1403results about "Work carriers" patented technology

The invention discloses a UPA pressure automatic compensation system and method for mask substrate polishing. The UPA pressure automatic compensation system comprises a pressure execution module, a distributed sensing feedback network and an intelligent control unit. Wherein the pressure execution module is used for directly polishing a mask base plate and comprises a force application shaft, a polishing head, an air source, a UPA air bag and an electric proportional valve, the distributed sensing feedback network comprises an air path pressure sensor and a tail end contact pressure sensor, and the intelligent control unit receives a collection signal of the distributed sensing feedback network and sends the collection signal to the polishing head. On the basis of a current process formula and process parameter coupling model, a data fusion algorithm, a feed-forward compensation algorithm and a fuzzy PID algorithm are operated to obtain a feed-forward compensation amount and a fuzzy PID output amount, the feed-forward compensation amount and the fuzzy PID output amount are superposed, a total control voltage is generated and output to an electric proportional valve, and then the input air pressure of a UPA air bag is adjusted. Therefore, closed-loop control over the polishing pressure of the mask substrate is achieved. Through multi-sensor data fusion, fuzzy PID self-adaptive control and intelligent feed-forward compensation based on a process parameter coupling model, real-time, accurate and constant control of the polishing pressure is realized, so that the surface precision and yield of the mask substrate are improved.

The invention provides a wafer positioning device and wafer grinding equipment thereof, and belongs to the technical field of wafer processing equipment.The wafer positioning device comprises a clamping positioning system, a vacuum rotary carrying table system, a control module and an image recognition system, and the clamping positioning system, the vacuum rotary carrying table system, the image recognition system and the control module cooperate to achieve the purpose of positioning the wafer. The problem that in the prior art, the flat edge and the notch angle of a wafer cannot be recognized is accurately solved, centering is achieved only through synchronous radial movement of a plurality of clamping jaws without an additional moving shaft, and after an image recognition system confirms that the wafer is coaxial with a fixed shaft, a control module directly controls a vacuum rotating carrying table system to adsorb the wafer and rotate, and the wafer is accurately positioned. The space requirement of a clean room is met, the precision is prevented from being influenced by displacement difference, the offset recalculation link is omitted, the efficiency is improved, and the high-precision grinding requirement of the advanced manufacturing process is met.

The utility model provides a photoelectrocatalysis assisted chemical mechanical polishing device which comprises a platform, a polishing disc, a transparent polishing pad, a polishing head, a photosensitive polishing solution swing arm and an ultraviolet lamp bead, the polishing disc is rotationally connected to the upper portion of the platform, and the transparent polishing pad is arranged on the polishing disc in a stacked mode. The photosensitive polishing liquid swing arm is connected to the platform and used for spraying polishing liquid to the transparent polishing pad layer, a liquid passing hole is formed in the transparent polishing pad layer in a penetrating mode, the polishing head is connected with the positive electrode of the power source, the polishing disc is connected with the negative electrode of the power source, and the ultraviolet lamp beads are embedded in the polishing disc. According to the photoelectrocatalysis-assisted chemical mechanical polishing device provided by the utility model, the photosensitive polishing solution swing arm is used for spraying the photosensitive polishing solution, and the ultraviolet lamp beads are arranged on the polishing disc, so that ultraviolet light irradiates the photosensitive polishing solution or a wafer below the polishing head through the transparent polishing pad, and strong-oxidation active groups are synchronously generated; the oxidation rate of silicon carbide on the surface of the wafer is improved, and the polishing efficiency of the wafer is improved.

The utility model provides an auxiliary driving device, a polishing mechanism for wafer processing and polishing equipment. The auxiliary driving device comprises an auxiliary driver; the magnetic coupling mechanism comprises an electromagnetic wheel and a conductive gear opposite to the electromagnetic wheel; the electromagnetic wheel is configured to be driven to rotate by the auxiliary driver; the conductive gear is provided with a conductive disc and a gear surrounding the conductive disc, and the conductive gear is in power connection with a polishing head station switching mechanism of the polishing equipment; the electromagnetic wheel is configured to have magnetism when powered on so as to be in magnetic connection with the conductive gear, so that power of the auxiliary driver is transmitted to the polishing head station switching mechanism through the conductive gear, and polishing head station switching is conducted. According to the polishing mechanism, the polishing head station switching mechanism can be driven by the auxiliary driver to conduct polishing head station switching and posture adjustment, and the maintenance or repair convenience of the polishing mechanism is improved.

The utility model relates to the technical field of ball valves, in particular to a sliding support type ball valve ball body grinding device which comprises a grinding table and a ball body, a rotating motor is arranged on the inner side of the grinding table, an installation frame and a bearing disc are fixedly installed on the top of the grinding table respectively, and a grinding oil tank and a hydraulic rod are fixedly arranged on the top of the installation frame respectively. An oil pump is arranged at the top of the grinding oil tank, a supporting column is arranged at the bottom end of a hydraulic rod, an annular pipe is arranged at the bottom of a mounting frame, a fixing rod is rotationally arranged at the top of a bearing disc through a bearing, a mounting hole is formed in the surface of the bottom of a ball, and grinding sleeves are arranged on the outer sides of the ball correspondingly. An adjusting mechanism is arranged between the grinding sleeve and the grinding table, through the arrangement of the sliding support type ball valve ball grinding device, the purpose of accurately adjusting the position of the grinding sleeve is achieved through the structural design in the adjusting mechanism, and it is guaranteed that a ball is evenly ground.

The utility model relates to an efficient silicon carbide wafer grinding device which comprises a base, two positioning assemblies and a grinding assembly are arranged on the base, and the centers of the two positioning assemblies and the grinding assembly are arranged in an isosceles triangle shape with the grinding assembly as the top. The positioning assembly comprises a first telescopic cylinder, the output end of the first telescopic cylinder is connected with a supporting disc, a suction cup frame is arranged outside the first telescopic cylinder below the supporting disc, a plurality of suction cups are fixedly arranged outside the suction cup frame around the first telescopic cylinder, through holes for containing the suction cups are formed in the supporting disc, and wafers are positioned through cooperation of the suction cups and the supporting disc; the grinding assembly comprises a rotating motor, the output end of the rotating motor is connected with a swing arm, the tail end of the swing arm is connected with a second telescopic cylinder, the output end of the swing arm is connected with a grinding motor, the output end of the grinding motor is connected with a grinding head, and the rotating motor enables the grinding head to be switched between the two positioning assemblies to alternately grind the positioned wafers. According to the efficient silicon carbide wafer grinding device, the wafer grinding efficiency can be obviously improved.

A skate blade sharpening system used to sharpen the blades of ice skates. The skate sharpener can include a housing that includes an elongated slot for receiving the blade of an ice skate for sharpening, and clamp jaws for retaining the skate. The housing can include at least one slot cover to engage the skate blade. Engagement of the skate blade can be sensed by a controller to enable sharpening operations to proceed. The skate blade sharpening system can automatically operate a grinding wheel and move the rotating grinding wheel back and forth along the lower face of the skate blade a desired number of times to sharpen the skate blade.

An object 102 to be polished is resin-sealed in a resin-sealed sample 105. The resin-sealed sample 105 is gripped by a holder 721 of a robot arm, and the bottom surface of the resin-sealed sample 105 is pressed against a polishing table 107 to polish a target surface 602. A cleaning liquid is applied to the polishing table 107 from a cleaning liquid supply nozzle 207. The target surface 602 is covered with the cleaning liquid. Light from a light emitter 201 passes through a polarizing plate 202a, and the target surface 602 is irradiated with polarized light 205a. Reflected light, which is the polarized light 205a reflected off the target surface 602, passes through a polarizing plate 202b, and the reflected light 205b enters a camera 206.

The invention discloses an electrochemical mechanical polishing head, a polishing device and a polishing method, and belongs to the technical field of wafer manufacturing. The electrochemical mechanical polishing head comprises a coupling disc and a polishing head, wherein a positioning hole is formed in the center of the coupling disc; the bearing disc is provided with a shaft part in a matched mode, and the shaft part is connected into the positioning hole in a sliding mode, so that the bearing disc rotates along with the coupling disc and / or moves in the vertical direction; the conductive elastic film is arranged below the bearing disc and is used for loading a wafer to be processed; the retaining ring is arranged below the bearing disc and is positioned on the peripheral side of the elastic film; the electric connection assembly is vertically arranged in a mounting hole configured along the shaft part, one end of the electric connection assembly is connected with a power supply, and the other end of the electric connection assembly is connected with a central cavity of the elastic film, so that a wafer to be processed is located in an electric field formed between the elastic film and the polishing solution; at least part of the electric connection assembly is a flexible part and stretches out and draws back in the vertical direction to adapt to deformation of the elastic film, and then a stable electric field is formed between the elastic film and the polishing solution.

The utility model discloses a ferrite magnetic core grinder, which relates to the field of ferrite magnetic core grinding and comprises a working platform, a grinding roller for grinding a magnetic core is mounted on the outer wall of the working platform, a movable plate is further mounted on the outer wall of the working platform in a sliding manner, and a lifting plate is vertically mounted at the top end of the movable plate in a sliding manner. The transmission mechanism is arranged on the movable plate and the lifting plate; the transmission mechanism comprises a limiting unit and a clamping unit; and the clamping unit is used for clamping the magnetic core. By arranging the transmission mechanism, when a magnetic core needs to be ground, the magnetic core can be clamped through the lead screw and the clamping block, the height of the lifting plate is adjusted by releasing limiting of the limiting block and the guide rod, the magnetic core is made to move to the needed height to make contact with the grinding roller to be ground, and compared with a traditional lifting mode, the magnetic core grinding device has the advantages that the magnetic core grinding efficiency is improved. By means of the structure, a user can conveniently and accurately adjust the height, and working efficiency is improved.

A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.

The utility model discloses efficient and energy-saving facet type automobile crystal gear shifting toggle grinding and polishing equipment which comprises a support and a grinding and polishing device, a displacement mechanism used for driving the grinding and polishing device to move in a three-dimensional mode is arranged above an inner cavity of the support, and a rotating mechanism used for driving the grinding and polishing device to rotate is arranged at the bottom of the displacement mechanism. A clamping mechanism used for clamping and fixing the facet type automobile crystal gear shifting toggle button is arranged below an inner cavity of the support, a second stepping motor used for driving the clamping mechanism to turn over is arranged on the support, and a liquid spraying mechanism used for conveying polishing liquid is arranged on the support. An adjusting mechanism used for adjusting the spraying angle of the polishing solution is arranged between the solution spraying mechanism and the rotating mechanism, and a collecting mechanism used for collecting the polishing solution is arranged at the bottom of the support. According to the multi-angle grinding and polishing device, multi-angle grinding and polishing can be achieved, the polishing time is effectively shortened, the polishing efficiency is improved, redundant polishing liquid can be collected and recycled in a unified mode through the collecting mechanism, and the purposes of high efficiency and energy saving are achieved.

The utility model belongs to the technical field of grinding equipment manufacturing, and discloses a grinding device which comprises a bracket, a retaining ring, an upper flange, an upper cover ring, a main body, a protective seat, an air bag rubber diaphragm, an edge pressing block and a positioning sealing seat, a retaining ring is arranged below the bracket; an upper cover ring is arranged above the bracket; a main body is fixedly arranged inside the upper cover ring; an upper flange is arranged above the main body; a positioning sealing seat is arranged between the bracket and the main body; a protective seat is arranged on the main body; an air bag rubber diaphragm is fixedly arranged below the protective seat; the air bag rubber diaphragm can be used for adsorbing and fixing a to-be-ground part; an edge pressing block is detachably arranged on the inner side of the air bag rubber diaphragm; the edge of the to-be-ground part is jacked and pressed through the edge pressing block; and a sealing ring seat is detachably and fixedly arranged on the protective seat. Through the combined design of the air bag rubber diaphragm, the protective seat and the edge pressing block, the grinding pressure can be ensured to be more uniformly distributed on the surface of the to-be-ground part in the grinding process of the to-be-ground part.

The invention discloses a wafer chemical-mechanical planarization control system, which is characterized by comprising a chemical-mechanical planarization system, a chemical-mechanical planarization control system, a chemical-mechanical planarization control system, a chemical-mechanical planarization control system and a chemical-mechanical planarization control system, the integrated detection system is used for acquiring wafer flatness information; the APC data analysis system is used for acquiring wafer flatness information of the integrated detection system and wafer polishing process parameters of the control system and generating the wafer polishing process parameters; and the control system is used for inputting wafer polishing process parameters and feeding back the wafer polishing process parameters to the chemical mechanical planarization system for polishing the next wafer. The invention also discloses a wafer chemical mechanical planarization control method. The APC data analysis system is introduced into detection of the CMP polishing effect, the measured value can be fed back to the chemical mechanical planarization system in time, the technological parameters of the chemical mechanical planarization system are corrected in time, equivalently, the technological parameters are corrected according to the difference of the real-time state of the chemical mechanical planarization system, and the overall polishing effect is better.

The invention discloses a positioning clamp for CMP polishing equipment, and relates to the technical field of wafer processing clamps, the positioning clamp comprises a shell, a supporting disc, an adsorption assembly, a positioning assembly and a driving assembly, and the shell is a cylindrical shell; the supporting disc is fixedly installed on the upper edge of the shell and used for supporting the wafer. The adsorption assembly comprises a plurality of adsorption pieces used for adsorbing wafers, and the adsorption pieces are movably arranged in a mounting cavity formed in the supporting disc; the positioning assembly comprises a plurality of guide grooves formed in the supporting disc, positioning rods are arranged in the guide grooves in a sliding mode, and the positioning assembly further comprises a control piece used for controlling the multiple positioning rods to move synchronously. By arranging the positioning assembly, the wafer is aligned and positioned, downward pressure is applied to the wafer, the wafer and the suction cup are attached and adsorbed, the stability of the wafer is improved, the wafer is effectively prevented from shifting or shaking in the machining process, meanwhile, the positioning rod is made to be far away from the wafer, the polishing face of the wafer is fully exposed, and the polishing efficiency is improved. And the surface of the wafer can be fully polished.

The invention relates to a sapphire wafer back surface roughening method, which is based on a planetary double-sided grinding machine platform, and comprises the following steps: firstly, bonding the front surface of a low-TTV sapphire wafer subjected to double-sided accurate grinding and polishing to the surface of a ceramic plate, then fixing the ceramic plate on a wandering star wheel, then placing the wandering star wheel on a lower grinding plate, and grinding the sapphire wafer back surface with the lower grinding plate; wherein the back surface of the wafer faces the lower grinding disc; the upper grinding disc is forbidden, a sun gear and inner gear transmission mechanism is utilized, the wandering star wheel rotates on the lower grinding disc to form a precise grinding interface, and roughening of the back face of the sapphire wafer is achieved by regulating and controlling the rotating speed of the sun gear, the inner gear and the wandering star wheel. According to the method, on one hand, wafer thickness uniformity and parallelism control is achieved through the double-face polishing technology, on the other hand, low TTV control over the obtained single polished wafer is achieved in the roughening process through combination of equipment design and technology innovation, and the method is suitable for the 8-12-inch sapphire wafer and can be applied to the fields needing high-precision thickness control such as LED or semiconductor manufacturing.

The utility model relates to the technical field of gauge block grinding, in particular to a gauge block machining grinding plate device which comprises a base, the middle end of the top of the base is fixedly connected with an n-shaped frame, an electric push rod is fixedly installed at the middle end of the top of the n-shaped frame, and the extending end of the electric push rod is fixedly connected with a movable plate. Fixing blocks are fixedly connected to the left end and the right end of the bottom of the movable plate, driving threaded rods are movably connected to the inner sides of the two fixing blocks through bearings, and driving motors fixedly connected with the right sides of the driving threaded rods are fixedly mounted on the right sides of the fixing blocks. Through cooperation of the structures, the device has the advantage of being good in grinding quality, and the problems that most of grinding plates on existing grinding equipment grind gauge blocks in a reciprocating type linear track or a reciprocating type annular track, the same part of the gauge blocks can be repeatedly ground in the grinding mode, and the grinding efficiency is poor are solved. And grinding traces caused by repeated grinding can influence the surface quality of the gauge block.

The invention discloses a high-precision vertical double-sided grinding / polishing machine, which belongs to the technical field of grinding and polishing machines and comprises an upper disc device, a central transmission device and a lower disc supporting device, and both the upper disc device and the central transmission device are supported by the lower disc supporting device; the center transmission device comprises a main shaft supporting plate, an oil cylinder body is arranged on the main shaft supporting plate, a mounting cavity used for mounting a sun wheel shaft is formed in the inner side of the oil cylinder body, and the sun wheel shaft is arranged in the mounting cavity. An oil cylinder sleeve is arranged on the outer side of the oil cylinder body, a gear ring tray is arranged on the oil cylinder sleeve, an inner gear ring is arranged on the gear ring tray, the sun wheel shaft is arranged on a triangular fork through a first bearing, and the triangular fork is connected with the oil cylinder sleeve through a connecting rod. The problem that in the prior art, it is difficult to guarantee high-precision and high-rigidity synchronous lifting of a sun gear and an inner gear ring is solved.

A semiconductor manufacturing device includes: a turntable configured to be rotatable and having a first surface; a polishing pad provided on the first surface; a first support portion configured to rotatably hold the turntable; a top ring having a second surface and including a suction mechanism that holds an object to be processed on the second surface; a second support portion configured to rotatably hold the top ring; a first member to come into contact with the turntable or top ring; a second member to come into contact with the polishing pad or suction mechanism and with the turntable or top ring via the first member; and a first acoustic emission sensor to come into contact with the second member.

The invention relates to a precision pipe fitting weld joint polishing treatment device and a treatment method thereof. The device comprises a fixing base and a polishing assembly, the polishing assembly comprises a center block, walking supporting structures are fixed to the two ends of the center block, two supporting rings are rotatably installed on the outer side of the center block, a rotating plate is fixed between the two supporting rings, and a transmission gear ring is fixed to the inner side of one end of the rotating plate; a transmission gear is installed on the inner side of the transmission gear ring in a meshed mode, the transmission gear is axially connected with a polishing motor, the polishing motor is fixed to the interior of one end of a center block, the other end of the center block is provided with an air hole, the air hole penetrates through the center block, a plurality of adjusting electric telescopic rods are inserted into the surface of the rotating plate, and polishing pads are fixed to the outer ends of the adjusting electric telescopic rods. Leakage of the polishing agent can be reduced, the polishing time is shortened, and the polishing efficiency is improved.

Information processing device that includes: an information acquisition unit that acquires reliability degradation factor state information in a chemical mechanical polishing process of a substrate performed by a substrate processing device, the reliability degradation factor state information including at least one of wear state information indicating a wear state of components of the substrate processing device and processing state information indicating a processing state during polishing; and a state prediction unit that predicts reliability information of a polishing endpoint detection function for the reliability degradation factor state information by inputting the reliability degradation factor state information acquired by the information acquisition unit into a learning model that has been trained through machine learning to learn a correlation between the reliability degradation factor state information and reliability information of the polishing endpoint detection function that indicates reliability of an endpoint detection function that detects that the chemical mechanical polishing process has reached an endpoint.

The present invention relates to techniques for calculating polishing rate responsiveness with respect to a change in the pressure with which a workpiece used for manufacturing a semiconductor device, such as a wafer, a substrate, or a panel, is pressed against a polishing pad. A method of the present invention comprises: calculating by simulation a pressing-pressure responsiveness profile indicating a distribution of pressing-pressure applied from a workpiece to a polishing pad (2) as the pressing-pressure changes in response to a change of unit pressure in a pressure chamber of a polishing head (7); polishing the workpiece by pressing the workpiece against the polishing pad with the interior of the pressure chamber maintained at a predetermined pressure; creating a polishing rate profile indicating a polishing rate distribution of the workpiece being polished; and creating a polishing rate responsiveness profile on the basis of the pressing-pressure responsiveness profile, the predetermined pressure, and the polishing rate profile.

The invention relates to the technical field of semiconductor polishing, in particular to a polishing carrier and a flyer detection method.The polishing carrier comprises a carrier body, the carrier body comprises a first base and a second base which are stacked, and the second base is used for bearing a to-be-polished piece; the detection part is arranged on the second seat and located on the outer side of the range covered by the first seat; the detection assembly comprises a laser sensor, and the detection assembly is arranged on the outer side of the carrier body, located above the detection part and used for monitoring the displacement change of the detection part in the direction perpendicular to the plane where the to-be-polished piece is located. The technical problem that the flyer condition cannot be accurately identified and timely coped in the polishing process is solved, and the technical effect of accurately identifying and timely coping the flyer condition is achieved.

The invention relates to the technical field of grinding devices, in particular to a cylindrical injection molding part grinding device which comprises a grinding platform and a lower grinding disc installed at the top of the grinding platform, an upper grinding disc is installed at the top of the lower grinding disc, a cleaning structure is arranged at the top of the grinding platform, and a plurality of positioning plates for supporting workpieces are installed at the top of the lower grinding disc. By adopting the composite design of the slidable and rotatable cleaning cylinder, the peripheral cleaning brush and the internal negative pressure cavity, the cleaning brush is made of a flexible wear-resistant material, can rotate and slide along with the cleaning cylinder, goes deep into microcosmic lines and blind areas of a grinding disc, and mechanically peels off stubborn grinding dust, and meanwhile, the dust suction pump works to form negative pressure in the cleaning cylinder, so that the cleaning effect is improved. Scraped abrasive dust and grinding liquid are sucked synchronously through the peripheral dust suction holes, secondary attachment of the abrasive dust is avoided, the cleaning efficiency is improved, the secondary scratch rate of workpieces is reduced, the grinding and cleaning procedures are automatic, and all-region dead-corner-free cleaning of the abrasive dust is achieved.

The invention discloses a bearing balance block grinding tool and method, and belongs to the technical field of bearing balance block machining. The technical problems that in the horizontal grinding machining process of an existing balance block with the contact face being an arc spherical face, due to the fact that the balance block cannot serve as an alignment reference, deviation is prone to occurring in the machining process, and the machining precision is insufficient are solved. The base comprises a plurality of first bosses evenly distributed in the horizontal circumferential direction, the abrasive paper is pasted to the top faces of the first bosses, the clamping block is in a cylindrical pipe shape, a conical hole is formed in the lower portion of the inner wall of the clamping block, four sets of positioning grooves are evenly formed in the upper end of the clamping block in the circumferential direction, and each set of positioning grooves is provided with two adjacent notches. A compression spring is sleeved on a second boss in the middle of the positioning groove, the upper portion of the rotating shaft is cylindrical, four groups of double-fork type positioning teeth are evenly arranged at the bottom of the rotating shaft in the circumferential direction, and the positioning teeth are installed in a notch of the positioning groove in a sliding mode in the vertical direction. And the machining precision is improved. The grinding device is used for grinding the balance block for the bearing.

The invention discloses a feeding and discharging device of polishing equipment and the polishing equipment. The feeding and discharging device of the polishing equipment comprises a polishing head; the lifting driving part selectively drives the bottom plate to lift; the bearing plate is arranged between the bottom plate and the blasting head and is connected with the bottom plate; the upper side of the bearing main board is provided with a plurality of wafer detection sensors, and the plurality of wafer detection sensors are arranged on the edge of the bearing main board at intervals in the circumferential direction. Therefore, through synchronous lifting of the bottom plate and the bearing plate, the bottom plate and the bearing plate are close to or away from the polishing head, feeding and discharging of the wafer can be rapidly and directly achieved, the wafer guide column and the wafer detection sensor are integrated on the bearing main plate, the feeding and discharging speed of the wafer can be further increased, the wafer transmission time can be effectively shortened, and the process yield can be improved. Besides, the wall thickness of the bearing ring is set to be smaller in a reasonable range, so that the contact area between the bearing plate and the wafer can be reduced, and indentations generated on the surface of the wafer by the polishing solution can be reduced.

The invention discloses a grinding device and a control method thereof. The grinding device comprises a grinding assembly, a measuring unit and a control unit. The grinding assembly comprises a grinding head and a grinding pad, and the grinding head is used for pressing a wafer to be ground on the surface of the grinding pad. The measuring unit is coupled with the grinding assembly and is configured to determine an actual measured value, and the actual measured value represents the actual contact area of the measuring unit and the part of the grinding fluid output to the grinding assembly. The control unit is coupled with the grinding assembly and the measuring unit and is configured to adjust the liquid flow of the grinding liquid according to the actual measured value. Through the arrangement of the technical characteristics, the accuracy of liquid flow control of the grinding liquid in the wafer grinding process can be improved.

The invention discloses high-stability ferrite core automatic grinding equipment, and belongs to the technical field of machine tools and devices for grinding or polishing. The equipment comprises a machine cover, a workbench, two three-axis displacement mechanisms, two grinding mechanisms, two multi-connection clamping mechanisms, a scrap removing assembly and a two-way pressing mechanism, the three-axis displacement mechanisms drive the grinding mechanisms to achieve accurate movement in the X-axis direction, the Y-axis direction and the Z-axis direction, the grinding mechanisms grind magnetic cores, and the multi-connection clamping mechanisms and the two-way pressing mechanism jointly act, so that the scrap removing assembly can remove scraps on the magnetic cores. The magnetic core is stably clamped, and chippings and cooling water generated by grinding are treated in time through the chipping removing assembly; according to the grinding device, the grinding precision, stability and automation degree of the ferrite magnetic core are improved, the production efficiency is improved, the working environment is optimized, and the grinding device is suitable for machining of the hollow tubular ferrite magnetic core and has high practicability and popularization value.

The invention discloses a wafer grinding control method and system, and the method comprises the steps: carrying out the prediction of an initial grinding parameter through a pre-established thickness-grinding rate model according to the thickness initial distribution data of a wafer; the thickness-grinding rate model is constructed according to grinding process data of a wafer with a groove isolation structure; sending the initial grinding parameters to grinding equipment so as to control the grinding equipment to grind the grinding film layer; monitoring thickness allowance distribution data of the grinding film layer in the grinding process; the initial grinding parameters are adjusted according to the thickness allowance distribution data, and adjusted grinding parameters are obtained; and the adjusted grinding parameters are sent to the grinding equipment so as to control the grinding equipment to dynamically adjust the grinding rate. By adopting the method, the grinding parameters are dynamically adjusted in the grinding process, the process stability is improved, and the chip yield is improved.

The utility model discloses a large steam turbine generator carbon brush grinding machine which comprises a machine frame, a grinding roller, a transmission device, an adjusting device, a brush box and a control device. The transmission device comprises a transmission assembly, the transmission assembly is arranged on one side of the rack, and the transmission assembly is connected with the grinding roller; the adjusting device comprises a first adjusting assembly and a second adjusting assembly, and the first adjusting assembly is arranged on one side of the rack in a sliding mode; the second adjusting assembly is rotatably arranged on the first adjusting assembly; the brush box is arranged on the top of the second adjusting assembly. The control device comprises a control assembly, and the control assembly is arranged on one side of the rack. Therefore, the contact area of the carbon brush and the collector ring is obviously increased, the radian of the surface of the carbon brush is perfectly matched with the radian of the diameter of the collector ring, the precision of manual grinding is greatly improved, and in addition, the technology also greatly enhances the safety when the carbon brush is replaced in the running state of the generator.