3446results about "Radiation controlled devices" patented technology

An image sensor, a level shifter circuit, and an operation method thereof are provided. The image sensor includes a pixel circuit and a pixel driving circuit. The pixel driving circuit includes first, second, third, fourth, fifth, and sixth transistors. A first terminal of the first transistor is coupled to a first voltage. A first terminal of the second transistor is coupled to the first voltage, and a control terminal of the second transistor is coupled to a control terminal of the first transistor and a second terminal of the first transistor. A first terminal of the third transistor is coupled to the second terminal of the first transistor, and a second terminal of the third transistor is coupled to a ground voltage. A first terminal of the fourth transistor is coupled to a second terminal of the second transistor and an output terminal.

The invention relates to a backside illuminated image sensor and a preparation method thereof, and electronic equipment, and relates to the technical field of integrated circuits, the backside illuminated image sensor comprises a substrate, and photodiodes and laminated isolation structures which are located on the substrate, are alternately arranged along a first direction parallel to the surface of the substrate, and extend along the direction towards the substrate. The photodiode comprises an isolation layer, a first photosensitive layer, a second photosensitive layer and a third photosensitive layer which are sequentially stacked in the direction away from the substrate. The first photosensitive layer internally comprises a plurality of first SiP layers arranged at intervals in the first direction, and the first SiP layers penetrate through the first photosensitive layer in the second direction and extend to the isolation layer. And the third photosensitive layer internally comprises a plurality of second SiP layers which are arranged at intervals along the first direction, and the plurality of second SiP layers penetrate through the third photosensitive layer along the second direction and extend to the second photosensitive layer, so that the number of photon-generated carriers can be increased, and the quantum efficiency of the device can be improved.

A sensor that can reduce kTC noise and can be miniaturized is provided. A sensor according to the present embodiment is a sensor including a plurality of pixels, in which each of the pixels includes a semiconductor layer of a first conductivity type having a first surface, a photoelectric conversion section that is provided in the semiconductor layer and converts light incident on the semiconductor layer into a charge, a first channel layer of the first conductivity type that is provided on a side of the first surface in the semiconductor layer, a first gate electrode provided above the first channel layer, and a first capacitor layer of a second conductivity type that is provided below the first channel layer and accumulates the charge.

The invention relates to a backside illuminated image sensor and a preparation method thereof, and electronic equipment, and relates to the technical field of integrated circuits, the backside illuminated image sensor comprises a substrate, and photodiodes and laminated target isolation structures which are located on a first surface of the substrate, are alternately arranged along a first direction parallel to the first surface, and extend towards the substrate; the substrate internally comprises a plurality of trench isolation structures which extend into the substrate through the first surface and are arranged at intervals in the first direction; the trench isolation structures and the laminated target isolation structures right above the trench isolation structures are arranged in a one-to-one manner; the laminated target isolation structure comprises isolation parts and insulation parts which are sequentially and alternately laminated along a second direction deviating from the substrate; the photodiode comprises at least two photosensitive layers which are sequentially stacked in the second direction, the longitudinal sections of the photosensitive layers are T-shaped, one photosensitive layer makes contact with the first surface of the substrate, substrate damage caused by ion implantation can be avoided, and meanwhile the photoelectric conversion efficiency and the quantum efficiency are improved.

The invention relates to a backside illuminated image sensor and a preparation method thereof, and an electronic device, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate which comprises an isolation layer and a plurality of first isolation structures which are arranged at intervals in a first direction parallel to the surface of the substrate; forming first isolation parts in the substrate, wherein the first isolation parts and the first isolation structures are arranged in a one-to-one manner and extend to the isolation layer through the back surface of the substrate; removing the substrate between the adjacent first isolation parts to obtain side wall semiconductor layers located on the side surfaces of the first isolation parts and first grooves between the adjacent side wall semiconductor layers; the size of the side wall semiconductor layer is gradually increased in the direction close to the isolation layer. And forming a bottom photosensitive layer in the first groove, and epitaxially growing a top photosensitive layer on the bottom photosensitive layer. And forming a second isolation part connected with the first isolation part in a gap between the adjacent top photosensitive layers, thereby improving the photoelectric conversion efficiency and the quantum efficiency.

An image sensing device includes a pixel array including a plurality of image detection pixels structured to convert light incident onto the image detection pixels into pixel signals representing an image of an object, a plurality of phase-difference detection pixels in the pixel array structured to detect light from the object to generate a phase signal for measuring a distance between the image sensing device and the object, and a first lens positioned to direct light to the plurality of phase-difference detection pixels and including a plurality of portions each corresponding to at least one of the phase-difference detection pixels. A center of the first lens is located over a center of the plurality of phase-difference detection pixels, and each portion of the first lens extends from the center along a row or column direction between adjacent phase-difference detection pixels or along diagonal directions between the row and column directions.

To provide an image sensor in which the conversion gain (CG) is improved, the arrangement efficiency and size of pixel transistors are increased, and a metal wiring layer is reduced.SOLUTION: An image sensor of the present invention includes a pixel including two photodiodes (PDs) disposed on both sides in a first direction, a deep trench isolation (DTI) structure including an internal DTI structure that separates the two PDs in the pixel from each other and extends in a second direction that is orthogonal to the first direction and an external DTI structure that separates the pixels from each other and extends in the first direction or the second direction, a floating diffusion (FD) region that is disposed between a central part of the external DTI structure extending in the first direction and an edge of the internal DTI structure, and a transmission gate (TG) disposed adjacent to the FD region and disposed at least one by one in the PD. The two PDs in the pixel share the FD region.SELECTED DRAWING: Figure 2

An image sensing device includes a first photoelectric conversion element configured to overlap a left region of a first microlens, a second photoelectric conversion element configured to overlap a right region of the first microlens, a first floating diffusion region configured to accumulate photocharges received from at least one of the first photoelectric conversion element and the second photoelectric conversion element, a first transfer gate disposed at a top-left side of the first floating diffusion region and configured to transfer photocharges of the first photoelectric conversion element to the first floating diffusion region, and a second transfer gate disposed at a bottom-right side of the first floating diffusion region and configured to transfer photocharges of the second photoelectric conversion element to the first floating diffusion region.

An image sensor including a substrate having first and second surfaces that are opposite to each other. The substrate includes unit pixel regions having photoelectric conversion regions. A semiconductor pattern is disposed in a first trench defined in the substrate and defines the unit pixel regions. The semiconductor pattern includes a first semiconductor pattern and a second semiconductor pattern disposed on the first semiconductor pattern. A back-side insulating layer covers the second surface of the substrate. The first semiconductor pattern includes a side portion extended along an inner side surface of the first trench and a bottom portion connected to the side portion and disposed closer to the second surface of the substrate than the side portion. The second semiconductor pattern extends toward the second surface of the substrate and is spaced apart from the back-side insulating layer with the bottom portion of the first semiconductor pattern interposed therebetween.

A photo-detecting apparatus is provided. The photo-detecting apparatus includes a carrier conducting layer having a first surface; an absorption region is doped with a first dopant having a first conductivity type and a first peak doping concentration, wherein the carrier conducting layer is doped with a second dopant having a second conductivity type and a second peak doping concentration, wherein the carrier conducting layer comprises a material different from a material of the absorption region, wherein the carrier conducting layer is in contact with the absorption region to form at least one heterointerface, wherein a ratio between the first peak doping concentration of the absorption region and the second peak doping concentration of the carrier conducting layer is equal to or greater than 10; and a first electrode and a second electrode both formed over the first surface of the carrier conducting layer.

A pixel array includes photodiodes and a color filter array. A first fraction of the photodiodes is included in CIS pixels and a second fraction of the photodiodes is included in hybrid CIS / EVS pixels. The photodiodes are arranged into groupings. The color filter array includes first, second, and third color filters arranged in a mosaic pattern over the photodiodes. Each grouping includes a plurality of subgroupings including a first subgrouping disposed under at least one of the first color filters, a second subgrouping disposed under at least one of the second color filters, and a third subgrouping disposed under at least one of the third color filters. Each of the first, second, and third subgroupings includes at least one CIS pixel, and at least one of the first subgrouping of photodiodes further includes at least one hybrid CIS / EVS pixel disposed under at least one of the first color filters.

A display device includes a display panel having a display area and a non-display area. The display panel includes a pixel disposed in the display area and including a light emitting element and a pixel driving circuit electrically connected with the light emitting element, a sensor disposed in the display area and including a photo sensing element and a sensor driving circuit electrically connected with the photo sensing element, a data line electrically connected with the pixel and extended along a first direction, a scan line electrically connected with the pixel and extended along a second direction intersecting the first direction, and a readout line including a first readout portion in the display area. The first readout portion is electrically connected with the sensor and extended along the second direction in the display area.

An image sensor is disclosed. The image sensor includes a plurality of pixels arranged in a plurality of rows and a plurality of columns, each of the pixels including: a photodiode; a floating diffusion node configured to accumulate photocharges generated from the photodiode; a first capacitor configured to store charges according to a voltage of the floating diffusion node which is reset; a second capacitor configured to store charges according to a voltage of the floating diffusion node in which the photocharges are accumulated; a first sampling transistor connected to a first output node and configured to sample charges to the first capacitor; a second sampling transistor connected to the first output node and configured to sample charges to the second capacitor; and at least one precharge select transistor connected to the first output node and configured to reset the first output node.

A semiconductor device with an image sensor and a method of fabricating the same are disclosed. The semiconductor device includes a substrate, a pixel region with a pixel structure, an isolation region with an isolation structure disposed adjacent to the pixel region, and a contact pad region with a pad structure disposed adjacent to the isolation region. The pixel structure includes an epitaxial structure, which includes an embedded portion with a stepped structure disposed in the substrate and a protruding portion extending above a top surface of the substrate. The pixel structure further includes a capping layer disposed on the protruding portion.

Embodiments of this application disclose a camera module and an electronic device. The camera module includes a color filter layer. The color filter layer includes an electrochromic region and a plurality of color filter regions. Each color filter region is used for transmitting a spectrum of a band corresponding to the color filter region. The electrochromic region has a fully light-transmissive state and a filter state. In the fully light-transmissive state, the electrochromic region is used for transmitting spectra of a plurality of different bands. In the filter state, the electrochromic region is used for transmitting spectra of a same band.

An image sensor includes a substrate including a pixel region, a through electrode region, and a power supply region between the pixel region and the through electrode region, through electrodes in the through electrode region, shared pixels separated from each other by a first trench isolation structure in the pixel region and each shared pixel including unit pixels, wherein the first trench isolation structure extends in the substrate in a vertical direction, contact barriers arranged between the shared pixels and vertically overlapping the first trench isolation structure, and a protection diode arranged in the power supply region, including a first impurity region where first power is supplied by any one of the through electrodes, and electrically connected to the contact barriers.

A method includes forming a package, which includes an optical die and a protection layer attached to the optical die. The optical die includes a micro lens, with the protection layer and the micro lens being on a same side of the optical die. The method further includes encapsulating the package in an encapsulant, planarizing the encapsulant to reveal the protection layer, and removing the protection layer to form a recess in the encapsulant. The optical die is underlying the recess, with the micro lens facing the recess.

A method for manufacturing a semiconductor optical device for a LIDAR sensor system for a vehicle includes (a) forming a plurality of microlens structures at respective first locations on a first major surface of respective first and second semiconductor wafers. The method includes (b) forming a plurality of notch structures at respective second locations on a second major surface of the respective first and second semiconductor wafers, wherein the respective second locations on the second major surface are substantially opposite the respective first locations on the first major surface. The method includes (c) bonding the second major surface of the first semiconductor wafer to the second major surface of the second semiconductor wafer to form a semiconductor wafer pair. The method includes (d) dicing the semiconductor wafer pair to segment the semiconductor wafer pair into a plurality of individual semiconductor optical devices.

An image sensor is provided. The image sensor includes: a plurality of pixels; a semiconductor substrate including a first surface and a second surface opposing the first surface; a device isolation layer provided in a trench penetrating through the first surface and the second surface of the semiconductor substrate, and separating the plurality of pixels from each other; and a microlens provided on the second surface. The device isolation layer includes: a buried insulating pattern penetrating through the first surface and the second surface; an insulating liner between the buried insulating pattern and the semiconductor substrate; a conductive liner between the insulating liner and the buried insulating pattern; and a buried conductive pattern provided on at least a portion of the buried insulating pattern and contacting the conductive liner.

A circuit, including: a photodetector including a first readout terminal and a second readout terminal different than the first readout terminal; a first readout circuit coupled with the first readout terminal and configured to output a first readout voltage; a second readout circuit coupled with the second readout terminal and configured to output a second readout voltage; and a common-mode analog-to-digital converter (ADC) including: a first input terminal coupled with a first voltage source; a second input terminal coupled with a common-mode generator, the common-mode generator configured to receive the first readout voltage and the second readout voltage, and to generate a common-mode voltage between the first and second readout voltages; and a first output terminal configured to output a first output signal corresponding to a magnitude of a current generated by the photodetector.

The problem of forming a deep trench isolation structure suitable for photodetectors with small pitch is solved by a process in which a grid of trenches is etched from the front side using high energy plasma followed by annealing. The trenches are filled with an oxide followed by etching to recess the oxide. The trench recesses are filled with semiconductor to form a grid-shaped semiconductor structure. After FEOL processing, BEOL processing, attachment to a second substrate, and thinning from the back side, an etch removes the oxide from the back side. The etch stops on the grid-shaped semiconductor structure. The trenches are then lined and filled from the back side. The front side etch allows the trenches to be made narrow and with highly vertical sidewalls. Lining and filling the trenches from the back side provides good optical and electrical isolation.

An image sensor includes a first chip that includes a pixel region and a pad region, and a second chip that is in contact with one surface of the first chip and includes circuits that drive the first chip. The first chip includes a first substrate, an interlayer insulating layer disposed between the first substrate and the second chip, first interconnection lines disposed in the interlayer insulating layer, a conductive pad disposed in the pad region between the second chip and the first interconnection lines, and a recess region formed in the pad region that penetrates the first substrate and the interlayer insulating layer and exposes the conductive pad.

An image sensor may include pixel groups arranged in a Bayer pattern and a color separating lens array that separates incident light by wavelengths and concentrates the separated incident light on the pixels. The color separating lens array may include pixel corresponding groups, with each group having regions containing nanoposts in two layers. In each of the pixel corresponding groups in each of the two layers, there are a central group and a plurality of peripheral groups. The displacements of arrangement centers of the nanoposts in at least two of the peripheral groups have variations.

Aspects of the disclosed invention provide a semiconductor structure for a semiconductor chip with two layers of semiconductor devices, where the first layer of semiconductor devices directly contacts a semiconductor substrate and connects to a first frontside interconnect wiring. The first layer of semiconductor devices includes at least one trench semiconductor device such as a deep trench capacitor. The first frontside interconnect wiring is electrically connected to the second frontside interconnect wiring by one or more joined metal plugs. The second layer of active devices connects to a backside power delivery network and the second frontside interconnect wiring. The semiconductor chip with two layers of semiconductor devices that are bonded together provides one layer of semiconductor devices capable of being in a portion of the semiconductor substrate and a second layer of semiconductor devices with a backside power delivery network.

Provided are systems, methods, and apparatuses for non-scattering nanostructures of silicon pixel image sensors. In one or more examples, the systems, devices, and methods include forming a metal layer on a substrate layer of the pixel, the metal layer to reflect electromagnetic radiation incident on the pixel; forming a photodetector on a silicon layer of the pixel, the photodetector to generate photoelectrons based on the electromagnetic radiation; and forming a passivation layer over the silicon layer, the passivation layer including a thin film dielectric. In one or more examples, the systems, devices, and methods include forming a nanostructure on the passivation layer, the nanostructure to allow the electromagnetic radiation to pass through the nanostructure and steer the electromagnetic radiation linearly towards the photodetector, and forming a microlens on the nanostructure, the microlens including at least one of a flat coat layer or a curved lensing layer.

A pixel circuit includes a pixel array and a color filter. The pixel array includes a plurality of pixels each comprising two photodiodes, a floating diffusion coupled between the two photodiodes, and two transfer transistor coupled between the two photodiodes and the floating diffusion. The color filter array includes a plurality of color filters each having one of a plurality of colors and disposed over at least one of the pixels. Each pixel is coupled to a first readout circuit. The pixels include a second subset of the pixels coupled to a second readout circuit and a first subset of the pixels not coupled to the second readout circuit. Each pair of pixels arranged in two adjacent rows includes a first pixel included in the second subset of the pixels and a second pixel included in the first subset of the pixels and disposed underneath one of the color filters.

There is provided a solid-state imaging device including: a first substrate including a photoelectric converter and an electric charge accumulation section for each pixel, the electric charge accumulation section in which a signal electric charge generated in the photoelectric converter is accumulated; a second substrate including a semiconductor layer and a pixel transistor, the semiconductor layer being stacked on the first substrate, and the pixel transistor that includes a gate electrode opposed to the semiconductor layer, and reads the signal electric charge of the electric charge accumulation section; and a through electrode that is provided in the first substrate and the second substrate, and electrically couples the first substrate and the second substrate to each other and is partially in contact with the gate electrode.

Implementations described herein reduce electron-hole pair generation due to silicon dangling bonds in pixel sensors. In some implementations, the silicon dangling bonds in a pixel sensor may be passivated by silicon-fluorine (Si—F) bonding in various portions of the pixel sensor such as a transfer gate contact via or a shallow trench isolation region, among other examples. The silicon-fluorine bonds are formed by fluorine implantation and / or another type of semiconductor processing operation. In some implementations, the silicon-fluorine bonds are formed as part of a cleaning operation using fluorine (F) such that the fluorine may bond with the silicon of the pixel sensor. Additionally, or alternatively, the silicon-fluorine bonds are formed as part of a doping operation in which boron (B) and / or another p-type doping element is used with fluorine such that the fluorine may bond with the silicon of the pixel sensor.

A display device includes a substrate; an emission layer disposed on the substrate, and including emission areas and a pixel defining layer disposed between the emission areas and including a light blocking material; an encapsulation layer disposed on the emission layer, and including a first inorganic encapsulation film, an organic encapsulation film on the first inorganic encapsulation film, and a second inorganic encapsulation film on the organic encapsulation film; a dam surrounding the organic encapsulation film, including an organic material, and including a plurality of sub-dams; and a bank disposed to surround at least a portion of the dam, and including a first bank layer, a second bank layer on the first bank layer, a third bank layer on the second bank layer, and a fourth bank layer on the third bank layer, wherein the third bank layer includes the light blocking material.

An optical receiver comprises a monolithically integrated pin photodiode (PIN) and transimpedance amplifier (TIA). The TIA comprises InP heterojunction bipolar transistors (HBT) fabricated from a first plurality of layers of an epitaxial layer stack grown on a SI:InP substrate; the PIN is fabricated from a second plurality of layers of the epitaxial layer stack. The p-contact of the PIN is directly connected to the input of the TIA to reduce PIN capacitance CPIN. The TIA capacitance CTIA may be matched to CPIN. Device parameters comprising: a thickness of the absorption layer, window area, and an optional mirror thickness of the PIN; device capacitance CPIN+CTIA; and feedback resistance RF of the TIA; are optimized to performance specifications comprising a specified sensitivity and responsivity at an operational wavelength. This design approach enables cost-effective fabrication an integrated PIN-TIA, for applications such as a 1577 nm receiver for an ONU for 10G-PON.