1924results about "Work carriers" patented technology

The invention relates to the technical field of semiconductor chemical mechanical polishing, in particular to a pressure-adjustable double-frequency ultrasonic-assisted semiconductor chemical mechanical polishing device which comprises a rotary table, and a tray, a lower vibration plate, an upper vibration plate, a magnetic sheet and a polishing pad are sequentially stacked and fixed to the upper surface of a table plate of the rotary table from bottom to top. A piezoelectric ceramic piece is fixed to the middle of the lower surface of the upper vibration plate, a retaining sleeve is eccentrically placed on the upper surface of the polishing pad, a threaded sleeve is in threaded connection with the upper end of the outer side face of the retaining sleeve, a damping spring is fixed to the outer top face of the threaded sleeve, a supporting piece is fixed to the upper end of the damping spring, and an inner ring of a second electric sliding ring is fixed to the upper surface of the supporting piece. A transmission shaft is fixedly assembled in an inner ring of the second electric slip ring, a clamping sleeve is fixed to the lower end of the transmission shaft, and an ultrasonic vibrator is fixedly assembled in the clamping sleeve. The method solves the problems that an existing semiconductor chemical mechanical polishing technology is low in polishing speed, poor in surface quality after polishing and low in polishing qualification rate, and is suitable for semiconductor chemical mechanical polishing.

The invention relates to the technical field of diamond roller machining, in particular to diamond roller mounting inner hole high-precision grinding equipment which comprises a base, a linkage column fixedly connected to the top of the base and a rotary clamping assembly arranged on the base and used for centering and clamping a diamond roller. The lifting plate is provided with an air cooling type grinding assembly which conducts efficient cooling type grinding and assists in inner hole chipping cleaning. According to the diamond roller grinding device, centering clamping treatment is conducted on diamond rollers of different sizes through the rotary clamping assembly, comprehensive efficient grinding treatment of different inner holes is achieved in combination with the air-cooled grinding assembly, the grinding requirements of the diamond rollers of different sizes can be automatically met without additional replacement operation, and through cooperation of the rotary clamping assembly and the air-cooled grinding assembly, the grinding efficiency is greatly improved. And the multi-direction grinding effect can be further achieved, and chippings can be discharged in an auxiliary mode for convenient collection.

A polishing pad and a chemical mechanical polishing apparatus are provided. The polishing pad includes: a central portion, designed with a central recess; and a peripheral portion surrounding the central portion, and designed with at least one peripheral recess. The at least one peripheral recess is disposed along an annulus contour. A lower part of the peripheral recess is greater than an upper part of the peripheral recess in terms of diameter area, and is different from the upper part in shape.

The invention provides a wafer bearing unit, a post-processing device, an overturning method and processing equipment. The wafer bearing unit comprises a bearing bracket, a detection assembly and an adjusting assembly, the bearing bracket comprises a turnover main body, the main body comprises an upper limiting piece which is fixedly mounted, a lower limiting piece driver and a lower limiting piece which is movably mounted and is used for limiting and bearing a wafer in the turnover process of the main body, and the lower limiting piece driver is used for driving the lower limiting piece to be close to or far away from the center of the main body; the detection assembly is used for detecting the inclination angle of the wafer in the direction from the upper limiting piece to the lower limiting piece when the main body is overturned to the horizontal state; the adjusting assembly comprises an adjusting driver and an adjusting supporting element, and the adjusting driver drives the adjusting supporting element to support the wafer at an inclined angle and drives the adjusting supporting element to be in a horizontal state after the lower limiting part driver drives the lower limiting part to be away from the lower limiting part. According to the invention, the inclined wafer can be leveled, and the wafer cannot be polluted and the limiting piece cannot be damaged.

The invention discloses a UPA pressure automatic compensation system and method for mask substrate polishing. The UPA pressure automatic compensation system comprises a pressure execution module, a distributed sensing feedback network and an intelligent control unit. Wherein the pressure execution module is used for directly polishing a mask base plate and comprises a force application shaft, a polishing head, an air source, a UPA air bag and an electric proportional valve, the distributed sensing feedback network comprises an air path pressure sensor and a tail end contact pressure sensor, and the intelligent control unit receives a collection signal of the distributed sensing feedback network and sends the collection signal to the polishing head. On the basis of a current process formula and process parameter coupling model, a data fusion algorithm, a feed-forward compensation algorithm and a fuzzy PID algorithm are operated to obtain a feed-forward compensation amount and a fuzzy PID output amount, the feed-forward compensation amount and the fuzzy PID output amount are superposed, a total control voltage is generated and output to an electric proportional valve, and then the input air pressure of a UPA air bag is adjusted. Therefore, closed-loop control over the polishing pressure of the mask substrate is achieved. Through multi-sensor data fusion, fuzzy PID self-adaptive control and intelligent feed-forward compensation based on a process parameter coupling model, real-time, accurate and constant control of the polishing pressure is realized, so that the surface precision and yield of the mask substrate are improved.

The invention belongs to the technical field of ball valve machining equipment, and particularly relates to double-station ball valve ball body grinding equipment which comprises a rack, a grinding device, a grinding device and a grinding device. The fixing device is arranged on the machining fixed table and used for fixing a ball to be ground; the grinding device is arranged on the mounting seat and is used for grinding the fixed ball body; the spraying devices are arranged on the two sides of the machining table and used for spraying auxiliary media for grinding on the balls; the number of the fixing devices, the number of the polishing devices and the number of the spraying devices are all two. The double-station ball grinding machine has the beneficial effects that the double-station design is adopted to achieve an alternate operation mode, when grinding is conducted on one station, the other station can synchronously complete ball clamping or other work, the window waiting period of traditional single-station equipment is effectively eliminated, the utilization rate of the equipment is increased, and the machining efficiency is improved.

The invention discloses a chemical mechanical polishing and planarization system, which at least comprises a polishing head, and the polishing head comprises a polishing head body; a plurality of air holes are formed in the lower surface of the hard disc, and a third air cavity communicated with the air holes is formed in the hard disc; at least part of the elastic unit is of an annular structure, the elastic unit is connected with the polishing head body and the hard disc, and a second air cavity is defined by the polishing head body, the elastic unit and the hard disc; the retaining ring is positioned below the polishing head body; when the third air cavity is in a negative pressure state, the lower surface of the hard disc can make contact with and adsorb the wafer substrate, and the pressure in the second air cavity is controllable, so that the elastic unit is driven to flexibly move, the hard disc and the wafer substrate are assisted to float, and chemical mechanical polishing of the wafer substrate is achieved. According to the hard drive in the hard disc, the problem that when the flexible film drives the wafer substrate to be polished, under the severe polishing condition, the flexible film is pulled to cause fracture or elastic modulus change is solved, and the service life of the flexible piece is prolonged.

The invention relates to the technical field of wafer processing, and discloses a wafer bonding machine for grinding and polishing, the wafer bonding machine comprises a fixing mechanism, a fixing assembly is fixedly arranged in the fixing mechanism, and a closing assembly is fixedly arranged on the inner wall of the fixing mechanism. The plurality of arc-shaped plates are in a stacked state, when the arc-shaped plates rotate, the center positions of the plurality of arc-shaped plates form a circular clamping area, the area clamps and limits the side wall of a wafer at the top of the microporous ceramic vacuum chuck, and when the wafer is clamped and limited, the side wall of the wafer at the top of the microporous ceramic vacuum chuck is clamped and limited. The wafer is guaranteed to be located at the center position of the micropore ceramic vacuum suction cup through pushing of the multiple arc-shaped plates, then the micropore ceramic vacuum suction cup generates adsorption force, and under the influence of the adsorption force and side wall clamping force, it is guaranteed that the device can conduct clamping and adsorption treatment on wafers of different specifications.

The invention relates to the technical field of polishing machines, and discloses a chemical mechanical polishing machine based on a feeding structure, which comprises a polishing machine body consisting of a C-shaped machine base, a driving cylinder and a driving motor, an output shaft of the driving motor is fixedly connected with a transmission shaft rotationally penetrating through the C-shaped machine base and the annular baffle. The chemical mechanical polishing machine based on the feeding structure can effectively solve the problems that in the prior art, due to the fact that the polishing solution is mostly added in a middle single-point mode, the concentration of the polishing solution is not uniform at the edge of a silicon wafer or the center area of a grinding pad, local excessive polishing or insufficient polishing is caused, and the overall polishing quality is affected; and the silicon wafer is mostly fixed through a clamp or a vacuum adsorption pad, so that the exposure thickness is inconvenient to adjust when the silicon wafers with different thicknesses are polished, and the damage risk is increased due to excessive pressure on the silicon wafer in the polishing process.

According to the polishing pad provided by the embodiment of the invention, in addition to the first grooves in the concentric form, the second grooves in the radial form, which are specially designed, are adopted, so that the flowability of slurry can be improved, and the wafer curve and the polishing rate can be changed.

To provide a top ring or a substrate polishing apparatus capable of making a polishing profile more uniform on the central side of a square substrate and the outer edge side of the substrate.SOLUTION: A top ring for holding a polygonal substrate includes: a base member which is connected to a rotation shaft; a substrate suction member which includes a substrate suction body that has a substrate suction surface for suctioning the substrate and communicates with a decompression module, a shielding member that is configured to cover the side of the substrate suction body opposite to the substrate suction surface, and a frame member that is connected to the shielding member so as to surround at least a portion of the periphery of the base member; and a biasing mechanism which has a first end in contact with the base member and a second end in contact with the frame member, and applies a biasing force in a direction that brings the base member and the frame member close to each other or separates them from each other.SELECTED DRAWING: Figure 3

The invention provides a grinding and polishing processing method for a wafer, which belongs to the technical field of semiconductors and comprises the following steps: S1, carrying out primary grinding on the wafer by adopting an edge collapse process to obtain a semi-finished wafer; s2, carrying out secondary grinding on the semi-finished wafer by adopting an edge bulge process, and correcting the thickness deviation of the semi-finished wafer to obtain a wafer finished product; the sequence of the edge collapse process in the step S1 and the edge protrusion process in the step S2 is adjustable. According to the grinding and polishing processing method of the wafer, the existing single grinding is changed into two grinding, different processing effects of the two grinding methods are superposed, and one-way deviations caused by the single grinding are mutually counteracted, so that the processing effect of lower thickness deviation between the central area and the edge area of the wafer is realized, and the processing efficiency is improved. And the uniformity of the surface quality of the wafer is improved.

A chemical mechanical polishing apparatus includes a platen, a carrier, a dispenser, and a temperature control system. The platen holds a polishing pad. The carrier holds a substrate against a polishing surface of the polishing pad during a polishing process. The dispenser supplies a polishing liquid to the polishing surface. The temperature control system includes a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned on the polishing pad.

The present invention relates to the technical field of filling devices, and discloses an automatic filling device for bearing rings for bearing grinding processing, comprising a table board, the top of the table board is fixedly connected to a support plate, and the bottom of the table board is fixedly connected to a support leg; the top of the support plate is provided with a grinding device, the bottom of the grinding device is provided with a scraping device, the circumferential surface of the grinding device is provided with a discharging device, and the outer shell is fixedly connected to the top of the support plate. When the present invention starts to perform grinding work, the rotation of the rotating disk will cause the bearings inside the outer shell to automatically fall into the holes opened in the rotating disk, so that batch grinding of the bearings can be carried out to improve the grinding efficiency of the bearings. At the same time, the movement of the fixed plate drives the movement of the sliding rod, so that the grinding bin can be automatically closed during grinding to avoid the flying out of the bearings during grinding and causing injuries to the workers.

The invention relates to a clamping fixture and a grinding and polishing device.The clamping fixture comprises a mounting frame, a clamping assembly, an adjusting assembly and a fixing assembly, the mounting frame is provided with a mounting cavity, the clamping assembly is movably arranged in the mounting cavity, and the clamping assembly comprises a first limiting plate and a second limiting plate; the first limiting plate is vertically arranged, the position of the first limiting plate in the horizontal direction is adjustable, the second limiting plate is horizontally arranged, the position of the second limiting plate in the vertical direction is adjustable, the first limiting plate and the second limiting plate define a containing cavity used for containing samples, and the adjusting assembly is connected with the mounting frame; the adjusting assembly is used for adjusting and fixing the position of the first limiting plate relative to the mounting frame in the horizontal direction, and the fixing assembly is connected with the mounting frame and used for fixing the position of the second limiting plate relative to the mounting frame in the vertical direction. According to the clamping fixture and the grinding and polishing device, the sample grinding and polishing efficiency and quality are improved.

The invention discloses a grinding and polishing method and system and grinding and polishing equipment. The grinding and polishing method comprises the steps that an indexing table rotates in the first direction, and a workbench with a workpiece fixed to the top face is sequentially rotated to a first grinding mechanism, a second grinding mechanism and a polishing mechanism for grinding; after polishing is completed, the top face of the workpiece is cleaned and dried; the indexing table rotates in the second direction to drive the workpiece to rotate towards the second grinding mechanism, and the workbench rotates; when it is determined that the workpiece moves and passes through the roughness detection assembly, a signal of the roughness detection assembly is obtained, and whether the surface roughness of the workpiece meets the requirement or not is determined; when it is determined that the workpiece moves and passes through a thickness measuring assembly at the second grinding mechanism, a signal of the thickness measuring assembly is obtained, and whether the total thickness change of the workpiece meets the requirement or not is determined; and after the workbench moves back to the second grinding mechanism, the workbench moves to the up-down position of the workpiece in the first direction. According to the invention, on-line detection of the surface roughness and total thickness change of the workpiece can be realized.

The invention provides a wafer positioning device and wafer grinding equipment thereof, and belongs to the technical field of wafer processing equipment.The wafer positioning device comprises a clamping positioning system, a vacuum rotary carrying table system, a control module and an image recognition system, and the clamping positioning system, the vacuum rotary carrying table system, the image recognition system and the control module cooperate to achieve the purpose of positioning the wafer. The problem that in the prior art, the flat edge and the notch angle of a wafer cannot be recognized is accurately solved, centering is achieved only through synchronous radial movement of a plurality of clamping jaws without an additional moving shaft, and after an image recognition system confirms that the wafer is coaxial with a fixed shaft, a control module directly controls a vacuum rotating carrying table system to adsorb the wafer and rotate, and the wafer is accurately positioned. The space requirement of a clean room is met, the precision is prevented from being influenced by displacement difference, the offset recalculation link is omitted, the efficiency is improved, and the high-precision grinding requirement of the advanced manufacturing process is met.

The utility model provides a photoelectrocatalysis assisted chemical mechanical polishing device which comprises a platform, a polishing disc, a transparent polishing pad, a polishing head, a photosensitive polishing solution swing arm and an ultraviolet lamp bead, the polishing disc is rotationally connected to the upper portion of the platform, and the transparent polishing pad is arranged on the polishing disc in a stacked mode. The photosensitive polishing liquid swing arm is connected to the platform and used for spraying polishing liquid to the transparent polishing pad layer, a liquid passing hole is formed in the transparent polishing pad layer in a penetrating mode, the polishing head is connected with the positive electrode of the power source, the polishing disc is connected with the negative electrode of the power source, and the ultraviolet lamp beads are embedded in the polishing disc. According to the photoelectrocatalysis-assisted chemical mechanical polishing device provided by the utility model, the photosensitive polishing solution swing arm is used for spraying the photosensitive polishing solution, and the ultraviolet lamp beads are arranged on the polishing disc, so that ultraviolet light irradiates the photosensitive polishing solution or a wafer below the polishing head through the transparent polishing pad, and strong-oxidation active groups are synchronously generated; the oxidation rate of silicon carbide on the surface of the wafer is improved, and the polishing efficiency of the wafer is improved.

The invention provides a three-axis three-phase variable-speed ultraprecise microsphere grinding and polishing device and a grinding and polishing method, and belongs to the technical field of high-precision spherical part machining. By adjusting three sets of servo grinding head assemblies, output shafts (a first shaft, a second shaft and a third shaft) of the three sets of servo grinding head assemblies intersect at the sphere center of a machined sphere; the alignment precision of the three servo grinding head assemblies relative to the center of the ultra-precision microsphere is improved; meanwhile, output shafts of the three servo grinding head assemblies are controlled to rotate at a variable speed according to the sine rule, it is guaranteed that the motion trails formed by the three servo grinding head assemblies are evenly distributed on the surface of the machined ball and can completely wrap the surface of the machined ball, and sliding of the ultra-precise microspheres in the machining process is avoided; and the stability in the ultra-precision microsphere processing process can be ensured.

The invention relates to the technical field of cable machining, in particular to an adjustable sphere grinding machine which comprises a supporting mechanism and a grinding mechanism, the supporting mechanism is used for supporting and fixing a spherical workpiece and driving the spherical workpiece to rotate, and the grinding mechanism is used for grinding the peripheral face of the spherical workpiece. The device further comprises a rotation driving source and a supporting seat, the rotation driving source is used for driving the supporting seat to rotate, and the supporting mechanism is arranged on the supporting seat in a sliding mode in the axial direction of the spherical workpiece. The synergistic effect of the supporting mechanism and the grinding mechanism can meet the grinding requirements of spherical workpieces of different sizes, the universality of the equipment is remarkably improved, and the problem that the equipment is frequently replaced due to the size change of the workpieces is solved.

The utility model provides an auxiliary driving device, a polishing mechanism for wafer processing and polishing equipment. The auxiliary driving device comprises an auxiliary driver; the magnetic coupling mechanism comprises an electromagnetic wheel and a conductive gear opposite to the electromagnetic wheel; the electromagnetic wheel is configured to be driven to rotate by the auxiliary driver; the conductive gear is provided with a conductive disc and a gear surrounding the conductive disc, and the conductive gear is in power connection with a polishing head station switching mechanism of the polishing equipment; the electromagnetic wheel is configured to have magnetism when powered on so as to be in magnetic connection with the conductive gear, so that power of the auxiliary driver is transmitted to the polishing head station switching mechanism through the conductive gear, and polishing head station switching is conducted. According to the polishing mechanism, the polishing head station switching mechanism can be driven by the auxiliary driver to conduct polishing head station switching and posture adjustment, and the maintenance or repair convenience of the polishing mechanism is improved.

The utility model discloses a grinding device of a wafer thinning machine, which comprises a grinding wheel mechanism, and the grinding wheel mechanism comprises a grinding wheel mounting rack, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting rack, a Z-axis lifting plate connected with the first Z-axis lifting mechanism, and a main shaft mounting seat connected to one side of the Z-axis lifting plate. The motorized spindle is mounted on the spindle mounting seat; the electric spindle is further in driving connection with a grinding wheel mounting seat, and a first grinding wheel is further mounted at the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged in the vertical direction are arranged in the circumferential direction of the bottom of the first grinding wheel at intervals. Compared with equipment applying an air floating main shaft, a mechanical main shaft grinding mode is adopted, so that the rigidity is greatly improved, the grinding machine can adapt to grinding of high-hardness materials, and the application range is wider.

The invention provides a wafer loading table and a system and method for online adjusting wafer loading pressure, and belongs to the technical field of semiconductor chemical mechanical polishing, the wafer loading table comprises a carrying table body and a plurality of pressure actuator sets, the carrying table body is used for bearing wafers, and the bearing surface of the carrying table body is provided with a plurality of pressure response areas; and the plurality of pressure actuator groups are arranged in the plurality of pressure response areas in a one-to-one correspondence manner, and the pressure actuator groups are used for providing upward supporting force for the wafer. According to the wafer loading table, the carrying table body is divided into the multiple pressure response areas, and the pressure actuator sets are arranged in the pressure response areas, so that the carrying table body can dynamically respond and adjust the supporting force on the wafer in real time, and pressure nonuniformity generated when a polishing head presses downwards is actively counteracted; the problem of microcracks or fragmentation caused by local stress concentration when the wafer is loaded is avoided, and the loading yield of the wafer is greatly improved.

The utility model relates to the technical field of ball valves, in particular to a sliding support type ball valve ball body grinding device which comprises a grinding table and a ball body, a rotating motor is arranged on the inner side of the grinding table, an installation frame and a bearing disc are fixedly installed on the top of the grinding table respectively, and a grinding oil tank and a hydraulic rod are fixedly arranged on the top of the installation frame respectively. An oil pump is arranged at the top of the grinding oil tank, a supporting column is arranged at the bottom end of a hydraulic rod, an annular pipe is arranged at the bottom of a mounting frame, a fixing rod is rotationally arranged at the top of a bearing disc through a bearing, a mounting hole is formed in the surface of the bottom of a ball, and grinding sleeves are arranged on the outer sides of the ball correspondingly. An adjusting mechanism is arranged between the grinding sleeve and the grinding table, through the arrangement of the sliding support type ball valve ball grinding device, the purpose of accurately adjusting the position of the grinding sleeve is achieved through the structural design in the adjusting mechanism, and it is guaranteed that a ball is evenly ground.

The utility model relates to an efficient silicon carbide wafer grinding device which comprises a base, two positioning assemblies and a grinding assembly are arranged on the base, and the centers of the two positioning assemblies and the grinding assembly are arranged in an isosceles triangle shape with the grinding assembly as the top. The positioning assembly comprises a first telescopic cylinder, the output end of the first telescopic cylinder is connected with a supporting disc, a suction cup frame is arranged outside the first telescopic cylinder below the supporting disc, a plurality of suction cups are fixedly arranged outside the suction cup frame around the first telescopic cylinder, through holes for containing the suction cups are formed in the supporting disc, and wafers are positioned through cooperation of the suction cups and the supporting disc; the grinding assembly comprises a rotating motor, the output end of the rotating motor is connected with a swing arm, the tail end of the swing arm is connected with a second telescopic cylinder, the output end of the swing arm is connected with a grinding motor, the output end of the grinding motor is connected with a grinding head, and the rotating motor enables the grinding head to be switched between the two positioning assemblies to alternately grind the positioned wafers. According to the efficient silicon carbide wafer grinding device, the wafer grinding efficiency can be obviously improved.

A skate blade sharpening system used to sharpen the blades of ice skates. The skate sharpener can include a housing that includes an elongated slot for receiving the blade of an ice skate for sharpening, and clamp jaws for retaining the skate. The housing can include at least one slot cover to engage the skate blade. Engagement of the skate blade can be sensed by a controller to enable sharpening operations to proceed. The skate blade sharpening system can automatically operate a grinding wheel and move the rotating grinding wheel back and forth along the lower face of the skate blade a desired number of times to sharpen the skate blade.

An object 102 to be polished is resin-sealed in a resin-sealed sample 105. The resin-sealed sample 105 is gripped by a holder 721 of a robot arm, and the bottom surface of the resin-sealed sample 105 is pressed against a polishing table 107 to polish a target surface 602. A cleaning liquid is applied to the polishing table 107 from a cleaning liquid supply nozzle 207. The target surface 602 is covered with the cleaning liquid. Light from a light emitter 201 passes through a polarizing plate 202a, and the target surface 602 is irradiated with polarized light 205a. Reflected light, which is the polarized light 205a reflected off the target surface 602, passes through a polarizing plate 202b, and the reflected light 205b enters a camera 206.

The invention discloses an ultraviolet light-assisted chemical mechanical polishing device which comprises a polishing disc assembly, a polishing solution supply part, a carrying disc and an optical fiber, the first end of the optical fiber is connected with an ultraviolet light source, the second end of the optical fiber is rotationally connected with the carrying disc, and a light-transmitting substrate is arranged in the carrying disc and located below the second end of the optical fiber. The polishing method comprises the steps that S1, a workpiece is fixedly installed on the bottom face of the light-transmitting substrate; s2, the carrying disc is placed on a polishing disc assembly and clamped into a blocking arm, so that the carrying disc can be driven by friction force between the polishing disc assembly and the workpiece to rotate; s3, turning on the ultraviolet light source and adjusting the ultraviolet light irradiation range until the bottom surface of the light-transmitting substrate is completely illuminated; s4, the polishing disc assembly is started, and the polishing liquid supply part drips polishing liquid into the polishing disc assembly for current-stage polishing; and S5, after the surface roughness value of the workpiece reaches the upper limit of the current polishing stage, the polishing disc assembly and the polishing solution are replaced, and then the step S4 is executed till the surface roughness value of the workpiece reaches the target value.

The invention discloses an electrochemical mechanical polishing head, a polishing device and a polishing method, and belongs to the technical field of wafer manufacturing. The electrochemical mechanical polishing head comprises a coupling disc and a polishing head, wherein a positioning hole is formed in the center of the coupling disc; the bearing disc is provided with a shaft part in a matched mode, and the shaft part is connected into the positioning hole in a sliding mode, so that the bearing disc rotates along with the coupling disc and / or moves in the vertical direction; the conductive elastic film is arranged below the bearing disc and is used for loading a wafer to be processed; the retaining ring is arranged below the bearing disc and is positioned on the peripheral side of the elastic film; the electric connection assembly is vertically arranged in a mounting hole configured along the shaft part, one end of the electric connection assembly is connected with a power supply, and the other end of the electric connection assembly is connected with a central cavity of the elastic film, so that a wafer to be processed is located in an electric field formed between the elastic film and the polishing solution; at least part of the electric connection assembly is a flexible part and stretches out and draws back in the vertical direction to adapt to deformation of the elastic film, and then a stable electric field is formed between the elastic film and the polishing solution.

The utility model discloses a ferrite magnetic core grinder, which relates to the field of ferrite magnetic core grinding and comprises a working platform, a grinding roller for grinding a magnetic core is mounted on the outer wall of the working platform, a movable plate is further mounted on the outer wall of the working platform in a sliding manner, and a lifting plate is vertically mounted at the top end of the movable plate in a sliding manner. The transmission mechanism is arranged on the movable plate and the lifting plate; the transmission mechanism comprises a limiting unit and a clamping unit; and the clamping unit is used for clamping the magnetic core. By arranging the transmission mechanism, when a magnetic core needs to be ground, the magnetic core can be clamped through the lead screw and the clamping block, the height of the lifting plate is adjusted by releasing limiting of the limiting block and the guide rod, the magnetic core is made to move to the needed height to make contact with the grinding roller to be ground, and compared with a traditional lifting mode, the magnetic core grinding device has the advantages that the magnetic core grinding efficiency is improved. By means of the structure, a user can conveniently and accurately adjust the height, and working efficiency is improved.