2546 results about "Electrical isolation" patented technology

An end effector assembly adapted to couple to an electrosurgical instrument, the end effector assembly including a pair of opposing jaw members pivotably attached about a pivot member and moveable from a first spaced position to a second grasping position. Each jaw member includes a jaw housing and a seal plate formed on an inner surface of the jaw member including at least two seal plate segments extending along a substantial portion of the length of the jaw members. An insulating member is positioned between adjacent seal plate segments and configured to provide electrical isolation between adjacent seal plate segments. Each sealing plate segment is adapted to selectively connect to an electrosurgical energy source and form part of an electrosurgical energy delivery circuit.

Apparatus, systems, and methods for forming a photovoltaic cell from a common layer on a substrate are provided. A first pass is made with a first laser beam over an area on the common layer. The first pass forms a groove in the common layer. The first pass forms within the common layer a first edge and a second edge. The first edge is separated from the second edge by the groove. The groove provides a first level of electrical isolation between the first edge and the second edge. A second pass is made with a second laser beam over approximately the same area on the common layer. The second pass provides a second level of electrical isolation between the first edge and the second edge. The second level of electrical isolation is greater than the first level of electrical isolation.

Method and apparatus for providing electrical isolation between devices in batch testing process during manufacturing procedure is provided.

A chemical vapor deposition apparatus is disclosed. The chemical vapor deposition apparatus comprises a chamber having a base plate, a chamber wall, a gas inlet and a gas outlet. The base plate has holes therethrough. A plurality of electrodes extend through the holes of the base plate. The plurality of electrodes are capable of being attached to a power source. At least two of the plurality of electrodes are capable of being electrically coupled to a silicon rod positioned in the chamber. An electrical isolation bushing can be positioned between each of the plurality of electrodes and the base plate. The electrical isolation bushing comprises a sleeve portion surrounding a portion of the electrodes that extends through the base plate and a collar portion surrounding the holes at a surface of the base plate. In some instances, the collar portion can comprise a different material than the sleeve portion. In some instances, an isolation layer can be employed in addition to the isolation bushing, the isolation layer surrounding the holes at the surface of the base plate. In some instances, the collar portion and the sleeve portion are both ceramic.

A control unit in a vehicle is provided in which power is supplied via a converter that provides an electrical isolation. For the data exchange with external components and other components in the control unit that are not electrically isolated, the component isolated by this electrical isolation is additionally connected to a coupling element that likewise provides an electrical isolation.

A micro-electromechanical system (MEMS) switch formed on a substrate, the switch comprising a transmission line formed on the substrate, a substrate electrostatic plate formed on the substrate, and an actuating portion. The actuating portion comprises a cantilever anchor formed on the substrate and a cantilevered actuator arm extending from the cantilever anchor. Attraction of the actuator arm toward the substrate brings an electrical contact into engagement with the portions of the transmission line separated by a gap, thus bridging the transmission line gap and closing the circuit. In order to maximize electrical isolation between the transmission line and the electrical contact in an OFF-state while maintaining a low actuation voltage, the actuator arm is bent such that the minimum separation distance between the transmission line and the electrical contact is equal to or greater than the maximum separation distance between the substrate electrostatic plate and arm electrostatic plate.

A system for transferring electrical signals while providing electrical isolation may include a first circuit and a second circuit electrically isolated from the first circuit. The first circuit may provide a first electrical signal path for conveying a transmit electrical signal and including a first EHF communication unit. The first EHF communication unit may be configured to receive the transmit electrical signal and to electromagnetically transmit an electromagnetic EHF signal representative of the electrical signal. The second circuit may provide a second electrical signal path and including a second EHF communication unit. The second EHF communication unit may be configured to electromagnetically receive the transmitted electromagnetic EHF signal, extract a received electrical signal from the received electromagnetic EHF signal, and apply the received electrical signal to the second electrical signal path. A dielectric element may conduct the electromagnetic EHF signal between the first and second EHF communication units.

A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The pairs of terminals are further aligned with each other so that horizontal faces of the terminals in each pair face each other to thereby promote broadside coupling between horizontal pairs of terminals. The components further include vertical castellations between adjacent terminals in order to provide electrical isolation to adjacent pairs of terminals.

A disposable simultaneous stereo endoscope system is disclosed. The disposable endoscope does not include image relay. Instead, two electronic imaging sensors and solid illumination lighting are arranged inside the endoscope. A demultiplexing beam splitter is used for splitting the two imaging light beams to the two imaging devices. A wedged multi-facet illumination window is used to create an illumination field that is larger than the field of view of the imaging optics. An electrically conductive heat sink is engaged for dissipating the heat generated by the solid light source and also for shielding end side of the endoscope. The disposable endoscope is shielded from electromagnetic interferences. A repeater unit is used to electrically connect the disposable endoscope with a remote receiver and to increase the data transfer rate. An electrical isolation means is provided between the endoscope and an image processing and power conditioning unit to protect the endoscope against electric shock.

An endoscope device providing electrical isolation between the endoscope and a camera control unit coupled to the endoscope. The endoscope uses an optical channel to transmit illuminating light to the endoscope and to transmit image data generated by an imaging device to the camera control unit. In this manner, only an optical connection between the endoscope and the camera control unit exits. Alternatively, a wireless channel for transmission of the image data and any commands signals may be utilized.

An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.

Layers of conductive foil and insulating material are configured to interconnect an array of rear-contact solar cells. An embodiment provides that the layer of conductive foil may be patterned to form repeating sets of electrically isolated, interdigitated fingers. Each set of interdigitated fingers may be used to connect the positive polarity contacts of a first rear-contact solar cell to the negative polarity contacts of a second, adjacent rear-contact cell. The insulating layer is attached to the patterned conductive foil and provides mechanical support and / or electrical isolation. In some embodiments, a protective backsheet may be disposed beneath the conductive foil and / or insulating layer to provide further mechanical support and environmental protection. In some embodiments, the layers of conductive foil and insulating material may be incorporated as an interconnect circuit in a rear-contact PV module.

A radio front end includes an antenna tuning unit, a duplexer, a balancing network, and a processing module. The antenna tuning unit is operably coupled to an antenna and operable to tune an operational characteristic of the antenna based on an antenna tuning signal. The duplexer is operably coupled to the antenna tuning unit and operable to provide electrical isolation between an outbound wireless signal and an inbound wireless signal. The balancing network is operably coupled to the duplexer and operable to establish an impedance that substantially matches an impedance of the antenna. The processing module is operable to estimate the impedance of the antenna to produce an estimated antenna impedance and to generate the antenna tuning signal based on the estimated antenna impedance.

A microfabricated device having a high vertical aspect ratio and electrical isolation between a structure region and a circuit region. The device may be fabricated on a single substrate and may include electrical interconnections between the structure region and the circuit region. The device includes a substrate and an isolation trench surrounding a structure region in the substrate. The isolation trench includes a lining of a dielectric insulative material. A plurality of microstructure elements are located in the structure region and are laterally anchored to the isolation trench.

An optical disk comprises a disk substrate having a hub and an annular optical metallicized data region extending radially outward from the hub. The optical disk further comprises a radio frequency identification (RFID) transponder affixed to the disk substrate, e.g., within the non-data containing hub region. The optical disk further comprises at least one linear antenna element coupled to the transponder, e.g., via pole lead(s), and extending within the data region. The antenna element(s) can be applied to the disk substrate as a patterned antenna layer over a metallicized data region, and can be electrically isolated from the data region. A method and system of identifying an optical disk is provided. A radio frequency (RF) signal can be transmitted to the optical disk at a range of at least five feet, and preferably at a range of at least ten feet. An RF signal with an identification code (e.g., a unique number) can be received from the optical disk in response to the transmitted RF signal. The activating RF signal can be transmitted by, and the identification RF signal can be received by, e.g., a handheld RF reader or an RF reader that is affixed to a building. The identification code can then be processed for many purposes, such as identifying the optical disk as a non-counterfeited optical disk, calculating a royalty, or tracking the location of the optical disk.

The invention is directed to a method for optical and electrical isolation between adjacent integrated devices. The method comprises the steps of forming at least one trench through an exposed surface of a semiconductor wafer by removing a portion of the semiconductor wafer material, forming an electrically insulating layer on the sidewalls and the bottom of the at least one trench, filling the at least one trench by conformally depositing an optically isolating material, and planarizing the semiconductor wafer surface by removing the portion of the optically isolating material above the exposed surface of the semiconductor wafer.

A front end module includes a duplexer and a balancing network. The duplexer includes a compensation circuit and a transformer three windings having five nodes. The first node for operably coupling an antenna to the first winding; the second node operable to receive an outbound wireless signal and operably couples the first winding to the second winding; the third node operably couples the second winding to a balancing network; the fourth node operably coupled to output a first signal component corresponding to an inbound wireless signal from the third winding; and the fifth node operably coupled to output a second signal component corresponding to an inbound wireless signal from the third winding. The duplexer provides electrical isolation between the first and second signal components and the outbound wireless signal. The compensation module is operable to compensate the electrical isolation between the first and second signals and the outbound wireless signal.

The invention relates to a photovoltaic module capable of being electrically isolated and an electrical isolation method thereof. The photovoltaic module is composed of a plurality of solar modules which are mutually connected; wherein the power output loop of each solar module is connected with a breaker, interruption of power supply is required when in emergency, the electric connection circuit of the photovoltaic module is utilized to load and transmit a power interruption signal, the power interruption signal triggers the breaker to cut off the power transmission line of each solar module, thus the whole photovoltaic generating system stops power output; and when the emergency is lifted, the power interruption signal is disconnected, so that the breaker is switched on the power transmission line and power supply is normal. The invention has the advantages of simple structure and reliable operation.

An electrically isolated combined power and signal coupler is usable for a portable medical monitoring device attachable to a patient in a medical environment. A power coupling system transfers power between a power source and a powered device separated by a physical and electrical isolation barrier. The system comprises a power coupler including in a first device, a first section of a magnetic circuit including a first core section of magnetically permeable material of cross-sectional area substantially larger at an isolation barrier interface than within a first winding located on the first core section. The first section of magnetic circuit being suitable, in a docking mode, for positioning adjacent to a second section of magnetic circuit in a second device to form a completed magnetic circuit used to transfer power between said first and second device. The second section of magnetic circuit including a second core section with a second winding magnetically coupling with the first winding via the completed magnetic circuit in the docking mode for the power transfer. The first core section comprises at least one substantially planar core section at the isolation barrier interface for positioning adjacent to a corresponding substantially planar core section of said second section of magnetic circuit at the isolation barrier interface to form the completed magnetic circuit without a device containing the second section of magnetic circuit enveloping a significant portion of the substantially planar core section.

An arrangement for enhancing electrical isolation between antennas in antenna structures comprising at least two antennas, and a radio device applying the arrangement. The interfering antenna comprises components causing substantial degradation in radiation characteristics in the operating band of another antenna. For example, a PIFA (310) may comprise, instead of a short-circuit conductor, a conductive structure (312, 313, 314) having a parallel resonance in the operating band of another antenna (320). Mutual interference of radio parts using separate antennas can be made relatively small without electrical isolation arrangements between antenna elements. Moreover, the invention makes antenna filter design easier and reduces disadvantages caused by antenna filters.

Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses. In another implementation, the isolating means comprise a multiplicity of short circuit protection modules, each module comprising a current sensor circuit and an electrical isolation switch.

The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate.

In general, the invention is directed to an IMD having a piezoelectric transformer to power a lead-based sensor. The IMD powers the piezoelectric transformer with a low amplitude signal. The piezoelectric transformer serves to convert the voltage level of the low amplitude signal to a higher voltage level to drive the sensor produced by a battery in the IMD to voltage levels appropriate for IMD operation. A piezoelectric transformer offers small size and low profile, as well as operational efficiency, and permits the IMD to transmit a low amplitude signal to a remote sensor deployed within an implantable lead. In addition, the piezoelectric transformer provides electrical isolation that reduces electromagnetic interference among different sensors.

To suppress stiction of a MEMS resonator during fabrication, conductive structures of the MEMS resonator are electrically coupled via a ground strap during the step of forming isolation trenches around their contact structures. After the isolation trenches have been formed, the ground strap is transformed into a non-conductive material to complete the electrical isolation of the conductive structures. An etch mask formed on top of the ground strap prevents etching of the ground strap during the formation of the trenches. Depending on the etching process, the ground strap may be formed as a bridge that suspends above the isolation trench or as a column that extends down to the bottom of the isolation trench.

A radio front module includes a power amplifier, a duplexer, and a tunable balancing network. The power amplifier is operably coupled to amplify an up-converted signal into an outbound wireless signal. The duplexer is operably coupled to an antenna and operable to provide electrical isolation between the outbound wireless signal and an inbound wireless signal. The tunable balancing network is operable to establish an impedance that substantially matches an impedance of the antenna. The tunable balancing network includes a plurality of capacitive elements, a plurality of resistive elements, and a plurality of low-voltage switching elements operable to, and in accordance with a tuning signal, couple one or more of the plurality of capacitive elements and one or more of the plurality of resistive elements to the duplexer as an impedance balancing load.

A MEMS (microelectromechanical system) electrical switch device is provided for circuit protection applications. The device includes a mechanical latching mechanism by which the switch is held in the closed position, and a mechanism by which this latch is released when the load current passing through the device reaches or exceeds some desired magnitude. In addition, a mechanism is provided by which the switch may be reset to its closed position by applying an electrical control voltage to certain terminals of the device. A number of these devices, or arrays of these devices, can be fabricated by parallel processes on a single substrate, and photolithography can be employed to define the mechanical structures described above. Other embodiments include additional electrical isolation of the resetting mechanism, enhancement of the separation distance of the contact points of the switch in the open position, and prevention of arcing at the latch mechanism. A method of fabricating the device is provided. A method of using the aforementioned device is also provided.

In a 3D free space micromirror device, a mirror plate is joined with actuators through flexible springs where the other ends of the actuators have fixed support on the substrate. Single crystal silicon and aluminum are used as bi-morph materials with silicon dioxide providing electrical isolation between the two. Thickness variation in the microstructure is achieved by two-step p-n junction formed in a p-type substrate. Thick and thin n-silicon layer formation and DRIE cut mechanisms are employed in such a way that all the thick and thin silicon components of the structure are released simultaneously avoiding overetch which can be detrimental to the thin flexural springs. Working prototypes of the device have been found suitable for any optical switching array architecture where deflections up to 10 degrees are required.

The present disclosure is related to a multiport adapter for a telecommunication connector system that is designed to reduce EMI from outside sources, as well as, between adjacent ports by electrical isolation design. The reduction of EMI is done by non-conventional methods of connecting hardware shielding techniques. The shield design surrounds all the internal pairs within the plug housing to reduce the transmitted signals EM radiation during transmission and it does not make contact with the modular connector plug, horizontal cable or the plastic support adapter housing. By isolating each component in the interface system, the coupled radiated noise from each port to port shield is individually controlled.