494results about How to "Reduce packaging costs" patented technology

The invention belongs to the technical field of integrated circuit packaging, and particularly relates to a resin-based gallium arsenide radio frequency chip fan-out packaging method. Comprising the following steps: using a temporary bonding support plate as a slide glass; coating photolysis temporary bonding glue on the slide glass in a spin coating mode, curing the photolysis temporary bonding glue, and then protecting the temporary bonding glue on the front surface by using a metal protection layer; bonding the back surfaces of the two heterogeneous gallium arsenide radio frequency chips to the front surface of the metal protection layer through a bonding layer; using a wafer-level plastic packaging process to package and wrap the two heterogeneous gallium arsenide radio frequency chips so as to form a first plastic packaging layer; performing laser or mechanical punching on the first plastic package layer to expose the metal protection layer so as to form a first plastic package through hole; and filling the first plastic package through hole to form a filler. According to the invention, the manufacturing cost of the chip is reduced, the miniaturization of the size of the chip is realized, the heat dissipation of the chip can be effectively enhanced by the high-heat-dissipation conductive layer on the back surface, and the performance of a system is improved.

The invention provides a phase shifting device. The device comprises a first phase shift module, a second phase shift module and M combiners, M is an integer greater than 1, an input interface of the first phase shift module is used for receiving a carrier component of a first signal, and one of M output interfaces of the first phase shift module is connected with a first input interface of one of the M combiners; the input interface of the second phase shifting module is used for receiving a sideband component of the first signal, and one of the M output interfaces of the second phase shifting module is connected with the second input interface of one of the M combiners; the output interface of one of the M combiners is used for being connected with the input interface of one of the M antenna units in the antenna array. Compared with a traditional phase shifting device, the phase shifting device provided by the invention can improve the dispersion efficiency in a magnitude manner, and realizes small size or single-chip integration.

The invention provides a micro-integrated temperature control heating semiconductor laser diode and a manufacturing method thereof, which are used for solving the technical problems of lower temperature control precision, more combined devices, higher difficulty of a packaging process and higher cost in the conventional packaged laser diode. The invention provides a micro-integrated temperature-control heating semiconductor laser diode which can accurately control the temperature, is low in cost and can simplify the packaging process, the micro-integrated temperature-control heating semiconductor laser diode comprises a laser chip, the laser chip sequentially comprises a substrate, a first buffer layer, an active layer, a second buffer layer and a passivation layer from bottom to top, and the back surface of the substrate is provided with a negative electrode; two grooves are etched on the passivation layer, and a ridge strip between the two grooves forms a waveguide; and a heating resistor and a thermistor are respectively arranged on two sides of the two grooves. A heating function and a temperature measuring function are integrated on the semiconductor laser by adopting a micro-integration technology, so that the number of used devices is effectively reduced, the packaging volume is reduced, the packaging procedure is simplified, and the packaging cost of the devices is reduced.

The invention discloses an insulating sleeve packaging production line and a control and use method thereof.The insulating sleeve packaging production line comprises a feeding system, a detection system, a pipe cutting and pulling system, a conveying system, a waste collecting system and a bundling and packaging system, and insulating sleeves are conveyed to the detection system through the feeding system; qualified products are pulled and conveyed to the conveying system through the cutting and pipe pulling system, and packaging is completed through the bundling and packaging system; when the detection system detects defective products, single-single cutting is carried out in the pipe cutting and drawing system, and waste collection is completed through the waste collection system. According to the invention, the defects of the sleeve can be detected, the detection device detects the defective sleeve by using the sensor under the condition that a packaging line is not stopped, manual intervention is not needed, the sleeve is not damaged, the quality control of the sleeve is realized in an automatic manner, the detection precision is improved, and a large amount of manpower and material resources are saved.

The invention discloses a packaging assembly, a packaging method and a packaging device, and relates to the technical field of packaging. The packaging assembly comprises two first packaging pieces and two second packaging pieces. The first covering part and the second covering part are arranged in parallel in a spaced mode and oppositely arranged outside the two faces of the rectangular body, an inserting tongue is arranged at the end of the connecting part in a protruding mode, and the inserting tongue extends into the second packaging piece and is attached to the second side wall; the first shielding part and the second shielding part are arranged in parallel in a spaced mode and oppositely arranged outside the two faces of the rectangular body, a pressing tongue is arranged at the end of the first shielding part in a protruding mode and comprises a first pressing section and a second pressing section which are connected with each other, the first pressing section is arranged outside the connecting part in an attached mode, and the second pressing section is clamped between the inserting tongue and the connecting part. According to the packaging assembly, the packaging cost can be reduced under the condition that the packaging effect is guaranteed, economic benefits are improved, the situation that the edges of the rectangular body are damaged can be avoided, and the protection effect is good.

The invention provides a film-coated copper sheet for interconnection of copper electrodes on the front side of a chip and a preparation method and application of the film-coated copper sheet. The preparation method comprises the following steps: S1, carrying out surface treatment and single-side metallization treatment on a bare copper sheet to obtain a copper sheet with a single-side metallization layer; s2, the single-face metallization layer of the copper sheet is coated with metal soldering paste, drying is conducted in an inert or reducing atmosphere, and the copper sheet with a pre-sintered metal film is obtained; s3, cleaning, drying and activating the copper sheet to obtain an activated copper sheet; and S4, coating the activated copper sheet with a coating solution, and curing after coating to obtain the film-coated copper sheet for interconnection of the copper electrodes on the front surface of the chip. According to the preparation method, the dried metal soldering paste can be protected, sufficient adhesive force can be provided for the film-coated copper sheet and the chip in the sintering process, dispensing fixation is avoided, the packaging cost is reduced, and the service reliability of a packaged device is improved.

The utility model discloses a device for storing and transporting predatory mites, which comprises a hollow accommodating body, the hollow accommodating body is an accommodating space for accommodating the predatory mites and feed, the accommodating body is further provided with an opening, a plugging piece is arranged at the opening, the top of the accommodating body is provided with a plurality of top air holes communicated with the accommodating space, and the top air holes are communicated with the accommodating space. A supporting structure is arranged at the top and / or the bottom of each containing body, so that when the two containing bodies are stacked in the vertical direction, the bottom of the upper containing body does not block a plurality of top air holes in the top of the lower containing body, and a plurality of side air holes communicating with the containing space are formed in the side faces of the containing bodies; the size of the containing space in the vertical direction is larger than the size of the containing space in the horizontal direction. The storage amount of predatory mites can be increased, the space utilization rate is greatly increased, and the survival rate is guaranteed; and during transportation, stacking arrangement in the vertical direction is achieved through the supporting structures, and more devices can be transported in a limited space.

The LED ceiling lamp comprises a base assembly and a lampshade assembly, the base assembly comprises a base and a light source module installed in the base, the lampshade assembly comprises a face ring, a light-transmitting plate and a reflecting cover, the light-transmitting plate and the reflecting cover are installed in the face ring, a clamping groove is formed in the outer side wall of the base, and a buckle is arranged on the inner side wall of the face ring. The lampshade assembly is installed on the base through clamping fit of the buckles on the face ring and the clamping grooves in the base. According to the LED lamp, the lampshade assembly is arranged, the light-transmitting plate and the reflecting cover are arranged in the face ring, the buckles are arranged on the inner side wall of the face ring, meanwhile, the clamping grooves are formed in the outer side wall of the base, the face ring is arranged on the base in a sleeved mode, the face ring is screwed on the base through matching of the buckles and the clamping grooves, and at least part of the base is installed in the face ring; the height of the ceiling lamp is reduced, the packaging and transportation cost is reduced, and the light effect of the whole lamp is improved.

The invention provides a semiconductor packaging structure. The semiconductor packaging structure comprises a first substrate; the processor module is arranged on the first plane of the first substrate and is connected with the first substrate; the chip stacking structure is arranged on the first plane of the first substrate and connected with the first substrate, and the first substrate is used for transmitting a first type of signals between the processor module and the chip stacking structure; the signal adapter plate is connected with the processor module and the chip stacking structure, and the signal adapter plate is used for transmitting a second type signal between the processor module and the chip stacking structure; the second substrate is parallel to the first substrate and connected with the second plane of the first substrate, and the second plane of the first substrate is parallel to and opposite to the first plane of the first substrate. According to the embodiment of the invention, the semiconductor packaging cost can be reduced.

The invention relates to a semiconductor laser with power monitoring, which comprises a lower electrode layer, a substrate layer, a lower cover layer, a lower waveguide layer, a multi-quantum well layer, an upper waveguide layer, a laser ridge layer, a detector coupling layer and an insulating filling layer, and is characterized in that the lower electrode layer, the substrate layer, the lower cover layer, the lower waveguide layer, the multi-quantum well layer and the upper waveguide layer are sequentially stacked from bottom to top; the laser ridge layer, the detector coupling layer and the insulating filling layer are located on the upper waveguide layer, the detector coupling layer and the laser ridge layer are arranged at intervals, and the insulating filling layer wraps local parts of the laser ridge layer and the detector coupling layer; the first upper electrode layer at the upper end of the laser ridge layer and the second upper electrode layer at the upper end of the detector coupling layer are exposed, the detector coupling layer is electrically isolated from the laser ridge layer, and optical coupling is established. According to the semiconductor laser, the laser ridge layer and the detector coupling layer are prepared on the upper waveguide layer at the same time, and power monitoring can be achieved while the manufacturing and packaging cost is not increased.

The invention discloses an automatic wobble plate packaging machine which comprises a lifting wobble plate mechanism, a double-layer conveying line and an automatic wobble plate returning mechanism, and the double-layer conveying line comprises an upper-layer conveying line and a lower-layer wobble plate returning line. And the lifting limit positions of the lifting tray placing mechanism and the automatic tray returning mechanism correspond to the height positions of the upper-layer conveying line and the lower-layer tray returning line of the double-layer conveying line respectively, and the conveying surfaces are flush. A backflow circulation line of the jig is formed by the lifting tray placing mechanism and the automatic tray returning mechanism which are arranged at the two ends of the double-layer conveying line, the situation that the overall working efficiency is low due to manual carrying is avoided, and the requirement for large-batch production and machining is met. And meanwhile, the working areas are arranged on the double-layer conveying line, so that the PCB is subjected to corresponding processing procedures such as adherence packaging and the like during conveying, the overall processing efficiency is effectively improved, the situation that a packaging film is damaged or the surface of the circuit board is scratched due to excessive picking and moving can be avoided, and the product yield is guaranteed.

The invention discloses a film winding machine which comprises a film covering mechanism and a film sealing mechanism. The film covering mechanism comprises a rotating frame and a film supply assembly, the rotating frame can drive the film supply assembly to do circular motion on the horizontal plane so as to wind a film onto stacked goods, and the film supply assembly comprises a film extending assembly used for stretching the film. The film extending assembly comprises a first rubber coating roller and a second rubber coating roller which are arranged in parallel, a limiting space allowing a film to penetrate through is reserved between the first rubber coating roller and the second rubber coating roller, and a rotating speed difference exists between the first rubber coating roller and the second rubber coating roller. The film cutting assembly comprises a heating block capable of pressing at least two layers of films on the abutting plate and a heating wire used for cutting off the films. It is ensured that the end of the thin film is attached to the inner layer thin film all the time after the thin film is wound, the phenomenon that the thin film flies around and influences the packaging effect of goods is avoided, and the packaging efficiency of stacked goods is improved.

The utility model relates to the technical field of battery packaging, in particular to a battery and electronic equipment.The battery comprises a shell assembly and a battery module, the shell assembly comprises a shell body and a limiting part, the shell body is provided with a containing space capable of containing the battery module, and the limiting part is arranged in the containing space and fixedly connected with the shell body; the first side wall of the shell body in the first direction and the limiting part are arranged at an interval in the first direction. When the battery module is located in the accommodating space, the two ends of the battery module in the first direction are limited by the first side wall and the limiting part respectively, so that the first battery protection plate can apply pressure pointing to the battery cell body to the top sealing edge. According to the battery and the electronic equipment provided by the invention, a process of fixing the top sealing edge and the battery protection plate through a bonding substance is replaced, multiple dispensing / rubberizing procedures in the battery packaging process are saved, the packaging process is simplified, the material consumption is reduced, and the stability of the battery packaging structure is improved.

This invention provides a power packaging structure and power module, including a substrate, a power chip, several conductive pillars, a molding compound, and several front-side lead-out terminals. The conductive pillars are sequentially divided into a first structure and a second structure along a direction away from the top surface of the substrate, and the bottom surface of the first structure is fixed to the electrode lead-out area on the top surface of the substrate. Since the cross-sectional area of ​​the first structure is smaller than that of the second structure of the conductive pillars, and several conductive pillars are fixed to the top surface of the substrate, the space requirement for the conductive pillars on the substrate is greatly reduced by decreasing the contact area between a single conductive pillar and the top surface of the substrate, thereby reducing the size of the substrate and consequently lowering the packaging cost.

This application relates to a packaging assembly, which includes an outer box, a first packaging module, and a second packaging module. The first packaging module is disposed inside the outer box and has a first accommodating space and a second accommodating space separated from each other. The first accommodating space is used to accommodate an energy storage device, and the second accommodating space is used to accommodate photovoltaic accessories. The second packaging module is disposed inside the outer box and is detachably stacked on top of the first packaging module. The second packaging module has a third accommodating space for accommodating photovoltaic panels. With this embodiment, the photovoltaic power generation system achieves high space utilization of the packaging assembly, reducing the consumption of packaging materials.

A fireplace telescopic hook is characterized in that the fireplace telescopic hook comprises an installation base and a hook body installed in the installation base, and the hook body comprises an installation part extending transversely and a hook part arranged at the outer side end of the installation part and extending downwards; a guide groove extending front and back is formed in the bottom face of the installation base and penetrates through at least one side face of the installation base. The installation part is arranged in the guide groove, the hook part extends out of the outer side of the guide groove, and the installation part can move inside and outside along the guide groove in the guide groove. Due to the fact that the telescopic hook body is arranged, the hook can be suitable for table tops with right-angle or round-angle corners at the same time, and applicability is higher. Due to the detachable design of the hook body and the installation base, the packaging size and the space occupied by transportation can be reduced, and the packaging cost and the transportation cost can be greatly reduced. In addition, the telescopic hook can be used for hanging heavier articles with the lightest weight. The mounting seat of the telescopic hook can also be used as a decoration, and is high in flexibility and strong in practicability.

The invention discloses an intelligent power module semiconductor packaging core-pulling mechanism, and relates to the technical field of core-pulling molding, the intelligent power module semiconductor packaging core-pulling mechanism comprises a base plate and a mold, and the top end of the mold is provided with a placing groove and an ejection unit; a mounting unit and a moving unit. Through the arrangement of the ejection unit, the core-pulling cross rod slides in the sliding groove to push the core-pulling push plate to move upwards, and the core-pulling ejector rod moves to eject the intelligent power module out; after the traditional plastic packaging and glue filling, the whole product packaging can be completed without adding a secondary glue dispensing process, so that the production efficiency is greatly improved; moreover, the reliability of a one-time glue pouring structure is higher than that of a product with two-time glue pouring, two resin materials are adopted for two-time glue pouring, and in order to save the cost of investment on secondary dispensing equipment and secondary dispensing resin consumables in a packaging factory, the packaging cost is greatly saved due to a one-time core-pulling forming process, and the market competitiveness of the product is improved.

The utility model discloses a split type down lamp outer cover and down lamp thereof, including the shell, the top of shell is disconnected and is connected with the lamp cover, and the inside of shell is provided with accommodating chamber, and the lamp cover is used for sealing the top of shell, and the disconnection and connection is convenient for dismounting and transportation, and the accommodating chamber and the shell are integrally formed and convenient for installing the lamp, the utility model discloses through the split type structure design of upper outer cover and lower outer cover makes each part can produce alone, flexible assembly, and the split direct stamping can, and the split can be fitted together, and the occupied space is reduced greatly, and the packing and the logistics cost in the transportation process are reduced, guaranteeing the light output symmetry through the central arrangement of LED board lamp pearl, and the light cup of inner wall is handled through high reflection, and the scattered light of lamp pearl is gathered effectively, and the light utilization rate is improved, the quick fixing of down lamp is realized through the elastic deformation of lamp decoration spring clamp, and the top is sealed through the lamp cover, and the impurities such as dust, water vapor are blocked.

The invention provides an automatic wire penetrating and binding packer which comprises a rack, a material box arranged on a clamp, a packing oil cylinder arranged on the rack, a pressing plate arranged at the piston rod end of the packing oil cylinder, a first blade arranged on the pressing plate, a door opening oil cylinder arranged on a machine box base and a door body arranged on one side of a machine box. The bag pushing oil cylinder is arranged on the opposite side of the door body, the wire grabbing oil cylinder is arranged on the front vertical face of the door body, the wire grabbing mechanism is arranged at the output end of the wire grabbing oil cylinder, the wire penetrating mechanism is arranged on the side, away from the door body, of the rack, and the iron wire disc is arranged on one side of the wire penetrating mechanism. The door body is opened, and the wire grabbing oil cylinder drives the wire grabbing mechanism to the bottom position of the door body; a rope penetrating groove is reserved in the bottom of the pressing plate. The wire grabbing mechanism grabs the wire penetrating mechanism to penetrate through the rope penetrating groove, and the iron wire is conveyed to the front iron wire binding disc to be bound. According to the invention, automatic threading and binding are realized, the working efficiency is improved, the packing field is saved, the packing cost of a user is saved, and the energy consumption is also reduced.

The present invention discloses a vertical sealing device for a plastic bag containing a block-shaped material package, comprising a supporting mechanism for the plastic bag and a clamping and shaping sealing mechanism, wherein the supporting mechanism comprises a backing plate and a supporting frame, the clamping and shaping sealing mechanism is located above the supporting mechanism, and the clamping and shaping sealing mechanism comprises a seat, a left swing arm, a right swing arm, a left clamping block, a right clamping block, a left shaping plate, a right shaping plate, a left push rod, a right push rod, a left sealing block and a right sealing block; the left clamping block and the right clamping block clamp the two sides of the bag opening end of the plastic bag; the left shaping plate and the right shaping plate shape the two sides of the bag opening of the plastic bag to form a sealing plane, and the left sealing block and the right sealing block clamp the sealing planes on both sides of the bag opening of the plastic bag to perform hot-melt sealing. The present invention can automatically shape and seal the bag opening of the plastic bag, reduce the labor intensity of operators, improve the sealing efficiency, and ensure the sealing quality.

The invention discloses a split-type colored egg and a mold and process for producing colored eggs, and belongs to the technical field of colored egg products and their production process. The split-type colored egg of the invention comprises an upper half of an egg body and a lower half of an egg body, which are fixed to form a hollow egg-shaped whole by upper and lower docking in a detachable manner, wherein the upper half of the egg body is made of fragile material, and the lower half of the egg body is made of non-fragile material. The mold for producing colored eggs of the invention comprises two groups of upper half molds of the egg body. The production process of colored eggs of the invention manufactures the upper half of the egg body and the lower half of the egg body separately, and the mold can produce two upper halves of the egg body each time the mold is closed, thereby doubling the production efficiency, and the upper half of the egg body can be produced, stored, packaged and transported separately from the lower half of the egg body, thereby reducing waste, and the lower half can be recycled, thereby increasing production and production efficiency, increasing the yield rate, being very convenient for packaging and transportation, reducing the packaging volume, and greatly reducing the packaging and transportation costs, thereby having significant progress.

The utility model relates to a kind of connecting mechanism and equipment pedestal, belong to laser direct imaging equipment technical field.Connecting mechanism includes positioning and guiding component, is set in the splicing of two adjacent pedestals, for the directional splicing of two adjacent pedestals together;Positioning and guiding component includes the first guide plate and second guide plate respectively set in two adjacent pedestals;First guide plate and second guide plate can be slid along splicing direction relative to the pedestal where it is;One of first guide plate and second guide plate is provided with convex part, and the other is provided with recess part;Convex part and recess part are used to guide and position two pedestals in splicing process;Locking assembly is used to fix two adjacent pedestals.By the guiding and positioning effect of first guide plate and second guide plate and the fixing effect of locking assembly, the accuracy and stability of splicing can be ensured while ensuring the rapid splicing of pedestal.

The utility model discloses a kind of substrate of substrate packaging capacitor, including top layer and bottom layer, anode pad, cathode pad and connecting assembly are set on the top layer, the anode pad and connecting structure are connected, positive electrode lead-out point is set in top layer one side, and negative electrode lead-out point is set in other side, capacitor positive electrode, capacitor negative electrode and lead-out structure are set on the bottom layer, and the capacitor negative electrode is connected with lead-out structure.The utility model provides important help for the batch production of SMT packaging tantalum capacitor.Adopt SMT packaging tantalum capacitor structure, lead-out substrate is used to tantalum core and is led out, and in the processing after packaging, production efficiency can be greatly improved.Compared with traditional lead frame structure, single packaging, aging, aging is carried out, only 18-60 capacitors can be processed, while using SMT packaging, lead-out substrate leads out in the mode of production, 100-300 capacitors can be processed in single time, greatly improve production efficiency, and also can reduce packaging cost.

The utility model discloses a bathroom exhaust fan motor packaging structure which comprises a packaging box body and a plurality of motors installed in the packaging box body. Each layer of positioning plate assembly comprises an upper plate body and a lower plate body, a plurality of first mounting grooves for placing motors are formed in the top surface of the upper plate body, so that the motors are fixed between the upper layer of positioning plate assembly and the lower layer of positioning plate assembly, and the motors on the upper layer of positioning plate assembly and the lower layer of positioning plate assembly are distributed in a staggered manner; in the structure, the periphery of a fixed motor body is not provided with #-shaped partition plates, the upper and lower ends of the motor are respectively limited and fixed by the upper and lower layer positioning plate assemblies, a motor lead is not blocked in a middle space position, the lead can be freely straightened and placed, the structure arrangement is reasonable, the production of the #-shaped partition plates is reduced, and the packaging cost is reduced; the upper-layer motor and the lower-layer motor are arranged in a staggered mode through the upper-layer positioning plate assembly and the lower-layer positioning plate assembly, the longitudinal space utilization rate is reduced, the number of motor installation layers is increased, and the packaging and transporting cost is reduced.

The utility model provides an air conditioner. The air conditioner comprises a shell, an air inlet and an air outlet, the evaporator is arranged in the air conditioner; the condensation assembly is arranged on the air outlet side of the air conditioner, and the condensation assembly comprises a condenser and a condensation fan; the electric control assembly is arranged in the air conditioner, and the electric control assembly is located between the condensation assembly and the air inlet side of the air conditioner; wherein the electric control assembly comprises an electric control mounting bottom plate, a first electric control part and a second electric control part; the electric control mounting bottom plate is connected with the shell; the first electric control part, the second electric control part and the evaporator are arranged on the electric control mounting bottom plate, and the evaporator is arranged between the first electric control part and the second electric control part. The technical problems that an air inlet fan and an air outlet fan usually need to be arranged on the air inlet side and the air outlet side of a small integrated air conditioner for auxiliary heat dissipation in the prior art, and the energy consumption of the air conditioner is large are solved.

The present invention relates to the technical field of winding and packaging equipment, and particularly discloses an attachment chain plate conveyor with a film guiding mechanism for use in conjunction with a horizontal winding packaging machine, including an attachment chain plate conveyor and a film guiding mechanism installed thereon. The protruding part of the long frame in the attachment chain plate conveyor with a film guiding mechanism and the film guiding mechanism installed thereon can pass through the closed rotating ring of the horizontal winding packaging machine and be arranged within the rotating packaging range of the film rack, enabling the horizontal winding packaging machine to operate normally and smoothly export the PE stretch film. The front end of the protruding part of the long frame of the attachment chain plate conveyor is close to the rear end of the rear conveying line, which can enable the goods with a U-shaped tray, cushion blocks placed at the bottom or a shorter length in the running direction of the conveyor to smoothly transition and be wound and packaged using the horizontal winding packaging machine, expanding the application range of the horizontal winding packaging machine and being an effective supplement to the horizontal winding packaging machine.

The application belongs to the technical field of switching power supply, and an auxiliary circuit is added between two branches of a traditional two-phase Dickson converter; in a dead time when all main power tubes are closed, the auxiliary circuit can transfer the charge of one branch to another branch, realizes zero-voltage turn-on of all main power tubes, and reduces switching loss.

The invention relates to the technical field of computer vision and artificial intelligence, and particularly discloses a bird's nest texture AI identification verification system and method, and the system comprises an image collection module, an AI processing module, a database module, and a verification interaction module. The image acquisition module acquires a texture image by using high-precision equipment; the AI processing module extracts features, trains a model and matches the features; the database module stores data in a cloud distributed manner; and the verification interaction module supports multi-terminal verification. The method comprises the steps of production end collection and filing, AI model training optimization and terminal verification operation. The system takes the natural texture of the cubilose as an identifier, avoids counterfeiting, does not need a paper label, is high in verification accuracy, is simple to operate by consumers, and is suitable for multiple scenes.

An electronic device and a manufacturing method thereof, wherein an antenna module and a packaging module are connected to a flexible circuit board, so that the antenna module can be set near the casing of the electronic product according to the signal strength requirement. Therefore, the configuration of the flexible circuit board is not limited by the position of the antenna module, and the design of other internal components of the electronic product is not limited by space, so that the electronic product can meet the preset functions according to the requirements.