962results about "Work carriers" patented technology

The invention discloses a UPA pressure automatic compensation system and method for mask substrate polishing. The UPA pressure automatic compensation system comprises a pressure execution module, a distributed sensing feedback network and an intelligent control unit. Wherein the pressure execution module is used for directly polishing a mask base plate and comprises a force application shaft, a polishing head, an air source, a UPA air bag and an electric proportional valve, the distributed sensing feedback network comprises an air path pressure sensor and a tail end contact pressure sensor, and the intelligent control unit receives a collection signal of the distributed sensing feedback network and sends the collection signal to the polishing head. On the basis of a current process formula and process parameter coupling model, a data fusion algorithm, a feed-forward compensation algorithm and a fuzzy PID algorithm are operated to obtain a feed-forward compensation amount and a fuzzy PID output amount, the feed-forward compensation amount and the fuzzy PID output amount are superposed, a total control voltage is generated and output to an electric proportional valve, and then the input air pressure of a UPA air bag is adjusted. Therefore, closed-loop control over the polishing pressure of the mask substrate is achieved. Through multi-sensor data fusion, fuzzy PID self-adaptive control and intelligent feed-forward compensation based on a process parameter coupling model, real-time, accurate and constant control of the polishing pressure is realized, so that the surface precision and yield of the mask substrate are improved.

The utility model provides an auxiliary driving device, a polishing mechanism for wafer processing and polishing equipment. The auxiliary driving device comprises an auxiliary driver; the magnetic coupling mechanism comprises an electromagnetic wheel and a conductive gear opposite to the electromagnetic wheel; the electromagnetic wheel is configured to be driven to rotate by the auxiliary driver; the conductive gear is provided with a conductive disc and a gear surrounding the conductive disc, and the conductive gear is in power connection with a polishing head station switching mechanism of the polishing equipment; the electromagnetic wheel is configured to have magnetism when powered on so as to be in magnetic connection with the conductive gear, so that power of the auxiliary driver is transmitted to the polishing head station switching mechanism through the conductive gear, and polishing head station switching is conducted. According to the polishing mechanism, the polishing head station switching mechanism can be driven by the auxiliary driver to conduct polishing head station switching and posture adjustment, and the maintenance or repair convenience of the polishing mechanism is improved.

A skate blade sharpening system used to sharpen the blades of ice skates. The skate sharpener can include a housing that includes an elongated slot for receiving the blade of an ice skate for sharpening, and clamp jaws for retaining the skate. The housing can include at least one slot cover to engage the skate blade. Engagement of the skate blade can be sensed by a controller to enable sharpening operations to proceed. The skate blade sharpening system can automatically operate a grinding wheel and move the rotating grinding wheel back and forth along the lower face of the skate blade a desired number of times to sharpen the skate blade.

The invention relates to a sapphire wafer back surface roughening method, which is based on a planetary double-sided grinding machine platform, and comprises the following steps: firstly, bonding the front surface of a low-TTV sapphire wafer subjected to double-sided accurate grinding and polishing to the surface of a ceramic plate, then fixing the ceramic plate on a wandering star wheel, then placing the wandering star wheel on a lower grinding plate, and grinding the sapphire wafer back surface with the lower grinding plate; wherein the back surface of the wafer faces the lower grinding disc; the upper grinding disc is forbidden, a sun gear and inner gear transmission mechanism is utilized, the wandering star wheel rotates on the lower grinding disc to form a precise grinding interface, and roughening of the back face of the sapphire wafer is achieved by regulating and controlling the rotating speed of the sun gear, the inner gear and the wandering star wheel. According to the method, on one hand, wafer thickness uniformity and parallelism control is achieved through the double-face polishing technology, on the other hand, low TTV control over the obtained single polished wafer is achieved in the roughening process through combination of equipment design and technology innovation, and the method is suitable for the 8-12-inch sapphire wafer and can be applied to the fields needing high-precision thickness control such as LED or semiconductor manufacturing.

The invention discloses a high-precision vertical double-sided grinding / polishing machine, which belongs to the technical field of grinding and polishing machines and comprises an upper disc device, a central transmission device and a lower disc supporting device, and both the upper disc device and the central transmission device are supported by the lower disc supporting device; the center transmission device comprises a main shaft supporting plate, an oil cylinder body is arranged on the main shaft supporting plate, a mounting cavity used for mounting a sun wheel shaft is formed in the inner side of the oil cylinder body, and the sun wheel shaft is arranged in the mounting cavity. An oil cylinder sleeve is arranged on the outer side of the oil cylinder body, a gear ring tray is arranged on the oil cylinder sleeve, an inner gear ring is arranged on the gear ring tray, the sun wheel shaft is arranged on a triangular fork through a first bearing, and the triangular fork is connected with the oil cylinder sleeve through a connecting rod. The problem that in the prior art, it is difficult to guarantee high-precision and high-rigidity synchronous lifting of a sun gear and an inner gear ring is solved.

The invention relates to a precision pipe fitting weld joint polishing treatment device and a treatment method thereof. The device comprises a fixing base and a polishing assembly, the polishing assembly comprises a center block, walking supporting structures are fixed to the two ends of the center block, two supporting rings are rotatably installed on the outer side of the center block, a rotating plate is fixed between the two supporting rings, and a transmission gear ring is fixed to the inner side of one end of the rotating plate; a transmission gear is installed on the inner side of the transmission gear ring in a meshed mode, the transmission gear is axially connected with a polishing motor, the polishing motor is fixed to the interior of one end of a center block, the other end of the center block is provided with an air hole, the air hole penetrates through the center block, a plurality of adjusting electric telescopic rods are inserted into the surface of the rotating plate, and polishing pads are fixed to the outer ends of the adjusting electric telescopic rods. Leakage of the polishing agent can be reduced, the polishing time is shortened, and the polishing efficiency is improved.

Information processing device that includes: an information acquisition unit that acquires reliability degradation factor state information in a chemical mechanical polishing process of a substrate performed by a substrate processing device, the reliability degradation factor state information including at least one of wear state information indicating a wear state of components of the substrate processing device and processing state information indicating a processing state during polishing; and a state prediction unit that predicts reliability information of a polishing endpoint detection function for the reliability degradation factor state information by inputting the reliability degradation factor state information acquired by the information acquisition unit into a learning model that has been trained through machine learning to learn a correlation between the reliability degradation factor state information and reliability information of the polishing endpoint detection function that indicates reliability of an endpoint detection function that detects that the chemical mechanical polishing process has reached an endpoint.

The present invention relates to techniques for calculating polishing rate responsiveness with respect to a change in the pressure with which a workpiece used for manufacturing a semiconductor device, such as a wafer, a substrate, or a panel, is pressed against a polishing pad. A method of the present invention comprises: calculating by simulation a pressing-pressure responsiveness profile indicating a distribution of pressing-pressure applied from a workpiece to a polishing pad (2) as the pressing-pressure changes in response to a change of unit pressure in a pressure chamber of a polishing head (7); polishing the workpiece by pressing the workpiece against the polishing pad with the interior of the pressure chamber maintained at a predetermined pressure; creating a polishing rate profile indicating a polishing rate distribution of the workpiece being polished; and creating a polishing rate responsiveness profile on the basis of the pressing-pressure responsiveness profile, the predetermined pressure, and the polishing rate profile.

The invention relates to the technical field of semiconductor polishing, in particular to a polishing carrier and a flyer detection method.The polishing carrier comprises a carrier body, the carrier body comprises a first base and a second base which are stacked, and the second base is used for bearing a to-be-polished piece; the detection part is arranged on the second seat and located on the outer side of the range covered by the first seat; the detection assembly comprises a laser sensor, and the detection assembly is arranged on the outer side of the carrier body, located above the detection part and used for monitoring the displacement change of the detection part in the direction perpendicular to the plane where the to-be-polished piece is located. The technical problem that the flyer condition cannot be accurately identified and timely coped in the polishing process is solved, and the technical effect of accurately identifying and timely coping the flyer condition is achieved.

The invention relates to the technical field of grinding devices, in particular to a cylindrical injection molding part grinding device which comprises a grinding platform and a lower grinding disc installed at the top of the grinding platform, an upper grinding disc is installed at the top of the lower grinding disc, a cleaning structure is arranged at the top of the grinding platform, and a plurality of positioning plates for supporting workpieces are installed at the top of the lower grinding disc. By adopting the composite design of the slidable and rotatable cleaning cylinder, the peripheral cleaning brush and the internal negative pressure cavity, the cleaning brush is made of a flexible wear-resistant material, can rotate and slide along with the cleaning cylinder, goes deep into microcosmic lines and blind areas of a grinding disc, and mechanically peels off stubborn grinding dust, and meanwhile, the dust suction pump works to form negative pressure in the cleaning cylinder, so that the cleaning effect is improved. Scraped abrasive dust and grinding liquid are sucked synchronously through the peripheral dust suction holes, secondary attachment of the abrasive dust is avoided, the cleaning efficiency is improved, the secondary scratch rate of workpieces is reduced, the grinding and cleaning procedures are automatic, and all-region dead-corner-free cleaning of the abrasive dust is achieved.

The invention discloses a feeding and discharging device of polishing equipment and the polishing equipment. The feeding and discharging device of the polishing equipment comprises a polishing head; the lifting driving part selectively drives the bottom plate to lift; the bearing plate is arranged between the bottom plate and the blasting head and is connected with the bottom plate; the upper side of the bearing main board is provided with a plurality of wafer detection sensors, and the plurality of wafer detection sensors are arranged on the edge of the bearing main board at intervals in the circumferential direction. Therefore, through synchronous lifting of the bottom plate and the bearing plate, the bottom plate and the bearing plate are close to or away from the polishing head, feeding and discharging of the wafer can be rapidly and directly achieved, the wafer guide column and the wafer detection sensor are integrated on the bearing main plate, the feeding and discharging speed of the wafer can be further increased, the wafer transmission time can be effectively shortened, and the process yield can be improved. Besides, the wall thickness of the bearing ring is set to be smaller in a reasonable range, so that the contact area between the bearing plate and the wafer can be reduced, and indentations generated on the surface of the wafer by the polishing solution can be reduced.

The invention discloses a wafer grinding control method and system, and the method comprises the steps: carrying out the prediction of an initial grinding parameter through a pre-established thickness-grinding rate model according to the thickness initial distribution data of a wafer; the thickness-grinding rate model is constructed according to grinding process data of a wafer with a groove isolation structure; sending the initial grinding parameters to grinding equipment so as to control the grinding equipment to grind the grinding film layer; monitoring thickness allowance distribution data of the grinding film layer in the grinding process; the initial grinding parameters are adjusted according to the thickness allowance distribution data, and adjusted grinding parameters are obtained; and the adjusted grinding parameters are sent to the grinding equipment so as to control the grinding equipment to dynamically adjust the grinding rate. By adopting the method, the grinding parameters are dynamically adjusted in the grinding process, the process stability is improved, and the chip yield is improved.

The utility model relates to a polishing system of a germanium single crystal wafer for a high-flatness ultra-thin solar cell, which comprises a rough polishing mechanism, a rough polishing mechanism and a polishing mechanism, the rough polishing mechanism comprises a rough polishing machine fixed disc, rough polishing cloth arranged on the upper end face of the rough polishing machine fixed disc, a rough polishing grinding head arranged above the rough polishing machine fixed disc, and a rough polishing ceramic disc arranged at the grinding end of the rough polishing grinding head; the semi-fine polishing mechanism comprises a semi-fine polishing machine fixed disc, semi-fine polishing cloth arranged on the upper end face of the semi-fine polishing machine fixed disc, a semi-fine polishing grinding head arranged above the semi-fine polishing machine fixed disc and a semi-fine polishing ceramic disc arranged at the grinding end of the semi-fine polishing grinding head. The fine polishing mechanism comprises a fine polishing machine fixed disc, fine polishing cloth arranged on the upper end face of the fine polishing machine fixed disc, a fine polishing grinding head arranged above the fine polishing machine fixed disc and a fine polishing ceramic disc arranged at the grinding end of the fine polishing grinding head. By means of rough polishing, surface attachments and stains can be removed, machining allowance can be rapidly removed, efficiency is improved, and size control and flatness can be gradually achieved through semi-fine polishing and fine polishing.

The invention relates to polishing equipment, a polishing method, an evaluation method and a polished silicon wafer. In one aspect, a polishing apparatus is provided, the polishing apparatus comprising: a carrier provided with a hole open to a side of the carrier, the hole for receiving a silicon wafer to be polished; the substrate is located on one side of the side face of the carrier, and a polishing pad is arranged on the side face, opposite to the side face, of the substrate; and the driving mechanism is used for driving the substrate and the carrier to do relative linear motion, so that the silicon wafer is linearly polished through the polishing pad. Therefore, the polishing effect difference of different areas of the silicon wafer can be reduced, and the polishing uniformity of the different areas of the silicon wafer is improved.

The application relates to the field of optical fiber grinding equipment, in particular to an optical fiber grinding machine. The optical fiber grinding machine comprises a machine body, a holder and a control element, the machine body comprises a machine box, a grinding disc and a driving mechanism, the holder and the grinding disc are arranged above the machine box, the holder comprises a support frame and a clamp, the support frame is fixed relative to the machine box, the clamp is installed on the support frame, and the clamp is suitable for clamping an optical fiber; the grinding disc is installed between the top surface of the machine box and the clamp in the vertical direction, the driving mechanism is installed on the machine box and can drive the grinding disc to rotate so as to grind the optical fiber clamped by the clamp; the grinding disc and the clamp are both conductive parts, the grinding disc is electrically connected with the control element through a first wire, the clamp is electrically connected with the control element, the control element is signal-connected with the driving mechanism; when the bottom surface of the clamp contacts the grinding disc, the grinding disc, the clamp and the control element form a conduction loop, the control element collects the electric signal of the conduction loop and controls the driving mechanism to stop working.

This invention discloses a grinding tool for a high-rigidity precision mold guide post, relating to the field of guide post grinding technology. It includes a grinding assembly for grinding the guide post and checking its dimensional accuracy. The grinding assembly comprises a grinding component, a support switching component, and an inspection component. The grinding component grinds the guide post, the support switching component clamps and switches the positions of the two guide posts, and the inspection component checks the grinding status of the guide post. The grinding component includes a fixed stage and a moving stage. The support switching component is mounted on the moving stage, and the inspection component is mounted on the fixed stage. Through the operation of the grinding assembly, two guide posts can operate in parallel with station switching, allowing grinding and inspection of the guide posts to be performed simultaneously. A single guide post can quickly switch between grinding and inspection positions, ensuring that one guide post is always being ground while another is being inspected. This utilizes the idle time of existing grinding processes, improving the production efficiency of guide post grinding.

This invention provides a processing apparatus that removes a wafer from a holding surface in a short time without causing it to break. The wafer, held by a transport pad, is raised from the holding surface. When the entire lower surface of the wafer has left the holding surface, an air flow regulating valve is opened to eject air from the holding surface. As the distance between the holding surface and the wafer leaving the holding surface increases by raising the transport unit, the opening degree of the air flow regulating valve is adjusted to increase the air flow, thereby preventing the wafer from breaking and allowing it to leave the holding surface in a short time.

The application provides a roll diameter detection assembly and a substrate grinding device, and relates to the technical field of semiconductor substrate grinding. The substrate grinding device comprises a first roller, a first oscillating member, a first pressing part, a first angle measuring sensor, a third oscillating member and a third pressing part. The first roller is provided with a grinding roll belt. The first oscillating member is arranged on one side of the first roller. The first pressing part is arranged on the first oscillating member and is used for adaptively pressing on the circumferential surface of the roll belt on the first roller. The first angle measuring sensor is used for measuring the oscillation angle of the first oscillating member. The third oscillating member is arranged on the same side of the first roller. The third pressing part is arranged on the third oscillating member and is used for adaptively pressing on the circumferential surface of the roll belt on the first roller. The third pressing part and the first pressing part are respectively located on the upstream and downstream of the lead wire of the roll belt. The first pressing part is configured to press on one more layer of the roll belt than the third pressing part.

This utility model discloses a center hole grinding machine, belonging to the field of material processing technology. It includes a slide rail body, a head ejector seat and a tail ejector seat oppositely disposed at both ends of the slide rail body and slidably connected to the slide rail body via a slider, a front processing ejector fixed inside the head ejector seat, a rear processing ejector located inside the tail ejector seat, and a chuck for clamping shaft-machined parts. The slider is equipped with a locking component. The tail ejector seat is equipped with an elastic pressing assembly that drives the rear processing ejector to move axially. A dial is rotatably connected to the outside of the front processing ejector via a bearing. A lever is fixed on the dial for driving the chuck to rotate coaxially. A continuously variable motor for driving the dial is installed on the head ejector seat. This utility model improves the grinding uniformity and processing accuracy of the two electrode machining holes, ensuring the coaxiality of the center hole after grinding.

The invention relates to the technical field of semiconductor packaging, in particular to high-uniformity automatic layer removing equipment for a 3D packaged chip and a control method. A high-uniformity automatic layer removing device for a 3D packaging chip comprises a rack, an outer function disc and a center support, and is characterized in that the center support is connected to the middle of the rack, and the outer function disc is arranged on the outer edge of the rack. Compared with the prior art, the 3D packaging chip high-uniformity automatic layer removing equipment and the control method have the advantages that through the equipment and the method, the size needing to be thinned is set, automatic high-precision thinning and layer removing of a sample can be achieved, the thinned sample is good in flatness, the removed sample layer is high in size precision, and the production efficiency is improved. And abnormal points and a line state diagram of the hierarchy where the failure points are located can be effectively observed.

The invention provides glass substrate multi-axis cooperative grinding equipment which comprises a machine table, a first multi-axis driving unit is assembled on the top of the machine table, a grinding unit used for grinding is assembled on the front face of the first multi-axis driving unit, a placing assembly is fixedly installed on the top of the machine table, and the placing assembly and the grinding unit are correspondingly matched with each other; a second multi-shaft driving unit is arranged on the front side of the machine table, a processing unit is arranged on a driving assembly of the second multi-shaft driving unit, and a loading unit is arranged on one side of the machine table and used for being matched with the processing unit; the grinding unit comprises a mounting cross beam, a grinding disc assembly and a spraying assembly. A glass substrate can be stably clamped, the position of the substrate can be adjusted through the position changing assembly, the position of the detection assembly can be switched, the detection assembly linearly moves along with the position changing assembly, full-surface detection of the substrate is achieved, and defect omission is avoided; the multi-axis driving unit drives the processing unit to move flexibly, and it is ensured that the substrates are in accurate butt joint in the grinding, detecting and loading links.

The utility model discloses peripheral support internal control grinding equipment, and belongs to the technical field of medical instrument machining equipment. Comprising a grinding assembly sleeved with a support. The clamping assembly is arranged on the outer side of the support and used for clamping and fixing the support; the grinding assembly is connected with a driving assembly, and the driving assembly drives the grinding assembly to grind the inner wall of the support. The to-be-ground support is arranged on the grinding assembly in a sleeving mode, the to-be-ground support is fixed through the clamping assembly and makes contact with the to-be-ground support, and then the grinding assembly and the to-be-ground support move relatively under work of the driving assembly, so that grinding of the inner wall of the support is achieved; and the grinding degree can be adjusted by controlling the power of the driving assembly, so that the grinding process is controllable, accurate and efficient, and the qualification rate of grinding the peripheral support is greatly increased.

A wafer processing apparatus according to an embodiment of the present application can include a turntable rotating about a rotation axis to position a grinding area for grinding a wafer and a polishing area for polishing the wafer, a plurality of chuck tables disposed on the turntable for the wafer to be placed thereon, a grinding device for grinding the wafer positioned at the grinding area, a polishing device for polishing the wafer ground by the grinding device, a frame dividing the grinding area and the polishing area on the turntable, and a moisture removing portion disposed on the frame for removing moisture of the wafer moved from the grinding area to the polishing area by rotation of the turntable.

The utility model discloses a high-precision dynamic balance compensation device for a grinding disc, relates to the technical field of grinding processing equipment, aims to solve the problems of unsmooth feeding and influence on efficiency caused by easy inclination and unbalance of materials during automatic feeding in the prior art, and comprises a base, a circulating water tank, a material disc, a grinding disc, a feeding table and the like. The compensation device is arranged on the feeding table support and comprises a two-way threaded rod, a connecting plate, a sliding guide rod and a clamping plate, the two-way threaded rod is driven to drive the clamping plate to move, and the position of materials in the feeding table is adjusted or fixed. And it is guaranteed that the materials smoothly and stably fall into the material holes, and the continuity of grinding work and the production efficiency are improved.

The utility model discloses a grinding tool for glasses legs, which comprises a limit component, a grinding component and a grinding component, and the limit component comprises a hook, a screw, a nut, a movable plate and a connecting pipe; the hook is located at the top of the screw. The nut is in threaded connection with the screw. Through the arrangement of the limiting assembly, when the glasses legs need to be machined, rotating force is applied to the connecting pipes, the distance between the nuts and the connecting pipes is increased, and pulling force is applied to the movable plates located outside, so that the distance between the two sets of movable plates is increased, and the tops of the glasses legs are buckled outside the hooks; the bottoms of the glasses legs are inserted between the two groups of movable plates, pushing force is applied to the movable plates, and the bottoms of the glasses legs are fixed in the movable plates, when the glasses legs are mounted, the glasses legs are fixed by the hooks positioned in the middle, and then the glasses legs are mounted on the hooks positioned on the two sides, so that the scheme can quickly fix the multiple groups of glasses legs in required positions, and the mounting efficiency is improved. And the grinding efficiency of the glasses legs is improved.

The application discloses a high-precision optical lens production grinding device, relates to the technical field of optical lens grinding, and comprises a grinding box and a connecting table arranged on one side of the grinding box. The inside of the grinding box is provided with a grinding assembly. The top of the connecting table is provided with a driving assembly. The driving assembly is used in cooperation with the grinding assembly. An adjusting assembly is connected to the driving assembly. The bottom of the grinding box is provided with a reflux filtering assembly. The reflux filtering assembly comprises a reflux box arranged at the bottom of the grinding box. The bottom of the reflux box is provided with a leakage hole. A bushing is arranged on the outer wall of one side of the reflux box. The high-precision optical lens production grinding device disclosed by the application can improve the cleanliness of the recycled grinding liquid, thereby guaranteeing the grinding effect of high-precision optical lenses.

The application provides a bearing assembly for chemical mechanical polishing, comprising a damping module, a driving module and a bearing head; wherein the damping module comprises a spindle with a cavity inside and a first damping unit in the cavity, the first damping unit comprises a core and a plurality of damping blocks arranged on the outer wall of the core, the damping blocks extrude the inner wall of the cavity to absorb the transverse vibration of the spindle. The core is placed in the spindle, which enhances the damping and anti-vibration effect, in addition, the plurality of damping blocks arranged on the outer wall of the core can absorb the transverse excitation generated from the polishing head grinding, the compression resistance of the damping blocks is fully utilized, the original shearing and tensile working state is changed to a compression working state, the transverse damping capacity is increased, and the reset and limiting effects are also exerted.

The utility model provides a retaining ring space ring component for double-sided polishing of a mask substrate, and belongs to the technical field of precision optical device machining. The retaining ring space ring component for double-sided polishing of the mask substrate comprises a main body part, a retaining ring and a retaining ring, and a hollow area suitable for embedding a substrate workpiece is formed on the main body part; and the supporting protrusions are formed on the top surface of the main body part, distributed on the edge of the hollowed-out area and suitable for abutting against the polishing pad in the polishing process of the substrate workpiece. According to the retaining ring space ring component for double-sided polishing of the mask substrate, fold springback of the polishing pad can be restrained, substrate workpiece corner collapse caused by fold of the polishing pad is avoided, and the flatness and polishing precision of the polished surface of the mask substrate are improved.

A system and method for detecting movement of a sample subjected to a polishing operation in a vibratory polisher is disclosed. The system includes a sample holder for securing a sample to be polished. A housing supports a platen on which the sample holder is disposed. The platen allows movement of the sample holder during the polishing operation as the sample holder traverses a polishing fluid dispensed around the platen. One or more sensors are disposed around the housing and operable to monitor movement of the sample holder on the platen relative to the housing.

The utility model discloses an angle positioning device for FA (Fiber Array) grinding, relates to the technical field of grinding positioning devices, aims to solve the technical problem that the current optical fiber grinding angle fixing device adopts a single fixing structure and is tedious to operate, and comprises an outer ring, an inner disc, an inserting mechanism, a locking mechanism and an adjusting sheet, a hoisting rod is fixed to the middle of the upper end face of the inner disc, side connectors are formed in the outer side of the inner disc in an annular array mode, wiring grooves are formed in the side connectors at equal intervals, butt joint pieces are fixed into the wiring grooves, adjusting openings are formed in the two ends of the interior of each side connector, and the outer rings are fixed to the outer side of the inner disc through connecting screws after being connected in a sleeving mode. Inserting openings are formed in the outer side of the outer ring in an annular array mode, the inserting-connecting mechanisms are inserted into the inserting openings in a sliding mode, the inserting-connecting mechanisms are composed of inserting-connecting boxes, and side blocks are fixed to the two ends of each inserting-connecting box. The utility model has the advantages that the operation is simple, a plurality of optical fiber ends in the light array are positioned in one step, and the operation difficulty is reduced.