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13660 results about "Glass sheet" patented technology

Single automatic document feeder sensor for media leading edge and top cover being opened detection

A single plate flatbed scanner utilizing a single sensor to detect both opening of a lid covering the plate and the leading edge of an automatically fed document. The flatbed scanner includes a contact glass plate defining a flatbed scanning area where a document to be scanned may be manually positioned. An automatic document feeder (ADF) scan window where ADF-fed documents are scanned is defined within the flatbed scanning area. An image sensor is maintained at a fixed position in the ADF scan window while scanning ADF-fed documents. To scan a manually fed document, the image sensor moves under the flatbed scanning area so as to scan an image of the document. Since the ADF scan window and the flatbed scanning area both are defined in the same area of the contact glass plate, a document inadvertently left on the contact glass blocks the ADF scan window and prevents the scanning of an ADF fed document. A single sensor is utilized to detect the opening of the ADF which uncovers the contact glass to allow manual placement of a document. Detecting the opening of the glass plate cover is used to determine whether or not a document has been left on the glass plate after scanning. The same sensor is also utilized to detect the leading edge of an ADF fed document to initiate the scanning process at the precise time the document reaches the ADF scan window.
Owner:HEWLETT PACKARD DEV CO LP

High-rise building with large scale display device inside transparent glass exterior

A high-rise building with a large scale dot-matrix display device is disclosed. The glass panels arranged in rows and columns form a curtain wall structured transparent outer wall 12 extending over an exterior of a building 10. Each panel is installed apart from end portions of floor slabs to form a void space therebetween. A plurality of louver structured modules 22 are arranged within the void space in rows and columns to form a large scale display area. Each module 22 has a louver-like structure formed of a plurality of posts 24 arranged in substantially parallel relationship and a plurality of parallel, uniformly spaced beams 26 connecting said adjacent posts 24. A plurality of LED combination lamps 28 are mounted on each beam 26 at uniform pitches as those between the adjacent beams 26. The LEDs are driven by drive circuits disposed in each beam 26. The vertical guide members 44 are fixed to the end portions of the floor slabs 20. The guide members 44 are arranged substantially in parallel relationship so that the modules 22 are supported between the adjacent guides 44 at the both lateral sides thereof. A plurality of vertical mullion members 48 fixed to the vertical guide members 44 as spaced apart from each of the vertical guides 44, so that the glass panels 12 are supported therebetween.
Owner:AVIX

Hermetic wafer scale integrated circuit structure

A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor die. Each individual die formed on the wafer includes a number of bond pads that are exposed on the die surface in various locations to provide electrical connections to the circuitry created on the die. The wafer further includes a planar glass sheet that is substantially the same size as the wafer, the glass sheet being adhered to the wafer using a suitable adhesive. The glass sheet has a number of pre-formed holes in it, the arrangement of the pre-formed holes corresponding to the location of the bond pads at each of the individual semiconductor die formed as part of the wafer structure. Following adherence of the glass sheet to the semiconductor wafer utilizing the intermediate adhesive material, metal connections are made between pads formed on the glass sheet and the bond pads formed on the integrated circuit die. Solder balls are then attached to the pads on the glass sheet to provide a conductive flow between the solder balls and the bond pads. After the solder balls are attached, trenches are cut around each of the individual die on the wafer. The trenches are cut at an angle and extend through the glass sheet and the intermediate adhesive material and into the semiconductor substrate in which the integrated circuits are formed. After the trenches are cut around each individual semiconductor die, a noble metal is deposited on the sidewalls of the trench to extend over the interface between the glass sheet, the adhesive material and the semiconductor die. The wafer is then cut along the noble metal lined trenches to provide individual, hermetically sealed packaged integrated circuit die.
Owner:MICRO CHIP SCALE PACKAGING
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