159 results about "Salient point" patented technology

The invention discloses a data stream dynamic mode perception privacy protection method based on local differential privacy, which comprises the following steps: a client selectively captures salient points, retains a data trend while reducing the number of samples, and enhances the disturbance precision of each point to improve the overall data utility; the client side represents the importance of the salient points by calculating PID; the client obtains a sampling point by calculating a sampling rate so as to improve data utility; the client uses a dynamic privacy budget allocation method which adapts to the importance of current and future sampling points so as to optimize budget allocation on a time sequence; the client uses a square wave mechanism to disturb the salient points, and w event level differential privacy is used. According to the method, the user is allowed to select the salient points according to the statistical characteristics of own data, and then the privacy budget is allocated according to the importance of the salient points so as to disturb the salient points.

The utility model provides a chip packaging structure and a chip packaging module, the chip packaging structure is provided with a salient point and a welding column between a packaging body and a first substrate, and the welding column is at least partially arranged around the salient point, so that after the packaging body and the first substrate are connected through the salient point and the welding column, the packaging body and the first substrate are connected through the salient point and the welding column; the shear stress caused by thermal mismatch between the packaging body and the first substrate can be released by using the bending (rotational degree of freedom in a first plane) or stretching (stretching degree of freedom in a first direction) deformation of the welding columns, so that the situation that the stress generated by thermal mismatch between the packaging body and the first substrate cannot be released is reduced; therefore, the probability of packaging failure between the packaging body and the first substrate is reduced, and the reliability of the chip packaging structure is improved.

The embodiment of the invention relates to the technical field of semiconductors, and discloses a radio frequency module, radar and electronic equipment, the radio frequency module comprises a chip packaging body, the chip packaging body is provided with at least one radiation part, and a plurality of salient points are arranged around the radiation part and form a first waveguide channel; a second waveguide channel is arranged at the position, corresponding to each first waveguide channel, of the PCB carrier plate; the waveguide antenna is provided with at least one antenna unit and a third waveguide channel; wherein the first waveguide channel, the second waveguide channel and the third waveguide channel are communicated to form a radio frequency signal transmission channel. According to the scheme, the loss of the module on the feeder line can be effectively reduced, and the waveguide antenna is externally connected to the PCB, so that replacement is convenient to realize.

The invention discloses an analysis method and system based on AI video recognition behavior monitoring, and relates to the technical field of video recognition, and the method comprises the steps: collecting video data, calculating the overall pixel gradient change of adjacent frames, marking preliminary candidate frames, calculating the edge saliency intensity of each frame, and analyzing a salient region point set; clustering and calculating the geometric center point of each cluster as an anchor point value, and forming an anchor point set through the center points of each cluster; according to the method, concentrated extraction of salient points is realized through a density-based clustering algorithm DBSCAN, so that an extraction result has logic uniqueness and local integrity of a salient target, a local feature map is extracted by using a shallow convolutional network, target texture and edge information is effectively captured, bounding box optimization is realized by rotating an IoU loss function, and the robustness of the target is improved. And the fitting precision of the boundary of the salient region is improved.

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

The invention discloses a semiconductor chip packaging method, and relates to the technical field of semiconductor packaging, and the method comprises the steps: carrying out the salient point preparation of a semiconductor chip, carrying out the data collection, obtaining a salient point shape data set, carrying out the cleaning after the preparation of a substrate, obtaining the surface data of the substrate, fusing the surface data of the substrate with the salient point shape data set, generating a shape quality data set, and carrying out the processing of the shape quality data set. The method comprises the following steps: establishing a chip prediction model, outputting a welding spot failure probability and optimized process parameters, overturning a chip, performing alignment operation to obtain a chip and a substrate assembly which are subjected to alignment, performing welding parameter optimization through a reflow soldering furnace, forming a uniform intermetallic compound, and obtaining a welded chip and substrate assembly. And according to the welded chip and substrate assembly, a dispensing machine and a molding press are used for processing, and a packaged chip assembly is obtained. According to the method, the chip prediction model is established, so that the failure rate of the welding spots is remarkably reduced, the adaptability of process parameters is improved, and missing detection of the failed welding spots is avoided.

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method for correcting a vertical routing exposed position. The packaging structure for correcting the exposed position of the vertical wire bonding comprises a substrate, and is characterized in that a plurality of packaging units are arranged on the substrate, each packaging unit comprises a step-type stacked chip group, and each chip group is bonded with the substrate through a vertical lead; and one end, close to the substrate, of the vertical lead is connected with the salient point. Compared with the prior art, the packaging structure and the packaging method for correcting the exposed position of the vertical wire bonding have the advantages that interconnected salient points are grown in situ at the exposed position of the wire bonding metal, the size of the salient points can be flexibly adjusted through a photomask on the basis of a one-time patterning process, and the abnormal bridging short circuit in the subsequent welding process can be effectively improved.

The invention discloses a buffering device capable of optimizing the vibration mode of a back door, the back door and a vehicle, and belongs to the technical field of automobile body opening and closing parts. The buffer base comprises a support and a connecting arm which are connected with each other; the support is connected with a back door; the connecting arm is connected with the buffer block; a set included angle is formed between the support and the connecting arm; the buffer pad is arranged on a vehicle side wall tail lamp mounting plate, one end of the buffer block is a buffer surface which is in contact with the buffer pad when the back door is closed, a plurality of salient point structures are arranged on the buffer surface, and when the back door is closed, each salient point structure is in point contact with the buffer pad. The buffering block is connected with the buffering base, and the buffering base is arranged to be in a bent mode, so that the buffering device can be installed in a vehicle model with a large punching angle of a back door inner plate or a compact back door and side wall space.

The invention discloses a fuel cell triangular bipolar plate and a fuel cell stack, and belongs to the technical field of fuel cells, and the fuel cell triangular bipolar plate comprises an anode plate and a cathode plate; outlets, namely an air inlet / outlet, a hydrogen inlet / outlet and a cooling liquid inlet / outlet, are formed in three sides of the polar plate; two surfaces of the polar plate are respectively a reaction side and a cooling side, the reaction side is provided with a gas flow field area and a gas sealing area, and the gas flow field area is communicated with a group of gas inlets and outlets; the gas flow field area comprises a dot matrix flow field, a snakelike dot matrix flow field and a dot matrix rectangular block flow field which are communicated in sequence; the dot matrix flow field comprises a plum-blossom-shaped salient point area, and the plum-blossom-shaped salient point area is composed of a plurality of salient points arranged in a plum blossom shape; the snakelike dot matrix flow field is divided into a front section and a rear section, the front section comprises a plurality of parallel rectangular blocks, salient points are arranged on one side of the end part of each rectangular block, and the salient points in adjacent rows are alternately arranged on one side of the first end or the second end of each rectangular block; and each row in the rear section comprises a plurality of rectangular blocks, and gaps or salient points are arranged among the plurality of rectangular blocks. The problems of long and narrow gas path and overlarge pressure drop in the prior art are solved.

The utility model discloses a display device, which relates to the technical field of display devices and comprises a host, a mounting plate and a connecting buckle, a mounting position and a groove are formed on the host, an elastic block is arranged in the groove, a salient point is formed on the elastic block and extends out of an opening of the groove, and the mounting position comprises a first connecting hole and a second connecting hole which are communicated with each other. The aperture of the first connecting hole is greater than that of the second connecting hole; clamping holes are formed in the mounting plate, the convex points are used for being clamped in the clamping holes, and the side, away from the host, of the mounting plate is used for being mounted on a wall; and the connecting buckle is mounted on the mounting plate and is clamped in the second connecting hole. The connecting buckle penetrates through the first connecting hole and extends into the inner cavity, the mounting plate abuts against the protruding point, the elastic block deforms towards the groove, the main machine slides, the connecting buckle is clamped into the second connecting hole, the elastic block recovers deformation, the protruding point is clamped into the clamping hole, and therefore the main machine is fixed. The display device can be quickly mounted and dismounted, and the use comfort is improved.

The utility model relates to a special substrate for a Saw filter film coating process. A pasting film is arranged on the substrate body, a plurality of chips are installed between the substrate body and the pasting film, a plurality of gold balls are arranged between the chips and the substrate body, a plurality of salient points are arranged on the periphery between the substrate body and the pasting film to form a salient point enclosure frame, and the chips are located in the salient point enclosure frame. The problem of board edge slope existing in a saw fall film coating process is solved, the flatness of a chip is improved, the slope phenomenon is avoided, the test failure caused by the uneven surface of a product is reduced, and the test yield is improved; the risk of product failure caused by excessive invasion of the epoxy film is reduced; and product layering quality abnormity is avoided.

The utility model relates to the technical field of semiconductor manufacturing equipment, especially for a wafer transfer box fixing mechanism for wafer loader, including object table and mesa, the bottom of object table is equipped with mesa, the bottom fixedly connected with fixed frame of mesa, the bottom fixedly connected with the fixed frame limit seat, the inside slide connection of limit seat has the guide rail, the bottom fixedly connected with the fixed plate of limit seat rear of fixed frame, the right side fixedly connected with first air cylinder of fixed plate, the top fixedly connected with the fixed pin of mesa that penetrates object table, in the utility model, through the positioning hole and fixed pin that set up can carry out positioning and fixed effect to wafer transfer box, through the second air cylinder, briquetting, fixed groove and connecting plate that set up carry out reverse extrusion fixed to wafer transfer box, rubber salient point can strengthen the friction between briquetting and connecting plate, effectively avoided wafer transfer box to be opened and pulled when appearing the phenomenon of shaking and falling off.

The utility model relates to the technical field of medical instruments, in particular to a light-weight three-dimensional (3D) conjoined tension-free inguinal hernia repair patch which comprises a patch body and a placing box used for storing the patch body, the patch body is of an axial symmetry structure and has a certain curvature, a plurality of large meshes are formed in the patch body, and the large meshes are arranged in the placing box. Large meshes are formed in the patch body, the porosity of the large meshes is the same, anchoring holes are formed in the periphery of the patch body, salient points are designed on the surface of the patch body, and a marking structure is further arranged on the patch body. The patch body which is in the axial symmetry shape and has the curvature is beneficial for adapting to anatomical differences of different patients to be cut, the 3D shape better conforms to the human groin structure, and placement is facilitated; a large mesh structure is arranged, so that the patch body is lighter; the hernia repair patch solves the problems that an existing common hernia repair patch is poor in fitting degree during use, inconvenient to store properly and prone to being infected by the external environment.

The external protective sleeve comprises a protective sleeve assembly, and the protective sleeve assembly comprises a protective sleeve body, a transparent bag arranged on the protective sleeve body, an opening formed in the front end of the protective sleeve body, a circular ring fixed in the opening and a long rope penetrating through the circular ring. The antiskid assembly comprises rubber salient points fixed on the bottom surface of the protective sleeve main body, a first adhesive sheet fixed on the side wall of the protective sleeve main body, first release paper attached to the first adhesive sheet, a second adhesive sheet fixed on the side wall and second release paper attached to the second adhesive sheet. The protective sleeve assembly and the anti-skid assembly are matched with each other, so that the endoscope pedal is fully covered and protected during use, multiple skid resistance is performed on the bottom surface of the protective sleeve, the problem of accidental sliding during use is avoided, the use stability of the protective sleeve is improved, a user can conveniently observe the color of the pedal due to the structural design of the transparent bag, and the service life of the pedal is prolonged. And operation errors are avoided.

The invention discloses a scrap jumping prevention method for a lead frame, a punching machine, a device and a medium, and relates to the technical field of lead frames. The method comprises the steps that a raw material is divided into a plurality of machining areas, and the moving step pitch of the raw material is determined according to the sizes of the machining areas; according to the moving step pitch, the raw materials are fed through a progressive feeding mechanism; the salient point forming mechanism is used for sequentially machining each machining area to form salient points; each machining area is sequentially punched through the punching mechanism, during punching, a pushing rod enters a pushing groove to push pushing blocks on the two sides to get close to each other, after a punch enters a tool edge, a punching adjusting block abuts against the punch, and waste generated during punching is prevented from rising through the punching adjusting block; forming is conducted on each machining area in sequence through a forming mechanism; and cutting off the joint between each processing area and the adjacent processing area in sequence through a cutting-off mechanism to obtain the lead frame. The method can prevent scrap jumping.

The invention discloses a bump packaging structure and a packaging method. The packaging method comprises the following steps: step 1, sputtering a seed layer on the surface of a wafer; 2, manufacturing a photoresist opening in the surface of the wafer; 3, at least two metal layers are manufactured in the photoresist opening, so that the Pad is connected out; 4, removing the seed layer on the surface of the wafer to enable the salient points to be directly independent, and avoiding short circuit; and step 5, completing coating, grinding and cutting of the metal layer structure on the surface of the salient point, and manufacturing the whole wafer into a single packaging chip. According to the invention, a compact nickel-gold layer can be formed on the surface of the salient point, corrosion of water vapor to copper is prevented, galvanic effect in a chip cutting process is avoided, the reliability passing rate of the chip in a high-humidity environment is improved, and the preparation method is simple, convenient and suitable for industrial popularization and application.

The utility model discloses a separable wearable structure and intelligent wearable equipment, and relates to the technical field of electronic products. Comprising a face shell and a middle frame, the face shell is provided with a face shell interference magnitude annular face, the middle frame is internally provided with a middle frame interference magnitude annular face matched with the face shell interference magnitude annular face, the face shell is further provided with a face shell groove, and the middle frame is internally provided with middle frame protruding points matched with the face shell groove. The separated host has unique advantages in design, can meet the requirements of different users for replacing a wearing middle frame in various scenes, avoids the problem that equipment cannot be worn due to breakage of a plastic watch ear of an integrated host, and the separated host is simple and elegant in appearance and rich in layering sense due to meticulous design of a surface shell groove. The separated middle frame and the face shell are buckled through the groove and the protruding point and are in interference fit with the upper surface, good matching hand feeling and stability are achieved, the bottom shell is provided with the glue overflowing groove, the link of processing redundant overflowing glue in the production process is omitted, and labor cost is reduced.

The embodiment of the invention provides a chip packaging structure, a preparation method thereof and electronic equipment, relates to the technical field of semiconductors, and aims at improving the structural stability of the chip packaging structure and improving the yield of chips. The chip packaging structure comprises a chip, a gasket, a first dielectric layer, a plastic packaging layer, a second dielectric layer and salient points. The chip includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The pad is located on the first surface of the chip. The first dielectric layer is located at one side of the pad away from the chip. The plastic packaging layer comprises a first part and a second part which are connected, and the first part is located on the side, away from the chip, of the first dielectric layer. The second dielectric layer is located on one side of the first portion away from the chip. The salient point comprises a first connecting part and a second connecting part, and the second connecting part is connected with the liner and the first connecting part. The chip packaging structure is applied to the electronic equipment so as to improve the performance of the electronic equipment.

The utility model belongs to the technical field of controller electromagnetic shielding and circuit boards, and particularly relates to a PCBA bump electromagnetic shielding controller and an automobile. The PCBA salient point electromagnetic shielding controller comprises an upper shell and a PCBA assembly, the PCBA assembly comprises an electronic chip, a ground bar exposed copper, a solder ball and a circuit board. The electronic chip is arranged in the circuit area of the circuit board; the ground bar exposed copper is arranged on the circuit board and surrounds the circuit area; the plurality of solder balls are arranged on the ground bar exposed copper at preset intervals; the upper shell is connected with the PCBA assembly, and the upper shell is in contact with the solder ball to form an electromagnetic shielding structure, so that a controller electromagnetic shielding technical scheme which is good in electromagnetic protection reliability and low in cost is realized.

The utility model discloses a thermal bulb assembly, a heat exchanger and an air conditioner. The thermal bulb assembly comprises a sleeve and a thermal bulb, at least two positioning convex points are arranged on the inner wall of the sleeve, and the thermal bulb is inserted into the sleeve and abuts against the positioning convex points, so that the thermal bulb and the sleeve are in interference fit. According to the utility model, at least two positioning salient points are arranged on the inner wall of the sleeve, and the temperature sensing bulb can be tightly abutted against the positioning salient points after being inserted into the sleeve to form effective interference fit, so that firm and reliable connection between the temperature sensing bulb and the sleeve is ensured, the problem of loosening caused by vibration or temperature change is avoided, and the service life of the temperature sensing bulb is prolonged. Therefore, the stability and durability of the whole thermal bulb assembly are improved. In addition, the temperature sensing bulb is directly inserted into the sleeve and is stably connected through the positioning convex points, so that extra material cost is saved, the production process is simplified, the production efficiency is improved, the overall manufacturing cost is remarkably reduced, and the market competitiveness of the product is improved.

The electric anastomat induction device comprises a gun barrel and an anastomat body which are detachably connected, a limiting block is arranged on the outer pipe wall of the rear end of the gun barrel, a stroke guide groove allowing the limiting block to be inserted and rotating in the circumferential direction is formed in the inner wall of a pipe opening in the front end of the anastomat body, and a circuit board is further arranged in the anastomat body. A metal conducting strip A is arranged on the outer tube wall of the rear end of the gun barrel, and two conducting convex points A which are distributed at intervals are arranged on the metal conducting strip A. The utility model aims to provide the electric anastomat induction device capable of preventing misoperation. The anastomat has the advantages that the metal conducting strip A is arranged on the outer tube wall of the rear end of the gun barrel, the metal conducting strip B and the metal conducting strip C which are independent of each other are arranged on the inner wall of the tube opening of the front end of the anastomat body, and when the gun barrel and the anastomat body are connected in an inserted mode and rotate in place, the two conducting convex points A are in butt joint with the metal conducting strip B and the metal conducting strip C respectively; and the circuit board forms an access, so that the percussion can be started only after the gun barrel is mounted in place, and the problem of manual misoperation of the electric detachable anastomat is solved.

The utility model provides a cylindrical roll core with tabs on the same side, roll core preparation equipment and a battery, and relates to the technical field of lithium ion batteries, the end face on the same side of the cylindrical roll core is provided with a positive pole tab area and a negative pole tab area, and the negative pole tab in the negative pole tab area is provided with salient points; and the top of the salient point is flush with the top of a positive pole lug arranged in the positive pole lug area. The cylindrical roll core has the beneficial effects that the convex points on the negative pole lug of the cylindrical roll core can increase the height of the negative pole lug, so that the negative pole lug is matched with the positive pole lug in height, and the heights of the end surfaces of the positive pole lug and the negative pole lug can be kept consistent after a leveling process. The height consistency of the end surfaces of the flatted tabs can be more easily controlled; meanwhile, the height and the compactness of the tabs are better controlled, and the subsequent welding process is more stable and reliable, so that the overall production yield is improved.

The invention discloses a metal thin-wall part for a fingerprint recognition module, a machining method and electronic equipment, and belongs to the technical field of CNC machining, and the machining method comprises the steps that a raw material profile is fixed to a primary clamping position of a CNC machine table, the same clamping position is located on the raw material profile, and a front side face area of a thin-wall body is formed through CNC machining; the back side face area of the thin-wall body is machined through a T-shaped milling cutter, a first material connecting point and a second material connecting point are reserved at the two ends of the back side face area respectively, and the first material connecting point and the second material connecting point are connected to a raw material profile respectively to provide machining support; the first material connecting point and the second material connecting point are broken through a pneumatic material taking jig so that the thin-wall body can be taken out; and carrying out batch polishing so as to respectively remove residual salient points on the first material connecting point and the second material connecting point on the thin-wall body. The technical effects that the machining cost can be reduced, poor appearance and size are avoided, and the product quality is improved are achieved.

The invention discloses a processing method of a silicon carbide salient point vacuum chuck, and aims to overcome the defects that salient points on the vacuum chuck are poor in strength, easy to fall off and low in yield. The method comprises the following steps: S1, forming a ceramic biscuit; s2, rough machining of a ceramic biscuit; s3, degreasing the ceramic biscuit to form a porous biscuit; s4, sintering is carried out; s5, finish machining is conducted, specifically, grinding machining is conducted on the salient point machining face of the sintered semi-finished product; s6, a plurality of convex points are machined on the ground convex point machining face through laser; s7, the end faces of the convex points are polished to form the vacuum suction cup; and S8, cleaning the vacuum chuck. According to the vacuum chuck machining method, the machining period is shortened, the working efficiency is improved, the cost is reduced, and the qualified rate of products is increased.

The utility model belongs to the technical field of electrode slice assembling, and relates to electrode slice pre-assembling equipment which comprises a machine table and a servo rotating disc arranged on the machine table, a plurality of jigs used for placing plastic pieces are distributed on the rotating disc, a plastic piece feeding and discharging area and an electrode slice feeding area are arranged on the two sides of the rotating disc respectively, and the servo rotating disc is arranged on the machine table. A welding area is arranged between the plastic part feeding and discharging area and the pole piece feeding area, an ultrasonic welding machine is arranged in the welding area, and a pseudo soldering detection mechanism is arranged between the ultrasonic welding machine and the plastic part feeding and discharging area. Through the pseudo soldering detection mechanism, the height of the positioning salient point on the welded plastic part can be detected, whether the positioning salient point is pressed in place or not is detected, it is ensured that the flange formed through pressing can block the upper end face of the pole piece, the pole piece is prevented from falling off, therefore, the welding quality is ensured, and the problem that the yield is low in the prior art is solved.

The utility model relates to a four-layer thermoelectric separation copper substrate, which comprises a red copper hot disc, heat dissipation salient points, thermosetting adhesive, a first copper-clad plate, a second copper-clad plate, a first via hole, a second via hole and resin, and is characterized in that the heat dissipation salient points are arranged on the red copper hot disc and penetrate through the thermosetting adhesive, the first copper-clad plate and the second copper-clad plate; the upper surface and the lower surface of the red copper hot plate are respectively connected with the first copper-clad plate and the second copper-clad plate through the thermosetting adhesive, the first via hole respectively penetrates through the first copper-clad plate and the second copper-clad plate, the second via hole penetrates through the red copper hot plate, the thermosetting adhesive, the first copper-clad plate and the second copper-clad plate, and the resin is arranged in the second via hole. Wherein the first copper-clad plate and the second copper-clad plate have the same structure. Compared with the prior art, the four-layer circuit and high-density wiring design meets the dense circuit layout requirement, and meanwhile, the added heat dissipation salient points are utilized, so that the high heat conduction function of the circuit board is realized; and electronic components are welded on two sides, so that diversified design requirements of customers are met, and the practicability is higher.

The invention discloses an underwater positioning, docking and recycling device for an AUV (Autonomous Underwater Vehicle), and belongs to the technical field of ocean engineering equipment. Comprising an auxiliary bearing piece and a transverse butt joint unit, an anti-skid pad provides instantaneous static friction, sensor salient points are elastically embedded with broken stones / sea grass and sense contact pressure in real time, so that the fitting degree of a mounting box and the seabed is larger than or equal to 98%, the point contact inclination error is thoroughly eliminated, and a submillimeter-level reference plane is provided for AUV butt joint; the incident flow area is divided into three micro-vortex generators by a sheet section formed by the inclined supporting pipes, the transverse supporting pipes and the inclined plane ribs of the triangular frame, the differential pressure resistance is reduced, the rated tension of a winch of a mother ship is reduced to 6.5 t from 8 t, the cable diameter is reduced to 24 mm from 28 mm, and the purchase price of the whole mooring system is reduced by 20%; after the flexible expansion supporting sleeve is expanded after being filled with water, a damping ring is formed, the transverse error tolerance is expanded to + / -120mm from + / -50mm, the vortex-induced lateral force is reduced by 35%, the probability of collision deflection of the AUV is greatly reduced, and the actual measurement sea test capture success rate is increased.

The invention provides ultra-thin VC and a preparation method thereof, and relates to the technical field of vapor chamber, the ultra-thin VC comprises a lower cover and an upper cover with stamping capillary salient points, and the lower cover is fixedly connected with the upper cover with stamping capillary salient points. And the lower cover and the upper cover with the convex points with the stamping capillary are welded into a whole through laser welding. The stamping capillary is made of copper, stamping is carried out through a press, a capillary structure is pressed through a die, regular grooves are formed, and the capillary is generated after oxidation reduction. Compared with the prior art, the production cycle is shortened, and net burning is reduced; the cost is reduced, compared with the prior art, the capillary of the copper (steel) net is reduced, the weight is reduced, the capillary of the copper (steel) net is reduced, and the method has more advantages on electronic products. Cavities are generated after oxidation reduction, and the ultra-high heat-conducting property is achieved after sealing combination.

The utility model relates to the technical field of orthodontic instruments, and provides a self-locking bracket with a spring bump structure. Comprising a bracket and a cover plate, and the bracket and the cover plate are in self-locking connection through a spring salient point structure; the top of a spring structure body of the spring salient point structure is provided with a salient point structure, and the salient point structure is provided with an arc-shaped surface. A plurality of wedge-shaped grooves are inwards formed in the side wall of the spring structure body. The self-locking bracket disclosed by the utility model has the beneficial effects that the bracket and the cover plate of the self-locking bracket are in self-locking connection through the spring salient point structure, and the salient point structure is arranged at the top of the spring structure body of the spring salient point structure, so that the cover plate can move on the bracket and is self-locked and limited by pulling the cover plate; the convex point structure can extend into the first limiting hole or the second limiting hole, the structure is simple, and use is convenient.