The
polishing head comprises a shell, a carrier, a
retaining ring and an elastic film
assembly, the shell is used for being connected to the lower portion of a rotary driving part, the carrier is connected to the lower portion of the shell and provided with a containing cavity with a downward opening, the
retaining ring is connected to the lower end face of the carrier, and the elastic film
assembly is connected to the lower end face of the carrier. The
elastic membrane assembly is arranged in the containing cavity, a buffering
cushion ring is arranged at the bottom of the
elastic membrane assembly, and the buffering
cushion ring is arranged close to the outer ring of the
elastic membrane assembly. According to the
polishing head for the square
silicon wafer, the incircle area of the square
silicon wafer is ground through the middle area of the elastic film assembly, meanwhile, the buffering
cushion ring close to the outer ring of the elastic film assembly abuts against the upper portion of the corner area of the square
silicon wafer, effective buffering on the corner area is formed, and the
polishing effect is improved. The problem that
stress concentration is generated in the corner area in the
grinding process is avoided, the
grinding structure of the corner area is optimized, synchronous
grinding of the inscribed circle area and the corner area is achieved, and the grinding quality of the square silicon wafer is guaranteed.