17432results about "Article separation" patented technology

An image read device is provided, which conveys an original while performing reading of an image of the original at a read position on a transparent member by a read unit fixed, the image read device including: a moving unit that moves the transparent member back and forth in an original conveying direction; a control unit that conveys the original and moves the transparent member by using the moving unit while causing the reading of the image to be performed at the read position; and a determining unit that, when an event causing interruption of original conveyance occurs, stops the transparent member and determines whether a control of returning the transparent member to a home position is to be performed or not in accordance with a stopped position of the original in an original conveying path.

A substrate processing apparatus having a transport apparatus, at least one sensor connected to the transport apparatus and a controller. The transport apparatus is adapted for transporting the substrate between processing stations of the processing apparatus. The sensor is capable of sensing the substrate transported by the transporting apparatus. The sensor is arranged for sending at least one signal in response to sensing the substrate. The controller is communicably connected to the sensor and arranged to determine alignment of the substrate in at least two directions, angled relative to each other, relative to a predetermined location. The controller is capable of determining alignment from the at least one signal identifying no more than two points on the substrate and independent of radial variances between substrates.

A seal-protected perimeter partition valve apparatus (450) defines a vacuum and pressure sealed space (401) within a larger space (540) confining a substrate processing chamber with optimized geometry, minimized footprint and 360° substrate accessibility. A compact perimeter partitioned assembly (520) with seal protected perimeter partition valve (450) and internally contained substrate placement member (480) further provides processing system modularity and substantially minimized system footprint.

A semiconductor processing apparatus includes a reaction chamber, a loading chamber, a movable support, a drive mechanism, and a control system. The reaction chamber includes a baseplate. The baseplate includes an opening. The movable support is configured to hold a workpiece. The drive mechanism is configured to move a workpiece held on the support towards the opening of the baseplate into a processing position. The control system is configured to create a positive pressure gradient between the reaction chamber and the loading chamber while the workpiece support is in motion. Purge gases flow from the reaction chamber into the loading chamber while the workpiece support is in motion. The control system is configured to create a negative pressure gradient between the reaction chamber and the loading chamber while the workpiece is being processed. Purge gases can flow from the loading chamber into the reaction chamber while the workpiece support is in the processing position, unless the reaction chamber is sealed from the loading chamber in the processing position.

A semiconductor-processing apparatus includes: a wafer handling chamber; a wafer processing chamber; a wafer handling device; a first photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer partially blocks light received by the first photosensor at a ready-to-load position and substantially entirely blocks light received by the first photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction; and a second photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer does not block light received by the second photosensor at the ready-to-load position and partially blocks light received by the second photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction.

The invention provides methods and apparatus for dispensing items from a dispensing unit. According to the invention, the dispensing unit comprises a plurality of locations in which the items are held, a processor in which records corresponding to the items on the unit are stored, and a plurality of item switches corresponding to the locations in which the items are held. The item switches are connected to the processor so that a user of the dispensing unit can input records of items removed from the unit into the processor. The apparatus described is particularly suited for dispensing medical supplies although the apparatus will be usable for other types of items as well. Preferred embodiments will include a plurality of visual indicators, typically in the form of light emitting diodes, corresponding to the locations in which the items are held. Upon selection of a desired item from a list of items held by the unit, the visual indicator corresponding to the item is actuated so that the user can locate the desired item quickly and conveniently with the help of the visual indicator.

Methods and apparatus for selecting and combining packages in an outbound container by employing autonomous transfer and transport vehicles which move on a network of roadways to carry a plurality of individual cases each containing the same kind of product from a loading station and to a destination station where individual packages are combined in the outbound container. The travel of each vehicle through the roadway network is computer controlled, and each vehicle includes means for automatically loading and unloading packages from predetermined locations on the network.