80results about "Sealing devices" patented technology

The present invention facilitates maintenance of a diaphragm or the like in a face-down type plating device.　This plating device comprises: a plating tank for holding a plating solution; a substrate holder which holds a substrate in a state in which a surface to be plated faces down; and an anode holder assembly which is attached to the plating tank in a manner that is horizontally-removable via an opening in a side wall of the plating tank, and which has an anode holder having one or more openings at a central part, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more seal surfaces for sealing the plating tank from the outside, and one or more seal surfaces for partitioning the plating tank into upper and lower chambers.

An out of tank electrochemical treatment system includes a housing with a treatment fluid supply manifold connected to the one or more treatment fluid reservoirs and including treatment fluid supply channels, a return manifold connected to the one or more treatment fluid reservoirs and including treatment fluid return channels, and an electrode section connected to the treatment fluid supply manifold. A porous pad coupled to the electrode section is configured to contact and wet the substrate with treatment fluid. A frame attached to the housing holds the porous pad and compresses the porous pad reducing the porosity of the porous pad at its periphery to reduce treatment fluid outflow at the periphery of the porous pad. The uniformity of current distribution is increased at the porous pad / substrate interface.

A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

The invention relates to a device (D) and a system for the electrochemical surface treatment of the inner surface of a longitudinal tubular member (T) made of an electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular member (T); a longitudinal anode (3) configured to be coaxially arranged inside the tubular member (T); a sealed interface mechanism (4A, 4B) configured to removably mate with the tubular member (T) and the anode (3), said sealed interface mechanism (4A, 4B) comprising at least first and second inlet / outlet ends for connecting a source of treatment fluid and adapted, in use, to communicate with a sealed longitudinal passage (7) formed between the anode (3) and the inner surface of the tubular member (T); and a mechanism (5) for driving the tubular member (T) in rotation about the longitudinal axis (X0); characterised in that said frame assembly (1) is adapted to support the tubular member (T) in a non-vertical orientation, and in that the device (D) further comprises means for pulling the anode under traction configured to act on at least one of the two ends of the anode (3) to prevent it from flexing.

The invention relates to a device (D) and a system for electrochemical surface treatment of an inner surface of a longitudinal tubular element (T) made of electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means (4A, 4B) forming a sealed interface configured to removably cooperate with the tubular element (T) and with the anode, the means (4A, 4B) forming a sealed interface comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, when in use, with a sealed longitudinal passage that is formed between the anode and the inner surface of the tubular element (T); and means (5) for rotating the tubular element (T) about its longitudinal axis (X0), characterised in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and in that the device (D) further comprises means for pulling the anode that are configured to act on at least one of the two ends of the anode in order to prevent the anode from bending.

To provide a lipseal for use in a lipseal assembly of an electroplating clamshell which engages with a semiconductor substrate and supplies electrical current to the semiconductor substrate during electroplating, and a method of electroplating the semiconductor substrate using the lipseal.SOLUTION: A lipseal 212 includes an elastomeric body having an outer portion configured to engage with a cup 201 of the lipseal assembly and an inner portion configured to engage with a peripheral region of the semiconductor substrate. The inner portion includes a protrusion having a width in a radial direction sufficient to provide a contact area with the semiconductor substrate which inhibits diffusion of acid in an electroplating solution used during the electroplating. The protrusion is located at an inner periphery of the lipseal.SELECTED DRAWING: Figure 2

Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

The application provides a plate passing device and a workpiece processing system. The plate passing device comprises a temporary storage groove and two groups of rotating opening and closing mechanisms. Any rotating opening and closing mechanism comprises two groups of oppositely arranged roller transmission mechanisms, any roller transmission mechanism comprises a driving mechanism, a first rotating shaft and a roller assembly; wherein the driving end of the driving mechanism is connected with the first rotating shaft, the first rotating shaft is connected with the roller assembly, the driving mechanism drives the two groups of opposite roller assemblies to rotate towards each other and contact and extrude to form a sealing surface, or drives the two groups of opposite roller assemblies to rotate away from each other to form a plate passing gap. The plate passing device with the structure does not contact the roller assembly when the workpiece passes through the plate, effectively ensuring the surface quality of the workpiece; meanwhile, the workpiece does not contact the plate passing device, the resistance during plate passing is small, the workpiece can pass through the plate quickly, and the production efficiency is improved. In addition, the workpiece moves horizontally into the working groove, compared with the lifting mechanism lifting and crossing the groove, the lifting mechanism is not needed, and the height space of the factory building is not occupied, and the required height space of the factory building is small.

A cup-type chuck for a substrate holding device is disclosed. The cup-type chuck includes an inner pressure ring, a middle frame, a seal portion, an outer pressure ring, and a contact ring. The inner pressure ring is fixed to the inner peripheral surface of the middle frame. The seal portion has an outer end, a bottom, and an inner end. The outer end of the seal portion covers at least a portion of the outer peripheral surface of the middle frame. The bottom of the seal portion covers the bottom of the middle frame and is exposed to the outside of the cup-type chuck. The inner end of the seal portion covers at least a portion of the inner peripheral surface of the middle frame and is pressed between the inner pressure ring and the middle frame by the inner pressure ring. The outer pressure ring is made of an insulating material and fixed to the outer peripheral surface of the middle frame, and the outer end of the seal portion is pressed between the outer pressure ring and the middle frame by the outer pressure ring. The contact ring is located above the seal portion and is pressed between the inner pressure ring and the middle frame, with the seal ring being disposed between the inner pressure ring and the contact ring.

The present invention discloses a sealing device, a container, and a workpiece processing device, wherein the sealing device includes a channel body that allows a workpiece to be processed to pass through; and a scraper sealing assembly that is arranged on at least one inner wall surface of the channel body, the scraper sealing assembly including a plurality of scraper seals arranged along the travel direction of the workpiece to be processed, the workpiece to be processed enters the channel body and is sealingly slidably connected to the scraper seals. During the travel of the workpiece to be processed through the channel body, the scraper sealing assembly can block as much as possible the flow of a portion of the processing liquid out of the channel body, and the workpiece to be processed is always in sealing sliding connection with the scraper seal, so that the sealing effect between the two is better, thereby reducing the outflow of the processing liquid through the channel body, thereby reducing the outflow rate of the processing liquid.

Methods and apparatus for electroplating metal onto a substrate are provided herein. For example, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while plating a metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain a separation between a plating surface of the substrate and the anode during electroplating; and (c) an ionically resistive ionically permeable element comprising a substrate facing surface and an opposing surface wherein the ionically resistive ionically permeable element allows a flow of an ionic current through the ionically resistive ionically permeable element toward the substrate during electroplating, and wherein the ionically resistive ionically permeable element and the substrate holder are configured to cooperate with each other and rotate together relative to the plating chamber.

Embodiments disclosed herein relate to electroplating apparatuses used for components in semiconductor processing chambers. In one embodiment, an electroplating device is provided. The electroplating device includes a housing including a first surface and a second surface and a plurality of holes disposed in the housing. The plurality of holes extend from the first surface to the second surface, and are configured to hold a component to be electroplated. The electroplating device further includes a gas inlet connected to an air bladder. The air bladder is disposed between the plurality of holes. The air bladder is configured to cover an outer surface of the component to be electroplated. The electroplating device further includes a cathode connector disposed below the first surface, and a cathode insert connected to the cathode connector. The cathode insert is connected to the plurality of holes and is configured to electrically charge the component.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

The present invention addresses the problem of efficiently introducing a liquid into an internal space of a substrate holder. The present invention relates to a substrate holder for holding a substrate, the substrate holder comprising: a first holding member and a second holding member that sandwich and hold the substrate; a sealing member disposed between the first holding member and the second holding member in a state in which the substrate is held by the first holding member and the second holding member, the sealing member sealing an outer peripheral portion of the substrate in contact with a contact of the substrate holder; a liquid injection port for injecting a liquid into the internal space sealed by the sealing member; and an exhaust port for discharging gas from the internal space, the exhaust port being formed by combining the recess of the first holding member and the recess of the second holding member, and the flow path area of the exhaust port being larger than the flow path area of the liquid injection port.

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P11 and continue with a period T11; step 3: when the period T11 ends, adjusting the first plating power supply applied on the first anode to output a power value P12 and continue with a period T12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P21 and continue with a period T21; and step 4: when the period T21 ends, adjusting the second plating power supply applied on the second anode to output a power value P22 and continue with a period T22; wherein step 2 to step 4 are performed periodically.

The present invention discloses a sealing device, a container, and a workpiece processing device, comprising: a channel body that allows a workpiece to be processed to pass through; and a sealing component provided on at least one inner wall surface of the channel body, the sealing component including a plurality of rotatable sealing rollers arranged along the advancing direction of the workpiece, the workpiece to be processed enters the channel body and is in sealed rolling connection with the sealing rollers. The overall device structure is reasonably arranged and has strong practicability. The sealing rollers are in sealed rolling connection with the workpiece to be processed, avoiding the liquid level in each container from dropping too fast, facilitating subsequent batch processing of the workpiece. The solutions for the processes of different workpieces in each container are the same, improving the uniformity of workpiece processing.

The invention relates to a device (100) and a method for forming a via in a layered substrate (101) having a through-hole (102) which is closed on a first face (101a) of the substrate (101) by means of a metal layer (103) and exits the substrate on a second face (101b) of the substrate (100). A metal is deposited in the through-hole (102) by means of electrochemical deposition. The device comprises a support (106) for receiving and positioning the substrate (101), an electrical contact for electrically contacting the metal layer (106), a metallization container (108) which can be filled with an electrolyte, and an anode (109) which is immersed in the electrolyte during the deposition process. The support (106) is preferably part of the metallization container (108) and / or is designed and / or positioned in such a way that the layered substrate (101) forms a boundary of the metallization container (108). In a first variant, the device is designed in such a way that only the second face (101b) of the substrate (100) comes into contact with the electrolyte during the deposition process. In a second variant, the support (106) is designed and / or positioned in such a way that the inserted substrate (100) forms a boundary of the metallization container (108). In a third variant, the support (106) is electrically conductive and serves as the electrical contact for electrically contacting the metal layer (103), or the electrical contact is integrated into the support (106) or is fixed to the support (106). In a fourth variant, an ultrasound generator (110) is provided on the first face (101a) of the substrate (101) and applies ultrasound to the substrate (101) during the deposition process. In a fifth variant, the device comprises a stationary sub-element (116) and a movable sub-element (115).

This disclosure relates to a sealing system (10) for a processing chamber (11) for chemically and / or electrolytically surface treating a substrate (12) in a substrate holder (13), comprising a cover element (14), a cover plate element (15), and a suspension unit (16). The cover element (14) is configured to partially cover an opening of the processing chamber (11), and the cover element (14) includes a cover opening (142) for the substrate holder (13) to enter and exit the processing chamber (11). The cover plate element (15) is configured to reduce a gap (141) between the cover element (14) and the substrate holder (13), and the cover plate element (15) includes a cover opening (151) for the substrate holder (13) to enter and exit the chamber (11). The suspension unit (16) is configured to provide an air cushion (161) between the cover element (14) and the cover plate element (15) to raise the cover plate element (15) relative to the cover element (14) into a suspended state, in which the gap (141) between the cover element (14) and the base retainer (13) is at least partially sealed.

The present invention discloses a workpiece processing production system, which includes: a transmission line, which carries and transmits workpieces; the workpieces sequentially enter a pre-processing device arranged along the conveying direction of the transmission line, which includes at least one first container and a pre-processing component arranged in the first container to pre-process the surface of the workpiece; a processing device, which includes at least one second container, an electrochemical treatment component arranged in the second container, and sealed channels arranged at both ends of the second container; a chemical treatment liquid is provided in the second container, and the workpiece is sealedly input or output into or out of the second container through the sealed channel; and a post-processing device, which includes at least one third container and a post-processing component arranged in the third container to post-process the surface of the workpiece. The provision of the sealed channel ensures that the solutions between two adjacent containers do not mix with each other; and the workpiece is transferred from one container to another, which simplifies the workpiece processing process and facilitates subsequent batch processing of workpieces.

To provide a workpiece holder and a device for loading workpieces onto the holder for use in wet chemical semiconductor processing. [Solution] The workpiece holder includes two perimeter seal plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the perimeter seal plates provide force for both fluid sealing and electrical contact. The locking plate also functions as an electrical bus, supplying current to the electrical contact insert. The workpiece loader includes a stage for inserting or removing a workpiece from the workpiece holder. The loader also includes a vacuum chuck that positions the perimeter seal plates before loading and compresses the perimeter seal plates during locking and unlocking.

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

In one embodiment of the present invention, an electrolytic plating apparatus is disclosed. The electrolytic plating apparatus includes an electrolytic plating tank, a clamp, a positioning cylinder, and an anode. In the electrolytic plating apparatus, the positioning cylinder is located in the electrolytic plating tank, and one end of the positioning cylinder is open. The anode is located inside the positioning cylinder, and the positioning cylinder is in sealing contact with the anode. Furthermore, of the total surface area of ​​the anode, only a first surface is in contact with the electrolytic plating solution, the first surface faces the substrate in parallel, the center is aligned with the center of the substrate, and the size of the first surface is similar to the size of the effective electrolytic plating area of ​​the substrate. The electrolytic plating apparatus allows the electric field generated by the anode to be uniformly distributed on the surface of the substrate, thereby improving the uniformity of the electrolytic plating height on the surface of the substrate. Furthermore, in one embodiment of the present invention, an electrolytic plating method using the electrolytic plating apparatus is disclosed.

The present invention aims to facilitate the maintenance of diaphragms and the like in a downward-facing plating apparatus. A plating apparatus includes: a plating tank for holding a plating solution; a substrate holder for holding a substrate with the plating surface facing downwards; and an anode holder assembly that is horizontally pullable and mountable to the plating tank via an opening in the side wall of the plating tank, and has an anode holder having one or more openings in its central portion, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more sealing surfaces that seal the plating tank relative to the outside, and one or more sealing surfaces that divide the plating tank into upper and lower chambers.

The present invention belongs to the technical field of electroplating, and particularly relates to an energy-saving and efficient metal surface electroplating device, which includes an electroplating tank body. A regulating structure is arranged on the lower side of the electroplating tank body, an anode mounting mechanism is arranged at the end of the electroplating tank body, a lifting mechanism is arranged on the outside of the electroplating tank body, and a buffer mechanism is arranged on the upper side of the lifting mechanism; The problem to be solved by the present invention is that regardless of the size of the electroplated workpiece, a large amount of electroplating solution is required for electroplating operations. The large amount of electroplating solution cannot be fully utilized, resulting in waste. Moreover, due to the excessive electroplating solution, it takes a long time to adjust the temperature, affecting the electroplating efficiency; The present invention designs the electroplating tank body to be divided into a main tank body, a middle tank body, and an end tank body. The position between the main tank body, the middle tank body, and the end tank body is adjusted through the regulating structure, so that the length adjustment of the inner tank body can adapt to the electroplating of workpieces of various lengths, thereby reasonably adding the corresponding electroplating solution to reduce waste.

The invention belongs to the field of geosynthetic materials, and discloses acid-resistant and high-temperature-resistant polypropylene composite cloth covering an electrolytic bath. The acid-resistant and high-temperature-resistant polypropylene composite cloth comprises silica gel fireproof cloth, polypropylene filament geotextile and a PTFE (Polytetrafluoroethylene) film which are sequentially laminated and compounded, when the acid-resistant and high-temperature-resistant polypropylene composite cloth covers the electrolytic cell, one side of the silica gel fireproof cloth of the acid-resistant and high-temperature-resistant polypropylene composite cloth faces the electrolytic cell to cover the electrolytic cell. The acid-resistant and high-temperature-resistant polypropylene composite cloth can resist erosion of acid chemical substances, and has the functions of sealing (preventing acid mist from overflowing), covering, heat preservation and protection at the same time.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.