1774results about "Tanks" patented technology

The invention relates to the technical field of circuit board electroplating equipment, and discloses an electroplating device for integrated circuit board processing, the electroplating device comprises an electroplating bath and a floating block, the top of the electroplating bath is provided with a cathode guide rail, and the outer side of the cathode guide rail is fixedly sleeved with a plurality of hanging rings; and a plurality of nozzles capable of adjusting the flow of sprayed electroplating liquid are arranged at the bottom of the electroplating bath. Electroplating liquid circulates in the electroplating bath through the nozzles, the liquid level fluctuation of the electroplating liquid is increased, a circuit board ascends and descends along with the fluctuation of the liquid level under the action of buoyancy, then the circuit board is driven to move back and forth in a transmission mode, and the circuit board is driven to move back and forth under the flowing action and self-shaking of the electroplating liquid sprayed out of the nozzles. Balance between bubbles attached to the side face is broken through, the bubbles break away from the surface of the circuit board and float in an accelerated mode under driving of the electroplating liquid to be discharged out of the surface of the electroplating liquid, pinholes in the surface of the circuit board caused by the bubbles generated by hydrogen evolution are avoided, and the yield of the circuit board is increased.

The invention discloses non-contact type vertical lifting electroplating equipment which comprises a fixed platform, supporting columns and channel steel. The electroplating equipment is characterized in that the fixed platform, the supporting columns and the channel steel jointly form a main body frame structure of the electroplating equipment; inverted U-shaped steel is fixedly connected to the middle of the upper surface of the fixed platform; the middle of the U-shaped steel is fixedly connected with a vertically-arranged oil cylinder through a first supporting plate. The output end of the oil cylinder is fixedly connected with a connecting plate; the circuit board on the hanging tool can be vertically lifted and horizontally transferred in a non-contact manner; as the circuit board on the hanger does not contact with the roller and the wall of the electroplating bath and other objects, the problem that the subsequent electroplating effect is influenced by collision damage, roller marks and the like is avoided, in addition, the structure is compact, the electroplating continuity is good, the circuit board does not need to contact with other carriers such as a transfer frame in the transfer process, the external interference factors are few, and the production cost is low. And the electroplating effect is relatively stable, and the product quality judgment rate is relatively low.

The invention discloses a copper plating method for a superconducting strip. The method comprises the following steps: S1, carrying out initial electrochemical copper plating on a processed strip; s2, high-precision continuous thickness measuring equipment is adopted to test the thickness of the plating layer in the length direction and the width direction of the strip; s3, compensating the thickness error by adjusting the position of the shielding plate according to the thickness distribution data obtained by testing; and S4, the steps S2-S3 are repeated until the plating layer is accumulated to reach the target thickness. The thicknesses of the copper plating layers on the two sides of the superconducting tape are adjusted by adjusting the shielding plates, non-contact detection and dynamic adjustment of the thickness of the plating layer are achieved, and the precision of the thickness of the plating layer is improved.

The invention discloses a surface treatment device for electronic accessory processing, an electroplating cylinder mechanism is rotatably mounted between two groups of side surface frames, the electroplating cylinder mechanism comprises an electroplating cylinder rotatably mounted between the two side surface frames through a bearing, and a driving main shaft is rotatably mounted between the two side surface frames through a bearing; two groups of driving assemblies are mounted at the two ends of the driving main shaft, a dispersing mechanism is rotatably mounted in the electroplating roller, and a cleaning mechanism for cleaning the electroplating roller is mounted between the two groups of side surface frames. And the driving main shaft is further connected with the dispersing mechanism, and the rotating direction of the dispersing mechanism is opposite to that of the electroplating roller, so that the electronic accessories form turbulent flow in the electroplating roller, aggregation of the electronic accessories is reduced, and the electronic accessories are stirred more uniformly.

The invention relates to the technical field of electroplating devices, and provides a composite coating electroplating device and method.The device comprises an electroplating pool, the bottom side of the electroplating pool is rotationally connected with a stirring shaft, the outer wall of the electroplating pool is slidably connected with a T-shaped plate, and the bottom side of the T-shaped plate is connected with the stirring shaft through a first gear set; the stirring shaft is used for controlling the stirring of the electroplating liquid in the electroplating tank; the supporting frame is arranged on the top side of the electroplating pool, a supporting rod is fixedly connected to the bottom side of the supporting frame, a guide rail is slidably connected to the outer wall of the supporting rod, a lead screw motor is arranged on the top side of the supporting frame, and the guide rail is in threaded connection to the driving end of the lead screw motor. A workpiece in the electroplating tank can flexibly move and rotate, so that the electroplating liquid is in comprehensive contact with the workpiece, and a plating layer is uniform; meanwhile, workpiece movement is matched with stirring shaft operation, electroplating liquid components are uniform, and efficiency is stable; in addition, the mounting shaft regulates the cathode conducting rod to facilitate feeding and discharging, and the overall efficiency of the production line is improved.

The invention discloses a coating with in-situ plugging and active protection functions as well as a preparation method and application thereof, and belongs to the technical field of metal material surface treatment. An innovative electrolyte design scheme is provided, the commercial 5083 aluminum alloy is subjected to micro-arc oxidation in a phosphate system containing specific cerium salt and a complexing agent, film layer growth and in-situ chemical blocking of micropores are completed in one step, the process is simple, and the obtained coating has excellent blocking firmness and corrosion resistance, has an active protection function and is suitable for large-scale industrial production. And a new solution is provided for improving the durability of the 5083 aluminum alloy in a harsh marine environment.

The invention relates to the technical field of electroplating processing, in particular to slotting type annular roller reel-to-reel water electroplating treatment equipment which comprises a base plate, an electroplating treatment cabin is integrated on the top of the base plate, one side of the lower portion of the electroplating treatment cabin communicates with a liquid conveying pipe, a pump body is installed outside the input end of the liquid conveying pipe, and a positioning roller is rotationally arranged in the middle of the lower portion in the electroplating treatment cabin; and the lower part in the electroplating treatment cabin is close to two sides above the positioning rollers, and two sides of the upper part in the electroplating treatment cabin are communicated with spraying pipes. According to the invention, through the electroplating treatment cabin, cavity diversion and bottom eddy current are utilized to accelerate electrolyte circulation, an anode plate and an inner cavity of the electroplating treatment cabin are overlapped to enlarge the anode action area, and through cooperation with conductive roller spacing and annular groove chamfering polishing, the plating thickness standard deviation is reduced, the yield is improved, and the comprehensive energy consumption is reduced; the limiting rollers are used for restraining deviation of an electroplating film conveying path, and high-speed electroplating of ultra-thin materials is adapted; the double-electrode effect can be eliminated during electroplating through the electroplating bath, and the process stability is improved.

The present invention relates to an integrated horizontal electroplating device, comprising a first power supply and an electroplating tank, an electroplating solution being provided in the electroplating tank. The electroplating tank comprises recovery tanks arranged at intervals within the electroplating tank, conductive cathode rollers and non-conductive rollers rotatably disposed within the electroplating tank, and a lower anode disposed within the electroplating tank, the conductive cathode rollers being located in the recovery tanks, and the non-conductive rollers being located between adjacent recovery tanks. The lower anode is connected to a positive electrode of the first power supply, the conductive cathode rollers are connected to a negative electrode of the first power supply, far ends of the non-conductive rollers are flush with far ends of the conductive cathode rollers, and the conductive cathode rollers and the non-conductive rollers rotate to convey a substrate. According to the integrated horizontal electroplating device of the present invention, since all positions within the electroplating tank are in communication with one another, the liquid level of the electroplating solution is flush at all positions within the electroplating tank, thus ensuring a sufficient and uniform electroplating thickness of the bottom surface of the substrate, and improving the electroplating effect for the substrate.

The utility model discloses copper plating equipment for a high aspect ratio circuit board, which relates to the technical field of circuit board processing, and comprises a box body, the top of the box body is fixedly connected with a top cover, five tanks are arranged in the box body and are respectively a pickling tank, a first rinsing tank, a sewage collecting tank, an electroplating tank and a second rinsing tank from front to back, a grabbing assembly is arranged over the electroplating bath and comprises a first top base, the top of the first top base is fixedly connected to the bottom of the top cover, a first sliding groove is longitudinally formed in the middle of the bottom of the first top base, two longitudinal first sliding channels are formed in the top of the first top base, and tooth grooves are formed in the left inner side wall and the right inner side wall of the first sliding groove. And motors III are connected into the two sliding channels I in a sliding manner. The circuit board is grabbed, electroplated and the like through the mechanical arm in the grabbing assembly, manual feeding and discharging are not needed, efficiency is improved, and safety of operators is further protected.

The invention belongs to the technical field of current collectors, and particularly relates to an ultrasonic-assisted directional energy deposition current collector and a preparation method and system thereof.The preparation method comprises the following steps that S1, Cu is sputtered on the surface of a base material layer through magnetron sputtering, and a carrier foil is obtained; s2, copper is electrodeposited on the carrier foil in an acid sulfate system through electrodeposition for thickening to obtain a Cu layer, meanwhile, ultrasonic impact treatment is conducted on the carrier foil, the frequency of ultrasonic waves is 10-30 MHz, and the power does not exceed 100 W; according to the method, the ultrasonic field is applied in the acid sulfate system, diffusion control in the Cu deposition process is converted into electrochemical control, the mass transfer process is accelerated, and the electro-deposition effect of Cu is improved; meanwhile, ultrasonic waves have a grain refining effect, and a microcrystalline structure on the surface of the composite copper foil can be increased in the process of utilizing ultrasonic impact to assist deposition, so that the corrosion of an electrolyte to the composite current collector copper foil is reduced, and the electrolyte resistance of a film layer is improved.

The invention relates to an adjustable electrolysis device, an electroplating system and an electroplating method. The adjustable electrolysis device comprises an electroplating mold, and the electroplating mold comprises an outer cylinder and an inner cylinder arranged in the outer cylinder; the outer cylinder is provided with an outer outlet and an inner inlet communicated with the outer outlet through a channel. According to the method, the internal cylinder and external cylinder structures of the electroplating mold are determined, so that the uniformity of the local coating film thickness of a semiconductor electronic element and the accuracy of a plating area can be quickly obtained, and the requirement of a high-end semiconductor lead frame in the metal coating electroplating process can be met; and the requirement for the screening accuracy of the optimal condition of the selective adjustable electroplating mold is met. The invention further provides an electroplating mold combination of a disposable adjustable electrolysis device as an update, and a rapid and accurate electroplating method for local plating areas of various semiconductor electronic elements is realized through the adjustable function of the through opening width of a cylinder in the electroplating mold.

A finishing system includes a frame that includes a bath station configured to communicate with an electrode. A hoist supported by the frame is movable into register with the bath station to establish electrical communication between the hoist and a current generated by a power source. The current drives deposition of a coating onto a load carried by the hoist. A drive assembly of the system is supported by the hoist and is operable to rotate a sprocket. The drive assembly includes a rotary conductor electrically coupled to the sprocket and configured to come into electrical communication with the frame. An electrically conductive lifting chain is operable through rotation of the sprocket to lower the load into the bath station. The frame communicates current from the power source to the rotary conductor, and the lifting chain communicates current from the rotary conductor to the load.

The utility model relates to the technical field of bonding wire electroplating, in particular to equipment for bonding wire electroplating, the equipment for bonding wire electroplating comprises an electroplating bath, supporting columns, a supporting plate, a drying box and a bottom plate, the outer side surface of the electroplating bath is fixedly connected with the bottom plate, the bottom surface of the electroplating bath is fixedly connected with the supporting columns in sequence, and the supporting plate is fixedly connected with the supporting columns. According to the equipment for bonding wire electroplating, through cooperation of the moving frame and the threaded rod, when the rotating motor operates, the threaded rod is driven to rotate, the threaded rod rotates to drive the moving frame connected with the outer side in a meshed mode to move, and therefore the bonding wire electroplating effect is improved; as the top of the movable frame is fixedly connected with the first connecting pipe, when the movable frame moves downwards, the first connecting pipe is driven to slide downwards in the fixed cylinder, so that a first wire guide wheel and a second wire guide wheel which are mounted on the first connecting pipe and the second connecting pipe are driven to move downwards, and the bonding wires mounted on the wire guide wheels are electroplated.

The invention belongs to the technical field of semiconductors, and discloses an electroplating device, and an opening and closing mechanism of the electroplating device has an open state and a closed state; when the opening and closing mechanism is in an open state, the clamp assembly can penetrate through the opening to move up and down; when the opening and closing mechanism is in the closed state, the opening and closing mechanism closes the opening; when the wafer carried by the clamp assembly completes the electroplating process and ascends to the preset cleaning position, the opening and closing mechanism is switched to the closed state to close the opening, and at the moment, the opening and closing mechanism in the closed state can prevent liquid formed when the clamp assembly and / or the wafer carried by the clamp assembly is cleaned from falling into electroplating liquid in the electroplating cavity. The preset cleaning position is located above the opening and closing mechanism. When the clamp assembly and the wafer are cleaned, the concentration of the electroplating liquid in the electroplating cavity is not affected, the stability, uniformity and quality of wafer electroplating can be improved, part of the electroplating liquid attached to the clamp assembly and the wafer can be recycled into the electroplating cavity, the working efficiency is high, and the energy consumption is low.

The invention relates to the technical field of galvanization equipment, and discloses metal surface galvanization treatment equipment which comprises a mounting frame and a galvanization pool, the galvanization pool is mounted on the mounting frame, a heating part is arranged in the galvanization pool, a first lead screw is arranged on the mounting frame, a connecting cylinder is arranged on the outer side of the first lead screw, and a second lead screw is arranged on the connecting cylinder. A connecting frame is arranged at the bottom end of the connecting cylinder, clamping frames are arranged on the two sides of the bottom end of the connecting frame, a galvanized part is clamped between every two adjacent clamping frames, clamping replacement mechanisms are arranged in the clamping frames, and the clamping replacement mechanisms replace the clamping mode of the galvanized part after the galvanized part enters a galvanizing pool. Through the clamping replacement mechanism in the clamping frame, the clamping mode is changed after the galvanized part enters the galvanizing bath, it is ensured that all positions of the surface of the galvanized part can be galvanized, the problem that the clamped part cannot be galvanized in a traditional clamping mode is solved, the surface of the galvanized part is completely galvanized, and the attractiveness and corrosion resistance of the galvanized part are improved.

The invention discloses a horizontal electroplating production line and relates to the technical field of circuit board electroplating, the horizontal electroplating production line comprises horizontal electroplating equipment and a circuit board feeding device, the horizontal electroplating equipment comprises a first rack, an electroplating cylinder and a horizontal electroplating conveying device, the electroplating cylinder and the horizontal electroplating conveying device are arranged on the first rack, and the electroplating cylinder extends in the first direction; the horizontal electroplating conveying device is used for clamping the circuit board to move in the electroplating cylinder and carrying out electroplating, the circuit board feeding device comprises a second rack and a feeding conveying mechanism arranged on the second rack, and the feeding conveying mechanism is a conveying line with a certain length; the feeding conveying mechanism is used for allowing the circuit board to be horizontally placed and conveying the circuit board to the horizontal electroplating conveying device of the electroplating equipment in the horizontal direction, in the whole conveying process, the circuit board is kept horizontal and does not need to be operated through a mechanical arm, the occupied space of the equipment is smaller than that of traditional electroplating equipment, and the manufacturing cost is lower; and the high-precision electroplating requirement is met.

Disclosed are methods and systems of reversible metal electrodeposition (RME) devices with applications in dynamic smart windows. Embodiments use a RME device that includes two transparent substrates that sandwich a working electrode, counter electrode, and an electrolyte solution. Embodiments apply a pulsed voltage to the RME device that causes electrochemical deposition of metal ions from the electrolyte solution to create a metallic film on the working electrode. The metallic film results in reduced light transmittance of the RME device.

The invention belongs to the technical field of circuit board processing machinery, and relates to an electroplating device for integrated circuit board processing, which comprises a tank body, a protective cover is horizontally and slidably mounted in the tank body, a drilling assembly is rotatably mounted on the protective cover, and a first driving assembly is mounted between the protective cover and the drilling assembly; a vertical second partition plate is arranged in the groove body, a vertical first partition plate is arranged in the groove body between the second partition plate and the protective cover, a receding hole matched with the drill hole is formed in the first partition plate, and a polishing assembly is arranged between the first partition plate and the second partition plate; a collecting hopper is arranged below the protective cover and the first partition plate; air holes are formed in the side wall of the tank body between the first partition plate and the protective cover; the U-shaped frame is arranged on the tank body, the clamping assembly is arranged on the U-shaped frame, the drying assembly is installed below the U-shaped frame, the electroplating assembly is installed at the end, away from the protective cover, in the tank body, abrasive dust of the circuit board is removed in time after polishing is completed, and the follow-up electroplating quality is improved. And after electroplating is completed, the circuit board is dried in time, and follow-up assembling work is facilitated.

The present invention discloses a non-contact vertical lifting electroplating device, which includes a fixed platform, support columns and channel steels; it is characterized in that: the fixed platform, support columns and channel steels jointly constitute the main frame structure of the electroplating device; a buckled U-shaped steel is fixedly connected to the middle of the upper surface of the fixed platform; a vertically arranged oil cylinder is fixedly connected to the middle part of the U-shaped steel through a first support plate; a connecting plate is fixedly connected to the output end of the oil cylinder; the circuit board on the hanging tool can be vertically lifted and horizontally transferred in a non-contact manner; since the circuit board on the hanging tool does not contact objects such as rollers and the inner wall of the electroplating tank, there will be no problems such as bump damage and roller marks that affect the subsequent electroplating effect. In addition, due to the compact structure and good electroplating continuity, there is no need to contact other carriers such as transfer racks during the transfer of the circuit board, and there are fewer external interference factors, the electroplating effect is relatively stable, and the rejection rate of product quality is relatively low.

The present invention relates to the technical field of electroplating devices, and specifically to an electroplating device and method for surface treatment of metal products, comprising an electroplating pool, wherein a plurality of partitions are arranged inside the electroplating pool, and the plurality of partitions divide the internal space of the electroplating pool into a plurality of electroplating tanks, and a bracket is arranged on the top of the electroplating pool, and the bracket is in the shape of a gate, and a first linear slide distributed along its own length direction is arranged on the top of the bracket, and a vertical plate is arranged at the movable end of the first linear slide, and a second linear slide distributed vertically is arranged on the surface of the vertical plate, and a horizontal plate is arranged at the movable end of the second linear slide; the present invention has an electroplating rack and a blowing part, and when the electroplating rack carries the electroplated parts out of the electroplating liquid, the blowing part can be used to blow air to the surface of the electroplating rack, thereby accelerating the dripping of the electroplating liquid on the surface of the electroplated parts to avoid cross contamination between different electroplating liquids.

The invention discloses high-strength anti-fatigue damping spring surface electroplating equipment and an electroplating process thereof, and relates to the technical field of damping spring electroplating, the high-strength anti-fatigue damping spring surface electroplating equipment comprises a fixed bottom plate and a circulating assembly, an electroplating base is mounted on the upper surface of the fixed bottom plate, an electroplating mother groove is formed in the left end of the inner side of the electroplating base, and an electroplating son groove is formed in the right end of the inner side of the electroplating base; a supporting disc is mounted at the front end of the upper surface of the fixed bottom plate, and the circulating assembly comprises a stepped mounting groove, a mounting strip, a first filter screen, a mounting plate, a second filter screen, a liquid extracting pipe, a liquid extracting pump, a liquid conveying pipe, a connecting outlet pipe, a liquid discharging valve and a connecting inlet pipe. According to the high-strength anti-fatigue damping spring surface electroplating equipment and the electroplating technology thereof, circulation of electroplating liquid can be achieved through the circulation assembly, the electroplating liquid can keep flowing in the electroplating process, the electroplating effect is improved, and the electroplating quality of the electroplating liquid can be kept through the filtering mechanism in the circulation process.

The present invention facilitates maintenance of a diaphragm or the like in a face-down type plating device.　This plating device comprises: a plating tank for holding a plating solution; a substrate holder which holds a substrate in a state in which a surface to be plated faces down; and an anode holder assembly which is attached to the plating tank in a manner that is horizontally-removable via an opening in a side wall of the plating tank, and which has an anode holder having one or more openings at a central part, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more seal surfaces for sealing the plating tank from the outside, and one or more seal surfaces for partitioning the plating tank into upper and lower chambers.

The utility model belongs to the technical field of electroplating devices, and particularly relates to a fitting electroplating device for metal furniture, which comprises an electroplating bath, a water outlet connector is arranged at the bottom of the electroplating bath in a penetrating manner, a circulating pump is arranged at the other end of a filter cartridge, a drainage pipe is arranged at the water outlet end of the circulating pump, a filter screen is arranged in the filter cartridge, and a water outlet connector is arranged at the water outlet end of the filter screen. And filter cotton is arranged on one side of the filter screen. By installing the filter screen and the filter cotton, when impurities appear in electroplating liquid, the circulating pump operates to drive the filter cartridge to absorb the electroplating liquid through the water outlet connector under the adsorption action of the absorption end, the filter screen can filter large impurities in the electroplating liquid, and then the electroplating liquid enters the filter cotton to filter small impurities. And then the electroplating liquid is conveyed into the electroplating bath through the drainage pipe, so that the technical problems that after the electroplated part is immersed in the electroplating liquid, part of impurities enter the electroplating liquid, the electroplating liquid is polluted, and the electroplating effect of the electroplated part is influenced are solved.

According to the electroplating device and the using method thereof, through cooperation of the wafer carrier and the auxiliary device, flexible moving and positioning of the spraying tank are achieved through the telescopic connecting piece, before electroplating, the auxiliary device can wet the surface of a wafer in advance, air in Via and Trench can be effectively removed, it is ensured that electroplating liquid is fully filled, and poor plating and hole generation are avoided; after electroplating, the auxiliary device can quickly clean the residual electroplating liquid on the surface of the wafer and collect the cleaning liquid to prevent the cleaning liquid from being introduced into the electroplating bath to interfere with the concentration of the additive; meanwhile, upwelling electroplating liquid steam can be shielded, and film forming defects caused by contact reaction of the upwelling electroplating liquid steam and the wafer are avoided; in addition, during electroplating, the auxiliary device can rotate to the outer side of the electroplating bath and conduct cleaning liquid discharging operation, normal electroplating steps are not affected, and the stability and efficiency of the electroplating process are improved.

The invention discloses a nickel plate electroplating forming pool for a light guide plate, and relates to the technical field of light guide plate processing, the nickel plate electroplating forming pool comprises a pool body, an electroplating device and an auxiliary device; an electroplating bath containing electroplating liquid is arranged in the tank body; the electroplating device comprises an electrolysis assembly and a clamping assembly, and the auxiliary device comprises a net plate; the electroplating bath is separated by the net plate, and a plurality of net holes are uniformly distributed in the net plate; the electrolysis assembly and the clamping assembly are located on the two sides of the screen plate respectively, a plurality of electrolysis rods of the electrolysis assembly are all immersed in electroplating liquid, and the light guide plate is immersed in the electroplating liquid after being clamped on the clamping assembly; and the plurality of mesh holes in the mesh plate are aligned with the concave dot structures on the light guide plate. The preparation quality of the nickel plate can be effectively improved, the cost is reduced, the efficiency is improved, and therefore the uniformity of concave point or net point results obtained after hot pressing treatment of the light guide plate can be effectively improved, and the optical performance of the light guide plate is guaranteed.

The invention discloses electroplating equipment and an electroplating method, and the electroplating equipment comprises an electroplating tank which is provided with a cavity for accommodating electroplating liquid; the anode assembly is used for transmitting the first current and the second current; the cathode assembly is used for clamping a to-be-electroplated part; wherein the anode assembly is provided with a first anode plate and a second anode plate which are used for transmitting the first current and the second current, and a preset distance for placing the to-be-electroplated part is formed between the first anode plate and the second anode plate; and when the electroplating equipment is in a use state, the first current and the second current are respectively transmitted to the first anode plate and the second anode plate, so that the electroplating equipment can be used for electroplating by adjusting the numerical values of the first current and the second current. And the electroplating states of the two faces of the part to be electroplated located between the first anode plate and the second anode plate are controlled correspondingly. Current of different values can be applied to the first conductive support and the second conductive support at the same time, double-face electroplating is conducted on the to-be-electroplated parts at the same time, and the two faces of the to-be-electroplated parts can achieve the effect that electroplating circuit areas, electroplating areas and electroplating results are different.

The electroplating device of the square substrate comprises an electroplating cavity, the electroplating cavity comprises an anode cavity, the anode cavity comprises a central anode area and a peripheral anode area, the central anode area corresponds to an inscribed circle area of the square substrate, the central anode area comprises one or more anode areas, and the peripheral anode area corresponds to the inscribed circle area of the square substrate. The peripheral anode region corresponds to a region between an inscribed circle and a circumscribed circle of the square substrate, the peripheral anode region is divided into a plurality of fan-ring-shaped anode regions along the circumferential direction, and each anode region is provided with an anode, an anolyte inlet and an anolyte outlet. Along with the rotation of the square substrate, the electrodes in the areas covered by the corners of the square substrate can be independently controlled to be opened, and the electrodes in the areas not covered by the corners of the square substrate can be independently controlled to be closed, so that the plating on the edge part of the square substrate is prevented from being too thick, and the electroplating uniformity of the square substrate is ensured.

The utility model discloses a new energy automobile radiator electroplating treatment device which comprises a cover plate, the cover plate is arranged above an electroplating pool, first hydraulic cylinders are arranged on the two sides of the electroplating pool, mounting holes are formed in the cover plate, a mounting frame is arranged above the cover plate, the mounting frame is in sliding connection with the cover plate, and the first hydraulic cylinders are arranged on the first hydraulic cylinders. A storage screen frame is arranged below the cover plate, and a second hydraulic cylinder is arranged between the mounting rack and the cover plate; the electroplating anode is arranged in the electroplating tank, a power supply device is arranged on the back of the electroplating tank and electrically connected with the storage screen frame and the electroplating anode, a liftable cover plate is arranged above the electroplating tank of the electroplating treatment device, and the cover plate is lowered to be connected with the electroplating tank during electroplating. Impurities can be prevented from entering the electroplating pool, sputtering of electroplating liquid can be avoided, the use safety in the electroplating treatment process is guaranteed, electroplating treatment of a plurality of radiators can be conducted at the same time through the partition plates, and the electroplating treatment efficiency of the radiators is improved.

The utility model provides horizontal rotating wafer electroplating equipment and a wafer electroplating device. The horizontal rotating wafer electroplating equipment comprises a wafer containing tank body, a cover body, a wafer and a wafer bearing back plate, the crystal containing groove body and the cover body are movably and hermetically connected; the crystal containing groove body comprises a first groove bottom, a groove wall and a first cavity defined by the first groove bottom and the groove wall; a through first opening is formed in the first groove bottom; the wafer and the wafer bearing back plate are sequentially stacked in the first cavity, and the to-be-plated surface of the wafer corresponds to the first opening; the wafer bearing back plate is an electric conductor and is electrically communicated with the to-be-plated surface of the wafer; the cover body comprises a first locking surface facing one side of the crystal bearing back plate, the outer surface of the first locking surface is provided with a first conductive part, the first conductive part comprises a first end and a second end, the second end is electrically connected with an external electrode, and the first end is in contact with and electrically communicated with the crystal bearing back plate; according to the electroplating equipment and the electroplating device, the integration degree and the electric connection reliability are improved.