2666results about "Plane surface grinding machines" patented technology

The invention relates to the technical field of semiconductor manufacturing, and provides wafer thinning equipment and a wafer thinning process. The wafer thinning equipment comprises a plurality of grinding discs, a functional assembly and a slicking assembly; two functional assemblies are correspondingly arranged on the grinding face of each grinding disc, and two grinding areas are formed between the two functional assemblies. The functional assembly is used for cleaning the grinding area and spraying grinding fluid; the slicking assembly penetrates through the grinding areas of the multiple grinding discs and is used for dispersing grinding fluid. The functional assembly is arranged corresponding to the grinding disc, the grinding fluid in the grinding area of the grinding disc can be cleaned, and the grinding fluid is sprayed again, so that wafer grinding particles can be cleaned, and the purity of the grinding fluid is ensured; and meanwhile, by arranging the slicking assembly, the grinding fluid can be uniformly dispersed before the grinding fluid is in contact with the wafer, so that local aggregation of the grinding fluid is avoided, the stress concentration problem is prevented, the wafer cannot be scratched, and the grinding precision is guaranteed.

The invention provides a manufacturing method of a compressor slip sheet, the compressor slip sheet is provided with a sliding surface in sliding connection with a compressor cylinder body and a hinge part for hinging a compressor piston, and the compressor slip sheet is used for realizing eccentric rotation of the compressor piston and a crankshaft and realizing air compression, and the manufacturing method comprises the following steps: preparing a slip sheet body; the thickness of the slip sheet body is 2.8 mm to 4.5 mm, and the slip sheet body is provided with a first plane used for machining a sliding surface and second planes located at the two axial ends of the hinge part; the first plane is ground; feeding from the first plane of the slip sheet body, carrying out at least one time of linear cutting according to the target track of the hinged part to obtain the hinged part, and enabling the diameter range of the hinged part to be 1.5 mm to 3.5 mm; the second plane is subjected to accurate grinding treatment; and inspecting the surface of the slip sheet body, processing edges, and cleaning to obtain the compressor slip sheet. The problems that the size precision of the hinged end of the sliding vane does not meet the requirement, high-speed and smooth rotation is difficult, and noise is easily generated due to vibration are solved.

The invention relates to the technical field of semiconductor material precision machining, and discloses a 12-inch silicon wafer double-sided polishing upper and lower surface removal amount monitoring system and method, and the system comprises a macroscopic thickness monitoring unit, a microcosmic contact state decoupling sensing unit and a data processing controller. The method comprises the following steps: synchronously acquiring a total thickness signal of a silicon wafer, an acoustic emission signal of an upper / lower fixed disc side and a fluid dynamic pressure signal; the method comprises the following steps: constructing a lubrication state correction coefficient by utilizing fluid dynamic pressure, and carrying out nonlinear correction on a mechanical friction energy index extracted by acoustic emission to obtain an effective vector removal index representing real cutting capacity; and the removal distribution ratio of the upper surface and the lower surface is calculated, and the independent absolute removal amount of the upper surface and the lower surface is obtained through decoupling in combination with the total thickness variation. According to the method, by eliminating the interference of a fluid'water cushion effect 'on a friction signal, visualization and closed-loop feedback control of a single-face removal behavior in the double-face polishing process are achieved, and the problem of silicon wafer warping caused by removal asymmetry is effectively solved.

The invention discloses a steel structure butt welding adjusting device which comprises a supporting plate and supporting rods fixed to the four corners of the bottom of the supporting plate. A grinding part is arranged in the butt joint mechanism, in the butt joint process of the two steel structure bodies, the grinding part can make contact with the steel structure bodies along with continuous movement of a driving part, the grinding part comprises a coarse grinding plate, a fine grinding plate and a polishing plate, in the grinding process, a sliding plate slides on the top of a supporting plate along with a mounting plate driven by the driving part to move, and the grinding plate is in contact with the grinding part. The rough grinding plate firstly makes contact with the rotating steel structure main body and conducts comprehensive rough grinding on the end face of the steel structure main body through rotation of the steel structure main body, and due to the fact that a second gear at the bottom of a lead screw is meshed with a second rack at the bottom of a mounting shell, the lead screw can rotate, and therefore when a grinding piece moves to a certain degree, the grinding piece can rotate. And the rough grinding plate, the fine grinding plate and the polishing plate can sequentially treat the steel structure body and then move downwards into the second mounting frame.

Dust particles generated on a back surface of a substrate as a result of polishing by a polishing tool are also forced out toward an outer periphery of the polishing tool by centrifugal force. Then, nitrogen gas is ejected from an ejection port. This forces the dust particles adhering to the back surface of the substrate to separate from the back surface of the substrate. The dust particles are sucked through a suction port. This makes the dust particles less likely to remain on the back surface of the substrate, so that it is possible to increase the rate of removal of the dust particles generated as a result of polishing.

The rubber sealing element grinding device comprises a sealing element mounting mechanism, an external grinding mechanism, a feeding mechanism, an end grinding mechanism and a material guiding mechanism, the external grinding mechanism is arranged at one end of the sealing element mounting mechanism, the feeding mechanism is arranged at one end of the external grinding mechanism, and the end grinding mechanism is arranged at the other end of the external grinding mechanism. A material guiding mechanism is arranged at one end of the feeding mechanism, and an end grinding mechanism is arranged at one end of the material guiding mechanism. According to the sealing element polishing device, the sealing element mounting mechanism is used for sleeving a rod-shaped structure (an external structure is matched with a sealing element) with a sealing sleeve, then the external polishing of the sealing element is realized through the external polishing mechanism, and the sealing element is conveyed to the end polishing mechanism through the feeding mechanism and the material guiding mechanism; and the end part of the sealing element is polished through the end part polishing mechanism.

According to the brake disc grinding method and device, a flat vertical type upper and lower double-grinding-wheel structure is adopted, a brake disc is arranged between the two grinding wheels to achieve synchronous grinding of the upper surface and the lower surface, and positioning is completed through the fact that a circumferential protruding block of a structural part is matched with a groove in the inner side of the brake disc. According to the method, the three-stage grinding process of rough grinding, stress releasing and accurate grinding is set, tight clamping and clearance fit switching of a structural part and the brake disc are achieved by driving protruding points to stretch out and draw back, and the rotating direction and the rotating speed of the brake disc and a grinding wheel are cooperatively regulated and controlled. The brake disc and the grinding wheel reversely rotate in the coarse grinding and fine grinding stages; and in the stress release stage, the two rotate in the same direction at different speeds to synchronously finish semi-fine grinding operation. According to the method, stress release and semi-fine grinding are integrated, grinding stress is effectively released, the rotating coaxiality and grinding stability of the brake disc are guaranteed, the machining efficiency is improved, meanwhile, the disc shape precision and surface smoothness of the brake disc are remarkably improved, and the machining requirements of the brake disc made of high-performance brittle materials such as silicon carbide ceramics are met.

A concrete surface processing machine (100) for processing a concrete surface, wherein the concrete surface processing machine is arranged to be supported on the concrete surface by one or more support elements (150) extending in a base plane (101) of the machine parallel to the concrete surface, wherein the concrete surface processing machine is arranged to rotate (R) about an axis (C) normal to the base plane (101) by the one or more support elements (150), wherein the concrete surface processing machine comprises control unit (110) connected to at least one laser range finder (120) arranged pointing in a fixed direction from the concrete surface processing machine, and wherein the control unit (110) is arranged to determine a boundary geometry of the concrete surface based on a sequence of ranges obtained by the laser range finder (120).

The utility model relates to the technical field of polishing devices, in particular to a rare earth permanent magnet material high-precision polishing device which comprises a machining base, an installation vertical plate is fixedly installed on the machining base, a workpiece to be polished is placed on the machining base, and a grinding and polishing mechanism for rapidly grinding the workpiece to be polished is arranged on the installation vertical plate. And a grinding auxiliary mechanism for limiting and clamping a workpiece to be polished is arranged on the machining base, the grinding and polishing mechanism comprises a rotary round seat movably mounted on the mounting vertical plate, driving assemblies are symmetrically mounted on the rotary round seat, and a first grinding head and a second grinding head are arranged on the two driving assemblies correspondingly. By arranging the grinding and polishing mechanism, the grinding head can be automatically and rapidly replaced in the grinding and polishing process through mutual cooperation between the rotary round seat and the driving motor, the rare earth permanent magnet material can be roughly ground and finely ground, the integration degree is high, and workers do not need to manually replace the grinding head.

The utility model relates to a superhard material guide rail machining device which comprises a lathe bed. The working table is arranged above the machine body; the two ends of the cross beam are arranged on the workbench through stand columns; the X-axis linear motor module is arranged on the cross beam; the Z-axis linear module is arranged on the X-axis linear motor module; the spindle box is arranged on the Z-axis linear module, an electric spindle is arranged in the spindle box, and a grinding tool or a polishing tool is installed on the electric spindle; the Y-axis linear motor module is arranged on the workbench; and the workpiece carrying plate is arranged above the Y-axis linear motor module. Through multi-axis linkage of the X-axis linear motor module, the Y-axis linear motor module and the Z-axis linear motor module, the long guide rail is pressurized and polished through a small tool, the grinding amount is controlled through the dwell time and the polishing pressure, and high-precision machining of the long guide rail is achieved.

An example method includes obtaining data indicative of a workpiece processing parameter. In some implementations, the example method includes determining a grinding depth for a semiconductor workpiece based at least in part on the data indicative of the workpiece processing parameter. In some implementations, the example method includes performing a grinding operation to remove material from the semiconductor workpiece to reduce a thickness of the semiconductor workpiece by the grinding depth.

A rail grinding machine (1) comprises a machine frame (6), rail guide units arranged on the machine frame (6), a grinding unit (9) with a drive motor (44) and a tool holder (47) for rotating a grinding tool (49) about a rotary axis (48), a height adjustment device (10) for adjusting the height of the grinding unit (9), and a handle (11) for manually repositioning the grinding unit (9). A guide (24) of the height adjustment device (10) defines a guide plane (E). The rotary axis (48) is spaced apart from the guide plane (E), particularly in the area of ​​the tool holder (47). This gives the rail grinding machine (1) a simple design and a high level of user-friendliness. In particular, the rail grinding machine (1) allows an unobstructed view of the grinding point.

A surface abrading system is presented that includes a robot arm with an end effector on an end of the robot arm. The end effector is configured to couple to an abrasive article. The system also includes a movement mechanism that moves the robot arm with respect to a surface. The system also includes a robot controller that causes the robot arm to execute an abrasive trajectory on the surface. The abrasive trajectory includes the abrasive article in contact with the surface. The robot controller includes a trajectory retriever that retrieves an abrasive trajectory. The abrasive trajectory includes a surface appearance portion prior to an endpoint. The surface appearance portion comprises a reduction in relative movement speed between the robot arm and the abrasive article or a reduction in effective applied force on the abrasive article. The controller also includes a command generator that communicates the abrasive trajectory to the movement mechanism to execute the trajectory.

A quick changing device of a spring grinding machine comprises a tool body, a spring containing cavity is formed in the tool body, a plurality of clamping grooves are distributed in the surface of the tool body with the center of the spring containing cavity as the circle center, the clamping grooves are communicated with the spring containing cavity, and a plurality of spring outer diameter adjusting clamping blocks of L-shaped structures are placed in the spring containing cavity. The horizontal section of the spring outer diameter adjusting clamping block is clamped into the clamping groove, the vertical section of the spring outer diameter adjusting clamping block extends into the spring containing cavity, a guide sliding pin is vertically connected to the spring outer diameter adjusting clamping block, the upper end of the tool body is covered with a rotary locking top cover, and an opening right facing the spring containing cavity is formed in the rotary locking top cover. A plurality of inclined sliding grooves are distributed in the inner top face of the rotary locking top cover with the center of the rotary locking top cover as the circle center, the upper end of each guide sliding pin is clamped into one inclined sliding groove, and a top cover locking mechanism and a top cover limiting mechanism are further arranged between the tool body and the rotary locking top cover. The method has the advantages of being high in perpendicularity qualification rate, short in model changing time and high in machining efficiency.

A grinding carrier assembly, a grinding apparatus, and a grinding method. The grinding carrier assembly (200) comprises a first carrier (210) and second carriers (220), wherein the first carrier (210) is provided with a first accommodating groove (211); and a plurality of second carriers (220) are detachably arranged in the first accommodating groove (211), and are arranged at equal intervals around the axis of the first accommodating groove (211), each of the second carriers (220) is provided with a second accommodating groove (221), and the second accommodating grooves (221) accommodate target objects. The grinding carrier assembly (200) is applied to the grinding apparatus. The grinding apparatus comprises a base, wherein the base is provided with a grinding region (101). A plurality of grinding carrier assemblies (200) are arranged at equal intervals around the axis of the grinding region (101), and the grinding carrier assemblies (200) can revolve around the axis of the grinding region (101). The number of the second carriers of the grinding carrier assembly is adjusted on the basis of the number of target objects to be ground, thereby improving the adaptability of the grinding apparatus, and reducing the adverse effect of disc deviation on the grinding quality.

The invention relates to the technical field of laser detection, in particular to a large stone size laser detection device which comprises supporting frames, and a clamping and lifting mechanism, a grinding mechanism, a detection protection mechanism and an air blowing cleaning mechanism are arranged between the supporting frames. The clamping and lifting mechanism comprises two connecting plates, U-shaped rods are fixedly connected to the top ends of the two connecting plates, clamping blocks are fixedly connected to the ends, close to each other, of the two U-shaped rods, clamping grooves in the clamping blocks are vertical and inclined, and the clamping blocks are used for making contact with the vertical face and the inclined face of the trapezoidal stone. The bottoms of the ends, close to each other, of the two connecting plates are fixedly connected with shoveling plates, and the two shoveling plates are used for lifting the bottom end of the trapezoidal stone. According to the device, the trapezoidal stone can be lifted, and the shoveling plate is horizontally arranged, so that when the height of the trapezoidal stone is measured, the depth of a pit is not increased, and the measurement accuracy is ensured.

The numerical control surface grinding, chamfering and rounding all-in-one machine comprises a machining all-in-one machine, a machining bin is formed in the upper left corner of the front end of the machining all-in-one machine, a bin door is connected to the upper side of the front end of the machining all-in-one machine in a sliding mode, and the bin door can slide to the front end of the machining bin for shielding. Storage mechanisms are arranged on the left side and the right side of the inner wall of the lower end of the machining bin correspondingly, a plurality of chamfering and rounding grooves with different inner diameters are formed in the cylindrical outer wall of a chamfering and grinding wheel, and the edge of a silicon wafer can be chamfered and rounded at different angles; chamfering rounding grooves with different inner diameters can be adjusted to be clamped at the two ends of a silicon wafer to meet different machining requirements, stretching and retracting between a clamping telescopic rod and a telescopic sliding sleeve are controlled through a hydraulic control mechanism, the clamping position and tightness can be controlled according to the radius of the silicon wafer, the chamfering rounding device is suitable for machining of the silicon wafers with different radiuses, the machining range is widened, and the machining quality is improved.

The invention provides a contact type measurer and wafer thinning equipment. The contact-type measurer includes: a first mounting seat configured with a mounting hole; the first measuring rod is mounted in the mounting hole and horizontally extends to the position above the bearing table, a first measuring head is arranged at the tail end of the first measuring rod, and the first measuring rod can ascend and descend in the mounting hole so that the first measuring head can make contact with the wafer and ascend and descend along with the change of the thickness of the wafer; the protective air pipe is provided with a vent groove which extends along the length of the protective air pipe and is provided with a downward opening, the protective liquid pipe is provided with a liquid groove which extends along the length of the protective liquid pipe and is provided with a downward opening, and the vent groove discharges air downwards to form an air curtain so as to prevent machining chippings from entering the mounting hole; the liquid flowing groove discharges liquid downwards to form a liquid curtain so as to prevent machining chippings penetrating through the air curtain from entering the mounting hole. According to the technical scheme, accumulation of chippings at the mounting hole can be effectively reduced, interference to movement of the measuring rod is avoided, and therefore the measuring accuracy is improved.

The invention provides a workpiece machining double-end-face grinding machining device and method, and relates to the technical field of workpiece machining, the workpiece machining double-end-face grinding machining device comprises a lower grinding set, a feeding assembly and a multi-element clamp, the lower grinding set is located in the center of a base, and a first conveying belt and a second conveying belt are sequentially and circularly arranged on the portion, on the outer side of the lower grinding set, of the base; a plurality of sets of mechanical arms are arranged at the edge of the top of the base at equal included angles, the multi-element clamp is rotationally arranged on the mechanical arms, and side seats are arranged at the front end and the rear end of the base; workpieces are conveyed to the first conveying belt through the feeding assembly and distributed, the workpieces are clamped through the cooperation of the multiple sets of multi-element clamps and position adjustment of the mechanical arm, and due to the fact that the workpieces can be clamped through the upper faces and the lower faces of the multi-element clamps, the workpieces on the first conveying belt are conveyed into the lower grinding set, and meanwhile the workpieces are clamped through the multiple sets of multi-element clamps. And the machined workpieces can be overturned, synchronously clamped and taken out to the second conveying belt and are matched with the discharging conveying belt for discharging, so that multi-group automatic feeding and discharging are carried out through the layout, and the machining efficiency is improved.

The invention relates to a sapphire wafer back surface roughening method, which is based on a planetary double-sided grinding machine platform, and comprises the following steps: firstly, bonding the front surface of a low-TTV sapphire wafer subjected to double-sided accurate grinding and polishing to the surface of a ceramic plate, then fixing the ceramic plate on a wandering star wheel, then placing the wandering star wheel on a lower grinding plate, and grinding the sapphire wafer back surface with the lower grinding plate; wherein the back surface of the wafer faces the lower grinding disc; the upper grinding disc is forbidden, a sun gear and inner gear transmission mechanism is utilized, the wandering star wheel rotates on the lower grinding disc to form a precise grinding interface, and roughening of the back face of the sapphire wafer is achieved by regulating and controlling the rotating speed of the sun gear, the inner gear and the wandering star wheel. According to the method, on one hand, wafer thickness uniformity and parallelism control is achieved through the double-face polishing technology, on the other hand, low TTV control over the obtained single polished wafer is achieved in the roughening process through combination of equipment design and technology innovation, and the method is suitable for the 8-12-inch sapphire wafer and can be applied to the fields needing high-precision thickness control such as LED or semiconductor manufacturing.

To provide a conditioning method of a polishing tool which enables reduction of time for conditioning of the polishing tool, and to provide a substrate processing method and a substrate processing device.SOLUTION: A conditioning method of a polishing tool 89 includes: a substrate rotation step in which a silicon dummy substrate DW having a major surface in a non-mirror state is held in a horizontal attitude and rotated around a vertical axis AX5; and a conditioning performing step in which the polishing tool 89 having a resin body in which abrasive grains are dispersed is placed in contact with the major surface of the rotating dummy substrate DW to perform conditioning of the polishing tool 89.SELECTED DRAWING: Figure 6

The utility model discloses an end face grinding and polishing device of a rhinestone, and belongs to the technical field of rhinestone production. Comprising an end face grinding and polishing machine, an edge trimmer, a middle rotating disc and a disc edge stacking support. A feeding port is formed in the front side of the end face grinding and polishing machine, a feeding storage rack is arranged in front of the end face grinding and polishing machine and located on the right side of the feeding port, and a discharging storage rack is arranged in front of the end face grinding and polishing machine and located on the left side of the feeding port. The edge trimmer comprises a support, a positioning plate, a driving structure, a pressing plate and a cutter. The middle rotating disc is a disc and located on the adjacent right side of the front portion of the discharging storage rack and located in the adjacent front portion of the end face grinding and polishing machine, and the edge trimmer is arranged on the rear portion of the discharging storage rack. M pieces of blister trays after grinding and polishing and before trimming are stacked on the middle rotating disc, and N pieces of blister trays after trimming are stacked on the front portion of the discharging storage rack; the disc edge stacking support is fixed to the ground, located beside the discharging storage rack and located on the front left portion of the edge trimmer. The disc edges are arranged on the disc edge stacking support in a sleeving mode and stacked up and down, and the cutter is located over the left end of the outer edge of the positioning plate.

The invention belongs to the technical field of building material processing, and discloses building material cutting equipment which comprises a first limiting frame, a limiting frame is arranged on one side of the first limiting frame, the first limiting frame and the limiting frame are both L-shaped alloy frames, and a cutting and grinding integrated assembly is arranged in the first limiting frame; and the cutting and grinding integrated assembly comprises a rotating main frame rotationally arranged with the first limiting frame, and a grinding roller is rotationally arranged on one side of the rotating main frame. The building board cutting machine is changed into a vertical or transverse cutting machine, and is matched with an integrated grinding roller structure design, so that the grinding requirement for cut building boards can be met, the building board cutting machine is more convenient to use, the cutting requirements of various building boards with different sizes are met, and the construction progress of building materials is accelerated.

The utility model provides a material pressing and grinding mechanism of a reciprocating type double-sided grinding machine, which comprises a bottom plate capable of sliding along the front-back direction of the grinding machine, a support frame is connected onto the bottom plate, a material bearing table for supporting a workpiece is arranged on the support frame, and a positioning baffle is arranged at one end of the material bearing table. A first material pressing assembly capable of moving in the horizontal direction is arranged on the side, opposite to the positioning baffle, of the supporting frame, and a second material pressing assembly capable of ascending and descending in the vertical direction is further arranged on the portion, located above the material bearing table, of the supporting frame. And the driving assembly is used for driving the bottom plate to move back and forth so as to drive the workpiece to be fed into and moved out of the grinding channel. According to the material pressing and grinding mechanism of the reciprocating type double-sided grinding machine, a plurality of workpieces can be pressed, limited and ground at the same time, the working efficiency is effectively improved, the positioning stability of the workpieces is high, and the perpendicularity of grinding surfaces is guaranteed.

The utility model discloses a circuit board polishing device which comprises a rack, and the rack is sequentially provided with a feeding mechanism, a polishing mechanism and a cleaning mechanism. The feeding mechanism comprises a plurality of conveying rollers, and the conveying rollers are rotationally connected to the rack; the grinding mechanism comprises a grinding roller and a positioning assembly, the grinding roller is rotationally connected to the rack and used for grinding the circuit board, the positioning assembly comprises a driving part and two positioning plates, and the driving part is used for driving the two positioning plates to get close to each other; the cleaning mechanism comprises a cleaning box and a dust suction box, the cleaning box is provided with a water spraying pipe and an air knife, the water spraying pipe is used for spraying water to the circuit board, the air knife is used for blowing air to the circuit board, the dust suction box is provided with an air pump and an air collecting pipe, the two ends of the air collecting pipe are communicated with the dust suction box and the air pump respectively, and the air pump is used for sucking air to the dust suction box. According to the circuit board polishing device, the position deviation of the circuit board can be reduced, dust can be prevented from adhering to the circuit board, and the polishing quality of the circuit board is improved.

The invention relates to the technical field of integrated circuit manufacturing, and provides wafer thinning equipment and a wafer thinning method. The wafer thinning equipment comprises a grinding device and an adsorption platform, the adsorption platform is used for bearing a wafer and driving the wafer to rotate, the grinding device is arranged above the adsorption platform in a lifting mode, and a grinding wheel used for grinding the wafer is arranged on the lower portion of the grinding device. The grinding wheel comprises a base material and a plurality of grinding blocks, and the grinding blocks are fixed to the base material through adhesive layers. The grinding block comprises spiral calcium carbonate containing a Si-O-Ca structure and is used for dispersing stress during grinding. According to the technical scheme, the problem that the flatness of the thinned wafer is poor in the prior art is solved.

The invention relates to the technical field of electric power accessories, in particular to electronic connector end grinding equipment which comprises a storage mechanism used for bearing an electronic connector and functional assemblies. The adsorption fixing mechanism is mounted on the storage mechanism and is used for fixing an electronic connector; the grinding mechanism is arranged on one side of the storage mechanism, and the grinding mechanism comprises a driving assembly, a rough grinding assembly and a fine grinding assembly. A strain gauge type pressure sensor is used for detecting the contact pressure between a grinding roller and an end in real time, and after a signal is fed back to a control system, the grinding roller is driven to rotate; the servo motor drives the sleeve and the grinding roller to finely adjust the feeding amount through the ball screw, the grinding pressure is stabilized within a reasonable range, excessive end grinding or material damage caused by too large pressure is effectively avoided, meanwhile, surface defect residues caused by too small pressure are prevented, and the rough grinding precision and the product consistency are remarkably improved.

The invention discloses a machining position correction system and a control method thereof.The system comprises a base, a turret clamping mechanism and a sliding table mechanism, at least one machining station is arranged on the base, a positioning device and the sliding table mechanism are arranged at the machining station, and the sliding table mechanism comprises a machining assembly and a calibration probe assembly; the machining assembly can reciprocate in the first direction of the machining station, the sliding table mechanism reciprocates in the radial direction of the turret clamping mechanism, a clamping assembly is arranged on the turret clamping mechanism, a calibration device is arranged on the clamping assembly, and the turret clamping mechanism drives the clamping assembly to rotate to the machining station. The calibration probe assembly detects the positioning device and the calibration device so as to determine the position offset of the clamping assembly relative to the machining station. The control precision of the rotation angle of the turret clamping mechanism is compensated, and the machining precision of machining equipment is improved.

The invention provides an automatic production line suitable for polishing, cutting and punching aluminum parts. The automatic production line comprises a grabbing robot. A punching machine, a feeding conveyor and two machining chambers are arranged on the periphery of the grabbing robot. A grinding mechanism and a cutting mechanism are installed in the two machining chambers correspondingly. A translation mechanism is mounted on the bottom side of the processing chamber; the translation mechanism is connected with a material loading seat through a turnover mechanism, and a chuck for clamping an aluminum part is arranged above the material loading seat; a telescopic piece is arranged at the input end of the turnover mechanism, and the input end of the turnover mechanism is further connected with a reset part; and a stop block for stopping the telescopic piece is fixed in the processing chamber. Through cooperative arrangement of the turnover mechanism and the telescopic piece, after the aluminum piece is cut or ground, in the process that the material carrying base drives the aluminum piece to move outwards from the machining chamber, turnover of the material carrying base and the aluminum piece can be automatically achieved, and therefore chippings attached to the top, the interior and the material carrying base of the aluminum piece are poured down.

The utility model discloses decoration wall surface polishing equipment which is characterized in that a polishing head is fixedly connected with a rotating platform, teeth are arranged on the circumferential wall of the rotating platform, the rotating platform is meshed with a driving gear through the teeth, an extension sleeve is arranged at the end, away from a blade, of the polishing head, a through hole is formed in the center of the rotating platform, and the through hole penetrates through the rotating platform; a dust suction pipe is mounted in the through hole, the end, close to the grinding head, of the dust suction pipe is of a wide-opening design, the end, away from the grinding head, of the dust suction pipe is connected with an air suction pump, and an extension sleeve is arranged at the end, away from the blade, of the grinding head and can reduce dust generated during wall grinding from entering the space between the motor or the driving gear and the rotating platform; the radius difference between the grinding head and the rotating platform is larger than the thickness of the side wall of the outer frame, when the device is fixed, the maximum grinding range of the grinding head exceeds the width of the outer frame, and the situation that the edges of the two sides of the wall cannot be ground due to the influence of the outer frame is avoided.