6338results about "Plane surface grinding machines" patented technology

An apparatus for polishing a butt weld includes a machine frame; a polishing mechanism, including a rotating arm, a supporting column rotatably mounted on the rotating arm, and a polishing roll rotatably mounted on the supporting column in a circumferential direction of the polishing roll; an angle limiting assembly, movably mounted on the rotating arm, the angle limiting assembly limiting an angle at which an outer side end of the supporting column swings upward; a roll driving part, mounted on the rotating arm. The roll driving part is in transmission connection with the polishing roll and drives the polishing roll to rotate on the supporting column in the circumferential direction of the polishing roll. An arm driving part is mounted on a fixed frame, the rotating arm being mounted on the arm driving part, and the arm driving part drives the rotating arm to rotate in a circumferential direction.

To provide a new technique, related to a workpiece processing preparation method before thinning processing, and a workpiece processing method prepared by the same.SOLUTION: A workpiece processing preparation method includes a first resin supply step of laying a first resin on a sheet S, a resin layer formation step of pressing a first plate-like object and solidifying the first resin, then peeling the first plate-like object, and forming a first resin layer 31, a plate-like object installation step of installing a second plate-like object 20 on the upper surface of the first resin layer 31, a second resin supply step of laying a resin 25 on the second plate-like object 20, a second laminate formation step of making a plate-like workpiece W face the resin 25 laid on the upper surface of the second plate-like object 20, pressing and integrating the workpiece W and the resin 25, solidifying the resin 25 by external stimulation, and forming a second laminate 42, and a third laminate formation step of removing the first resin layer 31 and the sheet S from the second laminate 42, and forming a third laminate.SELECTED DRAWING: Figure 5

The invention relates to the technical field of polishing, and discloses an intelligent steel rail polishing control method which comprises the following steps: acquiring surface and internal defect data of a steel rail through laser and ultrasonic fusion detection, discretizing the data into multi-dimensional nodes, and constructing a dynamic graph model comprising a microscopic-macroscopic dual-cluster neural network to predict a defect evolution trend; based on fractal dimensions and information entropy, multi-source data are dynamically fused, abnormities are eliminated, chaotic optimization and wear prediction are adopted to generate global optimal polishing parameters, and finally parameter dynamic adjustment is achieved through closed-loop feedback of pulse frequency and control errors. Steel rail defect collaborative perception is achieved through a multi-scale dynamic graph model, fractal-entropy weight dynamic fusion is combined to enhance data reliability, global optimal parameters are generated through chaos optimization and abrasion prediction, accurate grinding is achieved through pulse-error closed-loop control, and the method is simple and convenient to implement. The problems of data fusion failure, defect response lag, parameter local optimization and insufficient control precision in the prior art are solved.

The invention discloses a curved surface mapping track optimization and multi-modal force control method for complex wall surface polishing. The method can efficiently meet the polishing requirement of a complex curved surface. A polishing track is determined by introducing a projection technology, a path optimization model is constructed, and multi-node force fusion attitude control is combined, so that interpolation point calculation and attitude change and position planning matching are realized, and a robot polishing path including a polishing position, an attitude and adjustment parameters is effectively generated. According to the multi-mode force control method, a force control mode is dynamically adjusted by combining radial height state switching of state classification of convex and concave path sections; multi-node fusion attitude control is further introduced, the surface contact force of a sand disc is accurately tracked, the tail end attitude of the robot is dynamically adjusted to follow the curved surface characteristics, the problems of irregular curved surfaces, unstable force control and the like in the traditional grinding technology are solved, and the method can be widely applied to automatic efficient grinding operation in the fields of buildings, ships and the like; and efficient and high-precision grinding of the complex curved surface is achieved.

The present disclosure provides a polishing device comprising a frame (1), and a polishing disc (2), an assistant polishing disc (3), and a fixture (5) that are disposed on the frame (1). At least one polishing position (4) is disposed on the assistant polishing disc (3). The assistant polishing disc (3) is clamped by the fixture (5) and in contact with the polishing disc (2). The fixture (5) includes a plurality of claws (52), the plurality of claws (52) include at least a first claw extending from above the at least one polishing position (4) to an edge of the assistant polishing disc (3). A pre-tightening part is disposed on a position, corresponding to the at least one polishing position (4), of the first claw. The pre-tightening part includes a scale and a pre-tightening member. A scale value representing a polishing removal efficiency is preset on the scale.

The utility model belongs to the technical field of surface grinding machines, and particularly relates to an auxiliary feeding and discharging mechanism for a surface grinding machine, which comprises a machining table and a feeding box, the feeding box is mounted on the right side of the machining table, a feeding device is arranged in the feeding box, and a feeding device is arranged on the upper surface of the machining table. According to the auxiliary feeding and discharging mechanism for the surface grinding machine, workpieces on the feeding plate are driven to ascend through the feeding unit, then the pushing air cylinder is started to push the pushing plate to move leftwards, and therefore the workpieces on the feeding plate are pushed to the position above the machining table for subsequent grinding machining, manual feeding is not needed, time and labor are saved, and the machining efficiency is improved. The guide rail base is driven to slide leftwards on the electric guide rail, so that a workpiece on a bearing table at the top of the guide rail base is driven to move leftwards for feeding and machining, and after the workpiece moves to the position below the grinding assembly, the two clamping air cylinders are synchronously started to drive the clamping plates to move relatively, so that the workpiece is clamped and fixed, and workpiece displacement in the grinding process is avoided.

The invention discloses an intelligent robot construction technology and system for building surface treatment, and relates to the technical field of building construction.The technology comprises the following specific processes that three-dimensional contour data collection is conducted, specifically, a building surface is comprehensively scanned through high-precision three-dimensional laser scanning equipment, and space coordinate information of all points on the surface of the building surface is obtained; by integrating three-dimensional laser scanning, image processing and spray gun and polishing control, full-process automatic operation from putty spraying, polishing to paint spraying is achieved, the construction period is greatly shortened, the efficiency advantage is particularly remarkable for large-area or complex-shape building surface treatment, and meanwhile, the construction efficiency is greatly improved. Due to the fact that the robot can work strictly according to the preset program and path and conduct accurate adjustment in combination with real-time feedback data, high consistency and uniformity of construction quality are ensured, and the problems of spraying omission, repeated spraying or uneven grinding and the like possibly occurring in manual construction are effectively avoided.

The invention belongs to the field of semiconductor materials, and particularly relates to a method for improving film thickness uniformity of a lithium tantalate bonding wafer, which comprises the following steps: thinning the lithium tantalate bonding wafer; and according to the film thickness distribution of the thinned lithium tantalate bonding wafer, pressurizing the polished bonding wafer in different areas step by step, fitting a polishing rate model according to the film thickness measured in real time, and adjusting a pressurizing formula for polishing. Whether the final shutdown thickness is reasonable or not is judged through a polishing rate model, compensation is obtained, and then secondary polishing is conducted. The consistency of supplied materials before polishing is guaranteed through thinning processing, and a foundation is provided for improving the thickness uniformity of a polishing film; the thickness uniformity of the film in the bonding sheet is ensured by pressurizing step by step in different regions; and the polishing rate model ensures the film thickness uniformity between the bonding sheets.

The invention provides a shoe sole wear resistance detection device, and belongs to the technical field of wear resistance detection, the shoe sole wear resistance detection device comprises an instrument body and a shoe sole sample formed by punching a shoe sole, and further comprises a simulation detection assembly and a dust removal cleaning assembly; under the guidance of the guide ring, the first support arm can periodically move up and down, the process simulates the dynamic change of the pressure borne by the sole in different gait stages when a person walks, and in combination with the rotation of the sole sample, not only is the vertical pressure change simulated, but also the friction force in different directions can be simulated through relative sliding. The stress state of the shoe sole in the walking process is restored, so that the detection is closer to the actual use scene; the dust removal system is driven by the power of the detection device to operate, so that all-directional coverage of the whole abrasion area is realized, the retention time of dust in the detection area is reduced, dust interference can be avoided, the state of a sole sample before and after detection is only influenced by abrasion of a grinding wheel, and the detection result more truly reflects the abrasion resistance of the sole.

The invention relates to the technical field of grinding machines, and discloses a surface grinding machine which comprises a rotary type grinding mechanism and a linkage type pressure applying mechanism. A hollow rotating column which can rotate along with the second butt-joint plate and is in a hollow state, a fifth butt-joint plate which can axially move along the hollow rotating column and rotate along with the hollow rotating column, and a spiral spring which generates downward elastic pressure on the fifth butt-joint plate are arranged in the second butt-joint plate. According to the surface grinding machine, the basic circular motion type grinding effect of the plane grinding disc on the surface of an object is utilized, and the relative motion of the built-in grinding block around the petal-shaped closed sliding groove is combined, so that the grinding block can generate radial reciprocating motion relative to the rotating axis on the surface of the object, and the grinding efficiency of the object is improved; the two kinds of grinding movement are from the same driving motor, and therefore the effective utilization rate of the driving motor can be effectively increased.

The invention discloses a polishing device for steel structure machining, and relates to the technical field of polishing for steel structure machining, the polishing device comprises a rack, L-shaped beams arranged in frames on the two sides of the top of the rack and conveyors installed on the two sides of the rear portions of the L-shaped beams, and a conveying compression roller is arranged between two vertical plates; a pressure applying assembly is mounted on the vertical plate; a reciprocating seat is arranged between the L-shaped beams, a lower grinding wire roller is installed at the rear end of the first rotating shaft, and an upper grinding mechanism is installed on the upper portion of the rear end face of the reciprocating seat. A dust blowing assembly is mounted on the inner frame wall of the rack; a side groove polishing mechanism is installed on the lower portion of the rack. Through cooperation of the upper grinding mechanism and the side groove grinding mechanism, all-directional grinding of H-shaped steel or I-shaped steel is achieved, efficient grinding operation of a steel structure side groove can be achieved, and the grinding quality and efficiency are improved; the lower grinding screw roller and the upper grinding screw roller can conduct double grinding on the upper end face and the lower end face of the steel structure at the same time, and the grinding quality is effectively improved; and all-around refined grinding of the steel structure is achieved.

The invention relates to the technical field of wafer processing, in particular to a wafer surface grinding device and a grinding method thereof, and solves the problem that high grinding precision and high grinding efficiency cannot be both considered during wafer surface grinding. The polishing device comprises a workbench, a rotary table, a plurality of polishing pieces, an adjusting assembly, a visual identification piece and a control piece, and the adjusting assembly is configured to enable at least one polishing piece to be close to or far away from a surface to be polished in the vertical direction and enable at least one polishing piece to move in the horizontal direction to be close to or far away from an original point; the control part determines grinding data according to the recognition image and controls the adjusting assembly to drive at least one grinding part to move according to the grinding data, so that one protrusion in the preset area is ground by one grinding part under the condition that the rotary table is static, or at least one protrusion is ground by multiple grinding parts at the same time under the condition that the rotary table rotates. According to the wafer surface grinding device and the grinding method thereof provided by the invention, the grinding precision and the grinding efficiency of the wafer surface can be improved.

The invention discloses a wall surface grinding machine. The wall surface grinding machine comprises a grinding piece, a driving mechanism, a supporting assembly, a controller, a remote controller and a charging mechanism. The driving mechanism is used for driving the polishing piece. The supporting assembly is connected to the driving mechanism and comprises a connecting rod and a front fork connected with one end of the connecting rod. The controller is electrically connected to the driving mechanism. The remote controller and the charging mechanism are installed at the other end of the connecting rod, the remote controller has a charging mode and a battery mode, in the charging mode, the remote controller is combined with the charging mechanism, and in the battery mode, the remote controller is separated from the charging mechanism. According to the wall surface grinding machine provided by the invention, the operation convenience can be ensured when an operator uses the wall surface grinding machine to carry out grinding operation.

The invention belongs to the technical field of semiconductor device manufacturing and processing, and particularly relates to semiconductor device manufacturing processing equipment which comprises a base and a mechanical arm fixedly arranged at the top of the base, a dust removal mechanism is fixedly arranged at one end of the mechanical arm, and a wafer polishing mechanism is fixedly arranged at the bottom end of the dust removal mechanism. A pneumatic lifting mechanism is fixedly arranged at the top of the base, when a wafer clamped by the wafer clamping mechanism needs to be turned over, the clamping air bag is inflated through the air nozzle, the wafer is clamped through the clamping air bag, then a valve on the air outlet is closed, at the moment, the air pressure in the hollow stand column can be continuously increased, and the wafer can be turned over. The piston assembly in the pneumatic lifting mechanism is pushed by air pressure to be jacked upwards, the ejector rod can be synchronously driven to ascend when the piston assembly is jacked upwards, the wafer clamping mechanism can be jacked up synchronously through the ejector rod, a wafer needing to be polished can be turned over conveniently, and the back face of the wafer can be polished conveniently.

A polishing pad and a chemical mechanical polishing apparatus are provided. The polishing pad includes: a central portion, designed with a central recess; and a peripheral portion surrounding the central portion, and designed with at least one peripheral recess. The at least one peripheral recess is disposed along an annulus contour. A lower part of the peripheral recess is greater than an upper part of the peripheral recess in terms of diameter area, and is different from the upper part in shape.

The invention belongs to the technical field of wall surface polishing, and particularly relates to a wall surface polishing device for building construction, which comprises a base, and an electric sliding rail is fixedly arranged at the upper end of the base. The wall surface polishing device further comprises a rotary lifting mechanism, a rapid polishing mechanism, a wall surface roughness detection mechanism, a wall surface hardness detection mechanism, a polishing assembly storage machine, a plurality of sets of pushing auxiliary material taking mechanisms and a PLC. The wall surface roughness can be rapidly detected before the wall surface is polished, a worker is automatically assisted in selecting a matched polishing disc according to a detection result, the hardness of the wall surface can be rapidly monitored before the wall surface is polished, the subsequent polishing power and polishing pressure are automatically regulated and controlled based on the hardness value of the wall surface, and the polishing efficiency is improved. According to the wall surface polishing device, the whole polishing working duration can be automatically regulated and controlled according to the wall surface roughness, the wall surface polishing quality and efficiency are effectively improved, the automation degree is high, and the regulation and control accuracy is higher.

The invention relates to the technical field of stone machining, in particular to an ultrathin stone machining device and machining method.The ultrathin stone machining device based on cutting and trimming comprises a shell and a cutting and trimming machine cutting and polishing structure arranged at the top of an inner cavity of the shell, and the bottom of the inner cavity of the shell is fixedly provided with a driving containing piece moving structure used for containing stone to move; airflow driving pieces used for enabling the output ends to move downwards to press the stone are arranged at the positions, close to the two side walls, of an inner cavity of the shell, blowing structures attached to the guiding pieces are arranged on the opposite surfaces of the two airflow driving pieces, when cutting is not carried out, the two blowing structures are both in a horizontal state, the ends of the two blowing structures are attached, and cutting is carried out. According to the stone cutting and polishing device, the cutting and polishing structure is separated from the moving structure, the hands of workers can be isolated from the cutting and polishing structure when the workers take and place stones, the possibility of being injured is reduced, and even if the stones are lifted up accidentally, the stones make contact with the blowing structure preferentially, and the situation that the stones are damaged by sharp positions of the cutting and polishing structure is avoided.

The invention discloses tool clamp polishing treatment equipment, which belongs to the technical field of tool clamp production and comprises a clamp body placing plate, a clamp body adsorption plate and a pressing column. A clamp body placing groove is formed in the clamp body placing plate in a penetrating manner, a grid plate is arranged on the bottom wall of the clamp body placing groove, and a station adjusting motor is connected to the central axis of the bottom wall of the clamp body placing plate; a clamp body adsorption groove is formed in the clamp body adsorption plate, an adsorption cavity is formed in the clamp body adsorption plate, the clamp body adsorption groove communicates with the adsorption cavity, a positioning baffle is arranged at the communicating position, and the clamp body adsorption plate is arranged in a rotatable mode and rotates to drive the clamp body to turn over; a pressing hole is formed in the pincer body adsorption plate in a penetrating mode, and the pressing column is used for penetrating through the pressing hole to transfer and press the pincer body in the pincer body adsorption groove into the pincer body containing groove. According to the tool clamp grinding treatment equipment, the clamp body can be automatically turned over, and double-face continuous grinding of the clamp body is completed.

The invention belongs to the technical field of bearing machining equipment, and particularly relates to a polishing device for the end face of a slewing bearing, the polishing device comprises a workbench, a supporting frame is fixedly connected to the workbench, an upper polishing mechanism used for polishing the upper surface of a bearing body is installed at the top of the supporting frame, and the upper polishing mechanism comprises a protective cover, a rotating shaft and a rotating shaft; and the bracket is fixed on the support frame. A reciprocating telescopic part and a water spraying part are arranged on the upper grinding mechanism, when a first motor drives a shaft rod and an upper grinding disc to rotate, a rotary disc can rotate synchronously, then a wedge-shaped block makes contact with a ball at the bottom of the reciprocating telescopic part, and a telescopic plate is driven to move upwards; and then the telescopic rod is driven to move through the matching relation between the upper wedge-shaped limiting block and the lower wedge-shaped limiting block, then the piston is made to move, water spraying operation of the spray head is achieved, when the rotating speed of the upper grinding disc is higher, the water spraying amount is larger, otherwise, the water spraying amount is smaller, and the problem that at the present stage, the device lacks an automatic water spraying and cooling function is solved.

The invention belongs to the field of robot polishing and metal material processing and manufacturing, and discloses a steel plate surface defect detection and self-adaptive polishing system and method, and the system comprises a surface defect detection system, a three-dimensional contour detection system, a roller bed control system, a robot polishing system and a server; the surface defect detection system is used for acquiring types and position information of defects; the three-dimensional contour detection system is used for accurately measuring depth information of the defect; the roller bed control system is used for controlling the movement of the roller bed to transfer the steel plate; the server is used for data interaction and storage among the surface defect detection system, the three-dimensional contour detection system, the roller bed control system and the robot grinding system; and the robot polishing system accurately polishes the surface defects of the steel plate according to the defect position and depth data in the server. The full-process intelligent operation of steel plate surface defect detection, defect three-dimensional contour scanning and robot self-adaptive grinding is achieved, and the automation level and the production efficiency of a production line are effectively improved.

The invention provides a wafer thinning equipment control method and device, electronic equipment and a storage medium, and relates to the technical field of wafer thinning. The method comprises the following steps: monitoring spreading and thinning behaviors of a spin-coating liquid film in real time and generating a residual layer distribution diagram; according to an area indicated by the residual layer distribution map, obtaining local thickness information by analyzing a fluorescence signal received from the area; after a laser beam is used for scanning the surface of the wafer, micro-vibration signals are recognized and extracted by analyzing reflected light signals; dividing the surface of the wafer into a plurality of grid areas; and the risk of generating cracks in each grid area is evaluated, and a wafer surface risk thermodynamic diagram used for controlling the grinding head and the grinding fluid is generated. The method aims at solving a series of problems caused by a microcosmic residual layer on the surface of the wafer or surface energy difference in the wafer thinning process, early and accurate sensing of microcosmic abnormity on the surface of the wafer is achieved, and a control system is guided to conduct regional and self-adaptive grinding parameter adjustment.

The utility model provides wooden furniture polishing equipment which comprises a polishing platform, a dust cover, guide rails, adjusting structures, a dust collecting box and a pushing structure, the dust cover is arranged on the upper surface of the polishing platform, inlet and outlet grooves are formed in the two ends of the dust cover, the two guide rails are arranged in one end of the dust cover, and one adjusting structure is arranged in each guide rail. A mounting groove is formed in the upper surface of the grinding platform, a dust collecting box is arranged in the mounting groove, and pushing structures are arranged on the two sides of the dust collecting box. According to the wood board polishing device, by arranging the adjusting structure, the two sets of polishing rods are driven to be close to each other to be attached to the outer surface of a wood board, the wood boards with different thicknesses can be conveniently adapted, then the polishing rods are driven to rotate, the wood boards are polished, and the wood boards are moved out of an in-out groove in the other end of the dustproof cover; the double-sided grinding device can be used for grinding the double surfaces of the wooden board, and meanwhile, the grinding distance can be adjusted according to the thickness of the wooden board, so that the working efficiency and the universality are effectively improved.

The invention provides a subsurface damage depth prediction and control method for ultra-precision grinding of a semiconductor wafer. The method comprises the following steps that the subsurface damage depth difference of ductile grinding and brittle grinding is analyzed; calculating the critical cutting depth of ductile-brittle transition; establishing the relationship between the subsurface damage depth and the normal force of a single abrasive particle; specifically, on the basis of the relation between the normal force of a single abrasive particle and the plastic radius of a plastic deformation area in ductile grinding and the median crack depth in brittle grinding, the relation between the subsurface damage depth of wafer grinding and the normal force of the single abrasive particle is obtained in combination with ductile-brittle transformation judgment conditions; establishing the relationship between the normal force of a single abrasive particle and the cutting depth of the abrasive particle; establishing the relationship between the abrasive particle cutting depth and the grinding process parameters; and establishing the relationship between the subsurface damage depth and the grinding process parameters. According to the method, the grinding process parameters are reversely solved based on the subsurface damage depth model, the grinding process can be formulated according to specific damage indexes, and the machining efficiency is improved on the basis of meeting the machining requirements.

The invention provides a chemical mechanical polishing film thickness real-time control method, device and equipment, and relates to the technical field of chemical mechanical polishing equipment. According to the invention, the optical sensing module is arranged in the vertical hole of the polishing disk, so that the reflected light intensity of the wafer can be monitored in real time in the CMP process. By adopting the optical sensing module, the corresponding relationship between the film thickness of samples with different thicknesses and the reflected light intensity is obtained. Therefore, the real-time film thickness can be determined in the CMP process according to the corresponding relation and the reflected light intensity monitored in real time, and chemical mechanical polishing film thickness real-time control is carried out on the target wafer. Time waste caused by multiple times of shutdown for film thickness detection in a traditional method is avoided, and the chemical mechanical polishing efficiency is improved.

The invention discloses an anti-abrasion electrical contact machining device and method, and the machining device comprises a circular machining table, a plurality of discharging structures, a polishing mechanism and a synchronous rotating mechanism; a plurality of mounting grooves are formed in the edge of the circular machining table in the diameter direction; the multiple discharging structures are movably arranged in the multiple mounting grooves correspondingly. One end of the main shaft downwards penetrates through the middle of the circular machining table, the annular grinding disc is arranged at the other end of the main shaft and is parallel to the circular machining table, and the main shaft is connected with the synchronous rotating mechanism; the synchronous rotating mechanism is arranged in the middle of the multiple discharging structures and is in transmission connection with the multiple discharging structures. According to the electric contact machining device, the circular machining table, the discharging structure, the grinding mechanism and the synchronous rotating mechanism are arranged, so that the grinding face is fully utilized, excessive grinding of part of electric contacts is avoided, and the machining consistency and uniformity of the electric contacts are guaranteed.

The invention provides a mixed bonding surface planarization process method of a wafer and chemical mechanical polishing equipment. The method comprises the following steps: controlling a grinding head to adsorb a first wafer to be subjected to surface planarization treatment, and grinding the first wafer on a first grinding pad to remove a copper film above a groove of the first wafer so as to obtain a second wafer; controlling the grinding head to move to a second grinding pad, and grinding the second wafer on the second grinding pad so as to remove the dielectric layer of the second wafer, the barrier layer above the dielectric layer and copper with the same thickness as the dielectric layer in the groove, and obtaining a third wafer with an exposed interface layer; controlling the grinding head to move to a third grinding pad, and grinding the third wafer on the third grinding pad, so that the surface height of the interface layer is the same as the surface height of the copper in the groove, and obtaining the wafer with the flattened surface; wherein the hardness of the third polishing pad is smaller than the hardness of the first polishing pad and the hardness of the second polishing pad. According to the invention, the wafer with a flat and smooth surface can be obtained.

The invention discloses a plane finishing system suitable for a large-size workpiece, and belongs to the technical field of ultra-precision plane machining equipment. The problems that in the prior art, deformation and secondary deformation exist in the machining process and the detection process of surface shape finishing machining equipment for large-size and large-weight workpieces, so that the machining efficiency is low, and the machining precision is difficult to guarantee are solved. Comprising a control center, and a first-stage platform, a second-stage platform, a first-stage leveling assembly, a second-stage leveling assembly, a processing device, a clamping assembly, a laser interferometer and two groups of laser reflection assemblies which are in signal connection with the control center, each laser reflection assembly comprises a laser, a laser reflector and a photosensitive position sensor. The method is used for plane finishing of large-size workpieces.

The invention relates to the field of correction machining, in particular to a panel correction device for steel box girder machining, which comprises a machine body and a conveyor arranged at the front end of the machine body, and further comprises at least one supporting plate arranged on the machine body and close to the conveyor; the movable support is composed of two swing arms symmetrically hinged to the bottom of the supporting plate and a connecting frame connected with the two swing arms. Before a steel plate is gripped into the straightening roller, the polishing roller linked with conveying is used for automatically cleaning the upper surface and the lower surface of the panel, hard pollutants such as oxide skin and welding slag are thoroughly removed, the polished pollutants are blocked by the scraping plate, and the polishing efficiency is improved. Therefore, the problem that hard objects are pressed into the surface of the straightening roll to form pits and indentations under huge straightening pressure is fundamentally avoided, abrasion of the straightening roll is remarkably reduced, maintenance cost and time for frequently stopping for grinding or replacing the roll are reduced, meanwhile, the clean plate surface also prevents contaminants from scratching the surface of a subsequent workpiece, and the service life of the workpiece is prolonged. And the surface quality of the steel box girder finished product is improved.

The invention provides a uniform-section thin-wall bearing end face grinding device and method, and belongs to the technical field of bearing grinding, the uniform-section thin-wall bearing end face grinding device comprises a rack, a plurality of wandering star wheels, a rotating wheel, a feeding mechanism and an upper grinding disc, the rack is vertically and slidably connected with a moving frame, the upper grinding disc is arranged on the moving frame, and the moving frame is rotatably connected with a rotating ring; a transmission tooth column is arranged on the lower end face of the rotating ring; a lower grinding disc is arranged below the upper grinding disc and comprises an outer grinding disc, an inner grinding disc capable of vertically moving and a plurality of grinding rings, the number of the grinding rings is equal to that of the wandering star wheels, the upper end faces and the lower end faces of the wandering star wheels are fixedly connected with limiting rings, and the outer diameters of the limiting rings are equal to the diameters of the grinding rings. A lower gear is fixedly connected to the lower portion of the polishing ring through a connecting column, and the number of teeth of the lower gear is equal to that of teeth of the wandering star wheel. The rotating wheel is arranged in the center of the inner grinding disc, and the upper end face of the rotating wheel is fixedly connected with an inner tooth column. The bearing grinding device has the effect of improving the bearing grinding quality.

The invention provides a gear inner hole grinding device and a grinding method thereof, and belongs to the technical field of gear inner hole grinding. Comprising a grinding mechanism and a gear, and the grinding mechanism comprises a mounting frame and a double-rod air cylinder; a clamping assembly used for fixing the gear and polishing one side face of the gear is installed between the two lugs of the installation frame. According to the gear grinding device, by arranging the clamping assembly, gears with different diameters can be clamped in a matched mode conveniently, the tedious clamping process is avoided, operation is easy and convenient, meanwhile, the gear grinding device can be matched with one side walls of the gears with different sizes for grinding, and certain operation procedures of operators are reduced; according to the gear grinding device, inner holes of gears with different inner hole diameters can be matched for grinding, the other side wall of each gear can be conveniently ground, the gears and the grinding device can be accurately and rapidly cooled, a grinding head is prevented from being replaced when the inner holes of the gears with the different inner hole diameters are ground, certain operation procedures of operators are reduced, and meanwhile waste of cooling liquid is avoided.