid, stomach or intestine fluid, colostrom, milk or lymph.

A multi-function ultrabase comprises a base member, a Mass Storage Device Interface, at least one Universal Serial Bus (USB), and a plurality of connectors (PS/2 connector and COM ports). Wherein, the USB connector is locate at the base member for connecting with a notebook or a desktop; An Integrated Device Electronics (IDE) Interface is located at the base member to connect to a Mass Storage Device and to couple the base member and the Mass Storage Device. The Mass Storage Device can be connected to the computer device by the USB connector; A plurality of connectors are located at the base member for connecting multiple related I/O device. Making the multiple related I/O device connect to the computer device by the USB connector.

The invention is directed to a method for optical and electrical isolation between adjacent integrated devices. The method comprises the steps of forming at least one trench through an exposed surface of a semiconductor wafer by removing a portion of the semiconductor wafer material, forming an electrically insulating layer on the sidewalls and the bottom of the at least one trench, filling the at least one trench by conformally depositing an optically isolating material, and planarizing the semiconductor wafer surface by removing the portion of the optically isolating material above the exposed surface of the semiconductor wafer.

A method for the fabrication complex-transition metal oxide (CTMO)/semiconductor or dielectric substrate integrated devices includes the separation of the CTMO film growth process from the CTMO-film/semiconductor or dielectric substrate integration process. The CTMO-film is transferred from the native substrate to the final substrate for fabrication into devices. The CTMO-film is grown onto a native substrate under growth conditions chosen to provide a CTMO-film having desirable properties and thickness. No restrictions are placed upon the native substrate used, the growth method used, or on the growth conditions required. The CTMO-film is then joined to the semiconductor or dielectric substrate and the native substrate is removed, providing the basis for an integrated electronics, photonics, or MEMS device. Techniques fully compatible with semiconductor processing can be used to fabricate monolithically integrated CTMO/semiconductor devices in a first embodiment.

Systems and methods are provided for an integrated device that persistently (or permanently) stores biometric data for a user in a tamper-resistant format. Subsequently, scan data collected from a user (e.g., a finger-print) can be compared against the biometric data. Once the user has been verified by the integrated device, a code can be wirelessly transmitted for authentication. The authentication module sends the code to a trusted key authority. The trusted key authority checks a list of enrolled integrated devices for a match. If there is a match, the authentication module sends a message to an application to allow access by the user. The trusted key authority also stores a profile associated with the code. The profile can contain user information such as name, age, account numbers, preferences, etc. and can also describe the status of the integrated device.

An integrated verification and manufacturability tool provides more efficient verification of integrated device designs than verification using several different verification tools. The integrated verification and manufacturability includes a hierarchical database to store shared design data accessed by multiple verification tool components (e.g., layout versus schematic, design rule check, optical process correction, phase shift mask assignment and machine language conversion). The hierarchical database includes representations of one or more additional, or intermediate layer structures that are created and used by the verification tool components for operations performed on the design being verified. Use of a single hierarchical database having shared data for access and use by multiple verification components streamlines the verification process, which provides an improved verification tool.

The multi-target tracking and discrimination system (MOST) fuses with and augments existing BMDS sensor systems. Integrated devices include early warning radars, X-band radars, Lidar, DSP, and MOST which coordinates all the data received from all sources through a command center and deploys the GBI for successful interception of an object detected anywhere in space, for example, warheads. The MOST system integrates the optics for rapid detection and with the optical sensor array delivers high-speed, high accuracy positional information to radar systems and also identifies decoys. MOST incorporates space situational awareness, aero-optics, adaptive optics, and Lidar technologies. The components include telescopes or other optical systems, focal plane arrays including high-speed wavefront sensors or other focal plane detector arrays, wavefront sensor technology developed to mitigate aero-optic effects, distributed network of optical sensors, high-accuracy positional metrics, data fusion, and tracking mounts. Field applications include space monitoring, battlefield artillery, battlefield management, ground defense, air defense, space protection, missile defense, gunfire detection, and the like.

This invnetion discloses a new generation call center (NGCC) system including an automatic call device ADC, a computer telephone integrated device CTI, an interactive voice response system IVR, a seat agent, an applied server AS and a database DB, in which, said ACD is used in mapping call requests of different signaling protocols from wide and narrow band network to a unified call matter and reports it to CTI device by a standard and open interface protocol and finishes the control process of call voice or video multimedia channel, said CTI device is used in boosting up queue to the reported call access request and route control to dispatch and manage the seats and IVR unifiedly, said IVR is used in analyzing and executing the automatic service logic and providing media resource ability.