1170results about "Tanks" patented technology

The invention discloses a copper plating method for a superconducting strip. The method comprises the following steps: S1, carrying out initial electrochemical copper plating on a processed strip; s2, high-precision continuous thickness measuring equipment is adopted to test the thickness of the plating layer in the length direction and the width direction of the strip; s3, compensating the thickness error by adjusting the position of the shielding plate according to the thickness distribution data obtained by testing; and S4, the steps S2-S3 are repeated until the plating layer is accumulated to reach the target thickness. The thicknesses of the copper plating layers on the two sides of the superconducting tape are adjusted by adjusting the shielding plates, non-contact detection and dynamic adjustment of the thickness of the plating layer are achieved, and the precision of the thickness of the plating layer is improved.

The invention discloses a coating with in-situ plugging and active protection functions as well as a preparation method and application thereof, and belongs to the technical field of metal material surface treatment. An innovative electrolyte design scheme is provided, the commercial 5083 aluminum alloy is subjected to micro-arc oxidation in a phosphate system containing specific cerium salt and a complexing agent, film layer growth and in-situ chemical blocking of micropores are completed in one step, the process is simple, and the obtained coating has excellent blocking firmness and corrosion resistance, has an active protection function and is suitable for large-scale industrial production. And a new solution is provided for improving the durability of the 5083 aluminum alloy in a harsh marine environment.

The invention relates to the technical field of electroplating processing, in particular to slotting type annular roller reel-to-reel water electroplating treatment equipment which comprises a base plate, an electroplating treatment cabin is integrated on the top of the base plate, one side of the lower portion of the electroplating treatment cabin communicates with a liquid conveying pipe, a pump body is installed outside the input end of the liquid conveying pipe, and a positioning roller is rotationally arranged in the middle of the lower portion in the electroplating treatment cabin; and the lower part in the electroplating treatment cabin is close to two sides above the positioning rollers, and two sides of the upper part in the electroplating treatment cabin are communicated with spraying pipes. According to the invention, through the electroplating treatment cabin, cavity diversion and bottom eddy current are utilized to accelerate electrolyte circulation, an anode plate and an inner cavity of the electroplating treatment cabin are overlapped to enlarge the anode action area, and through cooperation with conductive roller spacing and annular groove chamfering polishing, the plating thickness standard deviation is reduced, the yield is improved, and the comprehensive energy consumption is reduced; the limiting rollers are used for restraining deviation of an electroplating film conveying path, and high-speed electroplating of ultra-thin materials is adapted; the double-electrode effect can be eliminated during electroplating through the electroplating bath, and the process stability is improved.

The present invention relates to an integrated horizontal electroplating device, comprising a first power supply and an electroplating tank, an electroplating solution being provided in the electroplating tank. The electroplating tank comprises recovery tanks arranged at intervals within the electroplating tank, conductive cathode rollers and non-conductive rollers rotatably disposed within the electroplating tank, and a lower anode disposed within the electroplating tank, the conductive cathode rollers being located in the recovery tanks, and the non-conductive rollers being located between adjacent recovery tanks. The lower anode is connected to a positive electrode of the first power supply, the conductive cathode rollers are connected to a negative electrode of the first power supply, far ends of the non-conductive rollers are flush with far ends of the conductive cathode rollers, and the conductive cathode rollers and the non-conductive rollers rotate to convey a substrate. According to the integrated horizontal electroplating device of the present invention, since all positions within the electroplating tank are in communication with one another, the liquid level of the electroplating solution is flush at all positions within the electroplating tank, thus ensuring a sufficient and uniform electroplating thickness of the bottom surface of the substrate, and improving the electroplating effect for the substrate.

The invention relates to an adjustable electrolysis device, an electroplating system and an electroplating method. The adjustable electrolysis device comprises an electroplating mold, and the electroplating mold comprises an outer cylinder and an inner cylinder arranged in the outer cylinder; the outer cylinder is provided with an outer outlet and an inner inlet communicated with the outer outlet through a channel. According to the method, the internal cylinder and external cylinder structures of the electroplating mold are determined, so that the uniformity of the local coating film thickness of a semiconductor electronic element and the accuracy of a plating area can be quickly obtained, and the requirement of a high-end semiconductor lead frame in the metal coating electroplating process can be met; and the requirement for the screening accuracy of the optimal condition of the selective adjustable electroplating mold is met. The invention further provides an electroplating mold combination of a disposable adjustable electrolysis device as an update, and a rapid and accurate electroplating method for local plating areas of various semiconductor electronic elements is realized through the adjustable function of the through opening width of a cylinder in the electroplating mold.

A finishing system includes a frame that includes a bath station configured to communicate with an electrode. A hoist supported by the frame is movable into register with the bath station to establish electrical communication between the hoist and a current generated by a power source. The current drives deposition of a coating onto a load carried by the hoist. A drive assembly of the system is supported by the hoist and is operable to rotate a sprocket. The drive assembly includes a rotary conductor electrically coupled to the sprocket and configured to come into electrical communication with the frame. An electrically conductive lifting chain is operable through rotation of the sprocket to lower the load into the bath station. The frame communicates current from the power source to the rotary conductor, and the lifting chain communicates current from the rotary conductor to the load.

The invention belongs to the technical field of semiconductors, and discloses an electroplating device, and an opening and closing mechanism of the electroplating device has an open state and a closed state; when the opening and closing mechanism is in an open state, the clamp assembly can penetrate through the opening to move up and down; when the opening and closing mechanism is in the closed state, the opening and closing mechanism closes the opening; when the wafer carried by the clamp assembly completes the electroplating process and ascends to the preset cleaning position, the opening and closing mechanism is switched to the closed state to close the opening, and at the moment, the opening and closing mechanism in the closed state can prevent liquid formed when the clamp assembly and / or the wafer carried by the clamp assembly is cleaned from falling into electroplating liquid in the electroplating cavity. The preset cleaning position is located above the opening and closing mechanism. When the clamp assembly and the wafer are cleaned, the concentration of the electroplating liquid in the electroplating cavity is not affected, the stability, uniformity and quality of wafer electroplating can be improved, part of the electroplating liquid attached to the clamp assembly and the wafer can be recycled into the electroplating cavity, the working efficiency is high, and the energy consumption is low.

The invention belongs to the technical field of circuit board processing machinery, and relates to an electroplating device for integrated circuit board processing, which comprises a tank body, a protective cover is horizontally and slidably mounted in the tank body, a drilling assembly is rotatably mounted on the protective cover, and a first driving assembly is mounted between the protective cover and the drilling assembly; a vertical second partition plate is arranged in the groove body, a vertical first partition plate is arranged in the groove body between the second partition plate and the protective cover, a receding hole matched with the drill hole is formed in the first partition plate, and a polishing assembly is arranged between the first partition plate and the second partition plate; a collecting hopper is arranged below the protective cover and the first partition plate; air holes are formed in the side wall of the tank body between the first partition plate and the protective cover; the U-shaped frame is arranged on the tank body, the clamping assembly is arranged on the U-shaped frame, the drying assembly is installed below the U-shaped frame, the electroplating assembly is installed at the end, away from the protective cover, in the tank body, abrasive dust of the circuit board is removed in time after polishing is completed, and the follow-up electroplating quality is improved. And after electroplating is completed, the circuit board is dried in time, and follow-up assembling work is facilitated.

The present invention discloses a non-contact vertical lifting electroplating device, which includes a fixed platform, support columns and channel steels; it is characterized in that: the fixed platform, support columns and channel steels jointly constitute the main frame structure of the electroplating device; a buckled U-shaped steel is fixedly connected to the middle of the upper surface of the fixed platform; a vertically arranged oil cylinder is fixedly connected to the middle part of the U-shaped steel through a first support plate; a connecting plate is fixedly connected to the output end of the oil cylinder; the circuit board on the hanging tool can be vertically lifted and horizontally transferred in a non-contact manner; since the circuit board on the hanging tool does not contact objects such as rollers and the inner wall of the electroplating tank, there will be no problems such as bump damage and roller marks that affect the subsequent electroplating effect. In addition, due to the compact structure and good electroplating continuity, there is no need to contact other carriers such as transfer racks during the transfer of the circuit board, and there are fewer external interference factors, the electroplating effect is relatively stable, and the rejection rate of product quality is relatively low.

The invention discloses high-strength anti-fatigue damping spring surface electroplating equipment and an electroplating process thereof, and relates to the technical field of damping spring electroplating, the high-strength anti-fatigue damping spring surface electroplating equipment comprises a fixed bottom plate and a circulating assembly, an electroplating base is mounted on the upper surface of the fixed bottom plate, an electroplating mother groove is formed in the left end of the inner side of the electroplating base, and an electroplating son groove is formed in the right end of the inner side of the electroplating base; a supporting disc is mounted at the front end of the upper surface of the fixed bottom plate, and the circulating assembly comprises a stepped mounting groove, a mounting strip, a first filter screen, a mounting plate, a second filter screen, a liquid extracting pipe, a liquid extracting pump, a liquid conveying pipe, a connecting outlet pipe, a liquid discharging valve and a connecting inlet pipe. According to the high-strength anti-fatigue damping spring surface electroplating equipment and the electroplating technology thereof, circulation of electroplating liquid can be achieved through the circulation assembly, the electroplating liquid can keep flowing in the electroplating process, the electroplating effect is improved, and the electroplating quality of the electroplating liquid can be kept through the filtering mechanism in the circulation process.

The present invention facilitates maintenance of a diaphragm or the like in a face-down type plating device.　This plating device comprises: a plating tank for holding a plating solution; a substrate holder which holds a substrate in a state in which a surface to be plated faces down; and an anode holder assembly which is attached to the plating tank in a manner that is horizontally-removable via an opening in a side wall of the plating tank, and which has an anode holder having one or more openings at a central part, an anode mounted on the anode holder, and a diaphragm mounted on the anode holder above the anode. The anode holder assembly has one or more seal surfaces for sealing the plating tank from the outside, and one or more seal surfaces for partitioning the plating tank into upper and lower chambers.

According to the electroplating device and the using method thereof, through cooperation of the wafer carrier and the auxiliary device, flexible moving and positioning of the spraying tank are achieved through the telescopic connecting piece, before electroplating, the auxiliary device can wet the surface of a wafer in advance, air in Via and Trench can be effectively removed, it is ensured that electroplating liquid is fully filled, and poor plating and hole generation are avoided; after electroplating, the auxiliary device can quickly clean the residual electroplating liquid on the surface of the wafer and collect the cleaning liquid to prevent the cleaning liquid from being introduced into the electroplating bath to interfere with the concentration of the additive; meanwhile, upwelling electroplating liquid steam can be shielded, and film forming defects caused by contact reaction of the upwelling electroplating liquid steam and the wafer are avoided; in addition, during electroplating, the auxiliary device can rotate to the outer side of the electroplating bath and conduct cleaning liquid discharging operation, normal electroplating steps are not affected, and the stability and efficiency of the electroplating process are improved.

The invention discloses a nickel plate electroplating forming pool for a light guide plate, and relates to the technical field of light guide plate processing, the nickel plate electroplating forming pool comprises a pool body, an electroplating device and an auxiliary device; an electroplating bath containing electroplating liquid is arranged in the tank body; the electroplating device comprises an electrolysis assembly and a clamping assembly, and the auxiliary device comprises a net plate; the electroplating bath is separated by the net plate, and a plurality of net holes are uniformly distributed in the net plate; the electrolysis assembly and the clamping assembly are located on the two sides of the screen plate respectively, a plurality of electrolysis rods of the electrolysis assembly are all immersed in electroplating liquid, and the light guide plate is immersed in the electroplating liquid after being clamped on the clamping assembly; and the plurality of mesh holes in the mesh plate are aligned with the concave dot structures on the light guide plate. The preparation quality of the nickel plate can be effectively improved, the cost is reduced, the efficiency is improved, and therefore the uniformity of concave point or net point results obtained after hot pressing treatment of the light guide plate can be effectively improved, and the optical performance of the light guide plate is guaranteed.

The electroplating device of the square substrate comprises an electroplating cavity, the electroplating cavity comprises an anode cavity, the anode cavity comprises a central anode area and a peripheral anode area, the central anode area corresponds to an inscribed circle area of the square substrate, the central anode area comprises one or more anode areas, and the peripheral anode area corresponds to the inscribed circle area of the square substrate. The peripheral anode region corresponds to a region between an inscribed circle and a circumscribed circle of the square substrate, the peripheral anode region is divided into a plurality of fan-ring-shaped anode regions along the circumferential direction, and each anode region is provided with an anode, an anolyte inlet and an anolyte outlet. Along with the rotation of the square substrate, the electrodes in the areas covered by the corners of the square substrate can be independently controlled to be opened, and the electrodes in the areas not covered by the corners of the square substrate can be independently controlled to be closed, so that the plating on the edge part of the square substrate is prevented from being too thick, and the electroplating uniformity of the square substrate is ensured.

The invention provides a ceramic membrane filter, an electroplating liquid filtering and purifying system and a purifying method thereof, and belongs to the technical field of filtering devices. The ceramic membrane filter comprises a filter shell internally provided with a plurality of ceramic membrane pipes, a connector, a water inlet pipe and a water collecting pipe. The purification system comprises a plating tank, a carbon liquid mixer and the ceramic membrane filter. The ceramic membrane filter, the purification system and the in-situ backwashing system are adopted to replace a traditional wire-wound filter element, the problems that the traditional filter element is low in precision, non-reusable, much in solid waste and high in cost are solved through high-precision filtration and membrane in-situ regeneration, manual operation is reduced to the maximum extent, the labor cost is reduced, solid waste and secondary pollution are avoided, and the method is suitable for industrial production. The advantages of high efficiency, stability, low maintenance and environmental protection are realized.

The invention discloses an electrolytic bath on-line monitoring system and electrolysis equipment, the electrolytic bath on-line monitoring system comprises a plurality of distributed integrated acquisition devices, a data collection platform and a real-time monitoring platform, each distributed integrated acquisition device comprises a substrate, a positioning pin, magnetic steel and a shell; the positioning pin is arranged below the shell; the magnetic steel is embedded in the shell; the substrate is arranged in the shell, and a first probe, a second probe, a voltage stabilizing chip, a sensor and a data acquisition unit are integrated on the substrate; the tail end of the first probe is connected with the data acquisition unit through the voltage-stabilizing chip, and the head end of the first probe abuts against the interior of the electrolytic cell; the head end of the second probe abuts against a small electrolysis chamber electrode of the electrolytic bath; the sensor is connected with the tail end of the second probe; the data acquisition unit is connected with the sensor; the data collection platform is connected with the data acquisition unit; and the real-time monitoring platform is connected with the data collection platform. The device is high in integration degree, convenient to install, capable of achieving self-powered operation, comprehensive in monitoring coverage and capable of achieving real-time and accurate monitoring of parameters of the large electrolytic cell.

The utility model discloses a conveying device for hardware electroplating processing, and relates to the field of hardware electroplating processing, the conveying device comprises an electroplating pool, a support frame and a conveying cylinder, the top end of the electroplating pool is provided with a track, the top of the electroplating pool is provided with a conveying assembly, and the conveying assembly comprises the support frame; a supporting cross beam is movably installed in the supporting frame, two sets of hanging assemblies are installed at the bottom of the supporting cross beam, each hanging assembly comprises a conveying cylinder, a supporting column is installed in the conveying cylinder, multiple sets of supporting rods are arranged on the outer wall of the supporting column, and a connecting rod is fixed to the outer wall of the conveying cylinder. The end of the connecting rod is connected with a support, and the outer wall of the conveying cylinder is sleeved with a baffle. The plate blades of the baffle are limited and fixed through the positioning columns, the side face of the baffle is tightly attached to the end of the support, the baffle can prevent hardware from falling off from the end of the support, and therefore the phenomenon that the hardware on the conveying cylinder slides off in the conveying process is avoided.

There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; an anode placed in the plating tank and provided with a plurality of through holes; a substrate holder provided to hold a substrate to be opposed to the anode; a barrier membrane placed to be brought into close contact with a first face on a substrate side of the anode; and a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face.

The electroplating bath comprises an electroplating bath body, an anode box, the anode diaphragm, a filtering mechanism, a first water pump and a second water pump, the anode box is arranged in the electroplating bath body, an opening is formed in the side wall of the anode box, at least one filtering hole is formed in the anode diaphragm, and the filtering mechanism is arranged in the first water pump. The anode diaphragm is detachably connected to the side wall of the anode box and can cover the opening, the titanium basket can be hung in the anode box, the phosphor copper ball can be placed in the titanium basket, a first through hole is formed in the bottom of the anode box, and a water outlet of the filtering mechanism communicates with a water inlet of the second water pump through a third water pipe. The fourth water pipe is communicated with a water outlet of the second water pump, electroplating liquid in the anode box can flow into the filtering mechanism under the driving of the first water pump, the filtering mechanism can filter anode mud in the electroplating liquid, and the filtered electroplating liquid can flow into the electroplating bath under the driving of the second water pump. The phosphor copper ball cleaning device reduces phosphor copper ball cleaning frequency.

An electroplating method and an electroplating apparatus, which relate to the technical field of semiconductor processing. The electroplating method comprises: S10, applying a positive voltage to an intermediate anode, and an edge electrode not operating; S20, acquiring a deposition rate v1 of a plating layer of an intermediate region, and acquiring a deposition rate v2 of a plating layer of an edge region; S30, determining the magnitudes of v1 and v2; S40, if v1 is greater than v2, applying the positive voltage to the edge electrode, and outputting a current I; S50, if v1 is less than v2, applying a negative voltage to the edge electrode, and outputting the current I; and S60, if v1 is equal to v2, keeping an operating state of the edge electrode unchanged. By means of respectively acquiring deposition rates of plating layers of an intermediate region and an edge region, and controlling the voltage and current of an edge electrode accordingly, the deposition rate of the edge region can be dynamically adjusted, such that the deposition rates of the edge region and the intermediate region can be balanced in real time, thereby improving the uniformity of electroplating.

The invention relates to the technical field of plating solution impurity removal, and discloses an online plating solution impurity removal device which comprises an electroplating bath, an online monitor is fixedly connected to the bottom end of the interior of the electroplating bath, an electric control flow pump is fixedly connected into the electroplating bath, and a particle filtering mechanism is fixedly connected to the bottom end, away from the side face of the electroplating bath, of the electric control flow pump. A sealing pipe is movably connected to the side surface of the particle filtering mechanism; an organic filtering mechanism is fixedly connected to the side surface, away from the particle filtering mechanism, of the sealing pipe; the content of impurities in the electroplating liquid is monitored through the online monitor, the electroplating liquid containing the impurities is pumped into the particle filtering mechanism through the electric control flow pump, particle impurities in the electroplating liquid are filtered through the particle filtering mechanism, organic impurities in the electroplating liquid are removed through the organic filtering mechanism after filtering, and the electroplating liquid containing the impurities is obtained. Metal ion impurities in the electroplating liquid are removed through the cation resin column and the anion resin column, the clean electroplating liquid flows back into the electroplating bath, and the purity of the electroplating liquid in the electroplating bath is guaranteed.

The present application discloses an electroplating apparatus and a cleaning method. The electroplating apparatus comprises: a process chamber, used to store an electroplating solution; a substrate fixture, comprising a fixture body and a sealing member; a driving system, used to drive the substrate fixture to raise, lower and rotate; a cleaning system, comprising a nozzle, a cleaning liquid tank and a cleaning liquid supply tube, the nozzle having an upwardly inclined spraying direction used to spray a cleaning liquid to a preset position of a substrate and / or the sealing member, so as to clean the sealing member, the spraying direction having a component consistent with a tangential direction of a rotation direction of the substrate fixture passing through the preset position; and a control system, used to, during cleaning of the sealing member, control the driving system to lift the substrate fixture to a preset height above the nozzle and rotate it at a preset speed, and control the cleaning system to cause the nozzle to spray the cleaning liquid at a preset flow rate. The present application implements a cleaning function for a sealing member, and reduces the amount of cleaning liquid dripping during the cleaning of the sealing member.

The utility model relates to the technical field of circuit board processing, in particular to a PCB (printed circuit board) copper plating device which comprises an electroplating tank, a sliding plate is slidably connected to the top of the electroplating tank, a supporting frame is fixed to the end face of the sliding plate, and an avoiding groove is formed in the end face of the sliding plate. An electroplating frame is slidably connected to the portion, located in the receding groove, in the supporting frame, and a driving piece used for driving the electroplating frame to move is arranged at the top of the supporting frame. Wherein the top of the electroplating tank is provided with a reciprocating mechanism, the reciprocating mechanism is used for driving the electroplating frame to move back and forth, the electroplating frame is internally provided with a clamping piece used for fixing the circuit boards, the clamping piece can clamp and fix the multiple circuit boards, and the situation that the circuit boards are disengaged and slide off in the moving process can be prevented in cooperation with a bearing part; the device can adapt to circuit boards of different sizes and is high in practicability, the circuit board can move in the electroplating liquid through the reciprocating mechanism, and it is ensured that each position of the circuit board can make full contact with the electroplating liquid to promote the electroplating reaction.

An anode chamber for an electroplating apparatus includes an inert anode, an anode support in contact with the inert anode, an ionically conductive membrane separated from the inert anode by a gap in the anode chamber, a membrane clamp configured to hold the ionically conductive membrane, at least one inlet configured to flow anolyte into the gap at a first position, and at least one outlet configured to receive the anolyte flowing out of the gap at a second position.

The invention discloses a duplex and multi-link guider blade platinum plating device, which belongs to the technical field of electroplating, and comprises an electroplating bath, an electrode, a suspension assembly, a lifting block and a support shaft, the clamping assembly is connected to the end part of the supporting shaft, the clamping assembly is positioned in the electroplating bath, and the suspension assembly is used for driving the clamping assembly to move horizontally and vertically; and the washing assembly is connected to the supporting shaft. The inner ring of the guider is clamped and fixed by the clamping assembly, and then the clamping assembly is driven by the suspension assembly to horizontally move in the electroplating bath, so that a blade on the guider can be fully contacted with electroplating liquid, and in addition, in the horizontal reciprocating motion process of the guider in the electroplating bath, the blade is prevented from being damaged. And the electroplating liquid is repeatedly poked to the blade of the guider through the flushing assembly, so that the electroplating liquid is in flowing contact with the surface of each part of the blade of the guider, and the electroplating effect of the blade of the guider is improved to a certain extent.

The invention discloses an efficient and uniform electroplating manufacturing method of a thick copper plate. The efficient and uniform electroplating manufacturing method comprises the following steps: step 1, carrying out chemical oil removal treatment and micro-etching coarsening on a substrate; step 2, carrying out pre-impregnation treatment and manufacturing a mask; 3, a pulse electroplating device is adopted for carrying out edge auxiliary electroplating on the plate edge, and 4, plating solution closed-loop regulation and control are carried out, specifically, a regulation and control system is provided, the regulation and control system comprises a plating solution regulation and control device and an automatic compensation module, and a PLC control system controls the automatic compensation module to quantitatively supply additives according to the difference between a detection value and a required value. According to the method, the electric field intensity of the edge and the center of the substrate is balanced, the thickness uniformity of the copper layer is remarkably improved, and the thickness difference between the edge and the center is reduced; and the deposition rate stability of pulse electroplating is ensured. And meanwhile, the working efficiency is improved, the electroplating time is shortened, the energy consumption is reduced, the dosage of an electroplating additive is reduced, the service life of an electroplating solution is prolonged, the binding force of a copper layer and a substrate is improved, practicability is high, and high popularization significance is achieved.

A device, method, and equipment for improving the electroplating uniformity in wafer electroplating. The device includes an electroplating component and an electroplating rate adjustment component. The electroplating component includes an electroplating head, an electroplating tank, an anode metal and a power supply. The electroplating rate adjustment component includes an auxiliary electrode assembly, a switching device and a control module. The auxiliary electrode assembly consists of auxiliary electrodes, a circuit resistor assembly and a support ring structure. The auxiliary electrode is set on the support ring structure, and when the auxiliary electrode is connected to the circuit resistor assembly, the support ring body can be controlled to lift or rotate, bringing the auxiliary electrode closer to or farther from the wafer notch, thereby adjusting the electroplating rate at the notch.

The invention discloses electroplating equipment which is vertically placed, continuously rotates a workpiece, supplies power through dynamic elastic pressing of a contact and applies and sucks electroplating liquid in a close distance through a liquid conveying pipe and a liquid collecting pipe. The electroplating equipment is composed of a machining bin, a supply bin, a tool for clamping the workpiece and a discharging bin. The machining bin is composed of a circular anode power source, electroplating liquid, an electroplating liquid containing structure, an electroplating liquid spraying main pipe, an elastic cathode power source contact, a driving gear, a liquid feeding and collecting pipe and an elastic pressing contact scanning type electrode. The supply bin comprises an electroplating liquid tank, an electroplating power supply, a motor and a driving device which are used for driving a driving gear and a conveying chain, a pumping device and an integral circulating pumping device which are used for applying and sucking an electroplating liquid, and an integral electric control system of a power supply of an electronic and electric part and a software carrier; the clamping device is provided with a structure for keeping continuous electrification when the workpiece is in a moving state, and is provided with a pictographic power line compensation structure; gas and heat energy are delivered by the gas blowing pipe and the heating pipe; and isolation mechanisms or isolation areas are arranged among the bins.

The application discloses a swing device for an electroplating hanger and relates to the technical field of electroplating equipment. The swing device for the electroplating hanger comprises a frame body, a hanger, a driving assembly and a sliding piece. The frame body is provided with a first track and a second track which are oppositely arranged. The hanger comprises a first main body and a second main body which is slidably connected to the first main body. The second main body is provided with a clamp assembly for clamping an electroplating piece. The driving assembly is connected to the first main body and is used for driving the first main body to move along the first track. The sliding piece is connected to the second main body and is slidably connected to the second track. The second track is formed with a wave-shaped sliding groove which extends in the same direction as the first track. The sliding piece moves along the wave-shaped sliding groove under the driving of the second main body, so that the second main body moves in the extending direction of the first track and reciprocally slides relative to the first main body, thereby driving the electroplating piece clamped by the clamp assembly to reciprocally swing. The technical scheme of the application can solve the problem that the existing electroplating piece is not uniformly electroplated due to the bubbles attached to the surface of the electroplating piece.

A wafer electroplating device, comprising an integrated electroplating chamber and a working medium switching flow path, wherein the integrated electroplating chamber is provided with a reaction cavity and a placement groove configured to place a wafer therein, an alignment hole in communication with the reaction cavity is provided at the groove bottom of the placement groove, and the integrated electroplating chamber further comprises a chamber liquid inlet and a chamber liquid outlet, which are in communication with the reaction cavity; and the working medium switching flow path can switch working mediums acting on the reaction cavity, so as to allow access to a vacuum pump to perform vacuumizing, access to an infiltration liquid to perform infiltration, access to a plating liquid to perform electroplating and access to a cleaning liquid to perform cleaning. The wafer electroplating device integrates three chambers, i.e., a vacuum infiltration chamber, an electroplating chamber and a cleaning chamber, such that the wafer electroplating device occupies a small space and is high in terms of efficiency and low in terms of manufacturing cost, thereby overcoming the defects of a traditional discrete wafer electroplating device occupying a large space and being low in terms of efficiency and high in terms of manufacturing cost. Further disclosed in the present application is an integrated wafer electroplating method, which also has the above technical effects.