45results about "Sealing devices" patented technology

The present invention facilitates maintenance of a diaphragm or the like in a face-down type plating device.　This plating device comprises: a plating tank for holding a plating solution; a substrate holder which holds a substrate in a state in which a surface to be plated faces down; and an anode holder assembly which is attached to the plating tank in a manner that is horizontally-removable via an opening in a side wall of the plating tank, and which has an anode holder having one or more openings at a central part, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more seal surfaces for sealing the plating tank from the outside, and one or more seal surfaces for partitioning the plating tank into upper and lower chambers.

A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

The invention relates to a device (D) and a system for electrochemical surface treatment of an inner surface of a longitudinal tubular element (T) made of electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means (4A, 4B) forming a sealed interface configured to removably cooperate with the tubular element (T) and with the anode, the means (4A, 4B) forming a sealed interface comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, when in use, with a sealed longitudinal passage that is formed between the anode and the inner surface of the tubular element (T); and means (5) for rotating the tubular element (T) about its longitudinal axis (X0), characterised in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and in that the device (D) further comprises means for pulling the anode that are configured to act on at least one of the two ends of the anode in order to prevent the anode from bending.

To provide a lipseal for use in a lipseal assembly of an electroplating clamshell which engages with a semiconductor substrate and supplies electrical current to the semiconductor substrate during electroplating, and a method of electroplating the semiconductor substrate using the lipseal.SOLUTION: A lipseal 212 includes an elastomeric body having an outer portion configured to engage with a cup 201 of the lipseal assembly and an inner portion configured to engage with a peripheral region of the semiconductor substrate. The inner portion includes a protrusion having a width in a radial direction sufficient to provide a contact area with the semiconductor substrate which inhibits diffusion of acid in an electroplating solution used during the electroplating. The protrusion is located at an inner periphery of the lipseal.SELECTED DRAWING: Figure 2

Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

The application provides a plate passing device and a workpiece processing system. The plate passing device comprises a temporary storage groove and two groups of rotating opening and closing mechanisms. Any rotating opening and closing mechanism comprises two groups of oppositely arranged roller transmission mechanisms, any roller transmission mechanism comprises a driving mechanism, a first rotating shaft and a roller assembly; wherein the driving end of the driving mechanism is connected with the first rotating shaft, the first rotating shaft is connected with the roller assembly, the driving mechanism drives the two groups of opposite roller assemblies to rotate towards each other and contact and extrude to form a sealing surface, or drives the two groups of opposite roller assemblies to rotate away from each other to form a plate passing gap. The plate passing device with the structure does not contact the roller assembly when the workpiece passes through the plate, effectively ensuring the surface quality of the workpiece; meanwhile, the workpiece does not contact the plate passing device, the resistance during plate passing is small, the workpiece can pass through the plate quickly, and the production efficiency is improved. In addition, the workpiece moves horizontally into the working groove, compared with the lifting mechanism lifting and crossing the groove, the lifting mechanism is not needed, and the height space of the factory building is not occupied, and the required height space of the factory building is small.

Methods and apparatus for electroplating metal onto a substrate are provided herein. For example, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while plating a metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain a separation between a plating surface of the substrate and the anode during electroplating; and (c) an ionically resistive ionically permeable element comprising a substrate facing surface and an opposing surface wherein the ionically resistive ionically permeable element allows a flow of an ionic current through the ionically resistive ionically permeable element toward the substrate during electroplating, and wherein the ionically resistive ionically permeable element and the substrate holder are configured to cooperate with each other and rotate together relative to the plating chamber.

Embodiments disclosed herein relate to electroplating apparatuses used for components in semiconductor processing chambers. In one embodiment, an electroplating device is provided. The electroplating device includes a housing including a first surface and a second surface and a plurality of holes disposed in the housing. The plurality of holes extend from the first surface to the second surface, and are configured to hold a component to be electroplated. The electroplating device further includes a gas inlet connected to an air bladder. The air bladder is disposed between the plurality of holes. The air bladder is configured to cover an outer surface of the component to be electroplated. The electroplating device further includes a cathode connector disposed below the first surface, and a cathode insert connected to the cathode connector. The cathode insert is connected to the plurality of holes and is configured to electrically charge the component.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P11 and continue with a period T11; step 3: when the period T11 ends, adjusting the first plating power supply applied on the first anode to output a power value P12 and continue with a period T12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P21 and continue with a period T21; and step 4: when the period T21 ends, adjusting the second plating power supply applied on the second anode to output a power value P22 and continue with a period T22; wherein step 2 to step 4 are performed periodically.

The invention relates to a device (100) and a method for forming a via in a layered substrate (101) having a through-hole (102) which is closed on a first face (101a) of the substrate (101) by means of a metal layer (103) and exits the substrate on a second face (101b) of the substrate (100). A metal is deposited in the through-hole (102) by means of electrochemical deposition. The device comprises a support (106) for receiving and positioning the substrate (101), an electrical contact for electrically contacting the metal layer (106), a metallization container (108) which can be filled with an electrolyte, and an anode (109) which is immersed in the electrolyte during the deposition process. The support (106) is preferably part of the metallization container (108) and / or is designed and / or positioned in such a way that the layered substrate (101) forms a boundary of the metallization container (108). In a first variant, the device is designed in such a way that only the second face (101b) of the substrate (100) comes into contact with the electrolyte during the deposition process. In a second variant, the support (106) is designed and / or positioned in such a way that the inserted substrate (100) forms a boundary of the metallization container (108). In a third variant, the support (106) is electrically conductive and serves as the electrical contact for electrically contacting the metal layer (103), or the electrical contact is integrated into the support (106) or is fixed to the support (106). In a fourth variant, an ultrasound generator (110) is provided on the first face (101a) of the substrate (101) and applies ultrasound to the substrate (101) during the deposition process. In a fifth variant, the device comprises a stationary sub-element (116) and a movable sub-element (115).

This disclosure relates to a sealing system (10) for a processing chamber (11) for chemically and / or electrolytically surface treating a substrate (12) in a substrate holder (13), comprising a cover element (14), a cover plate element (15), and a suspension unit (16). The cover element (14) is configured to partially cover an opening of the processing chamber (11), and the cover element (14) includes a cover opening (142) for the substrate holder (13) to enter and exit the processing chamber (11). The cover plate element (15) is configured to reduce a gap (141) between the cover element (14) and the substrate holder (13), and the cover plate element (15) includes a cover opening (151) for the substrate holder (13) to enter and exit the chamber (11). The suspension unit (16) is configured to provide an air cushion (161) between the cover element (14) and the cover plate element (15) to raise the cover plate element (15) relative to the cover element (14) into a suspended state, in which the gap (141) between the cover element (14) and the base retainer (13) is at least partially sealed.

To provide a workpiece holder and a device for loading workpieces onto the holder for use in wet chemical semiconductor processing. [Solution] The workpiece holder includes two perimeter seal plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the perimeter seal plates provide force for both fluid sealing and electrical contact. The locking plate also functions as an electrical bus, supplying current to the electrical contact insert. The workpiece loader includes a stage for inserting or removing a workpiece from the workpiece holder. The loader also includes a vacuum chuck that positions the perimeter seal plates before loading and compresses the perimeter seal plates during locking and unlocking.

In one embodiment of the present invention, an electrolytic plating apparatus is disclosed. The electrolytic plating apparatus includes an electrolytic plating tank, a clamp, a positioning cylinder, and an anode. In the electrolytic plating apparatus, the positioning cylinder is located in the electrolytic plating tank, and one end of the positioning cylinder is open. The anode is located inside the positioning cylinder, and the positioning cylinder is in sealing contact with the anode. Furthermore, of the total surface area of ​​the anode, only a first surface is in contact with the electrolytic plating solution, the first surface faces the substrate in parallel, the center is aligned with the center of the substrate, and the size of the first surface is similar to the size of the effective electrolytic plating area of ​​the substrate. The electrolytic plating apparatus allows the electric field generated by the anode to be uniformly distributed on the surface of the substrate, thereby improving the uniformity of the electrolytic plating height on the surface of the substrate. Furthermore, in one embodiment of the present invention, an electrolytic plating method using the electrolytic plating apparatus is disclosed.

The present invention aims to facilitate the maintenance of diaphragms and the like in a downward-facing plating apparatus. A plating apparatus includes: a plating tank for holding a plating solution; a substrate holder for holding a substrate with the plating surface facing downwards; and an anode holder assembly that is horizontally pullable and mountable to the plating tank via an opening in the side wall of the plating tank, and has an anode holder having one or more openings in its central portion, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more sealing surfaces that seal the plating tank relative to the outside, and one or more sealing surfaces that divide the plating tank into upper and lower chambers.

The invention belongs to the field of geosynthetic materials, and discloses acid-resistant and high-temperature-resistant polypropylene composite cloth covering an electrolytic bath. The acid-resistant and high-temperature-resistant polypropylene composite cloth comprises silica gel fireproof cloth, polypropylene filament geotextile and a PTFE (Polytetrafluoroethylene) film which are sequentially laminated and compounded, when the acid-resistant and high-temperature-resistant polypropylene composite cloth covers the electrolytic cell, one side of the silica gel fireproof cloth of the acid-resistant and high-temperature-resistant polypropylene composite cloth faces the electrolytic cell to cover the electrolytic cell. The acid-resistant and high-temperature-resistant polypropylene composite cloth can resist erosion of acid chemical substances, and has the functions of sealing (preventing acid mist from overflowing), covering, heat preservation and protection at the same time.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

An electroplating system to process a substrate includes clamps and a membrane. The membrane is held by the clamps and separates a first portion of a chamber of the electroplating system from a second portion of the chamber. The membrane includes a surface extending from a center of a cavity of the chamber radially outward at an angle relative to a reference plane. The angle is greater than or equal to 0° and less than or equal to 3°.

A method for depositing a metallic material on a surface of a substrate comprising the steps of: providing the substrate having opposite first and second major surfaces; providing an arrangement for depositing a metallic material on a surface of the substrate, the arrangement comprising: a support structure having an electrode, a counter electrode, and an electrolyte for depositing metal ions onto one or more portions of the first major surface of the at least one substrate; attaching the substrate to the support structure wherein the electrode is in electrical contact with the substrate; contacting the substrate and the counter electrode with the electrolyte; and thereafter passing an electrical current through the electrolyte between the first major surface of the at least one substrate and the counter electrode such that the metallic material is deposited at at least some areas of the first major surface of the at least one substrate.

The invention relates to the field of mechanical design of electroplating equipment, in particular to multifunctional high-replaceability horizontal barrel plating equipment which comprises a barrel, supporting legs are arranged on the outer side wall of the barrel and used for stably placing the barrel, a sealing door is arranged at the end of the barrel, and an anode is detachably mounted in the barrel; the roller module moves in the axial direction of the roller body to enter the roller body, the roller module is detachably connected with the roller body, the roller module comprises a roller capable of rotating in the roller in the axial direction of the roller, and a cathode is coaxially arranged on the roller; the clamping module is used for putting the roller module into the roller body or taking the roller module out of the roller body; wherein the sealing door is provided with a driving motor, and the driving motor drives the roller to rotate through a coupler. The mechanical structure is highly modularized, core components can be rapidly detached and replaced, the equipment adjusting time is shortened, the production continuity and flexibility are improved, and the diversified electroplating process requirements are met.

The invention relates to a workpiece holder for wet chemical semiconductor processing and to a device for loading a workpiece to a holder. The workpiece holder includes two peripheral sealing plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the peripheral sealing plates provide force for fluid sealing and electrical contact. The locking plate may also act as an electrical bus to provide electrical current to the electrical contact inserts. The workpiece loader includes a table for inserting or removing a workpiece into or from the workpiece holder. The loader also includes a vacuum chuck for positioning the peripheral seal plate prior to loading and compressing the peripheral seal plate during locking and unlocking.

An electrochemical deposition device comprises: a process tank body having a receiving tank, the receiving tank being used to hold electroplating liquid; a substrate carrier having a carrying surface, the carrying surface being used to hold a substrate to be coated, at least a portion of the substrate carrier being located in the receiving tank; and at least one drive component, the drive component being arranged on the process tank body and being used to control the movement of the substrate carrier along a first plane, the first plane intersecting with the normal direction of the carrying surface.

An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.

To easily pull an electrolyte film away from a base material while keeping a plating solution in a housing and minimizing the deformation of the electrolyte film.SOLUTION: In a method for depositing a metallic film F, after placing a base material B on a placing stand 40, a metallic film F is deposited on a surface of the base material B while a plating solution L is in contact with the base material B through an electrolyte film 13. With the plating solution L sealed, at least one of the placing stand 40 or a housing body 15 is moved away from the other thereof, to pull the electrolyte film 13 away from the base material B. By the time of this pulling away, a circulation path 50 is shut off and the plating solution L in the housing 15 is sealed.SELECTED DRAWING: Figure 3A

The present invention provides a metal-coated film forming apparatus and a metal-coated film forming method, which can reduce the occurrence of discoloration or deterioration of a metal-coated film caused by drying of electrolyte solution remaining on the surface of the metal-coated film. A metal-coated film forming apparatus (1) of the present invention, in which a space (B) in which a metal-coated film (F) exists is enclosed between a housing (14) and a placement table (15) in a state in which a solid electrolyte film (12) is in contact with the metal-coated film (F), is provided with a water supply portion (40) that supplies cleaning water (A) to the enclosed space (B) so that the cleaning water (A) flows to the surface of the metal-coated film (F) in the state in which the solid electrolyte film (12) is in contact with the metal-coated film (F), and a water discharge portion (50) that discharges the cleaning water (A) from the enclosed space (B) so that the cleaning water (A) that has flowed to the surface of the metal-coated film (F) flows from the surface of the metal-coated film (F).

The present technology includes unitary electroplated seals, such as electroplated seals formed using additive manufacturing. The seal includes an outer seal member and an inner seal member. The outer sealing member includes an inner annular radius, an outer annular radius, and an outer sealing member body defined between an outer surface and an inner surface opposite the outer surface. The outer surface is formed from at least one polymer layer having a porosity of less than or about 10% by volume, and the outer sealing member body includes a filler. The inner sealing member is integrally formed with the outer sealing member and extends from the inner annular radius toward the outer annular radius along at least a portion of the inner surface of the outer sealing member. The inner sealing member includes a deformable thermoplastic elastomer.

The invention relates to the technical field of radioactive sources, and provides an electro-deposition device for preparing a toxic agent alarm source, which comprises a bottom plate, a fixed seat, an electroplating bath and a plurality of cam structures, the fixing seat is arranged on the bottom plate, a positioning structure is arranged on the surface, deviating from the bottom plate, of the fixing seat, and a plurality of arc-shaped grooves are formed in the circumferential surface of the fixing seat in the circumferential direction of the fixing seat; an annular boss is arranged on the inner wall of the electroplating bath, the electroplating bath is arranged outside the fixed seat in a sleeving manner, and a plurality of first through grooves penetrating through the electroplating bath in the thickness direction are formed in the electroplating bath in the circumferential direction; the first end of the cam structure abuts against the circumferential face of the fixing base, the second end of the cam structure penetrates through the first through groove and extends out of the electroplating bath, and when the second end of the cam structure is rotated upwards, the cam structure can be connected with the arc-shaped groove in a clamped mode so that the electroplating bath can be connected with the fixing base in a sealed mode. According to the electro-deposition device for preparing the toxic agent alarm source, rapid locking and releasing between the electroplating bath and the fixing base are achieved, operation is easy and efficient, and the experiment or production efficiency is greatly improved.