2534results about "Work carriers" patented technology

The invention relates to the technical field of semiconductor chemical mechanical polishing, in particular to a pressure-adjustable double-frequency ultrasonic-assisted semiconductor chemical mechanical polishing device which comprises a rotary table, and a tray, a lower vibration plate, an upper vibration plate, a magnetic sheet and a polishing pad are sequentially stacked and fixed to the upper surface of a table plate of the rotary table from bottom to top. A piezoelectric ceramic piece is fixed to the middle of the lower surface of the upper vibration plate, a retaining sleeve is eccentrically placed on the upper surface of the polishing pad, a threaded sleeve is in threaded connection with the upper end of the outer side face of the retaining sleeve, a damping spring is fixed to the outer top face of the threaded sleeve, a supporting piece is fixed to the upper end of the damping spring, and an inner ring of a second electric sliding ring is fixed to the upper surface of the supporting piece. A transmission shaft is fixedly assembled in an inner ring of the second electric slip ring, a clamping sleeve is fixed to the lower end of the transmission shaft, and an ultrasonic vibrator is fixedly assembled in the clamping sleeve. The method solves the problems that an existing semiconductor chemical mechanical polishing technology is low in polishing speed, poor in surface quality after polishing and low in polishing qualification rate, and is suitable for semiconductor chemical mechanical polishing.

The electrochemical mechanical polishing method and device are characterized in that a workpiece clamping device is adjusted according to the size of the semiconductor wafer and is adsorbed on a pressurizing device, and the semiconductor wafer is connected to a positive electrode of a power supply through a conducting ring to serve as an anode of an electrolysis system; the fixed abrasive pad is fixed on the polishing disc through a conductive adhesive and is connected to a power supply cathode through a conductive ring to serve as a cathode of the electrolysis system; during polishing, a polishing solution is connected with a conductive adhesive for fixing the polishing pad through a through hole in the fixed abrasive pad to form an electrolytic tank path, chemical oxidation and anodic oxidation are carried out on the surface of the third-generation semiconductor wafer during polishing to form a passivation oxide layer with low hardness, and valleys of the passivation oxide layer are passivated and protected. And the peak is quickly removed by the fixed abrasive, so that a polishing mode of anodizing and online removing the surface of the third-generation semiconductor wafer is realized. The method has the advantages of high abrasive utilization rate, high material removal rate, good surface quality, recycling of the polishing solution and the like.

The present disclosure provides a polishing device comprising a frame (1), and a polishing disc (2), an assistant polishing disc (3), and a fixture (5) that are disposed on the frame (1). At least one polishing position (4) is disposed on the assistant polishing disc (3). The assistant polishing disc (3) is clamped by the fixture (5) and in contact with the polishing disc (2). The fixture (5) includes a plurality of claws (52), the plurality of claws (52) include at least a first claw extending from above the at least one polishing position (4) to an edge of the assistant polishing disc (3). A pre-tightening part is disposed on a position, corresponding to the at least one polishing position (4), of the first claw. The pre-tightening part includes a scale and a pre-tightening member. A scale value representing a polishing removal efficiency is preset on the scale.

The invention relates to a double-sided polishing method for mask substrate glass, which comprises the following steps: polishing glass by using a double-sided polishing machine which comprises an upper polishing disk, a lower polishing disk, an upper polishing pad, a lower polishing pad, a sun wheel, a gear ring and a plurality of wandering star wheels; during polishing, the rotating speed of the lower polishing disc is higher than that of the upper polishing disc, and the rotating directions of the lower polishing disc, the upper polishing disc, the gear ring and the sun gear are opposite. In the polishing process, the back face type of the glass is kept to be a concave face type with the low center and the high periphery, the front face type of the glass is prevented from deteriorating, and the flatness effect of the front face of the polished glass is effectively improved.

The invention belongs to the field of machining, and discloses an end point detection method and system for the polishing process of a high-hardness and brittle material, and the method comprises the following steps: step 1, constructing a mathematical model of chemical mechanical polishing; 2, a test platform is built for force and torque signal acquisition; step 3, performing circuit design of an edge computing platform; 4, performing a parameter control experiment; 5, developing an upper computer system; step 6, finally obtaining a training set of the high-hardness and brittle material processing state prediction model based on the force and torque signals; step 7, training the processing state prediction model; and step 8, performing end point detection by using the trained processing state prediction model. According to the method, online real-time detection is conducted on the polishing state through the polishing torque, state feedback is conducted, the polishing machining efficiency can be improved, the polishing quality and the polishing yield can be improved, and the cost is reduced.

The invention relates to the technical field of diamond roller machining, in particular to diamond roller mounting inner hole high-precision grinding equipment which comprises a base, a linkage column fixedly connected to the top of the base and a rotary clamping assembly arranged on the base and used for centering and clamping a diamond roller. The lifting plate is provided with an air cooling type grinding assembly which conducts efficient cooling type grinding and assists in inner hole chipping cleaning. According to the diamond roller grinding device, centering clamping treatment is conducted on diamond rollers of different sizes through the rotary clamping assembly, comprehensive efficient grinding treatment of different inner holes is achieved in combination with the air-cooled grinding assembly, the grinding requirements of the diamond rollers of different sizes can be automatically met without additional replacement operation, and through cooperation of the rotary clamping assembly and the air-cooled grinding assembly, the grinding efficiency is greatly improved. And the multi-direction grinding effect can be further achieved, and chippings can be discharged in an auxiliary mode for convenient collection.

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to an ultraviolet light catalysis assisted gallium nitride wafer polishing method which comprises the following steps: S1, fixing a ground and flushed gallium nitride wafer on a clamp of a polishing machine; s2, the sealed cabin of the polishing machine is vacuumized until the vacuum degree reaches a set vacuum degree threshold value, and then the sealed cabin is filled with oxygen until the pressure value of the oxygen in the sealed cabin reaches a set pressure threshold value; s3, an ultraviolet lamp and a heater are turned on, the ultraviolet lamp irradiates the polishing solution, the heater heats the polishing solution to a set temperature and keeps the temperature constant, and then the polishing machine is started to polish the gallium nitride wafer; and S4, cleaning the polished gallium nitride wafer. According to the method, the oxidation rate is increased, and the polishing efficiency of the gallium nitride wafer is further improved.

The invention provides a polishing head, a polishing system and a control method of the polishing system. The polishing head comprises a retaining ring and a back film, the retaining ring and the back film are both installed on the body, the retaining ring surrounds the periphery of the back film, the polishing head further comprises a shape compensation plate, the shape compensation plate is installed on the bottom face of the back film and comprises a plurality of control point positions, and a wafer fixing cavity is formed between the shape compensation plate and the retaining ring. The shape compensation plate is used for being electrically connected with a deformation controller, and the deformation controller can control at least one control point to stimulate the shape compensation plate, so that the shape compensation plate deforms at the local part where the control point is located. The polishing system is provided with the polishing head, the invention further provides a working method of the polishing system, the polishing head can ensure the flatness of the wafer during polishing, the polishing thickness of the wafer is uniform, and the product yield is improved.

The invention provides an automatic grinding wire set for grinding an optical fiber MPO jumper wire, which comprises a plurality of grinding machine sets arranged side by side, a grinding machine for placing a grinding clamp and a cleaning machine for cleaning the grinding clamp are arranged on the table top of each grinding machine set, and a grinding support is further arranged on the table top of each grinding machine set. A linear sliding assembly located above the grinding machine and the cleaning machine is arranged on the grinding support, a pair of clamp clamping assemblies used for clamping the grinding clamp is connected to the linear sliding assembly in a sliding mode, and the linear sliding assembly is used for driving the pair of clamp clamping assemblies to synchronously and linearly reciprocate to clamp the optical fiber grinding clamp to synchronously move. The automatic grinding line group is in an array parallel group mode, each grinding machine and each cleaning machine form a station, the multiple stations are controlled by the PLC in a unified mode to conduct synchronous line production, grinding of the optical fiber MPO jumpers in multiple procedures can be conducted at the same time, and the production grinding efficiency is effectively improved.

The embodiment of the invention provides a wafer transmission manipulator and a wafer transmission method and device. The wafer transfer manipulator comprises: a base; the connecting mechanism is arranged on the base, and the connecting mechanism is provided with a centering reference datum; the first clamping jaw and the second clamping jaw can be movably connected to the connecting mechanism relative to the centering reference datum in an opposite or opposite manner; the driving mechanism is used for driving the first clamping jaw and the second clamping jaw to move, so that the first clamping jaw and the second clamping jaw are located at a bearing position, a clamping position or a releasing position; when the first clamping jaw and the second clamping jaw are located at the clamping positions, the distance between the circle center of the wafer and the centering reference plane is smaller than a first preset value. According to the embodiment, the first clamping jaw and the second clamping jaw can receive the wafer with position deviation when being at the bearing position, so that a front-end manipulator can interact with the embodiment. And the front-end manipulator can load the wafer from the wafer box in an adsorption manner, and place the processed wafer into the wafer box in a clamping manner, so that cross contamination during wafer loading and unloading is avoided.

A polishing pad and a chemical mechanical polishing apparatus are provided. The polishing pad includes: a central portion, designed with a central recess; and a peripheral portion surrounding the central portion, and designed with at least one peripheral recess. The at least one peripheral recess is disposed along an annulus contour. A lower part of the peripheral recess is greater than an upper part of the peripheral recess in terms of diameter area, and is different from the upper part in shape.

The invention discloses a polishing machine cooling structure multi-objective optimization method based on a heat generation model, which comprises the following steps: establishing a discrete point temperature variance calculation model in the radial direction of a polishing disk surface and a water channel volume calculation model of the polishing disk; the value range of the width of each water channel of the polishing disc, the value range of the interval width of each water channel, the value range of the number of the water channels, the value range of the interval width inside the cooling water channels, the value range of the interval width outside the cooling water channels and the value range of the depth of the water channels are used as constraint conditions; the minimum temperature variance of discrete points in the radial direction of the polishing disc surface, the maximum water channel volume of the polishing disc and the maximum thickness of the polishing disc serve as optimization targets, and the water channel width and the water channel depth of the polishing disc, the inner interval width of cooling water channels, the outer interval width of the cooling water channels, the interval width of all the water channels, the thickness of the polishing disc and the number of the water channels are optimized; and taking the optimal solution obtained by optimization as the structural parameter of the cooling water channel of the polishing disk.

The invention relates to a chemical mechanical grinding system and method for a hard and brittle semiconductor wafer, and the chemical mechanical grinding method comprises the following steps: preparing an oil-based thermal activity-optical activity composite grinding fluid by adopting an organic thermal decomposition type oxidizing agent, an organic optical decomposition oxidizing agent, polyethylene glycol, glycerol and vegetable oil; building an ultraviolet light-diamond abrasive grinding wheel chemical mechanical grinding platform which has an ultraviolet light irradiation function and is adjustable and controllable in irradiation intensity and ultraviolet light wavelength; the chemical mechanical grinding platform and the minimal quantity lubrication liquid supply device are started, and the wafer to be machined and the diamond abrasive grinding wheel are controlled to rotate relative to each other for opposite grinding; turning on an ultraviolet light generator to accurately irradiate the thermal activity-optical activity composite grinding liquid drops on the surface of the wafer, inducing a thermal decomposition type oxidizing agent and an optical decomposition type oxidizing agent to generate active free radicals by utilizing grinding heat energy and ultraviolet light irradiation energy, and initiating a free radical oxidation reaction of a wafer surface layer material to form an oxidation layer with low interface bonding force; the oxide layer on the surface of the wafer is removed through small-load micro-cutting of the diamond abrasive, and the semiconductor wafer with the subsurface almost free of mechanical damage is efficiently obtained.

A carrier head for chemical mechanical polishing includes a base assembly connected to a membrane assembly of the base assembly. The membrane assembly includes a membrane support, an inner membrane secured to the membrane support, the inner membrane forming a plurality of individually pressurizable interior chambers between an upper surface of the membrane and the membrane support, and an outer membrane secured to the membrane support and extending below the inner membrane, the outer membrane having an inner surface and an outer surface, wherein the outer membrane defines a lower pressurizable chamber between the inner surface of the outer membrane and a lower surface of the inner membrane, where the inner surface is positioned to contact the lower surface of the inner membrane when one or more of the plurality of chambers are pressurized, and where the outer surface is configured to contact a substrate.

The invention provides a wafer bearing unit, a post-processing device, an overturning method and processing equipment. The wafer bearing unit comprises a bearing bracket, a detection assembly and an adjusting assembly, the bearing bracket comprises a turnover main body, the main body comprises an upper limiting piece which is fixedly mounted, a lower limiting piece driver and a lower limiting piece which is movably mounted and is used for limiting and bearing a wafer in the turnover process of the main body, and the lower limiting piece driver is used for driving the lower limiting piece to be close to or far away from the center of the main body; the detection assembly is used for detecting the inclination angle of the wafer in the direction from the upper limiting piece to the lower limiting piece when the main body is overturned to the horizontal state; the adjusting assembly comprises an adjusting driver and an adjusting supporting element, and the adjusting driver drives the adjusting supporting element to support the wafer at an inclined angle and drives the adjusting supporting element to be in a horizontal state after the lower limiting part driver drives the lower limiting part to be away from the lower limiting part. According to the invention, the inclined wafer can be leveled, and the wafer cannot be polluted and the limiting piece cannot be damaged.

The invention discloses a UPA pressure automatic compensation system and method for mask substrate polishing. The UPA pressure automatic compensation system comprises a pressure execution module, a distributed sensing feedback network and an intelligent control unit. Wherein the pressure execution module is used for directly polishing a mask base plate and comprises a force application shaft, a polishing head, an air source, a UPA air bag and an electric proportional valve, the distributed sensing feedback network comprises an air path pressure sensor and a tail end contact pressure sensor, and the intelligent control unit receives a collection signal of the distributed sensing feedback network and sends the collection signal to the polishing head. On the basis of a current process formula and process parameter coupling model, a data fusion algorithm, a feed-forward compensation algorithm and a fuzzy PID algorithm are operated to obtain a feed-forward compensation amount and a fuzzy PID output amount, the feed-forward compensation amount and the fuzzy PID output amount are superposed, a total control voltage is generated and output to an electric proportional valve, and then the input air pressure of a UPA air bag is adjusted. Therefore, closed-loop control over the polishing pressure of the mask substrate is achieved. Through multi-sensor data fusion, fuzzy PID self-adaptive control and intelligent feed-forward compensation based on a process parameter coupling model, real-time, accurate and constant control of the polishing pressure is realized, so that the surface precision and yield of the mask substrate are improved.

The embodiment of the invention provides a wafer bearing table and chemical mechanical polishing equipment. The wafer bearing platform comprises a platform used for placing a workpiece; the swing shaft is fixedly connected to the platform; the swinging shaft is connected to the supporting mechanism and the base in a swinging mode and is provided with a containing hole, the supporting mechanism is arranged in the containing hole, and when the swinging shaft swings along with the platform, the supporting mechanism can provide axial buffering support for the swinging shaft; and the elastic mechanism is arranged between the platform and the base and is used for deforming when the platform swings so as to adaptively support the platform. In the swinging process of the platform, due to the fact that the supporting mechanism moves in the axial direction of the containing hole all the time, the platform is effectively positioned, deviation of the axis is prevented, and therefore the stability of the platform in the polishing operation is guaranteed.

The invention discloses automatic grinding equipment for ball bodies of ball valves, and relates to the field of ball grinding, the automatic grinding equipment comprises a machine body, the machine body is rotatably provided with an insertion rod, the insertion rod is vertically arranged, the insertion rod is in insertion connection with an insertion port of a ball body and forms coaxial rotation, and the machine body is provided with an abutting rod located on the upper side of the insertion rod in a lifting mode. An abutting rod is arranged on the machine body, the abutting rod abuts against the abutting plane of the ball, a mounting plate is arranged on the machine body in a swinging mode, two mounting bases are arranged on the mounting plate in a relative sliding mode, mounting discs are rotationally arranged on the mounting bases, and grinding discs are detachably connected into the mounting discs. Three clamping plates are arranged on the inner side of the mounting disc along the circumference, a clamping gap for clamping a grinding disc is formed among the three clamping plates, and a driving assembly for driving the three clamping plates to slide synchronously is arranged on the mounting disc. Different grinding discs can be disassembled and assembled so as to adapt to grinding machining of balls of different sizes, and the applicability is high.

The invention belongs to the technical field of semiconductor processing, and particularly discloses a processing auxiliary device for thinning a wafer, which comprises a base body and at least one limiting piece, the limiting piece is connected with the end part of the base body, the limiting piece is provided with a mounting hole, the mounting hole is used for mounting and placing the wafer, and the limiting piece is arranged on the base body. The wafer is detachably connected with one end of the base body, and the height difference between the limiting piece and the end portion of the base body is smaller than the height difference between the wafer to be machined and the end portion of the base body. According to the invention, the wafer breaking or bending phenomenon can be reduced while the wafer thinning quality is ensured.

The invention provides a double-sided grinding device and method, and belongs to the technical field of semiconductor manufacturing. The double-face grinding device comprises an upper fixed disc, a lower fixed disc, a bearing disc and a driving mechanism, the upper fixed disc and the lower fixed disc are oppositely arranged, and the bearing disc is arranged on the side, facing the upper fixed disc, of the lower fixed disc and comprises a plurality of workpiece bearing disc holes; the driving mechanism can drive the bearing disc to rotate relative to the upper fixed disc and the lower fixed disc; wherein the upper fixed disc is provided with at least one purified water flow guide hole facing the surface of the lower fixed disc, and the purified water flow guide hole is used for spraying purified water towards the lower fixed disc. According to the technical scheme, the problem that the ground silicon wafer is adsorbed on the upper fixed disc and falls to the surface of the lower fixed disc when rising to the air to cause fragments can be solved.

The invention belongs to the technical field of ball valve machining equipment, and particularly relates to double-station ball valve ball body grinding equipment which comprises a rack, a grinding device, a grinding device and a grinding device. The fixing device is arranged on the machining fixed table and used for fixing a ball to be ground; the grinding device is arranged on the mounting seat and is used for grinding the fixed ball body; the spraying devices are arranged on the two sides of the machining table and used for spraying auxiliary media for grinding on the balls; the number of the fixing devices, the number of the polishing devices and the number of the spraying devices are all two. The double-station ball grinding machine has the beneficial effects that the double-station design is adopted to achieve an alternate operation mode, when grinding is conducted on one station, the other station can synchronously complete ball clamping or other work, the window waiting period of traditional single-station equipment is effectively eliminated, the utilization rate of the equipment is increased, and the machining efficiency is improved.

The grinding disc cleaning line comprises a rack, a feeding alignment mechanism, an upper grinding mechanism, a lower grinding mechanism and a rear conveying assembly are sequentially arranged on the rack in the product conveying direction, and a spraying cleaning mechanism is arranged on the rear conveying assembly; the upper grinding mechanism comprises a horizontal driving platform and an upper grinding assembly, a vacuum carrying table is arranged on the horizontal driving platform, and pressure sensors and sensor lifting air cylinders for driving the pressure sensors to do lifting motion are arranged on the surfaces of the four corners of the vacuum carrying table correspondingly; the upper grinding assembly comprises an upper grinding disc magnetic attraction piece and an upper grinding disc connected with the upper grinding disc magnetic attraction piece, and a first rotary lifting driving mechanism is arranged above the upper grinding disc magnetic attraction piece. The pressure sensor can extend upwards, and detection of the levelness of the upper grinding disc is achieved through four-point pressure detection.

The invention discloses a chemical mechanical polishing and planarization system, which at least comprises a polishing head, and the polishing head comprises a polishing head body; a plurality of air holes are formed in the lower surface of the hard disc, and a third air cavity communicated with the air holes is formed in the hard disc; at least part of the elastic unit is of an annular structure, the elastic unit is connected with the polishing head body and the hard disc, and a second air cavity is defined by the polishing head body, the elastic unit and the hard disc; the retaining ring is positioned below the polishing head body; when the third air cavity is in a negative pressure state, the lower surface of the hard disc can make contact with and adsorb the wafer substrate, and the pressure in the second air cavity is controllable, so that the elastic unit is driven to flexibly move, the hard disc and the wafer substrate are assisted to float, and chemical mechanical polishing of the wafer substrate is achieved. According to the hard drive in the hard disc, the problem that when the flexible film drives the wafer substrate to be polished, under the severe polishing condition, the flexible film is pulled to cause fracture or elastic modulus change is solved, and the service life of the flexible piece is prolonged.

The invention relates to the technical field of wafer processing, and discloses a wafer bonding machine for grinding and polishing, the wafer bonding machine comprises a fixing mechanism, a fixing assembly is fixedly arranged in the fixing mechanism, and a closing assembly is fixedly arranged on the inner wall of the fixing mechanism. The plurality of arc-shaped plates are in a stacked state, when the arc-shaped plates rotate, the center positions of the plurality of arc-shaped plates form a circular clamping area, the area clamps and limits the side wall of a wafer at the top of the microporous ceramic vacuum chuck, and when the wafer is clamped and limited, the side wall of the wafer at the top of the microporous ceramic vacuum chuck is clamped and limited. The wafer is guaranteed to be located at the center position of the micropore ceramic vacuum suction cup through pushing of the multiple arc-shaped plates, then the micropore ceramic vacuum suction cup generates adsorption force, and under the influence of the adsorption force and side wall clamping force, it is guaranteed that the device can conduct clamping and adsorption treatment on wafers of different specifications.

The invention relates to the technical field of polishing machines, and discloses a chemical mechanical polishing machine based on a feeding structure, which comprises a polishing machine body consisting of a C-shaped machine base, a driving cylinder and a driving motor, an output shaft of the driving motor is fixedly connected with a transmission shaft rotationally penetrating through the C-shaped machine base and the annular baffle. The chemical mechanical polishing machine based on the feeding structure can effectively solve the problems that in the prior art, due to the fact that the polishing solution is mostly added in a middle single-point mode, the concentration of the polishing solution is not uniform at the edge of a silicon wafer or the center area of a grinding pad, local excessive polishing or insufficient polishing is caused, and the overall polishing quality is affected; and the silicon wafer is mostly fixed through a clamp or a vacuum adsorption pad, so that the exposure thickness is inconvenient to adjust when the silicon wafers with different thicknesses are polished, and the damage risk is increased due to excessive pressure on the silicon wafer in the polishing process.

According to the polishing pad provided by the embodiment of the invention, in addition to the first grooves in the concentric form, the second grooves in the radial form, which are specially designed, are adopted, so that the flowability of slurry can be improved, and the wafer curve and the polishing rate can be changed.

To provide a top ring or a substrate polishing apparatus capable of making a polishing profile more uniform on the central side of a square substrate and the outer edge side of the substrate.SOLUTION: A top ring for holding a polygonal substrate includes: a base member which is connected to a rotation shaft; a substrate suction member which includes a substrate suction body that has a substrate suction surface for suctioning the substrate and communicates with a decompression module, a shielding member that is configured to cover the side of the substrate suction body opposite to the substrate suction surface, and a frame member that is connected to the shielding member so as to surround at least a portion of the periphery of the base member; and a biasing mechanism which has a first end in contact with the base member and a second end in contact with the frame member, and applies a biasing force in a direction that brings the base member and the frame member close to each other or separates them from each other.SELECTED DRAWING: Figure 3

The invention provides a grinding and polishing processing method for a wafer, which belongs to the technical field of semiconductors and comprises the following steps: S1, carrying out primary grinding on the wafer by adopting an edge collapse process to obtain a semi-finished wafer; s2, carrying out secondary grinding on the semi-finished wafer by adopting an edge bulge process, and correcting the thickness deviation of the semi-finished wafer to obtain a wafer finished product; the sequence of the edge collapse process in the step S1 and the edge protrusion process in the step S2 is adjustable. According to the grinding and polishing processing method of the wafer, the existing single grinding is changed into two grinding, different processing effects of the two grinding methods are superposed, and one-way deviations caused by the single grinding are mutually counteracted, so that the processing effect of lower thickness deviation between the central area and the edge area of the wafer is realized, and the processing efficiency is improved. And the uniformity of the surface quality of the wafer is improved.

The invention relates to the technical field of grinding mills, and discloses an ultra-precise double-sided grinding miller which comprises a rack, a supporting frame is fixedly mounted at the top of the rack, a base is fixedly mounted in the middle of the top of the supporting frame, and a hydraulic cylinder is fixedly mounted at the top of the base; and a hydraulic rod is fixedly mounted at the top of the grinding assembly. According to the ultra-precise double-sided grinding machine, when a hydraulic rod drives a lantern ring to move downwards, a grinding block makes contact with a mechanical part firstly, along with continuous downward extrusion of the hydraulic rod, a clamping ring is extruded to drive a ring sleeve below the clamping ring to slide upwards on the surface of a positioning rod, and at the moment, a limiting ring slides on the surface of a sliding supporting rod while moving upwards along with the ring sleeve; the outer side of the extrusion bag is affected by deformation to extend outwards so as to be attached to the upper portion of the mechanical part, the grinding position of the mechanical part is limited, and it can be guaranteed that in the grinding process of the mechanical part, grinding pressure can be more evenly distributed on the surface of the mechanical part.

The utility model discloses a linkage type double-sided grinding machine, which belongs to the technical field of grinding machines and comprises a base, a lower grinding disc horizontally fixed at the top of the base, an upper grinding disc positioned at the top of the lower grinding disc, parallel to the lower grinding disc and coaxially arranged with the lower grinding disc, and a sun gear rotationally mounted in the middle of the lower grinding disc. The sliding holes are evenly formed in the outer side of the lower grinding disc in the circumferential direction, the outer tooth columns vertically slide in the sliding holes, the positions of the bottom ends of the outer tooth columns are limited through a tray and an arc-shaped plate, and in addition, through a lifting assembly composed of a limiting plate, a spring and a sliding rod at the bottom of the taking and placing table, the taking and placing efficiency is improved. An outer tooth column at the top of an arc-shaped plate can be controlled to ascend and descend in the using process, so that horizontal installation can be conducted in the feeding and discharging process and the planet wheel replacing process, using is more convenient, in addition, the arc-shaped plate can rotate around a lower grinding disc along with a lantern ring, the position of a taking and placing table can be adjusted at will, and practicability is higher.