135results about "Sealing devices" patented technology

The invention belongs to the technical field of semiconductors, and discloses an electroplating device, and an opening and closing mechanism of the electroplating device has an open state and a closed state; when the opening and closing mechanism is in an open state, the clamp assembly can penetrate through the opening to move up and down; when the opening and closing mechanism is in the closed state, the opening and closing mechanism closes the opening; when the wafer carried by the clamp assembly completes the electroplating process and ascends to the preset cleaning position, the opening and closing mechanism is switched to the closed state to close the opening, and at the moment, the opening and closing mechanism in the closed state can prevent liquid formed when the clamp assembly and / or the wafer carried by the clamp assembly is cleaned from falling into electroplating liquid in the electroplating cavity. The preset cleaning position is located above the opening and closing mechanism. When the clamp assembly and the wafer are cleaned, the concentration of the electroplating liquid in the electroplating cavity is not affected, the stability, uniformity and quality of wafer electroplating can be improved, part of the electroplating liquid attached to the clamp assembly and the wafer can be recycled into the electroplating cavity, the working efficiency is high, and the energy consumption is low.

The present invention facilitates maintenance of a diaphragm or the like in a face-down type plating device.　This plating device comprises: a plating tank for holding a plating solution; a substrate holder which holds a substrate in a state in which a surface to be plated faces down; and an anode holder assembly which is attached to the plating tank in a manner that is horizontally-removable via an opening in a side wall of the plating tank, and which has an anode holder having one or more openings at a central part, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more seal surfaces for sealing the plating tank from the outside, and one or more seal surfaces for partitioning the plating tank into upper and lower chambers.

The electroplating device comprises a central flow pipe which is arranged in an anode in a penetrating mode, one end of the central flow pipe is an anode electroplating liquid inlet, the other end of the central flow pipe extends out of the surface of the anode and is connected with a plurality of branch flow pipes extending towards the edge of the anode, and each branch flow pipe is provided with a plurality of spraying holes; the anode electroplating liquid is supplied to the anode surface through the injection holes of the branch flow pipes. Anode electroplating liquid can be drained to the surface of the anode, oxide generated on the surface of the anode is flushed away in time through impact force of the liquid, and therefore it is guaranteed that loop impedance is unchanged, and loop voltage is prevented from rising; and the flowability and the flow uniformity of the anode electroplating liquid are improved.

There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; an anode placed in the plating tank and provided with a plurality of through holes; a substrate holder provided to hold a substrate to be opposed to the anode; a barrier membrane placed to be brought into close contact with a first face on a substrate side of the anode; and a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face.

An out of tank electrochemical treatment system includes a housing with a treatment fluid supply manifold connected to the one or more treatment fluid reservoirs and including treatment fluid supply channels, a return manifold connected to the one or more treatment fluid reservoirs and including treatment fluid return channels, and an electrode section connected to the treatment fluid supply manifold. A porous pad coupled to the electrode section is configured to contact and wet the substrate with treatment fluid. A frame attached to the housing holds the porous pad and compresses the porous pad reducing the porosity of the porous pad at its periphery to reduce treatment fluid outflow at the periphery of the porous pad. The uniformity of current distribution is increased at the porous pad / substrate interface.

The invention discloses a sealing ring for electroplating equipment and the electroplating equipment. The sealing ring is in contact sealing with a semiconductor wafer when the semiconductor wafer is electroplated so as to define an electroplating area and a peripheral area, and the sealing ring comprises a sealing ring body and an elastic element. The sealing ring body is provided with an outer side edge and an inner side edge, the outer side edge is used for fixing the sealing ring body, the inner side edge is used for being in contact sealing with a semiconductor wafer, and the elastic element is arranged in the inner side edge of the sealing ring body. The inner side edge comprises a platform portion and a flange portion protruding upwards from the free tail end of the platform portion, and the elastic element is at least arranged in the flange portion. When the pressure applied to the flange part by the semiconductor wafer exceeds a preset threshold value, the elastic element provides upward elastic force for the flange part, so that the semiconductor wafer is propped upwards when the pressure applied to the semiconductor wafer is eliminated. The sealing ring provided by the invention can overcome the bonding between the semiconductor wafer and the sealing ring, and facilitates the separation of the semiconductor wafer. The electroplating equipment provided by the invention comprises the sealing ring.

An apparatus for electroplating semiconductor wafers includes an embedded member configured to surround a processing area. The embedded member has a top surface. A portion of the top surface of the embedded member has an upward slope that slopes upward from a peripheral area of ​​the top surface of the embedded member toward the processing area. The apparatus also includes a sealing member having an annular disk shape. The sealing member is positioned on the top surface of the embedded member. The sealing member is flexible so that a radially outer portion of the sealing member conforms to the upward slope of the top surface of the embedded member and a radially inner portion of the sealing member protrudes inwardly toward the processing area.

The invention relates to the technical field of mold machining, and discloses a mold core local hardening electroplating device and an electroplating technology.The mold core local hardening electroplating device comprises an electroplating pool, first piston cylinders are fixedly connected to the outer surface of the electroplating pool at equal intervals, and first piston rods are slidably connected to the interiors of the first piston cylinders in a sealed mode; the top end of the first piston rod is fixedly connected with a top seat, and a positioning assembly is installed at the center of the bottom of the top seat. Through the arrangement of the positioning assembly, after the mold core is placed in the containing groove, when an electric telescopic rod is started to drive the top base to slide downwards, namely before the mold core is immersed into electroplating liquid in an electroplating pool, the top cover slides downwards, the mold core can be fixed in the containing base, and the exterior of a mold core cavity is sealed through expansion of an annular air bag; and meanwhile, the sealing assembly seals the bottom of the interior of the containing groove, so that electroplating liquid can only make contact with the surface of the mold core cavity, electroplating is conducted on the surface of the cavity, and local hardening of the mold core is achieved.

A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

The invention relates to a device (D) and a system for the electrochemical surface treatment of the inner surface of a longitudinal tubular member (T) made of an electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular member (T); a longitudinal anode (3) configured to be coaxially arranged inside the tubular member (T); a sealed interface mechanism (4A, 4B) configured to removably mate with the tubular member (T) and the anode (3), said sealed interface mechanism (4A, 4B) comprising at least first and second inlet / outlet ends for connecting a source of treatment fluid and adapted, in use, to communicate with a sealed longitudinal passage (7) formed between the anode (3) and the inner surface of the tubular member (T); and a mechanism (5) for driving the tubular member (T) in rotation about the longitudinal axis (X0); characterised in that said frame assembly (1) is adapted to support the tubular member (T) in a non-vertical orientation, and in that the device (D) further comprises means for pulling the anode under traction configured to act on at least one of the two ends of the anode (3) to prevent it from flexing.

The invention relates to a device (D) and a system for electrochemical surface treatment of an inner surface of a longitudinal tubular element (T) made of electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means (4A, 4B) forming a sealed interface configured to removably cooperate with the tubular element (T) and with the anode, the means (4A, 4B) forming a sealed interface comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, when in use, with a sealed longitudinal passage that is formed between the anode and the inner surface of the tubular element (T); and means (5) for rotating the tubular element (T) about its longitudinal axis (X0), characterised in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and in that the device (D) further comprises means for pulling the anode that are configured to act on at least one of the two ends of the anode in order to prevent the anode from bending.

To provide a lipseal for use in a lipseal assembly of an electroplating clamshell which engages with a semiconductor substrate and supplies electrical current to the semiconductor substrate during electroplating, and a method of electroplating the semiconductor substrate using the lipseal.SOLUTION: A lipseal 212 includes an elastomeric body having an outer portion configured to engage with a cup 201 of the lipseal assembly and an inner portion configured to engage with a peripheral region of the semiconductor substrate. The inner portion includes a protrusion having a width in a radial direction sufficient to provide a contact area with the semiconductor substrate which inhibits diffusion of acid in an electroplating solution used during the electroplating. The protrusion is located at an inner periphery of the lipseal.SELECTED DRAWING: Figure 2

Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

The present invention provides a water-sealed conductive clamp, which at least includes a first clamp arm, a second clamp arm, a first soft seal, a second soft seal, a liquid supply assembly and a plurality of hard protective covers. The facing sides of the first and second clamp arms respectively have a first and a second protrusion corresponding to the position of the clamping surface, and the first clamp arm has an opening penetrating the first clamp arm above the first protrusion. The liquid supply assembly is connected to the opening in the first clamp arm to infuse liquid into the space between the first and second clamp arms. The first soft seal has a first opening whose position matches the first protrusion and the opening, and a plurality of first idle openings respectively located on both sides of the first opening. The second soft seal has a second opening whose position matches the second protrusion, and a plurality of second idle openings respectively located on both sides of the second opening. The hard protective cover covers the surfaces of the first and second clamp arms.

The application provides a plate passing device and a workpiece processing system. The plate passing device comprises a temporary storage groove and two groups of rotating opening and closing mechanisms. Any rotating opening and closing mechanism comprises two groups of oppositely arranged roller transmission mechanisms, any roller transmission mechanism comprises a driving mechanism, a first rotating shaft and a roller assembly; wherein the driving end of the driving mechanism is connected with the first rotating shaft, the first rotating shaft is connected with the roller assembly, the driving mechanism drives the two groups of opposite roller assemblies to rotate towards each other and contact and extrude to form a sealing surface, or drives the two groups of opposite roller assemblies to rotate away from each other to form a plate passing gap. The plate passing device with the structure does not contact the roller assembly when the workpiece passes through the plate, effectively ensuring the surface quality of the workpiece; meanwhile, the workpiece does not contact the plate passing device, the resistance during plate passing is small, the workpiece can pass through the plate quickly, and the production efficiency is improved. In addition, the workpiece moves horizontally into the working groove, compared with the lifting mechanism lifting and crossing the groove, the lifting mechanism is not needed, and the height space of the factory building is not occupied, and the required height space of the factory building is small.

A cup-type chuck for a substrate holding device is disclosed. The cup-type chuck includes an inner pressure ring, a middle frame, a seal portion, an outer pressure ring, and a contact ring. The inner pressure ring is fixed to the inner peripheral surface of the middle frame. The seal portion has an outer end, a bottom, and an inner end. The outer end of the seal portion covers at least a portion of the outer peripheral surface of the middle frame. The bottom of the seal portion covers the bottom of the middle frame and is exposed to the outside of the cup-type chuck. The inner end of the seal portion covers at least a portion of the inner peripheral surface of the middle frame and is pressed between the inner pressure ring and the middle frame by the inner pressure ring. The outer pressure ring is made of an insulating material and fixed to the outer peripheral surface of the middle frame, and the outer end of the seal portion is pressed between the outer pressure ring and the middle frame by the outer pressure ring. The contact ring is located above the seal portion and is pressed between the inner pressure ring and the middle frame, with the seal ring being disposed between the inner pressure ring and the contact ring.

The present invention discloses a sealing device, a container, and a workpiece processing device, wherein the sealing device includes a channel body that allows a workpiece to be processed to pass through; and a scraper sealing assembly that is arranged on at least one inner wall surface of the channel body, the scraper sealing assembly including a plurality of scraper seals arranged along the travel direction of the workpiece to be processed, the workpiece to be processed enters the channel body and is sealingly slidably connected to the scraper seals. During the travel of the workpiece to be processed through the channel body, the scraper sealing assembly can block as much as possible the flow of a portion of the processing liquid out of the channel body, and the workpiece to be processed is always in sealing sliding connection with the scraper seal, so that the sealing effect between the two is better, thereby reducing the outflow of the processing liquid through the channel body, thereby reducing the outflow rate of the processing liquid.

Methods and apparatus for electroplating metal onto a substrate are provided herein. For example, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while plating a metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain a separation between a plating surface of the substrate and the anode during electroplating; and (c) an ionically resistive ionically permeable element comprising a substrate facing surface and an opposing surface wherein the ionically resistive ionically permeable element allows a flow of an ionic current through the ionically resistive ionically permeable element toward the substrate during electroplating, and wherein the ionically resistive ionically permeable element and the substrate holder are configured to cooperate with each other and rotate together relative to the plating chamber.

A substrate is efficiently cleaned.A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.

Embodiments disclosed herein relate to electroplating apparatuses used for components in semiconductor processing chambers. In one embodiment, an electroplating device is provided. The electroplating device includes a housing including a first surface and a second surface and a plurality of holes disposed in the housing. The plurality of holes extend from the first surface to the second surface, and are configured to hold a component to be electroplated. The electroplating device further includes a gas inlet connected to an air bladder. The air bladder is disposed between the plurality of holes. The air bladder is configured to cover an outer surface of the component to be electroplated. The electroplating device further includes a cathode connector disposed below the first surface, and a cathode insert connected to the cathode connector. The cathode insert is connected to the plurality of holes and is configured to electrically charge the component.

The electroplating cup assembly includes a cup bottom, a lip seal, and an electrical contact structure. The cup bottom at least partially defines an opening configured to expose a wafer located in the cup assembly to an electroplating solution. A lip seal is on the cup bottom and includes a sealing structure extending upwardly along an inner edge of the lip seal to an apex configured to contact a seed layer of the wafer and adjacent a sacrificial layer of the wafer. An electrical contact structure is over a portion of the seal. The electrical contact structure is configured to be coupled to a seed layer of a wafer.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

The present disclosure provides a substrate holder in which a mechanism for fixing a first holder and a second holder to each other can be operated in a non-contact manner. The substrate holder involved in the present disclosure comprises: a first holder; a second holder for clamping and holding a substrate together with the first holder; a clamping member provided on one of the first holder and the second holder; and a clamped member fixed to the other of the first holder and the second holder, the clamping member being configured to have a magnet and being able to move between a locked position and an unlocked position by a magnetic force acting on the magnet, the locked position being a position in which the clamping member and the clamped member are engaged to fix the first holder and the second holder to each other, and the unlocked position being a position in which the engagement of the clamping member and the clamped member is released to release the fixation of the first holder and the second holder.

The present invention addresses the problem of efficiently introducing a liquid into an internal space of a substrate holder. The present invention relates to a substrate holder for holding a substrate, the substrate holder comprising: a first holding member and a second holding member that sandwich and hold the substrate; a sealing member disposed between the first holding member and the second holding member in a state in which the substrate is held by the first holding member and the second holding member, the sealing member sealing an outer peripheral portion of the substrate in contact with a contact of the substrate holder; a liquid injection port for injecting a liquid into the internal space sealed by the sealing member; and an exhaust port for discharging gas from the internal space, the exhaust port being formed by combining the recess of the first holding member and the recess of the second holding member, and the flow path area of the exhaust port being larger than the flow path area of the liquid injection port.

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P11 and continue with a period T11; step 3: when the period T11 ends, adjusting the first plating power supply applied on the first anode to output a power value P12 and continue with a period T12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P21 and continue with a period T21; and step 4: when the period T21 ends, adjusting the second plating power supply applied on the second anode to output a power value P22 and continue with a period T22; wherein step 2 to step 4 are performed periodically.