317results about "Sealing devices" patented technology

The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of it easily and securely, and also a plating apparatus provided with the substrate holder. A substrate holder (18), includes: a fixed holding member (54) and a movable holding member (58) for holding a substrate (W) therebetween; a sealing member (68) mounted to the fixed holding member (54) or the movable holding member (58); and a suction pad (94) for attracting a back surface of the substrate (W) held between the fixed holding member (54) and the movable holding member (58).

The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.

An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.

An insulated vibration-stirring apparatus comprising: a vibration generating means containing a vibration motor and a vibrating member attached to that motor, and a vibrating rod attached by an installation piece to allow vibration lined with the vibration generating means, and vibrating vanes installed on this vibrating rod. An electrical insulation area made from hard rubber is installed on a section nearer to the installation section to the installation piece than the section where the vibrating vanes are mounted on the vibrating rod. An electrical line is connected to the lower section of the vibrating rod on the electrical insulation area side where the vibrating vanes are installed. This electrical line conducts power to the vibrating vanes by way of the lower section of the vibrating rod. A power supply applies a voltage across the lower section of the vibrating rod and vibrating vanes and treatment tank by way of the electrical lines, and while applying power to the processing liquid within the treatment tank, the insulation vibration stirring apparatus vibrates and stirs the processing liquid.

An electrochemical device includes a pair of electrodes, an electrolytic solution, and a container for containing the pair of electrodes and the electrolytic solution. The container includes a frame body having concave shape and a sealing plate configured to seal an opening of the frame body, and an electronic device is buried in the frame body or the sealing plate.

An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.

Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.