The utility model discloses a full-automatic multi-
station drying device for
semiconductor wafers, and relates to the technical field of
semiconductor manufacturing equipment. The device comprises symmetrically arranged base plates, a conveying platform between the base plates, and a
drying cabin mounted in the middles of the base plates. The
drying cabin body is divided into a pretreatment area, a main drying area and a cooling area through four sets of lifting type isolation
doors, and channels are formed in the bottoms of the isolation
doors and driven by independent motors. An
infrared radiation heating array is arranged on the inner wall of the main drying area, and an
air cooling hole channel communicated with a cooling fan is formed in the inner wall of the cooling area. The
material transfer trolley slides on the conveying platform through a guide rail, and a bearing bracket of the
material transfer trolley is provided with a wedge-shaped locking block driven by a double-
torsion spring and used for locking a
wafer carrying disc with a conical positioning boss. The propelling mechanism enables the push rod to be matched with the positioning support to achieve automatic transfer of the transfer trolley. According to the utility model, the full-flow closed automatic operation of
wafer drying-cooling is realized, the problem of temperature fluctuation is solved, and the yield is improved by more than 15%.