230 results about "Salient point" patented technology

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

The invention discloses a data stream dynamic mode perception privacy protection method based on local differential privacy, which comprises the following steps: a client selectively captures salient points, retains a data trend while reducing the number of samples, and enhances the disturbance precision of each point to improve the overall data utility; the client side represents the importance of the salient points by calculating PID; the client obtains a sampling point by calculating a sampling rate so as to improve data utility; the client uses a dynamic privacy budget allocation method which adapts to the importance of current and future sampling points so as to optimize budget allocation on a time sequence; the client uses a square wave mechanism to disturb the salient points, and w event level differential privacy is used. According to the method, the user is allowed to select the salient points according to the statistical characteristics of own data, and then the privacy budget is allocated according to the importance of the salient points so as to disturb the salient points.

The utility model provides a chip packaging structure and a chip packaging module, the chip packaging structure is provided with a salient point and a welding column between a packaging body and a first substrate, and the welding column is at least partially arranged around the salient point, so that after the packaging body and the first substrate are connected through the salient point and the welding column, the packaging body and the first substrate are connected through the salient point and the welding column; the shear stress caused by thermal mismatch between the packaging body and the first substrate can be released by using the bending (rotational degree of freedom in a first plane) or stretching (stretching degree of freedom in a first direction) deformation of the welding columns, so that the situation that the stress generated by thermal mismatch between the packaging body and the first substrate cannot be released is reduced; therefore, the probability of packaging failure between the packaging body and the first substrate is reduced, and the reliability of the chip packaging structure is improved.

The embodiment of the invention relates to the technical field of semiconductors, and discloses a radio frequency module, radar and electronic equipment, the radio frequency module comprises a chip packaging body, the chip packaging body is provided with at least one radiation part, and a plurality of salient points are arranged around the radiation part and form a first waveguide channel; a second waveguide channel is arranged at the position, corresponding to each first waveguide channel, of the PCB carrier plate; the waveguide antenna is provided with at least one antenna unit and a third waveguide channel; wherein the first waveguide channel, the second waveguide channel and the third waveguide channel are communicated to form a radio frequency signal transmission channel. According to the scheme, the loss of the module on the feeder line can be effectively reduced, and the waveguide antenna is externally connected to the PCB, so that replacement is convenient to realize.

The invention discloses an analysis method and system based on AI video recognition behavior monitoring, and relates to the technical field of video recognition, and the method comprises the steps: collecting video data, calculating the overall pixel gradient change of adjacent frames, marking preliminary candidate frames, calculating the edge saliency intensity of each frame, and analyzing a salient region point set; clustering and calculating the geometric center point of each cluster as an anchor point value, and forming an anchor point set through the center points of each cluster; according to the method, concentrated extraction of salient points is realized through a density-based clustering algorithm DBSCAN, so that an extraction result has logic uniqueness and local integrity of a salient target, a local feature map is extracted by using a shallow convolutional network, target texture and edge information is effectively captured, bounding box optimization is realized by rotating an IoU loss function, and the robustness of the target is improved. And the fitting precision of the boundary of the salient region is improved.

The invention discloses a detection method of an automobile universal joint inner ball cage mold, which comprises the following steps: measuring and determining an outer contour protruding point of the automobile universal joint inner ball cage mold through a rotating platform and a vertical laser displacement sensor, and collecting point cloud data of an edge where the most protruding point of an outer cylindrical surface is located; collecting point cloud data of the edge where the most concave point of the inner cylindrical surface is located; converting into coordinate values in a space rectangular coordinate system; an auxiliary function is introduced, and the centers of fitting circles of the outer cylindrical surface and the inner cylindrical surface at different heights are solved through a least square method; respectively fitting the centers of the fitting circles of the inner / outer cylindrical surfaces into corresponding straight lines, and determining the coaxiality according to the fitting straight lines and the axis of the positioning hole of the automobile universal joint inner ball cage mold; and after deleting the chamfers in the point cloud data set of the edge where the most convex point of the outer cylindrical surface is located and the data points corresponding to the points not on the convex surfaces at the two ends, calculating the straightness of the outer cylindrical surface.

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

The utility model relates to an MPO anti-loosening buckle which comprises a lantern ring used for being sleeved on a shell in an MPO connector, a clamping plate is arranged above and / or below the lantern ring, and the middle of the clamping plate is matched with the lantern ring in a rotating mode. And the rear end of the clamping plate is provided with a salient point which can be clamped into a movable groove formed between the rear end of the outer shell and the rear end of an inner shell in the MPO connector and can prevent the outer shell from retreating relative to the inner shell. The MPO connector has the beneficial effects that if the MPO connector is always in a locked state, the clamping plate rotates around the connecting point of the clamping plate and the lantern ring until the convex point is clamped into the movable groove formed between the rear end of the outer shell and the rear end of the inner shell in the MPO connector, and even if the optical fiber patch cord has a certain weight, the MPO connector can be locked. According to the anti-loosening buckle, the phenomenon of loosening between the buckle of the MPO adapter and the MPO connector cannot be caused, and the anti-loosening buckle can be suitable for the existing MPO connector without improving the MPO connector.

The invention provides a chip packaging structure, a chip inverted packaging method and electronic equipment, relates to the field of semiconductors, does not occupy resources of bare chips and electronic devices, and also can filter high-frequency noise. The chip packaging structure comprises a bare chip, an electronic device, a plurality of conductive bumps and a first capacitor. The bare chip comprises a first wire, and the electronic device comprises a second wire and a third wire. The plurality of conductive salient points are arranged between the bare chip and the electronic device, and the plurality of conductive salient points comprise first conductive salient points and second conductive salient points. The first capacitor is arranged between the bare chip and the first conductive bump; the first wire is electrically connected with the second wire through the first capacitor and the first conductive bump; and the first wire is also electrically connected with the third wire through the second conductive bump. Wherein the first wire and the third wire are grounding wires, and the second wire is a power supply wire; or, the first wire and the third wire are power wires, and the second wire is a grounding wire.

The utility model relates to the technical field of IGBT (Insulated Gate Bipolar Translator) substrate processing, in particular to an IGBT substrate budding, salient point and radian one-step punching progressive die, which comprises a bottom die holder, an upper die fixing plate is arranged above the top end of the outer wall of the bottom die holder, and an IGBT substrate to be processed is arranged between the bottom die holder and the upper die fixing plate. An upper die holder is fixed at the bottom end of the outer wall of the upper die fixing plate, a mounting groove is formed in one side, opposite to the upper die holder, of the bottom die holder, and die parts for respectively carrying out sprouting, salient point processing and radian processing on the IGBT substrate are respectively arranged in the mounting groove. A worker can fix a die for processing buds, salient points and radians in the mounting groove through bolts, and then drives the upper die holder to move up and down through the hydraulic rod, so that the upper die holder is matched with the bottom die holder to process the buds, the salient points and the radians of the IGBT substrate at one time when moving downwards; therefore, personnel do not need to respectively place the IGBT substrate on different dies for stamping processing.

The invention discloses a semiconductor chip packaging method, and relates to the technical field of semiconductor packaging, and the method comprises the steps: carrying out the salient point preparation of a semiconductor chip, carrying out the data collection, obtaining a salient point shape data set, carrying out the cleaning after the preparation of a substrate, obtaining the surface data of the substrate, fusing the surface data of the substrate with the salient point shape data set, generating a shape quality data set, and carrying out the processing of the shape quality data set. The method comprises the following steps: establishing a chip prediction model, outputting a welding spot failure probability and optimized process parameters, overturning a chip, performing alignment operation to obtain a chip and a substrate assembly which are subjected to alignment, performing welding parameter optimization through a reflow soldering furnace, forming a uniform intermetallic compound, and obtaining a welded chip and substrate assembly. And according to the welded chip and substrate assembly, a dispensing machine and a molding press are used for processing, and a packaged chip assembly is obtained. According to the method, the chip prediction model is established, so that the failure rate of the welding spots is remarkably reduced, the adaptability of process parameters is improved, and missing detection of the failed welding spots is avoided.

Systems and methods for providing assistance to a surgeon during an implant surgery are disclosed. A method includes defining areas of interest in diagnostic data of a patient and defining a screw bone type based on the surgeon's input. Post defining the areas of interest, salient points are determined for the areas of interest. Successively, an XZ angle, an XY angle, and a position entry point for a screw are determined based on the salient points of the areas of interest. Successively, a maximum screw diameter and a length of the screw are determined based on the salient points. Thereafter, the screw is identified and suggested to the surgeon for usage during the implant surgery.

The utility model provides a splicing fuse type disconnecting switch, which comprises fuse disconnecting switches spliced side by side, each fuse disconnecting switch comprises a base and a shell hinged with the base, the front part and the rear part of the bottom end of the base are provided with inner grooves, the inner grooves are internally provided with fixing holes, one side of each fixing hole is provided with a positioning salient point, the inner grooves are internally provided with connecting plates, and the connecting plates are connected with the base. Fixing screws are arranged on the connecting plate, positioning holes are formed in one sides of the fixing screws, a handle is arranged on the front portion of the shell, a connecting hole is formed in the handle in a penetrating mode, and a connecting pin is arranged in the connecting hole in a penetrating mode. By arranging the inner grooves and arranging the connecting plates in the inner grooves, multiple fuse disconnecting switches are spliced and fixed, the splicing strength is enhanced, the shells are positioned and fixed by inserting the connecting pins into the connecting holes, the splicing convenience is improved, modularization of the fuse disconnecting switches is achieved, and the service life of the fuse disconnecting switches is prolonged. A user does not need to replace the fusing disconnecting switch under the condition of increasing the load, and only needs to increase a corresponding number of fuse disconnecting switches.

The utility model discloses a multifunctional meat ball cutter, including base and lid with the upper cover of base, one side of base with one side of upper cover articulates, the top of base is equipped with a plurality of support protruding, upper cover is equipped with with support protruding corresponding slot, be equipped with a plurality of blade in the slot, support protruding is equipped with with blade corresponding blade slot, the top of support protruding is equipped with hemispherical groove, the other side of upper cover is equipped with press operation groove, the surface of press operation groove is evenly equipped with a plurality of antiskid salient point, the other side of upper cover is equipped with opening operation groove. The utility model structure is simple, and support protruding is used for placing meat ball, and closing upper cover, and blade can quickly cut and flower to meat ball, and cutting and flower are even, and convenient to use, and high efficiency, and not easy to hurt hand, and after even cutting and flower of meat ball, more easily ripe, reduce cooking time, more easily taste, and use effect is good.

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method for correcting a vertical routing exposed position. The packaging structure for correcting the exposed position of the vertical wire bonding comprises a substrate, and is characterized in that a plurality of packaging units are arranged on the substrate, each packaging unit comprises a step-type stacked chip group, and each chip group is bonded with the substrate through a vertical lead; and one end, close to the substrate, of the vertical lead is connected with the salient point. Compared with the prior art, the packaging structure and the packaging method for correcting the exposed position of the vertical wire bonding have the advantages that interconnected salient points are grown in situ at the exposed position of the wire bonding metal, the size of the salient points can be flexibly adjusted through a photomask on the basis of a one-time patterning process, and the abnormal bridging short circuit in the subsequent welding process can be effectively improved.

The invention discloses a buffering device capable of optimizing the vibration mode of a back door, the back door and a vehicle, and belongs to the technical field of automobile body opening and closing parts. The buffer base comprises a support and a connecting arm which are connected with each other; the support is connected with a back door; the connecting arm is connected with the buffer block; a set included angle is formed between the support and the connecting arm; the buffer pad is arranged on a vehicle side wall tail lamp mounting plate, one end of the buffer block is a buffer surface which is in contact with the buffer pad when the back door is closed, a plurality of salient point structures are arranged on the buffer surface, and when the back door is closed, each salient point structure is in point contact with the buffer pad. The buffering block is connected with the buffering base, and the buffering base is arranged to be in a bent mode, so that the buffering device can be installed in a vehicle model with a large punching angle of a back door inner plate or a compact back door and side wall space.

The utility model relates to the technical field of electronic connection, in particular to a positive electrode elastic sheet structure, which comprises a main body plate, two semicircular connecting plates are fixedly connected to the left end of the main body plate, a contact part is arranged on the semicircular connecting plate on the front side, and salient points and lines are arranged on the contact surface of the contact part. The lower end of the semicircular connecting plate on the rear side is fixedly connected with an elastic plate, the elastic plate is of a wave-shaped structure and provides elastic deformation capacity, and the middle of the right end of the main body plate is fixedly connected with a clamping plate. According to the positive electrode elastic sheet structure, the positive electrode elastic sheet structure is connected with the contact part and the elastic plate through the semicircular connecting plate, the convex points and the lines on the contact part increase the contact friction force with the positive electrode, meanwhile, the wavy structure of the elastic plate provides good elastic deformation capacity, vibration can be effectively buffered, and the positive electrode elastic sheet structure can adapt to temperature changes; and stable positive electrode connection can be kept in various environments, so that the connection stability is greatly improved.

The invention discloses a fuel cell triangular bipolar plate and a fuel cell stack, and belongs to the technical field of fuel cells, and the fuel cell triangular bipolar plate comprises an anode plate and a cathode plate; outlets, namely an air inlet / outlet, a hydrogen inlet / outlet and a cooling liquid inlet / outlet, are formed in three sides of the polar plate; two surfaces of the polar plate are respectively a reaction side and a cooling side, the reaction side is provided with a gas flow field area and a gas sealing area, and the gas flow field area is communicated with a group of gas inlets and outlets; the gas flow field area comprises a dot matrix flow field, a snakelike dot matrix flow field and a dot matrix rectangular block flow field which are communicated in sequence; the dot matrix flow field comprises a plum-blossom-shaped salient point area, and the plum-blossom-shaped salient point area is composed of a plurality of salient points arranged in a plum blossom shape; the snakelike dot matrix flow field is divided into a front section and a rear section, the front section comprises a plurality of parallel rectangular blocks, salient points are arranged on one side of the end part of each rectangular block, and the salient points in adjacent rows are alternately arranged on one side of the first end or the second end of each rectangular block; and each row in the rear section comprises a plurality of rectangular blocks, and gaps or salient points are arranged among the plurality of rectangular blocks. The problems of long and narrow gas path and overlarge pressure drop in the prior art are solved.

The utility model relates to the field of gas stove accessories, and particularly discloses a timer mistaken touch prevention structure which comprises a knob and a timer body, the knob is installed on the timer body, one end of the knob is fixedly connected with a rotating rod, the rotating rod is inserted into the timer body, a limiting piece is installed on the timer body, elastic protruding points are arranged on the limiting piece, and the elastic protruding points are arranged on the rotating rod. One side of the rotating rod protrudes to form a screwing protruding point, and the screwing protruding point can make contact with the elastic protruding point. According to the utility model, the elastic salient point is designed to clamp the screwing salient point in the knob handle, so that the knob can be easily positioned to a closed position when a user uses the knob to rotate and close the knob, and if the knob needs to be screwed to a normally open contact, the knob needs to be screwed to a normally open gear only by overcoming the elastic salient point 24 of the limiting piece 21 with an obvious jerking operation torque; and a user does not need to pay attention to positioning deliberately, so that mistaken touch is avoided, and the user can use conveniently.

The utility model discloses a display device, which relates to the technical field of display devices and comprises a host, a mounting plate and a connecting buckle, a mounting position and a groove are formed on the host, an elastic block is arranged in the groove, a salient point is formed on the elastic block and extends out of an opening of the groove, and the mounting position comprises a first connecting hole and a second connecting hole which are communicated with each other. The aperture of the first connecting hole is greater than that of the second connecting hole; clamping holes are formed in the mounting plate, the convex points are used for being clamped in the clamping holes, and the side, away from the host, of the mounting plate is used for being mounted on a wall; and the connecting buckle is mounted on the mounting plate and is clamped in the second connecting hole. The connecting buckle penetrates through the first connecting hole and extends into the inner cavity, the mounting plate abuts against the protruding point, the elastic block deforms towards the groove, the main machine slides, the connecting buckle is clamped into the second connecting hole, the elastic block recovers deformation, the protruding point is clamped into the clamping hole, and therefore the main machine is fixed. The display device can be quickly mounted and dismounted, and the use comfort is improved.

The utility model relates to a turnover box, in particular to a raw tobacco leaf circulating turnover box convenient to stack and transport. Comprising a box body, longitudinal rocking covers and transverse rocking covers, the top and the bottom of the box body are connected with the longitudinal rocking covers and the transverse rocking covers, and transverse grains and longitudinal grains are arranged on the outer side face of each longitudinal rocking cover. According to the utility model, the transverse grains, the longitudinal grains and the salient point grains are arranged on the outer side of the longitudinal rocking cover, so that multidirectional anti-skid locking is formed. The transverse grains and the longitudinal grains respectively correspond to anti-skidding in front-back and left-right directions, so that the upper box body and the lower box body are ensured not to slide in a plane during stacking; the friction force is further improved through the synergistic effect of the convex point lines, the transverse lines and the longitudinal lines, the box is suitable for different stacking modes, local slippage is effectively avoided, the stacking safety is remarkably improved, the vertical lines are arranged on the outer side of the box body, and the overall pressure resistance of the box body is enhanced.

The embodiment of the invention provides a circuit board assembly, a preparation method of the circuit board assembly and electronic equipment, and aims to solve the problem of low reliability of an electronic device in related technologies. The circuit board assembly comprises a circuit board, a first electronic device, a filling material, a second electronic device and an isolation material. The first electronic device is welded on the first side of the circuit board through the first salient points. The filling material is at least partially located between the first electronic device and the circuit board, and the filling material wraps the first salient points. The second electronic device is welded to the first side of the circuit board through the second protruding points, the second electronic device and the first electronic device are arranged in the first direction, and the first direction is perpendicular to the thickness direction of the circuit board. The isolation material wraps at least part of the second electronic device, the isolation material is in contact with the filling material, and the elastic modulus of the isolation material is smaller than that of the filling material. The isolation material can prevent the filling material from making contact with the second electronic device, so that stress borne by the second electronic device is reduced.

The utility model relates to a special substrate for a Saw filter film coating process. A pasting film is arranged on the substrate body, a plurality of chips are installed between the substrate body and the pasting film, a plurality of gold balls are arranged between the chips and the substrate body, a plurality of salient points are arranged on the periphery between the substrate body and the pasting film to form a salient point enclosure frame, and the chips are located in the salient point enclosure frame. The problem of board edge slope existing in a saw fall film coating process is solved, the flatness of a chip is improved, the slope phenomenon is avoided, the test failure caused by the uneven surface of a product is reduced, and the test yield is improved; the risk of product failure caused by excessive invasion of the epoxy film is reduced; and product layering quality abnormity is avoided.

The utility model particularly relates to an open-type temperature protector, which comprises a conductor and a base, the base is arranged on the conductor, the base is provided with a static contact block and a second pin, the static contact block is connected with the second pin, the conductor is respectively provided with a limit salient point, a mounting table and a first pin, the mounting table is provided with a rivet joint, and the rivet joint is connected with the first pin. The rivet joint is provided with a metal sheet and a movable elastic sheet. One end of the movable elastic sheet is arranged on the upper surface of the contact block. The beneficial effects of the utility model are that the installation platform is provided with the riveting head, and the riveting head is provided with the metal sheet and the movable elastic sheet, thereby solving a plurality of installation processes, simplifying the installation structure, and improving the production efficiency.

The utility model relates to the technical field of semiconductor manufacturing equipment, especially for a wafer transfer box fixing mechanism for wafer loader, including object table and mesa, the bottom of object table is equipped with mesa, the bottom fixedly connected with fixed frame of mesa, the bottom fixedly connected with the fixed frame limit seat, the inside slide connection of limit seat has the guide rail, the bottom fixedly connected with the fixed plate of limit seat rear of fixed frame, the right side fixedly connected with first air cylinder of fixed plate, the top fixedly connected with the fixed pin of mesa that penetrates object table, in the utility model, through the positioning hole and fixed pin that set up can carry out positioning and fixed effect to wafer transfer box, through the second air cylinder, briquetting, fixed groove and connecting plate that set up carry out reverse extrusion fixed to wafer transfer box, rubber salient point can strengthen the friction between briquetting and connecting plate, effectively avoided wafer transfer box to be opened and pulled when appearing the phenomenon of shaking and falling off.

The utility model relates to the technical field of medical instruments, in particular to a light-weight three-dimensional (3D) conjoined tension-free inguinal hernia repair patch which comprises a patch body and a placing box used for storing the patch body, the patch body is of an axial symmetry structure and has a certain curvature, a plurality of large meshes are formed in the patch body, and the large meshes are arranged in the placing box. Large meshes are formed in the patch body, the porosity of the large meshes is the same, anchoring holes are formed in the periphery of the patch body, salient points are designed on the surface of the patch body, and a marking structure is further arranged on the patch body. The patch body which is in the axial symmetry shape and has the curvature is beneficial for adapting to anatomical differences of different patients to be cut, the 3D shape better conforms to the human groin structure, and placement is facilitated; a large mesh structure is arranged, so that the patch body is lighter; the hernia repair patch solves the problems that an existing common hernia repair patch is poor in fitting degree during use, inconvenient to store properly and prone to being infected by the external environment.

The external protective sleeve comprises a protective sleeve assembly, and the protective sleeve assembly comprises a protective sleeve body, a transparent bag arranged on the protective sleeve body, an opening formed in the front end of the protective sleeve body, a circular ring fixed in the opening and a long rope penetrating through the circular ring. The antiskid assembly comprises rubber salient points fixed on the bottom surface of the protective sleeve main body, a first adhesive sheet fixed on the side wall of the protective sleeve main body, first release paper attached to the first adhesive sheet, a second adhesive sheet fixed on the side wall and second release paper attached to the second adhesive sheet. The protective sleeve assembly and the anti-skid assembly are matched with each other, so that the endoscope pedal is fully covered and protected during use, multiple skid resistance is performed on the bottom surface of the protective sleeve, the problem of accidental sliding during use is avoided, the use stability of the protective sleeve is improved, a user can conveniently observe the color of the pedal due to the structural design of the transparent bag, and the service life of the pedal is prolonged. And operation errors are avoided.

The invention discloses a scrap jumping prevention method for a lead frame, a punching machine, a device and a medium, and relates to the technical field of lead frames. The method comprises the steps that a raw material is divided into a plurality of machining areas, and the moving step pitch of the raw material is determined according to the sizes of the machining areas; according to the moving step pitch, the raw materials are fed through a progressive feeding mechanism; the salient point forming mechanism is used for sequentially machining each machining area to form salient points; each machining area is sequentially punched through the punching mechanism, during punching, a pushing rod enters a pushing groove to push pushing blocks on the two sides to get close to each other, after a punch enters a tool edge, a punching adjusting block abuts against the punch, and waste generated during punching is prevented from rising through the punching adjusting block; forming is conducted on each machining area in sequence through a forming mechanism; and cutting off the joint between each processing area and the adjacent processing area in sequence through a cutting-off mechanism to obtain the lead frame. The method can prevent scrap jumping.

The invention discloses a bump packaging structure and a packaging method. The packaging method comprises the following steps: step 1, sputtering a seed layer on the surface of a wafer; 2, manufacturing a photoresist opening in the surface of the wafer; 3, at least two metal layers are manufactured in the photoresist opening, so that the Pad is connected out; 4, removing the seed layer on the surface of the wafer to enable the salient points to be directly independent, and avoiding short circuit; and step 5, completing coating, grinding and cutting of the metal layer structure on the surface of the salient point, and manufacturing the whole wafer into a single packaging chip. According to the invention, a compact nickel-gold layer can be formed on the surface of the salient point, corrosion of water vapor to copper is prevented, galvanic effect in a chip cutting process is avoided, the reliability passing rate of the chip in a high-humidity environment is improved, and the preparation method is simple, convenient and suitable for industrial popularization and application.

The utility model discloses a separable wearable structure and intelligent wearable equipment, and relates to the technical field of electronic products. Comprising a face shell and a middle frame, the face shell is provided with a face shell interference magnitude annular face, the middle frame is internally provided with a middle frame interference magnitude annular face matched with the face shell interference magnitude annular face, the face shell is further provided with a face shell groove, and the middle frame is internally provided with middle frame protruding points matched with the face shell groove. The separated host has unique advantages in design, can meet the requirements of different users for replacing a wearing middle frame in various scenes, avoids the problem that equipment cannot be worn due to breakage of a plastic watch ear of an integrated host, and the separated host is simple and elegant in appearance and rich in layering sense due to meticulous design of a surface shell groove. The separated middle frame and the face shell are buckled through the groove and the protruding point and are in interference fit with the upper surface, good matching hand feeling and stability are achieved, the bottom shell is provided with the glue overflowing groove, the link of processing redundant overflowing glue in the production process is omitted, and labor cost is reduced.