5results about "Sealing devices" patented technology

This disclosure relates to a sealing system (10) for a processing chamber (11) for chemically and / or electrolytically surface treating a substrate (12) in a substrate holder (13), comprising a cover element (14), a cover plate element (15), and a suspension unit (16). The cover element (14) is configured to partially cover an opening of the processing chamber (11), and the cover element (14) includes a cover opening (142) for the substrate holder (13) to enter and exit the processing chamber (11). The cover plate element (15) is configured to reduce a gap (141) between the cover element (14) and the substrate holder (13), and the cover plate element (15) includes a cover opening (151) for the substrate holder (13) to enter and exit the chamber (11). The suspension unit (16) is configured to provide an air cushion (161) between the cover element (14) and the cover plate element (15) to raise the cover plate element (15) relative to the cover element (14) into a suspended state, in which the gap (141) between the cover element (14) and the base retainer (13) is at least partially sealed.

In one embodiment of the present invention, an electrolytic plating apparatus is disclosed. The electrolytic plating apparatus includes an electrolytic plating tank, a clamp, a positioning cylinder, and an anode. In the electrolytic plating apparatus, the positioning cylinder is located in the electrolytic plating tank, and one end of the positioning cylinder is open. The anode is located inside the positioning cylinder, and the positioning cylinder is in sealing contact with the anode. Furthermore, of the total surface area of ​​the anode, only a first surface is in contact with the electrolytic plating solution, the first surface faces the substrate in parallel, the center is aligned with the center of the substrate, and the size of the first surface is similar to the size of the effective electrolytic plating area of ​​the substrate. The electrolytic plating apparatus allows the electric field generated by the anode to be uniformly distributed on the surface of the substrate, thereby improving the uniformity of the electrolytic plating height on the surface of the substrate. Furthermore, in one embodiment of the present invention, an electrolytic plating method using the electrolytic plating apparatus is disclosed.

An electroplating system to process a substrate includes clamps and a membrane. The membrane is held by the clamps and separates a first portion of a chamber of the electroplating system from a second portion of the chamber. The membrane includes a surface extending from a center of a cavity of the chamber radially outward at an angle relative to a reference plane. The angle is greater than or equal to 0° and less than or equal to 3°.

To easily pull an electrolyte film away from a base material while keeping a plating solution in a housing and minimizing the deformation of the electrolyte film.SOLUTION: In a method for depositing a metallic film F, after placing a base material B on a placing stand 40, a metallic film F is deposited on a surface of the base material B while a plating solution L is in contact with the base material B through an electrolyte film 13. With the plating solution L sealed, at least one of the placing stand 40 or a housing body 15 is moved away from the other thereof, to pull the electrolyte film 13 away from the base material B. By the time of this pulling away, a circulation path 50 is shut off and the plating solution L in the housing 15 is sealed.SELECTED DRAWING: Figure 3A

Methods and apparatus for electroplating metal onto a substrate are provided herein. For instance, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain separation between a plating face of the substrate and the anode during electroplating; and (c) an ionically-resistive ionically-permeable element including a substrate-facing surface and an opposing surface, where the ionically-resistive ionically-permeable element allows for flow of ionic current through the ionically-resistive ionically-permeable element towards the substrate during electroplating, and where the ionically-resistive ionically-permeable element and the substrate holder are configured to mate with one another and rotate together relative to the plating chamber.