4467results about "Plane surface grinding machines" patented technology

The invention relates to the technical field of polishing, and discloses an intelligent steel rail polishing control method which comprises the following steps: acquiring surface and internal defect data of a steel rail through laser and ultrasonic fusion detection, discretizing the data into multi-dimensional nodes, and constructing a dynamic graph model comprising a microscopic-macroscopic dual-cluster neural network to predict a defect evolution trend; based on fractal dimensions and information entropy, multi-source data are dynamically fused, abnormities are eliminated, chaotic optimization and wear prediction are adopted to generate global optimal polishing parameters, and finally parameter dynamic adjustment is achieved through closed-loop feedback of pulse frequency and control errors. Steel rail defect collaborative perception is achieved through a multi-scale dynamic graph model, fractal-entropy weight dynamic fusion is combined to enhance data reliability, global optimal parameters are generated through chaos optimization and abrasion prediction, accurate grinding is achieved through pulse-error closed-loop control, and the method is simple and convenient to implement. The problems of data fusion failure, defect response lag, parameter local optimization and insufficient control precision in the prior art are solved.

The invention provides a shoe sole wear resistance detection device, and belongs to the technical field of wear resistance detection, the shoe sole wear resistance detection device comprises an instrument body and a shoe sole sample formed by punching a shoe sole, and further comprises a simulation detection assembly and a dust removal cleaning assembly; under the guidance of the guide ring, the first support arm can periodically move up and down, the process simulates the dynamic change of the pressure borne by the sole in different gait stages when a person walks, and in combination with the rotation of the sole sample, not only is the vertical pressure change simulated, but also the friction force in different directions can be simulated through relative sliding. The stress state of the shoe sole in the walking process is restored, so that the detection is closer to the actual use scene; the dust removal system is driven by the power of the detection device to operate, so that all-directional coverage of the whole abrasion area is realized, the retention time of dust in the detection area is reduced, dust interference can be avoided, the state of a sole sample before and after detection is only influenced by abrasion of a grinding wheel, and the detection result more truly reflects the abrasion resistance of the sole.

The invention relates to the technical field of grinding machines, and discloses a surface grinding machine which comprises a rotary type grinding mechanism and a linkage type pressure applying mechanism. A hollow rotating column which can rotate along with the second butt-joint plate and is in a hollow state, a fifth butt-joint plate which can axially move along the hollow rotating column and rotate along with the hollow rotating column, and a spiral spring which generates downward elastic pressure on the fifth butt-joint plate are arranged in the second butt-joint plate. According to the surface grinding machine, the basic circular motion type grinding effect of the plane grinding disc on the surface of an object is utilized, and the relative motion of the built-in grinding block around the petal-shaped closed sliding groove is combined, so that the grinding block can generate radial reciprocating motion relative to the rotating axis on the surface of the object, and the grinding efficiency of the object is improved; the two kinds of grinding movement are from the same driving motor, and therefore the effective utilization rate of the driving motor can be effectively increased.

The invention belongs to the technical field of semiconductor device manufacturing and processing, and particularly relates to semiconductor device manufacturing processing equipment which comprises a base and a mechanical arm fixedly arranged at the top of the base, a dust removal mechanism is fixedly arranged at one end of the mechanical arm, and a wafer polishing mechanism is fixedly arranged at the bottom end of the dust removal mechanism. A pneumatic lifting mechanism is fixedly arranged at the top of the base, when a wafer clamped by the wafer clamping mechanism needs to be turned over, the clamping air bag is inflated through the air nozzle, the wafer is clamped through the clamping air bag, then a valve on the air outlet is closed, at the moment, the air pressure in the hollow stand column can be continuously increased, and the wafer can be turned over. The piston assembly in the pneumatic lifting mechanism is pushed by air pressure to be jacked upwards, the ejector rod can be synchronously driven to ascend when the piston assembly is jacked upwards, the wafer clamping mechanism can be jacked up synchronously through the ejector rod, a wafer needing to be polished can be turned over conveniently, and the back face of the wafer can be polished conveniently.

The invention belongs to the field of robot polishing and metal material processing and manufacturing, and discloses a steel plate surface defect detection and self-adaptive polishing system and method, and the system comprises a surface defect detection system, a three-dimensional contour detection system, a roller bed control system, a robot polishing system and a server; the surface defect detection system is used for acquiring types and position information of defects; the three-dimensional contour detection system is used for accurately measuring depth information of the defect; the roller bed control system is used for controlling the movement of the roller bed to transfer the steel plate; the server is used for data interaction and storage among the surface defect detection system, the three-dimensional contour detection system, the roller bed control system and the robot grinding system; and the robot polishing system accurately polishes the surface defects of the steel plate according to the defect position and depth data in the server. The full-process intelligent operation of steel plate surface defect detection, defect three-dimensional contour scanning and robot self-adaptive grinding is achieved, and the automation level and the production efficiency of a production line are effectively improved.

The invention provides a wafer thinning equipment control method and device, electronic equipment and a storage medium, and relates to the technical field of wafer thinning. The method comprises the following steps: monitoring spreading and thinning behaviors of a spin-coating liquid film in real time and generating a residual layer distribution diagram; according to an area indicated by the residual layer distribution map, obtaining local thickness information by analyzing a fluorescence signal received from the area; after a laser beam is used for scanning the surface of the wafer, micro-vibration signals are recognized and extracted by analyzing reflected light signals; dividing the surface of the wafer into a plurality of grid areas; and the risk of generating cracks in each grid area is evaluated, and a wafer surface risk thermodynamic diagram used for controlling the grinding head and the grinding fluid is generated. The method aims at solving a series of problems caused by a microcosmic residual layer on the surface of the wafer or surface energy difference in the wafer thinning process, early and accurate sensing of microcosmic abnormity on the surface of the wafer is achieved, and a control system is guided to conduct regional and self-adaptive grinding parameter adjustment.

The invention discloses a plane finishing system suitable for a large-size workpiece, and belongs to the technical field of ultra-precision plane machining equipment. The problems that in the prior art, deformation and secondary deformation exist in the machining process and the detection process of surface shape finishing machining equipment for large-size and large-weight workpieces, so that the machining efficiency is low, and the machining precision is difficult to guarantee are solved. Comprising a control center, and a first-stage platform, a second-stage platform, a first-stage leveling assembly, a second-stage leveling assembly, a processing device, a clamping assembly, a laser interferometer and two groups of laser reflection assemblies which are in signal connection with the control center, each laser reflection assembly comprises a laser, a laser reflector and a photosensitive position sensor. The method is used for plane finishing of large-size workpieces.

The invention relates to the field of correction machining, in particular to a panel correction device for steel box girder machining, which comprises a machine body and a conveyor arranged at the front end of the machine body, and further comprises at least one supporting plate arranged on the machine body and close to the conveyor; the movable support is composed of two swing arms symmetrically hinged to the bottom of the supporting plate and a connecting frame connected with the two swing arms. Before a steel plate is gripped into the straightening roller, the polishing roller linked with conveying is used for automatically cleaning the upper surface and the lower surface of the panel, hard pollutants such as oxide skin and welding slag are thoroughly removed, the polished pollutants are blocked by the scraping plate, and the polishing efficiency is improved. Therefore, the problem that hard objects are pressed into the surface of the straightening roll to form pits and indentations under huge straightening pressure is fundamentally avoided, abrasion of the straightening roll is remarkably reduced, maintenance cost and time for frequently stopping for grinding or replacing the roll are reduced, meanwhile, the clean plate surface also prevents contaminants from scratching the surface of a subsequent workpiece, and the service life of the workpiece is prolonged. And the surface quality of the steel box girder finished product is improved.

The utility model relates to a universal type vertical numerical control single-face grinding machine which comprises a machine frame, a workbench, a first driving motor and a third driving motor, the third driving motor is connected with a grinding assembly, and a product placing structure is arranged on the workbench and located below the grinding assembly. A second driving motor is arranged on the rack below the workbench; a turntable capable of rotating along with the motor shaft part of the second driving motor is arranged on the motor shaft part; a placement groove is formed in the workbench; the turntable can rotate in the placement groove; a crankshaft part of the second driving motor is connected with the turntable; a feeding device is arranged at the position, above the feeding end of the rotary disc, of the rack; a group of placement through holes matched with products to be processed in shape are formed in the rotary table, and the placement through holes are matched with the groove bottom of the placement groove to form a placement area for placing the products to be processed; a feeding device is arranged at the position, above the feeding end of the rotary disc, of the rack; and the feeding device is matched with the placement through hole. The grinding machine can effectively solve the problems that an existing grinding machine is complex and poor in general applicability.

There is disclosed a grinding apparatus for grinding one surface side of a workpiece in which modified layers are present on the one surface side, including a holding unit for holding the workpiece such that the one surface side is exposed, a grinding unit for grinding the one surface side of the workpiece held by the holding unit, a capturing unit for capturing the one surface side of the workpiece held by the holding unit, and a controller that determines whether grinding of the one surface side of the workpiece is to be terminated, with reference to information regarding the modified layers obtained by capturing of the one surface side of the workpiece that is performed in a state in which grinding of the one surface side of the workpiece is performed in parallel or is suspended.

The invention relates to crankshaft outer circle and end face integrated grinding equipment and a grinding method, and relates to the field of grinding equipment. According to the technical scheme, a single grinding machine is used for replacing three grinding machines in the original process, equipment investment is greatly reduced, labor and energy consumption are saved, the production efficiency is improved due to process concentration, and meanwhile the problems that an existing process is large in occupied area and large in labor consumption are solved; the outer circle and the end face of the crankshaft part can be synchronously ground through one-time clamping, positioning errors caused by multiple times of clamping are avoided, a numerical control system can conveniently monitor and compensate machining errors in real time, and the high-precision requirement is guaranteed. Specifically, a grinding wheel spindle is matched with an axial driving assembly to achieve synchronous grinding of the outer circle and the end face of the crankshaft. Diamond needles are welded to the outer circle and the side face of the grinding wheel dressing diamond roller in a buried mode, and dressing of the outer circles of a fixed grinding wheel and a movable grinding wheel and the end face of the movable grinding wheel can be completed. A metal guide wheel is selected to support a crankshaft spiral groove face, guide wheel abrasion is reduced, and grinding precision and efficiency are further guaranteed.

The invention discloses automatic stone grinding and dust removing equipment integrating negative pressure adsorption and filtration, and relates to the field of stone grinding, the automatic stone grinding and dust removing equipment comprises a cutting machine, a grinding mechanism and a machining supporting platform, the cutting machine is used for cutting stone, a stone outlet is formed in the cutting machine, and the cut stone is discharged from the stone outlet; the machining supporting platform is arranged at the bottom of the stone outlet and used for bearing the stone, and the grinding mechanism is used for grinding the stone on the machining supporting platform. When stone is placed on the machining supporting platform, the machining supporting platform is provided with a part of suction holes not covered by the stone, and when a negative pressure fan is started in the grinding process of the stone, the negative pressure fan can suck dust into the machining supporting platform, so that the dust falling effect is achieved, and the dust falling problem is solved from a cutting source.

The invention relates to a plate surface paint brushing device for furniture processing and a processing method thereof. The plate surface paint brushing device effectively solves the problems that an existing paint brushing device is low in precision, cannot guarantee the paint film flatness, cannot fully and uniformly brush paint, is low in efficiency and affects the furniture quality. According to the technical scheme, the plate surface paint brushing device for furniture processing and the processing method of the plate surface paint brushing device for furniture processing have the advantages that paint with uniform thickness is brushed on the surface of a plate through a double-step type suspension scraper mechanism, the flatness of the paint surface is guaranteed, a self-adaptive curing mechanism can heat and cure the paint, the curing efficiency is improved, an air cooling mechanism can quickly cool the paint surface, and the paint surface can be quickly cooled. Cooling time consumption is reduced; and the floating type grinding mechanism can finely grind the cured paint surface and remove salient points on the paint surface, dust generated during grinding can be fully recycled by the dust collection mechanism, dust attachment on the paint surface is further reduced, so that the paint brushing quality of the plate is improved, the paint brushing efficiency of the plate can be greatly improved, and the device is more convenient to use during furniture processing.

The invention discloses a combined type steel-wood bookshelf production polishing device, and relates to the field of polishing machining, the combined type steel-wood bookshelf production polishing device comprises a front conveying table, a transfer table and a rear conveying table which are arranged in sequence; a feeding conveying belt is arranged on the front conveying table, a bookshelf plate is placed on the feeding conveying belt, a first working groove is formed in the front conveying table, and two side grinding rollers and two surface grinding rollers corresponding to the bookshelf plate are sequentially arranged in the first working groove in the conveying direction of the bookshelf plate. A first feeding roller and a second feeding roller which are located on the two sides of the first working groove are arranged on the front conveying table. According to the combined type polishing equipment for steel-wood bookshelf production, through cooperation of the front conveying table, the transfer table, the rear conveying table and related structures arranged on the front conveying table, the transfer table and the rear conveying table, full polishing treatment can be conducted on all the surfaces of bookshelf plates in the bookshelf plate polishing process, and therefore the polishing efficiency of the bookshelf plates is effectively improved.

The invention relates to the technical field of semiconductor manufacturing, and provides wafer thinning equipment and a wafer thinning process. The wafer thinning equipment comprises a plurality of grinding discs, a functional assembly and a slicking assembly; two functional assemblies are correspondingly arranged on the grinding face of each grinding disc, and two grinding areas are formed between the two functional assemblies. The functional assembly is used for cleaning the grinding area and spraying grinding fluid; the slicking assembly penetrates through the grinding areas of the multiple grinding discs and is used for dispersing grinding fluid. The functional assembly is arranged corresponding to the grinding disc, the grinding fluid in the grinding area of the grinding disc can be cleaned, and the grinding fluid is sprayed again, so that wafer grinding particles can be cleaned, and the purity of the grinding fluid is ensured; and meanwhile, by arranging the slicking assembly, the grinding fluid can be uniformly dispersed before the grinding fluid is in contact with the wafer, so that local aggregation of the grinding fluid is avoided, the stress concentration problem is prevented, the wafer cannot be scratched, and the grinding precision is guaranteed.

The invention relates to the technical field of welding platforms, in particular to a steel pipe beam welding operation platform which comprises a base fixedly connected with a controller and further comprises two deformation positioning structures symmetrically arranged on the base, and each deformation positioning structure comprises a guide pushing mechanism connected with the base. The guide pushing mechanism is connected with a displacement clamping assembly; and the positioning calibration structure is connected with the base and comprises a first active telescopic frame, the moving end of the first active telescopic frame is fixedly connected with a suspension frame, the suspension frame is connected with a double-face grinding part, and the suspension frame is connected with an end face touch sweeping mechanism. Through mutual cooperation of the deformation positioning structure and the positioning calibration structure, the steel pipe beams in different shapes are positioned and clamped, then end face positioning and position measuring are conducted on the steel pipe beams, end face correction is conducted on the steel pipe beams, and therefore the steel pipe beams can be accurately and mutually positioned and in butt joint, the quality of subsequent welding machining is improved, and the production efficiency is improved. And manpower is saved.

The invention provides a manufacturing method of a compressor slip sheet, the compressor slip sheet is provided with a sliding surface in sliding connection with a compressor cylinder body and a hinge part for hinging a compressor piston, and the compressor slip sheet is used for realizing eccentric rotation of the compressor piston and a crankshaft and realizing air compression, and the manufacturing method comprises the following steps: preparing a slip sheet body; the thickness of the slip sheet body is 2.8 mm to 4.5 mm, and the slip sheet body is provided with a first plane used for machining a sliding surface and second planes located at the two axial ends of the hinge part; the first plane is ground; feeding from the first plane of the slip sheet body, carrying out at least one time of linear cutting according to the target track of the hinged part to obtain the hinged part, and enabling the diameter range of the hinged part to be 1.5 mm to 3.5 mm; the second plane is subjected to accurate grinding treatment; and inspecting the surface of the slip sheet body, processing edges, and cleaning to obtain the compressor slip sheet. The problems that the size precision of the hinged end of the sliding vane does not meet the requirement, high-speed and smooth rotation is difficult, and noise is easily generated due to vibration are solved.

The invention discloses a steel fireproof door plate polishing device, which belongs to the technical field of fireproof door plate processing, and comprises a rack, rotating rollers uniformly and rotatably mounted along the length direction of the rack, and a housing mounted at one end of the top of the rack, conveying mechanisms are arranged at two ends in the housing, and second hydraulic cylinders are symmetrically and vertically mounted on two sides of the top in the housing. A reciprocating mechanism composed of a first shaft sleeve, a first spline shaft, a reciprocating lead screw, a second sliding block, a connecting rod and a first belt wheel assembly is arranged at the end of the grinding roller, in the process that the grinding motor is used for controlling the grinding roller to rotate, the grinding roller can be controlled to reciprocate in the axial direction, and axial movement and rotation are combined; a crossed net-shaped grinding track is formed, covering is more comprehensive, surface textures are more uniform, subsequent polishing procedures are reduced, spraying or assembling requirements are directly met, in addition, the grinding roller axially moves to enable dust to be distributed more dispersedly, the dust concentration of a working area is greatly reduced in cooperation with a negative pressure dust suction mechanism, and potential safety hazards are reduced.

Systems and methods for grinding semiconductor workpieces are provided. In one example, a method includes providing a surface of the semiconductor workpiece against a grinding apparatus. The grinding apparatus includes an abrasive surface. The method further includes imparting relative motion between the abrasive surface and the semiconductor workpiece to implement a grinding operation on the semiconductor workpiece. The method further includes providing a fluid to the surface of the semiconductor workpiece or the abrasive surface during the grinding operation. The fluid includes an additive. The additive includes one or more of an oxidizing agent, an etchant, a surfactant, or a lubricant.

The invention provides a piezoelectric quartz wafer grinding control method and system based on grinding frequency monitoring, and relates to the technical field of grinding control, the method comprises the following steps: executing multi-source data perception of piezoelectric quartz wafer grinding, and establishing an original behavior observation data stream; behavior modeling of each round of grinding is carried out; the time sequence grinding behavior data set is used for conducting grinding working condition sensing; activating a non-contact thickness sensing unit to execute real-time piezoelectric quartz wafer thickness sensing; with the target grinding requirement as a control target, grinding control reconstruction based on the real-time sensing result and the thickness sensing result is executed, and a reconstruction result is established; and carrying out grinding control management on the piezoelectric quartz wafer. The technical problem that in the prior art, due to the fact that grinding control depends on fixed parameters and lacks real-time sensing and feedback, the quality of the piezoelectric quartz wafer is unstable is solved, the grinding process is optimized and adjusted through the multiple sensing sources, and the machining precision and quality of piezoelectric quartz wafer grinding are improved.

Grinding systems and methods for semiconductor workpieces are provided. In one example, a grinding system includes a workpiece support operable to support a semiconductor workpiece and rotate the semiconductor workpiece about a first axis. The grinding system further includes a grind wheel operable to rotate about a second axis. The grind wheel has a plurality of grinding teeth arranged in a grinding ring on the grind wheel. A radius of the grinding ring is less than or equal to a radius of the semiconductor workpiece (e.g., such that an effective gap ratio between grinding teeth on the grind wheel are reduced).

The invention relates to the technical field of semiconductors, in particular to a device and a method for automatically adjusting the depth of a groove of a 12-inch wafer polishing pan head, and aims to solve the problem that in the prior art, due to fluctuation of the initial thickness of a to-be-processed wafer, the thickness of the to-be-processed wafer is influenced. The polishing process adaptability is poor; the production efficiency is low; and the consistency of the polishing quality is difficult to control. The device comprises an online thickness measuring module, an adjustable groove polishing head module and a system control unit. The polishing head module is internally provided with a flexible hinge coupling type annular segmented array, a micro-drive actuator, a displacement sensing feedback network and a magnetorheological fluid damping locking system. According to the method, the initial thickness of a wafer is measured in a high-precision mode, the depth of a groove is calculated and adjusted in a feedforward mode, accurate execution and locking are achieved, and collaborative polishing and process dynamic compensation are carried out. According to the invention, accurate, rapid and spatially distinguished automatic adjustment of the groove depth of each wafer can be realized, and the automation level, the processing efficiency and the product quality of the polishing process are remarkably improved.

The invention relates to the technical field of semiconductor material precision machining, and discloses a 12-inch silicon wafer double-sided polishing upper and lower surface removal amount monitoring system and method, and the system comprises a macroscopic thickness monitoring unit, a microcosmic contact state decoupling sensing unit and a data processing controller. The method comprises the following steps: synchronously acquiring a total thickness signal of a silicon wafer, an acoustic emission signal of an upper / lower fixed disc side and a fluid dynamic pressure signal; the method comprises the following steps: constructing a lubrication state correction coefficient by utilizing fluid dynamic pressure, and carrying out nonlinear correction on a mechanical friction energy index extracted by acoustic emission to obtain an effective vector removal index representing real cutting capacity; and the removal distribution ratio of the upper surface and the lower surface is calculated, and the independent absolute removal amount of the upper surface and the lower surface is obtained through decoupling in combination with the total thickness variation. According to the method, by eliminating the interference of a fluid'water cushion effect 'on a friction signal, visualization and closed-loop feedback control of a single-face removal behavior in the double-face polishing process are achieved, and the problem of silicon wafer warping caused by removal asymmetry is effectively solved.

The invention is applicable to the technical field of semiconductor production equipment, and provides polishing equipment for semiconductor glass substrate processing, which comprises a polishing assembly, and the polishing assembly is rotatably matched with a positioning assembly; the polishing assembly comprises a polishing piece and a supporting piece arranged on the polishing piece in a sliding fit mode, and the positioning assembly comprises a clamping piece arranged on the polishing piece in a rotating fit mode, a rotating piece arranged on the clamping piece in a rotating fit mode and a cam piece located on the rotating piece in an inserted connection mode. The equipment solves the problems that when an existing semiconductor glass substrate is subjected to polishing operation on the upper surface and the lower surface, generally when polishing operation on one end face is completed, the clamping and positioning process of the clamped and positioned semiconductor glass substrate needs to be relieved, then the semiconductor glass substrate is turned over, and finally the semiconductor glass substrate is subjected to clamping and positioning operation after being turned over; the whole polishing process is too tedious, and the polishing efficiency of the upper surface and the lower surface of the same semiconductor glass substrate is reduced.

The flange plate machining equipment comprises a machine box, a workbench is fixedly connected to the top end of the machine box, and a grinding mechanism is arranged under the top end of the workbench; the grinding table is rotationally arranged in the middle of the workbench, and a bidirectional clamping mechanism is arranged on the grinding table; the air pump is fixedly mounted on the inner bottom wall of the case, and a rotary air supply mechanism is arranged between the air pump and the bidirectional clamping mechanism; and the gear ring is fixedly connected to the outer side of the bottom end of the grinding table, and a rotating mechanism matched with the gear ring is arranged below the left side of the workbench. Through cooperative use of the negative pressure pump, the filter box and the airflow circulation system in the case, integrated treatment of metal dust collection and equipment heat dissipation is achieved, and the technical effects of simplifying the equipment structure and improving the heat dissipation efficiency are achieved.

The invention discloses a turning device for flange plate machining, and belongs to the technical field of flange plate machining. The turning device for flange plate machining comprises a machining table, a sliding rail is installed at the top of the machining table, lifting equipment is installed on a sliding table of the sliding rail, the turning device further comprises an installation frame and a telescopic end fixedly connected to the lifting equipment, a cutter is installed on the installation frame, driving equipment is fixedly installed on the machining table, and the driving equipment is fixedly connected to the telescopic end of the lifting equipment. A turntable is mounted at the output end of the driving equipment; the two supports are symmetrically arranged and both arranged on the rotating disc, first telescopic devices are fixedly installed on the two supports, arc-shaped plates are fixedly installed at the telescopic ends of the two sets of first telescopic devices, and the rotating disc is provided with an overturning part for driving the two supports to rotate; according to the turning device, turning work of a flange plate blank can be rapidly completed, so that turning machining of the flange plate is facilitated, and the flatness of the surface of the flange plate can be improved.

The invention discloses a wall polishing device for placement house building construction, and belongs to the field of wall polishing devices.The wall polishing device comprises a base used for supporting the whole equipment, a lifting module, a polishing module and a dust removal module, and a moving assembly used for moving the equipment is arranged at the bottom of the base; the top of the base is connected with the grinding module through the lifting module, the grinding module comprises a sand disc used for grinding a wall, the lifting module is used for adjusting the height of the sand disc, and the dust removal mechanism is used for removing dust generated by grinding the wall. The wall polishing device has the effect of achieving efficient, accurate and low-dust wall polishing operation.

The invention provides a special-shaped steel formwork bending area polishing treatment device and method, and belongs to the technical field of polishing treatment, and the device comprises an assembling unit, a bearing plate, a bending polishing unit and a main body polishing unit. The assembling unit comprises an assembling plate and a connecting base, and the connecting base is arranged on the assembling plate in a sliding mode. The bearing plate is arranged on the connecting base in a liftable mode, and a posture adjusting rotating shaft is arranged on the side, away from the connecting base, of the bearing plate. The bending and polishing unit comprises a bending bearing seat and a detection plate. The main body grinding unit comprises a main body bearing seat and a grinding driving assembly. According to the grinding treatment device and method for the bending area of the special-shaped steel formwork, the grinding efficiency and grinding quality of the bending area of the special-shaped steel formwork can be improved.

In a grinding method for grinding a substantially planar workpiece surface of a workpiece, a grinding machine is used which has a grinding wheel with an abrasive side surface, wherein the grinding wheel can be rotated about a rotational axis by means of a rotational drive and can be fed by means of a feed drive in a feed direction oriented parallel to the rotational axis.To carry out a grinding operation, the workpiece is arranged in a working position, the grinding wheel is set in rotation about the axis of rotation, the abrasive side surface is brought into contact with the workpiece surface by feeding the grinding wheel; and the grinding wheel is fed from a starting position with workpiece contact to generate material removal according to a feed function. The feed of the grinding wheel takes place according to a workpiece-specific feed function depending on a material proportion curve, whereby the material proportion curve represents a distribution of workpiece material in a surface profile depending on a cutting depth measured parallel to the feed direction.

The invention belongs to the technical field of semiconductor wafer processing, and particularly relates to a grinding device for semiconductor production and processing, which comprises a workbench, a protective cover, a moving assembly and a liquid spraying assembly, and the moving assembly drives a grinding adjusting assembly to move; the polishing adjusting assembly comprises a box cover and a polishing box, an adjusting motor is installed on the box cover and connected with a transmission shaft and a reciprocating lead screw, and the transmission shaft drives the polishing box to rotate intermittently through the liquid spraying assembly. The polishing blocks are driven by the polishing adjusting assembly to press and fit the wafer disc, the polishing box is driven by the adjusting driving assembly to rotate intermittently, then the next group of polishing blocks is switched to be matched with the inserting block to move downwards again to press the pressing plate, and the effect that each group of polishing blocks fit the wafer disc is achieved. The polishing blocks are adjusted one by one through the polishing adjusting assembly, so that all the sets of polishing blocks can be attached to the uneven surface of the wafer disc, the polishing efficiency of the polishing blocks is improved, it is ensured that the thickness of the wafer disc is uniform, and uneven stress distribution of the wafer disc is avoided.