102 results about "Salient point" patented technology

The invention discloses an analysis method and system based on AI video recognition behavior monitoring, and relates to the technical field of video recognition, and the method comprises the steps: collecting video data, calculating the overall pixel gradient change of adjacent frames, marking preliminary candidate frames, calculating the edge saliency intensity of each frame, and analyzing a salient region point set; clustering and calculating the geometric center point of each cluster as an anchor point value, and forming an anchor point set through the center points of each cluster; according to the method, concentrated extraction of salient points is realized through a density-based clustering algorithm DBSCAN, so that an extraction result has logic uniqueness and local integrity of a salient target, a local feature map is extracted by using a shallow convolutional network, target texture and edge information is effectively captured, bounding box optimization is realized by rotating an IoU loss function, and the robustness of the target is improved. And the fitting precision of the boundary of the salient region is improved.

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method for correcting a vertical routing exposed position. The packaging structure for correcting the exposed position of the vertical wire bonding comprises a substrate, and is characterized in that a plurality of packaging units are arranged on the substrate, each packaging unit comprises a step-type stacked chip group, and each chip group is bonded with the substrate through a vertical lead; and one end, close to the substrate, of the vertical lead is connected with the salient point. Compared with the prior art, the packaging structure and the packaging method for correcting the exposed position of the vertical wire bonding have the advantages that interconnected salient points are grown in situ at the exposed position of the wire bonding metal, the size of the salient points can be flexibly adjusted through a photomask on the basis of a one-time patterning process, and the abnormal bridging short circuit in the subsequent welding process can be effectively improved.

The invention discloses a buffering device capable of optimizing the vibration mode of a back door, the back door and a vehicle, and belongs to the technical field of automobile body opening and closing parts. The buffer base comprises a support and a connecting arm which are connected with each other; the support is connected with a back door; the connecting arm is connected with the buffer block; a set included angle is formed between the support and the connecting arm; the buffer pad is arranged on a vehicle side wall tail lamp mounting plate, one end of the buffer block is a buffer surface which is in contact with the buffer pad when the back door is closed, a plurality of salient point structures are arranged on the buffer surface, and when the back door is closed, each salient point structure is in point contact with the buffer pad. The buffering block is connected with the buffering base, and the buffering base is arranged to be in a bent mode, so that the buffering device can be installed in a vehicle model with a large punching angle of a back door inner plate or a compact back door and side wall space.

The invention discloses a fuel cell triangular bipolar plate and a fuel cell stack, and belongs to the technical field of fuel cells, and the fuel cell triangular bipolar plate comprises an anode plate and a cathode plate; outlets, namely an air inlet / outlet, a hydrogen inlet / outlet and a cooling liquid inlet / outlet, are formed in three sides of the polar plate; two surfaces of the polar plate are respectively a reaction side and a cooling side, the reaction side is provided with a gas flow field area and a gas sealing area, and the gas flow field area is communicated with a group of gas inlets and outlets; the gas flow field area comprises a dot matrix flow field, a snakelike dot matrix flow field and a dot matrix rectangular block flow field which are communicated in sequence; the dot matrix flow field comprises a plum-blossom-shaped salient point area, and the plum-blossom-shaped salient point area is composed of a plurality of salient points arranged in a plum blossom shape; the snakelike dot matrix flow field is divided into a front section and a rear section, the front section comprises a plurality of parallel rectangular blocks, salient points are arranged on one side of the end part of each rectangular block, and the salient points in adjacent rows are alternately arranged on one side of the first end or the second end of each rectangular block; and each row in the rear section comprises a plurality of rectangular blocks, and gaps or salient points are arranged among the plurality of rectangular blocks. The problems of long and narrow gas path and overlarge pressure drop in the prior art are solved.

The utility model relates to the technical field of semiconductor manufacturing equipment, especially for a wafer transfer box fixing mechanism for wafer loader, including object table and mesa, the bottom of object table is equipped with mesa, the bottom fixedly connected with fixed frame of mesa, the bottom fixedly connected with the fixed frame limit seat, the inside slide connection of limit seat has the guide rail, the bottom fixedly connected with the fixed plate of limit seat rear of fixed frame, the right side fixedly connected with first air cylinder of fixed plate, the top fixedly connected with the fixed pin of mesa that penetrates object table, in the utility model, through the positioning hole and fixed pin that set up can carry out positioning and fixed effect to wafer transfer box, through the second air cylinder, briquetting, fixed groove and connecting plate that set up carry out reverse extrusion fixed to wafer transfer box, rubber salient point can strengthen the friction between briquetting and connecting plate, effectively avoided wafer transfer box to be opened and pulled when appearing the phenomenon of shaking and falling off.

The external protective sleeve comprises a protective sleeve assembly, and the protective sleeve assembly comprises a protective sleeve body, a transparent bag arranged on the protective sleeve body, an opening formed in the front end of the protective sleeve body, a circular ring fixed in the opening and a long rope penetrating through the circular ring. The antiskid assembly comprises rubber salient points fixed on the bottom surface of the protective sleeve main body, a first adhesive sheet fixed on the side wall of the protective sleeve main body, first release paper attached to the first adhesive sheet, a second adhesive sheet fixed on the side wall and second release paper attached to the second adhesive sheet. The protective sleeve assembly and the anti-skid assembly are matched with each other, so that the endoscope pedal is fully covered and protected during use, multiple skid resistance is performed on the bottom surface of the protective sleeve, the problem of accidental sliding during use is avoided, the use stability of the protective sleeve is improved, a user can conveniently observe the color of the pedal due to the structural design of the transparent bag, and the service life of the pedal is prolonged. And operation errors are avoided.

The invention discloses a scrap jumping prevention method for a lead frame, a punching machine, a device and a medium, and relates to the technical field of lead frames. The method comprises the steps that a raw material is divided into a plurality of machining areas, and the moving step pitch of the raw material is determined according to the sizes of the machining areas; according to the moving step pitch, the raw materials are fed through a progressive feeding mechanism; the salient point forming mechanism is used for sequentially machining each machining area to form salient points; each machining area is sequentially punched through the punching mechanism, during punching, a pushing rod enters a pushing groove to push pushing blocks on the two sides to get close to each other, after a punch enters a tool edge, a punching adjusting block abuts against the punch, and waste generated during punching is prevented from rising through the punching adjusting block; forming is conducted on each machining area in sequence through a forming mechanism; and cutting off the joint between each processing area and the adjacent processing area in sequence through a cutting-off mechanism to obtain the lead frame. The method can prevent scrap jumping.

The invention discloses a bump packaging structure and a packaging method. The packaging method comprises the following steps: step 1, sputtering a seed layer on the surface of a wafer; 2, manufacturing a photoresist opening in the surface of the wafer; 3, at least two metal layers are manufactured in the photoresist opening, so that the Pad is connected out; 4, removing the seed layer on the surface of the wafer to enable the salient points to be directly independent, and avoiding short circuit; and step 5, completing coating, grinding and cutting of the metal layer structure on the surface of the salient point, and manufacturing the whole wafer into a single packaging chip. According to the invention, a compact nickel-gold layer can be formed on the surface of the salient point, corrosion of water vapor to copper is prevented, galvanic effect in a chip cutting process is avoided, the reliability passing rate of the chip in a high-humidity environment is improved, and the preparation method is simple, convenient and suitable for industrial popularization and application.

The utility model discloses a separable wearable structure and intelligent wearable equipment, and relates to the technical field of electronic products. Comprising a face shell and a middle frame, the face shell is provided with a face shell interference magnitude annular face, the middle frame is internally provided with a middle frame interference magnitude annular face matched with the face shell interference magnitude annular face, the face shell is further provided with a face shell groove, and the middle frame is internally provided with middle frame protruding points matched with the face shell groove. The separated host has unique advantages in design, can meet the requirements of different users for replacing a wearing middle frame in various scenes, avoids the problem that equipment cannot be worn due to breakage of a plastic watch ear of an integrated host, and the separated host is simple and elegant in appearance and rich in layering sense due to meticulous design of a surface shell groove. The separated middle frame and the face shell are buckled through the groove and the protruding point and are in interference fit with the upper surface, good matching hand feeling and stability are achieved, the bottom shell is provided with the glue overflowing groove, the link of processing redundant overflowing glue in the production process is omitted, and labor cost is reduced.

The embodiment of the invention provides a chip packaging structure, a preparation method thereof and electronic equipment, relates to the technical field of semiconductors, and aims at improving the structural stability of the chip packaging structure and improving the yield of chips. The chip packaging structure comprises a chip, a gasket, a first dielectric layer, a plastic packaging layer, a second dielectric layer and salient points. The chip includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The pad is located on the first surface of the chip. The first dielectric layer is located at one side of the pad away from the chip. The plastic packaging layer comprises a first part and a second part which are connected, and the first part is located on the side, away from the chip, of the first dielectric layer. The second dielectric layer is located on one side of the first portion away from the chip. The salient point comprises a first connecting part and a second connecting part, and the second connecting part is connected with the liner and the first connecting part. The chip packaging structure is applied to the electronic equipment so as to improve the performance of the electronic equipment.

The utility model belongs to the technical field of controller electromagnetic shielding and circuit boards, and particularly relates to a PCBA bump electromagnetic shielding controller and an automobile. The PCBA salient point electromagnetic shielding controller comprises an upper shell and a PCBA assembly, the PCBA assembly comprises an electronic chip, a ground bar exposed copper, a solder ball and a circuit board. The electronic chip is arranged in the circuit area of the circuit board; the ground bar exposed copper is arranged on the circuit board and surrounds the circuit area; the plurality of solder balls are arranged on the ground bar exposed copper at preset intervals; the upper shell is connected with the PCBA assembly, and the upper shell is in contact with the solder ball to form an electromagnetic shielding structure, so that a controller electromagnetic shielding technical scheme which is good in electromagnetic protection reliability and low in cost is realized.

The electric anastomat induction device comprises a gun barrel and an anastomat body which are detachably connected, a limiting block is arranged on the outer pipe wall of the rear end of the gun barrel, a stroke guide groove allowing the limiting block to be inserted and rotating in the circumferential direction is formed in the inner wall of a pipe opening in the front end of the anastomat body, and a circuit board is further arranged in the anastomat body. A metal conducting strip A is arranged on the outer tube wall of the rear end of the gun barrel, and two conducting convex points A which are distributed at intervals are arranged on the metal conducting strip A. The utility model aims to provide the electric anastomat induction device capable of preventing misoperation. The anastomat has the advantages that the metal conducting strip A is arranged on the outer tube wall of the rear end of the gun barrel, the metal conducting strip B and the metal conducting strip C which are independent of each other are arranged on the inner wall of the tube opening of the front end of the anastomat body, and when the gun barrel and the anastomat body are connected in an inserted mode and rotate in place, the two conducting convex points A are in butt joint with the metal conducting strip B and the metal conducting strip C respectively; and the circuit board forms an access, so that the percussion can be started only after the gun barrel is mounted in place, and the problem of manual misoperation of the electric detachable anastomat is solved.

The utility model provides a cylindrical roll core with tabs on the same side, roll core preparation equipment and a battery, and relates to the technical field of lithium ion batteries, the end face on the same side of the cylindrical roll core is provided with a positive pole tab area and a negative pole tab area, and the negative pole tab in the negative pole tab area is provided with salient points; and the top of the salient point is flush with the top of a positive pole lug arranged in the positive pole lug area. The cylindrical roll core has the beneficial effects that the convex points on the negative pole lug of the cylindrical roll core can increase the height of the negative pole lug, so that the negative pole lug is matched with the positive pole lug in height, and the heights of the end surfaces of the positive pole lug and the negative pole lug can be kept consistent after a leveling process. The height consistency of the end surfaces of the flatted tabs can be more easily controlled; meanwhile, the height and the compactness of the tabs are better controlled, and the subsequent welding process is more stable and reliable, so that the overall production yield is improved.

The invention discloses a processing method of a silicon carbide salient point vacuum chuck, and aims to overcome the defects that salient points on the vacuum chuck are poor in strength, easy to fall off and low in yield. The method comprises the following steps: S1, forming a ceramic biscuit; s2, rough machining of a ceramic biscuit; s3, degreasing the ceramic biscuit to form a porous biscuit; s4, sintering is carried out; s5, finish machining is conducted, specifically, grinding machining is conducted on the salient point machining face of the sintered semi-finished product; s6, a plurality of convex points are machined on the ground convex point machining face through laser; s7, the end faces of the convex points are polished to form the vacuum suction cup; and S8, cleaning the vacuum chuck. According to the vacuum chuck machining method, the machining period is shortened, the working efficiency is improved, the cost is reduced, and the qualified rate of products is increased.

The utility model belongs to the technical field of electrode slice assembling, and relates to electrode slice pre-assembling equipment which comprises a machine table and a servo rotating disc arranged on the machine table, a plurality of jigs used for placing plastic pieces are distributed on the rotating disc, a plastic piece feeding and discharging area and an electrode slice feeding area are arranged on the two sides of the rotating disc respectively, and the servo rotating disc is arranged on the machine table. A welding area is arranged between the plastic part feeding and discharging area and the pole piece feeding area, an ultrasonic welding machine is arranged in the welding area, and a pseudo soldering detection mechanism is arranged between the ultrasonic welding machine and the plastic part feeding and discharging area. Through the pseudo soldering detection mechanism, the height of the positioning salient point on the welded plastic part can be detected, whether the positioning salient point is pressed in place or not is detected, it is ensured that the flange formed through pressing can block the upper end face of the pole piece, the pole piece is prevented from falling off, therefore, the welding quality is ensured, and the problem that the yield is low in the prior art is solved.

The utility model relates to a four-layer thermoelectric separation copper substrate, which comprises a red copper hot disc, heat dissipation salient points, thermosetting adhesive, a first copper-clad plate, a second copper-clad plate, a first via hole, a second via hole and resin, and is characterized in that the heat dissipation salient points are arranged on the red copper hot disc and penetrate through the thermosetting adhesive, the first copper-clad plate and the second copper-clad plate; the upper surface and the lower surface of the red copper hot plate are respectively connected with the first copper-clad plate and the second copper-clad plate through the thermosetting adhesive, the first via hole respectively penetrates through the first copper-clad plate and the second copper-clad plate, the second via hole penetrates through the red copper hot plate, the thermosetting adhesive, the first copper-clad plate and the second copper-clad plate, and the resin is arranged in the second via hole. Wherein the first copper-clad plate and the second copper-clad plate have the same structure. Compared with the prior art, the four-layer circuit and high-density wiring design meets the dense circuit layout requirement, and meanwhile, the added heat dissipation salient points are utilized, so that the high heat conduction function of the circuit board is realized; and electronic components are welded on two sides, so that diversified design requirements of customers are met, and the practicability is higher.

The utility model relates to the technical field of orthodontic instruments, and provides a self-locking bracket with a spring bump structure. Comprising a bracket and a cover plate, and the bracket and the cover plate are in self-locking connection through a spring salient point structure; the top of a spring structure body of the spring salient point structure is provided with a salient point structure, and the salient point structure is provided with an arc-shaped surface. A plurality of wedge-shaped grooves are inwards formed in the side wall of the spring structure body. The self-locking bracket disclosed by the utility model has the beneficial effects that the bracket and the cover plate of the self-locking bracket are in self-locking connection through the spring salient point structure, and the salient point structure is arranged at the top of the spring structure body of the spring salient point structure, so that the cover plate can move on the bracket and is self-locked and limited by pulling the cover plate; the convex point structure can extend into the first limiting hole or the second limiting hole, the structure is simple, and use is convenient.

The invention discloses a method for manufacturing interconnection salient points and application thereof, and belongs to the field of quantum computing. The method for manufacturing the interconnection salient point comprises the following steps of: obtaining a matrix of a stripping layer and a salient point layer which are covered by a graphical mask; grinding the substrate to remove the stripping layer so as to expose the mask; and stripping the mask to form a bump layer independently existing on the substrate. The interconnection salient point formed by the method has high quality.

The utility model discloses a copper pipe inner salient point punching device for refrigeration equipment, and relates to the technical field of refrigeration equipment production. The device comprises a pipe body, a sliding sleeve, a salient point assembly and a driving mechanism, the end of the pipe body is fixed to the top of the supporting table, the pipe body is sleeved with a plurality of sliding sleeves, and the positions and the number of the sliding sleeves are adjusted based on actual needs. A plurality of salient point assemblies which are uniformly distributed along the circumference are fixed on the side surface of the sliding sleeve, and the positions and the number of the salient point assemblies are adjusted based on actual requirements; the driving mechanism is located in the center of the interior of the pipe body and used for driving the protruding point assemblies to move at the same time and extrude the copper pipe body. Through the arrangement of the pipe body and the sliding sleeves, the device can be applied to punching of inner convex points on a long copper pipe body, meanwhile, the inner convex points are formed at a time, the dotting efficiency is greatly improved, and the problems that an existing copper pipe inner convex point punching device is low in dotting efficiency, poor in adjustability and difficult to cope with different types of convex points are solved.

The invention discloses a DRAM (Dynamic Random Access Memory) double-stack chip packaging structure and a packaging process, and relates to the technical field of storage chip packaging, the packaging structure comprises a substrate, a first bare chip, a second bare chip, a bump structure and a mold sealing layer; the first bare chip is attached to the substrate and connected through a bonding wire, and the surface of the first bare chip is provided with a first rewiring layer for leading out bonding, interconnection and supporting pads. The second bare chip is provided with a second rewiring layer and a salient point structure and is inversely mounted on the first bare chip, and salient points are aligned with the corresponding pads to form connection; the mold sealing layer wraps the core structure, and the crystal back of the second bare chip is exposed. The packaging process comprises the steps of bare chip preparation, position matching, surface mounting and bonding, flip interconnection and mold sealing and grinding. Through bump interconnection and bare crystal back design, the heat dissipation performance is improved, the packaging thickness is reduced, and the high-speed and ultrathin packaging requirements are met.

The invention discloses an adjusting mechanism for butt joint of a stacking frame and an injection molding machine, the adjusting mechanism comprises a material receiving support rod, a second material receiving bottom plate, a second material receiving middle plate and a second material receiving top plate, the second material receiving bottom plate is fixed at the rear end of the material receiving support rod, and a second connecting column is locked at the rear end of the second material receiving bottom plate; a second angle adjusting groove is formed in the rear end of the second material receiving middle plate, a second connecting column vertically and upwards penetrates through the second angle adjusting groove and then is connected with a second connecting screw, a second material receiving top plate is located above the second material receiving middle plate, a second material receiving cavity is formed in the middle of the second material receiving top plate, and a second material receiving positioning ring is clamped in the second material receiving cavity; and a plurality of receiving positioning salient points are distributed on the second receiving positioning ring. The adjusting mechanism, in butt joint with the injection molding machine, of the stacking frame can conduct positioning according to materials discharged after injection molding is completed in the injection molding machine, the relative angle between the second material receiving middle plate and the second material receiving bottom plate is adjusted according to the butt joint angle, and the requirement for front and back material transfer is met.

The utility model relates to the technical field of real stone paint, in particular to a real stone paint surface layer structure which comprises a base layer processing layer, a reinforcing framework layer coated on the outer side of the base layer processing layer, a functional middle coating layer coated on the outer side of the reinforcing framework layer, and a plurality of honeycomb-shaped convex points arranged on the top of the functional middle coating layer. A plurality of hemispherical hydrophobic salient points are arranged on the surface of the functional floating coating; according to the real stone paint surface layer structure, the temperature of the base layer is adjusted through the PCM microcapsule grid points, the stability is improved, the vivid stone texture is presented through the honeycomb-shaped convex points, and the waterproof and anti-pollution performance is enhanced through the hemispherical hydrophobic convex points and the bionic convex point groups; the noise reduction is realized by the irregular pyramid-shaped salient points; and the protection performance is optimized by the protection layer grooves and the micro water guide fibers.

The utility model relates to the technical field of vacuum arc-extinguishing chamber manufacturing equipment, in particular to vacuum arc-extinguishing chamber shielding cylinder salient point forming equipment which comprises a base and a salient point forming assembly, the base is provided with a containing groove for containing a ceramic shell, and the salient point forming assembly comprises a pushing part, a guide seat and a plurality of sliding parts. The guide seat is fixedly connected with the base and located in the containing groove, the pushing piece is movably arranged in the guide seat in the axis direction of the guide seat, and each sliding piece is movably arranged in the circumferential direction of the guide seat. And the sliding piece extends out of the side wall of the guide seat by a preset distance and applies an acting force to the inner side wall of the shielding cylinder, and the side wall of the shielding cylinder is enabled to form a bump structure matched with the bump part of the ceramic shell, so that the advantage that bumps can be punched on the side wall of the shielding cylinder is realized.

The utility model relates to a draining basket capable of being used for shredding. Comprising a cover body, a draining basket and a basin body, the draining basket is embedded in the basin body, the cover body covers an opening in the upper end of the basin body and is located on the draining basket, a shredder is arranged on the cover body, the shredder comprises four groups of shredding openings of different styles, and the four groups of shredding openings are distributed on the cover body in a cross shape; a plurality of water permeable holes are formed in the draining basket, salient points are arranged at the bottom of the draining basket and abut against the bottom of the inner cavity of the basin body, and a gap is reserved between the bottom of the draining basket and the bottom of the inner cavity of the basin body. According to the utility model, the upper part of the draining basket is covered with the cover body, different types of shredding openings are formed in the cover body, so that different slicing and shredding requirements can be met, sliced and shredded vegetables directly fall into the draining basket for later use, and the vegetables can be cleaned by directly filling water into the draining basket and lifting the draining basket.

The utility model relates to a coupler for preventing poor contact, which comprises an upper coupler and a lower coupler, a plurality of conductors are arranged in the upper coupler, a plurality of conductive reeds are arranged in the lower coupler, and when the upper coupler is coupled with the lower coupler, the plurality of conductors are electrically contacted with the plurality of conductive reeds respectively. The free end of the conductive reed is provided with an electric contact salient point in contact with the conductor, and the surface of the electric contact salient point is provided with a rough structure; according to the coupler, oxidation films or stains on the surfaces of the electric conductors are scraped off through the protruding rough structures on the conductive reeds, poor contact between the electric conductors and the conductive reeds is avoided, and it is guaranteed that enough contact pressure can be kept.

The invention provides a multi-grain packaging structure, a chip, electronic equipment and a packaging method. The multi-crystal-grain packaging structure comprises a first crystal grain, a second crystal grain and a substrate, the first crystal grains and the second crystal grains are welded through salient points; insulating glue is filled between the first crystal grains and the second crystal grains; the first crystal grains are arranged on the substrate; the metal gasket of the first crystal grain is connected with the substrate through a metal wire; the first surface of the first crystal grain further comprises an anti-overflow structure, and the anti-overflow structure is arranged between the salient point of the first crystal grain and the metal gasket; the anti-overflow structure is used for limiting the glue overflow distance of the insulation glue flowing towards the metal gasket to be smaller than or equal to the preset glue overflow distance, and the preset glue overflow distance is smaller than the natural flowing distance of the insulation glue on the first surface. The packaging structure is favorable for reducing the packaging size of the chip.

The invention discloses an efficient detection method for defects of an interconnection hole chain of a micro bump bonding integrated chip. The efficient detection method mainly comprises the following steps: carrying out a direct current electrical test on the interconnection hole chain; calculating an interconnection hole chain resistance value according to a direct current test result, judging a resistance abnormal value, and picking out a short-circuit or open-circuit interconnection hole chain according to the abnormal value; cutting the whole short-circuit or open-circuit interconnection hole chain structure from the middle of the salient point through a scribing process; mounting the bonding integrated chip with the cut interconnection hole chain structure on a section polishing clamp, keeping the section flush with a polishing disc, and performing section polishing on the whole cut interconnection hole chain structure; cleaning the polished bonding integrated chip; utilizing an optical microscope to inspect the cross section of the interconnected hole chain, screening abnormal points, and utilizing SEM to detect and analyze the bonding defects of the interconnected hole chain.

The invention provides a salient point beating mechanism and a method for machining salient points of a pipe structure. Deformation of the pipe structure during salient point machining can be improved. The salient point beating mechanism comprises an ejector rod component and a driving component, and the driving component is used for driving the ejector rod component to move in the axial direction; the bump forming mechanism further comprises an extrusion part and a limiting structure for limiting the axial movement of the extrusion part; when the extrusion part is at the first position, a first radial distance is formed between the extrusion part and the axis of the ejector rod component; one of the extrusion part and the ejector rod component is provided with a conical surface, when the extrusion part is at the second position, the conical surface abuts against the other one of the extrusion part and the ejector rod component, a second radial distance is formed between the axis of the extrusion part and the axis of the ejector rod component, and the first radial distance is smaller than the second radial distance; the extrusion part can abut against the inner surface of the pipe wall of the pipe structure to form protruding points.