2311results about How to "Reduce packaging costs" patented technology

Various configurations of micromachined optomechanical switching cells are disclosed herein. In accordance with the invention, an optomechanical switching cell is provided which includes an actuator positioned on a substrate and a mirror coupled to the actuator. The switching cell also includes an electrode disposed upon the substrate under the actuator. An insulator may also be interposed between the substrate and the electrode. In another aspect of the present invention the switching cell includes a latch having a first end region connected to the substrate and a second end region engaged by the mirror.

The invention discloses an LED lamp filament illuminating strip and a preparation method therefor. The illuminating strip comprises LED chips in upper and lower rows, wherein all LED chips in the lower row are distributed at intervals, and all LED chips in the upper row are respectively connected between two adjacent LED chips in the lower row in a lap joint manner. The illuminating surfaces of the LED chips in the upper and lower rows are opposite to each other. The positive and negative electrodes of all LED chips in the upper row are respectively welded with the negative and positive electrodes of two adjacent LED chips, in lap joint connection with the LED chips in the upper row, in the lower row. The preparation method comprises the steps: coating solder paste on the positive and negative electrodes of all LED chips in the lower row; heating the solder paste and enabling the solder paste to be melted, welding the corresponding electrodes, coating the front and back surfaces of chip strips in series connection with fluorescent glue, and solidifying the fluorescent glue. The illuminating strip employs the chips which are not overlapped with each other, and the illuminating surfaces of the chips are arranged oppositely, thereby improving the light-emitting uniformity and facilitating heat dissipation. The wire crossing and tandem among chips is avoided, the packaging cost is reduced, and the yield of finished products is improved.

The invention discloses a three-layer coextrusion heat shrinkage resin film, a production method and an application method. The-three layer coextrusion heat shrinkage resin film is produced by taking PE(LDPE, HPPE, LLDPE, mPE), EVA, PP, PA and EVOH resins as the main materials which are matched with a functional master batch and adopting a production method of one-step huffing. The largest transverse and longitudinal shrinking rates of the product can reach 60 percent and 85 percent; the largest shrinking force of the product can reach 2.0N/cm. The shrinking rate and the shrinking force of the product can be controlled and adjusted by controlling various technical parameters to lead a package to be firm and endurable. The packaged objects are pertinently led to reach the anti-rust, anti static, illumination-resistance, anti-aging, anti-puncturing, anti-low-temperature, anti-isolation, anti-bacteria and anti-degradation effects and the like by adjusting the material composition and mixture ratio of each layer. The three-layer coextrusion heat shrinkage resin film is used for replacing the traditional paper box wrappage to reduce the packaging cost. The mechanical properties are good, the pertinence is strong, the materials are saved; when the three-layer coextrusion heat shrinkage resin film is used, the shrinking temperature is low, the power is saved and the packaging cost is saved, thus effectively reducing the production cost and having extremely high application value.

A power sensor module suitable for automotive and other high volume applications combines speed sensing and torque sensing operations into a single unit. A magnetic speed sensor is utilized for speed sensing. A power measurement can be derived from torque and speed. Combining torque sensing and speed sensing within a single module instead of using separate modules for each allows for reducing redundancies and lowering cost.

A water-based cleaner is prepared by surfactant primary washing part, alkaline auxiliary washing part, solvent part, preservative and water; wherein the surfactant primary washing part is compounded by anion and nonionic surfactant; the alkaline auxiliary agent part selects trolamine, sodium metasilicate pentahydrate which has dispersive action on dirt and EDTA disodium which has chelation on metallic ions, and excludes phosphate accessory aid which pollutes water quality. The solvent part selectes alcohol, glycol ether or natural orange oil extract D-limonene which have good safety performance, strong solvency and little environmental pollution. The preservative selects food grade preservative propylparaben which is safe and nontoxic. The invention adopts concentrate formula, the preparation method is simple, users can dilute the product according to object to be washed and the degree of dirt, and operate with reasonable using concentration, thus avoiding the waste of washing cost due to excessive concentration and the waste of energy. The inventive water-based cleaner reduces package cost and transportation cost, and has no adverse effect on the environment.

Improved processing and packaging for perishable goods such as red meats providing a processing system wherein ambient air is excluded and suitable gases such as carbon dioxide are provided at a suitable pressure and in such a manner as to increase the quantity of the gases dissolved in the perishable goods. Then providing a base and placing the perishable goods over the base. A flexible web of plastic wrapping material (second web) is then applied over the base and the goods and air or gas evacuated therefrom and replaced with a suitable gas. The base includes a cup-shaped tray with a recess (first web), of plastics or other suitable material, with side walls extending upwardly to connect to a narrow horizontally disposed flange. The first web, goods and second web are located inside a depression in a third web of gas barrier material and there together placed into an enclosed evacuation chamber. A suitable gas is provided in the chamber in such a manner as to displace substantially all other gas and particularly atmospheric oxygen that may be present with the enclosed goods and web materials. The third web is then sealed so as to enclose the goods with first and second webs. that the pressure of the gas may be increased to a level above atmospheric pressure. Most preferably the quantity of gas dissolved into the goods will be increased. Most preferably the gas introduced into the chamber and the space will enhance preservation of the packaging goods when contacting the goods. The first web, second web and third web are sealed together thereby producing a hermetically sealed package with the goods and a gas filled space contained therein to provide a sealed package. The sealed package can be stored for any convenient period of time after which the third web is can be removed so as to allow ambient air to contact the goods. The invention further includes the method and apparatus for producing the processed goods and packaging.

An optical module package unit includes a light-emitting chip and a light sensor chip respectively installed in a light-emitting zone and a light-sensing zone on a substrate, a lid of plastic shell integrally formed on the substrate and defining therein a first cavity and a second cavity around the light-emitting chip and the light sensor chip respectively, and two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively. As the light-emitting chip and the light sensor chip are integrally packaged on the substrate, the packaging cost of the optical module is significantly lowered.

An image sensor package includes a bottom substrate, a transparent substrate, a plurality of spacers and adhesive. The bottom substrate includes a plurality of chips, which each includes an active surface and an image sensor disposed on the active surface. The transparent substrate includes a plurality of transparent substrate units which are respectively corresponding to the chips, wherein each transparent substrate unit is disposed above the active surface of the chip and covers the image sensor. The spacers are disposed between the transparent substrate unit and the chip for maintaining a predetermined gap between the transparent substrate unit and the image sensor. Each transparent substrate unit and chip are connected to each other by the adhesive.

A packaging carton is disclosed, suitable for packaging an electronic product, such as a peripheral product, a mobile phone, or a spare part. The packing carton is formed by folding a paper material and is one piece, and is fabricated by linking two clip slots. Furthermore, the packaging carton comprises two hollow buffer structures beside two sides of a storage chamber and two upper holding pieces adjacent to both sides of the storage chamber to protect an object packaged in the packaging carton.

A MEMS device according to the present invention includes a movable member, a supporting member supporting the movable member, an opposing member opposed to the movable member, and a wall member formed to an annular shape surrounding the movable member and connected to the supporting member and the opposing member.

A semiconductor device superior in heat dissipating performance and permitting reduction of the packaging cost is provided. The semiconductor device comprises a sealing body formed of an insulating resin, a semiconductor chip positioned within the sealing body, the semiconductor chip having a gate electrode and a source electrode on a first main surface thereof and having a back electrode (drain electrode) on a second main surface thereof, a drain electrode plate projecting in a gull wing shape on one end side of the sealing body, an upper surface of a portion of the drain electrode plate which portion is positioned in the sealing body being exposed from the sealing body and a lower surface thereof being connected to the back electrode through an adhesive, a gate electrode plate projecting in a gull wing shape on an opposite end side of the sealing body and being connected to the gate electrode within the sealing body, a source electrode plate projecting in a gull wing shape on the opposite end side of the sealing body and being connected to the source electrode within the sealing body, a depression formed in the surface of the drain electrode plate within the sealing body and filled with the resin which forms the sealing body, and a projecting portion formed on the surface of the drain electrode plate within the sealing body and engaged with the sealing body. The drain electrode plate and the source electrode plate branch into plural branch pieces (leads) serving as gull wing-shaped surface mounting terminals.

Various 3-port and 4-port micromachined optomechanical matrix switches are disclosed herein. In accordance with one aspect of the invention there is provided an optomechanical matrix switch including a substrate and a first plurality of optomechanical switching cells coupled thereto. Each of the first plurality of optomechanical switching cells is arranged to be in optical alignment with a first input port. A second plurality of optomechanical switching cells is also coupled to the substrate, each of the second plurality of optomechanical switching cells being in optical alignment with a second input port. In another aspect of the present invention an optomechanical matrix switch is provided which includes a substrate and a first plurality of optomechanical switching cells coupled thereto. Each of the first plurality of optomechanical switching cells is placed in optical alignment with one of a corresponding first plurality of input ports and with one of a corresponding first plurality of output ports. The matrix switch further includes a second plurality of optomechanical switching cells coupled to the substrate. Each of the second plurality of optomechanical switching cells is placed in optical alignment with one of a corresponding second plurality input ports and with one of a corresponding second plurality of output ports.

A semiconductor device having a flip-chip package and a method for fabricating the same are provided. A flip-chip package after being tested to be functionally workable is mounted on a carrier and is electrically connected to the carrier by a plurality of first conductive elements, the flip-chip package having a first chip mounted on a substrate in a flip-chip manner. At least a second chip is mounted on the flip-chip package and is electrically connected to the carrier by a plurality of second conductive elements. An encapsulant is formed on the carrier for encapsulating the flip-chip package and the second chip. A plurality of solder balls are implanted on a bottom surface of the carrier, such that the first and second chips can be electrically connected to an external device via the solder balls. The above arrangement can effectively improve the yield of a fabricated product and reduce packaging costs.

The invention relates to an implement method for high speed single bus communication. Data double-way transmission is performed on basis of an SDI signal line, the SDI signal line is connected with a host and a slave, the host sends signals through the SDI signal line, the slave is automatically adapted to receiving rate and starting and stopping of communication according to the received signals so that a self adaption one wire (SAOW) host-slave structure is formed, data information is transmitted by means of a command frame structure in terms of the data double-way transmission, and a command frame comprises a frame header, a slave address, a register address, data length, data and a frame tail. By means of the implement method for high speed single bus communication, one-bus double-way communication can be achieved, two communication parties are not required to use fixed baud rate, the baud rate can be changed whenever possible, and the method can be applied to occasions with unstable working frequency.

A self-locking fastener includes a base member and a clip member. The base member includes a buckle base, a buckle point and a buckle pin. The clip member includes a plurality of resilient locking arms disposed toward one side thereof. When the clip member is coupled to the base member, the buckle point of the base member extends out along the resilient locking arms. The resilient locking arms are fitted on the buckle pin. Free ends of the resilient locking arms lean against the inner end of the buckle point to stop the buckle point from sliding out along the resilient locking arms. Through the resilient locking arms and the buckle point, the free ends of the resilient locking arms are to lean against the inner end of the buckle point to achieve a self-locking connection of the base member and the clip member. The structure of present invention is simple. When packing a product, the two sheets of material are only required to have holes. The buckle point is inserted through the holes and coupled to the clip member so as to fix the two sheets of material. When detached, the connection of the buckle point and the buckle pin is cut off so as to detach the base member from the clip member. It is easy and convenient to use and operate the present invention, without the need to use a special apparatus. This can lower the packing cost.