486results about "Tanks" patented technology

The invention discloses a copper plating method for a superconducting strip. The method comprises the following steps: S1, carrying out initial electrochemical copper plating on a processed strip; s2, high-precision continuous thickness measuring equipment is adopted to test the thickness of the plating layer in the length direction and the width direction of the strip; s3, compensating the thickness error by adjusting the position of the shielding plate according to the thickness distribution data obtained by testing; and S4, the steps S2-S3 are repeated until the plating layer is accumulated to reach the target thickness. The thicknesses of the copper plating layers on the two sides of the superconducting tape are adjusted by adjusting the shielding plates, non-contact detection and dynamic adjustment of the thickness of the plating layer are achieved, and the precision of the thickness of the plating layer is improved.

The invention discloses a coating with in-situ plugging and active protection functions as well as a preparation method and application thereof, and belongs to the technical field of metal material surface treatment. An innovative electrolyte design scheme is provided, the commercial 5083 aluminum alloy is subjected to micro-arc oxidation in a phosphate system containing specific cerium salt and a complexing agent, film layer growth and in-situ chemical blocking of micropores are completed in one step, the process is simple, and the obtained coating has excellent blocking firmness and corrosion resistance, has an active protection function and is suitable for large-scale industrial production. And a new solution is provided for improving the durability of the 5083 aluminum alloy in a harsh marine environment.

The invention discloses an electrolytic bath on-line monitoring system and electrolysis equipment, the electrolytic bath on-line monitoring system comprises a plurality of distributed integrated acquisition devices, a data collection platform and a real-time monitoring platform, each distributed integrated acquisition device comprises a substrate, a positioning pin, magnetic steel and a shell; the positioning pin is arranged below the shell; the magnetic steel is embedded in the shell; the substrate is arranged in the shell, and a first probe, a second probe, a voltage stabilizing chip, a sensor and a data acquisition unit are integrated on the substrate; the tail end of the first probe is connected with the data acquisition unit through the voltage-stabilizing chip, and the head end of the first probe abuts against the interior of the electrolytic cell; the head end of the second probe abuts against a small electrolysis chamber electrode of the electrolytic bath; the sensor is connected with the tail end of the second probe; the data acquisition unit is connected with the sensor; the data collection platform is connected with the data acquisition unit; and the real-time monitoring platform is connected with the data collection platform. The device is high in integration degree, convenient to install, capable of achieving self-powered operation, comprehensive in monitoring coverage and capable of achieving real-time and accurate monitoring of parameters of the large electrolytic cell.

The application discloses a swing device for an electroplating hanger and relates to the technical field of electroplating equipment. The swing device for the electroplating hanger comprises a frame body, a hanger, a driving assembly and a sliding piece. The frame body is provided with a first track and a second track which are oppositely arranged. The hanger comprises a first main body and a second main body which is slidably connected to the first main body. The second main body is provided with a clamp assembly for clamping an electroplating piece. The driving assembly is connected to the first main body and is used for driving the first main body to move along the first track. The sliding piece is connected to the second main body and is slidably connected to the second track. The second track is formed with a wave-shaped sliding groove which extends in the same direction as the first track. The sliding piece moves along the wave-shaped sliding groove under the driving of the second main body, so that the second main body moves in the extending direction of the first track and reciprocally slides relative to the first main body, thereby driving the electroplating piece clamped by the clamp assembly to reciprocally swing. The technical scheme of the application can solve the problem that the existing electroplating piece is not uniformly electroplated due to the bubbles attached to the surface of the electroplating piece.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on “compressed gas solvents” mixed with various salts, referred to as “compressed gas electrolytes.” Various embodiments of a compressed gas solvent include a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and / or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, and pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes and techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.

The utility model provides electroplating equipment, which comprises an electroplating bath, an electroplating device and a control device, wherein the electroplating bath is used for accommodating electroplating liquid; the plating head is used for filling the electroplating liquid into the holes of the wafer; and the megasonic generation device is arranged on the side wall of the electroplating bath and is used for generating megasonic waves during electroplating and acting on the wafer at a preset angle, so that the hole of the wafer is completely filled with the electroplating liquid. According to the electroplating equipment disclosed by the utility model, the megasonic generation device is arranged on the outer wall of the electroplating bath, so that a controllable, stable and safe megasonic environment is provided for electroplating, an electroplating solution can fully enter a deeper wafer hole, a wafer is not directly placed in megasonic waves, and a wafer seed layer is prevented from being damaged while an expected electroplating effect is achieved.

The utility model relates to metal product production technical field discloses a metal product surface electroplating device, solved the problem that metal product processing surface electroplating device cannot reach the quick even electroplating effect in the process of using, it includes the electroplating pool, the outside top middle part fixed mounting of electroplating pool has control switch, the outside bottom middle part fixed mounting of electroplating pool has drain valve, the bottom fixed mounting of electroplating pool has support base, the top outside of electroplating pool installs the adjustment and placement subassembly, and the bottom end of adjustment and placement subassembly extends to the inside of electroplating pool, and the both ends of adjustment and placement subassembly are all with the top fixed connection of support base, and adjustment and placement subassembly includes movable strip, and movable strip is located the right above of electroplating pool, the utility model discloses, makes the metal product processing surface electroplating device in the process of using, can reach the quick even electroplating effect, improves the efficiency of production to reach better practicality conveniently.

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The resistor of the plating apparatus includes a first resistive member and a second resistive member disposed between the first resistive member and a substrate holder or between the first resistive member and an anode. The first resistive member has a plurality of first through holes formed therein, the first through holes opening toward the substrate holder side and the anode side, at least some of the first through holes overlap with the second resistive member so that the anode cannot be seen when the anode side is viewed from the substrate side, and the second resistive member is configured such that the distance between the second resistive member and the first resistive member is variable.

The electroplating treatment equipment comprises an electroplating box, a fixing frame is fixedly installed on the top of the outer surface of the electroplating box, a hydraulic cylinder is fixedly installed on the top face of the fixing frame, and a lifting frame is fixedly arranged at the output end of the hydraulic cylinder; iron casting fixing mechanisms are fixedly arranged on the two sides of the surface of the lifting frame; cavities are formed in the two sides of the inner wall of the electroplating box correspondingly, and heating mechanisms are fixedly arranged in the cavities. According to the electroplating treatment equipment for iron casting machining, through the arrangement of a heating mechanism and a stirring mechanism, an external power source is communicated, when the external temperature is low, an electric heating plate heats electroplating liquid, the heating temperature is controlled through a temperature controller, when the temperature of the electroplating liquid rises, the conductivity of the electroplating liquid is improved, a servo motor drives an auger rod to rotate, and the electroplating liquid is heated; the electroplating liquid can be in full and uniform contact with the iron casting, so that the effect of improving the electroplating efficiency of the iron casting is achieved.

The safe and efficient color plating device comprises a control table and an electroplating pool, a cover is hinged to the upper portion of the electroplating pool, and a temperature sensor, a concentration sensor, a cathode clamping part and an anode clamping part are fixedly installed in the electroplating pool. A heating device for heating an electroplating solution in the electroplating tank is fixedly mounted at the bottom of the electroplating tank, a liquid outlet is formed in the bottom of the electroplating tank, a sealing cover is arranged at the liquid outlet, and an exhaust port is formed in the upper part of the side wall of the electroplating tank; the console comprises a shell, a CPU module and a power supply device are arranged in the shell, a display screen, a power switch, a keyboard and a heating switch are embedded in the surface of the shell, the temperature sensor, the concentration sensor, the display screen, the heating device, the keyboard and the power supply device are all connected with the CPU module, and the power supply device is connected with the cathode clamping part, the anode clamping part and the power switch. The heating device is connected with the heating switch. According to the utility model, the plating quality, the plating safety and the plating efficiency are improved.

The application belongs to the technical field of electroplating, and discloses an electroplating device and an electroplating method. The electroplating device comprises an electroplating assembly, a shielding tool and a circulating assembly. The electroplating assembly has an electroplating tank. The shielding tool can be connected to the tank opening of the electroplating tank and can be fixedly connected to a workpiece to be plated, so that the plated area of the workpiece to be plated, part of the inner surface of the shielding tool and at least part of the inner surface of the electroplating tank form an accommodation space. The circulating assembly is connected to the electroplating assembly and can drive the electroplating liquid to flow between the electroplating assembly and the circulating assembly, so that the electroplating liquid in the accommodation space can be in a flowing state. By rotating the electroplating assembly so that the plated area is located below the accommodation space, the electroplating liquid can completely cover the plated area, and the bubbles float upwards, ensuring that the plated area can fully contact the electroplating liquid and avoiding the phenomenon of missed plating. The electroplating liquid in the flowing state can effectively improve the quality and uniformity of the plated layer.

This utility model provides a square tube processing electroplating corrosion-resistant treatment device, belonging to the field of electroplating equipment technology. The utility model includes an electroplating tank, a drain pipe on one side of the electroplating tank, a control valve on the outer surface of the drain pipe, and an auxiliary device at the top of the electroplating tank. The auxiliary device includes two support rods, with sliding rods slidably connected to the inner walls of the support rods. A frame rod is fixedly connected to the top of the sliding rods, and a tank cylinder is fixedly connected to one end of the two support rods that are close to each other. By setting up the auxiliary device, the utility model allows the square tube to be inserted into the tank cylinder with perforated surfaces. During electroplating, the lower half of the tank cylinder's surface enters the electroplating solution. A servo motor drives the tank cylinder to rotate slowly, causing the square tube inside the tank cylinder to slide or roll and change position, improving the contact effect between the square tube surface and the electroplating solution, and enhancing the effectiveness and comprehensiveness of electroplating treatment on the square tube surface using the electroplating device.

A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

Systems and methods for controlling current during electrochemical processes, such as electroplating, anodizing, and others. The disclosed systems and methods utilize a microcontroller system that receives inputs from various current and voltages sensors and monitors the various current and voltage readings throughout the system. The microcontroller system further compares the measured system current to a target system operating current, which the microcontroller may have established based on a user inputting desired features, values, and parameters of the system, and the microcontroller identifies deviations between the measured current and target system operating current. The microcontroller system may then adjust semiconductor arrays to maintain the modulated current generally at a target system operating current, may shut the system down if the measured current exceeds a certain predetermined safe operating threshold, and may send alerts to a user to notify the user of various information regarding the system, such as when a safe operating parameter is exceeded or when another threshold is met or exceeded.

The utility model provides a kind of metal product surface electroplating processing device, including tank, mobile mechanism is arranged on the front side surface of tank upper, anode is installed in the tank inner wall both sides, the top of tank is fixed with cathode hanger, the front side of the bottom of tank inner wall is equipped with scrap collecting groove, the bottom of tank inner wall is inclined with the angle of rear high front low, filter box is fixed with intercommunication in the right side of scrap collecting groove of tank, conveying pump is intercommunicated in the right side of filter box, the conveying end intercommunication of conveying pump has shunt pipe, shunt pipe surface intercommunication has shunt shell, the rear side intercommunication of shunt shell and tank inner wall bottom, C type scraper is slidably connected on the surface of scrap collecting groove, tank front side surface intercommunication has drainage valve.The utility model passes through the linkage of tank bottom inclination design, scrap collecting groove and mobile scraper, significantly improves impurity collection efficiency.

The invention relates to the technical field of electroplating pools, in particular to a device for improving electroplating uniformity of a VCP electroplating line, which comprises an electroplating pool, a metal mesh plate is fixed in the electroplating pool, a rotating handle is arranged below the metal mesh plate, the rotating handle is rotatably connected to a bottom plate of the electroplating pool, blades are fixed on the surface of the rotating handle, and a mounting frame is mounted at the top of the electroplating pool. A servo motor is mounted on the surface of the mounting frame, the power output end of the servo motor is in transmission connection with a driving shaft, and the bottom end of the driving shaft penetrates through the metal net plate and then is inserted into the top end of the rotating handle; the device has the beneficial effects that the rotating handle is driven to rotate through the servo motor, the blades are driven to forcibly stir electrolyte, metal ion diffusion is accelerated, and the concentration gradient is eliminated; electrolyte circulation is promoted in the stirring process, so that metal ions generated by anodic oxidation reaction are rapidly supplemented to a cathode area, the deposition rate of a plating layer is stabilized, and the phenomenon that the edge thickness of a workpiece is out of tolerance is reduced.

The utility model relates to the field of galvanization devices, in particular to a multilayer printed circuit board galvanization device which comprises an electroplating pool, supporting rods fixedly installed on the periphery of the top of the electroplating pool, a top plate fixedly installed on the tops of the supporting rods and linkage plates fixedly installed on the two sides of the top of the electroplating pool. And the driving toothed plate is fixedly mounted on the inner side of the linkage plate. According to the multilayer printed circuit board galvanization device, an electric cylinder pushes a moving plate to descend, so that a driven gear is matched with a driving toothed plate, a second rotating rod drives a cam to rotate, when a protruding part of the cam rotates to the two sides, a rectangular frame can be pushed by the cam to horizontally move in an inner cavity of a mounting groove, the rectangular frame is reset through the elastic force of a spring, and galvanization of the multilayer printed circuit board is achieved. And the steps are repeated, the circuit board clamped and fixed on the inner side of the limiting plate synchronously shakes along with the upper connecting plate, electroplating liquid on the surface of the circuit board shakes and falls into an electroplating pool, the circuit board can be rapidly cleaned through repeated pushing and pulling of the electric cylinder, and the overall galvanization efficiency of the circuit board is improved.

The utility model relates to the technical field of semiconductors, in particular to a vertical moving device for semiconductor equipment and the semiconductor equipment, and solves the problem that the vertical moving device is low in control accuracy for vertical movement of the vertical moving device. The device comprises a transmission assembly, a driving source assembly, a magnetic railing ruler and a control assembly. The driving source assembly is connected with the transmission assembly and can drive the transmission assembly and the materials to move in the vertical direction. The driving source assembly is provided with an output shaft and an encoder, the encoder can collect rotation information of the output shaft, and the rotation information can be converted into first position data of materials. The magnetic railing ruler is connected with the transmission assembly and can collect second position data of the materials when the materials move in the vertical direction. The control assembly is in communication connection with the encoder and the magnetic railing ruler and can control the driving source assembly to operate or stop based on the difference value of the two pieces of position data. According to the device, the encoder and the magnetic railing ruler are used for detecting and controlling the vertical movement of the device, and the control accuracy is improved.

The utility model provides a kind of for memory steel wire electroplating bath, it is related to electroplating bath technical field, including electrolytic cell, guiding assembly is arranged on the electrolytic cell, the guiding assembly includes first guide roller and second guide roller, the height of first guide roller is higher than second guide roller, the height of first guide roller is higher than second guide roller, the guiding assembly further includes feed inlet and discharge port being opened in the both ends of electrolytic cell.This motor for memory steel wire electroplating bath can drive winding drum rotate by winding shaft, and winding shaft will also drive driving wheel, driven wheel, reciprocating screw rotate, the reciprocating screw is rotated to make slider drive guide column reciprocate, and the guide column of reciprocating movement will make steel wire move relative to the axial direction of winding drum, and the rotation of winding drum can make steel wire evenly wind on winding drum, avoid uneven and neatness decline caused by repeated accumulation.

This invention provides a substrate immersion current synchronous triggering system and method for electroplating processes. The system includes a host controller, a power supply, a plating head, an electroplating tank, and a direct-switch module. The direct-switch module and the host controller are connected in parallel to form a two-stage control architecture. The direct-switch module includes a contact detection unit, a triggering unit, and an execution unit. The contact detection unit detects the instant the substrate contacts the electroplating solution and outputs a switching signal. The triggering unit generates and transmits a hardware trigger signal within microseconds. The execution unit controls the power supply to output a preset dynamic current during substrate immersion. This invention eliminates system delay through a hardware-level instantaneous triggering mechanism, ensuring that the current application is synchronized with the substrate immersion, avoiding seed layer corrosion, and improving plating uniformity and process repeatability.

The utility model discloses a uniform flow field hard alloy anodic oxidation device which comprises a tank body and oxidation anodes, the oxidation anodes are installed on two side plates of a tank chamber of the tank body, a liquid homogenizing cavity pore plate and a backflow cavity pore plate are fixedly installed at the front end and the rear end of the tank chamber of the tank body respectively, and an adjusting pore plate is adjustably installed on the liquid homogenizing cavity pore plate; the liquid uniformizing cavity pore plate and the end plate at the corresponding end of the tank body define a stirring and liquid uniformizing cavity, and a stirrer is arranged in a cavity body of the stirring and liquid uniformizing cavity; a backflow cavity is defined by the backflow cavity pore plate and an end plate at the corresponding end of the tank body, and the backflow cavity leads to the stirring and liquid homogenizing cavity through a circulating pipeline; and a movable anode scraping plate is arranged on the oxidation anode. The liquid uniformizing holes in the liquid uniformizing cavity pore plate correspond to the liquid uniformizing adjusting holes in the adjusting pore plate in a one-to-one mode, and the adjusting pore plate is adjustably installed on the liquid uniformizing cavity pore plate through pore plate adjusting bolts. The device can form a stable liquid flow field in the tank, ensures uniform distribution of metal ions, and is particularly suitable for precise anodic oxidation treatment of hard alloy.

The utility model relates to the technical field of gravure electroplating baths, in particular to a gravure electroplating bath crossed type anode moving mechanism which comprises a bath body, the bath body is provided with a pair of anode plates arranged at intervals, the bath body is further provided with an adjusting mechanism, and the adjusting mechanism comprises a lifting seat capable of moving longitudinally and a pair of sliding modules arranged symmetrically. The sliding module comprises an adjusting sliding seat which slides obliquely in the longitudinal direction of the shielding plate, and the adjusting sliding seat is connected with the anode plate; the lifting seat is provided with a pair of connecting arms which can be symmetrically arranged, and the connecting arms are rotationally connected with the adjusting sliding seat; the gravure roller is arranged between the two shielding plates, the lifting seat can drive the adjusting sliding seat to obliquely ascend and descend along the shielding plates through the connecting arms by moving the lifting seat, so that the included angle of the two connecting arms is changed, and as the adjusting sliding seat is connected with the anode plates, the two anode plates get close to each other or get away from each other; therefore, the distance between the two anode plates can be adjusted, and gravure rollers with different sizes can be conveniently matched.

This utility model discloses an electroplating tank with temperature monitoring function. The electroplating tank includes: a base, a first tank, a second tank, a pure water tank, several drive modules, a temperature control module, and a control box. The first tank, second tank, pure water tank, several drive modules, temperature control module, and control box are all disposed on the top side surface of the base. The several drive modules are respectively connected to the first tank, second tank, and pure water tank in a one-to-one correspondence. The control box is electrically connected to the several drive modules and the temperature control module. The temperature control module is disposed between the several drive modules and the first and second tanks. The electroplating tank of this utility model uses the temperature control module to adjust the temperature of the electroplating solution output by each drive module before supplying it to the first and second tanks, thereby maintaining a constant temperature of the electroplating solution.

The invention discloses a porefilling copper plating method, which comprises an electrolytic tank body, a power supply module, a partition flow control module and a temperature control module, the electrolytic tank body is divided into a pretreatment area, a porefilling area and a post-treatment area, the power supply module comprises three groups of independent adjustable electrodes which are respectively arranged in the porefilling area, the partition flow control module is arranged in the porefilling area, and the temperature control module is arranged in the porefilling area. Sequentially carrying out oil removal, micro-etching, activation and pre-plating treatment on the PCB to be plated in the pretreatment area; fixing the pretreated PCB in a hole filling area, injecting a hole filling plating solution, starting a power supply module and a partition flow control module, performing hole filling and copper plating by adopting parameters of gradient current, pulse frequency of 500800Hz and plating solution temperature of 28-32 DEG C, and performing hole filling and copper plating by adopting a spraying flow rate of 1.0-1.2 m / s and a circulating flow rate; according to the method, hole-filling copper plating combining the solution and the device is adopted, hole-filling copper plating of micro holes with the hole diameter smaller than or equal to 0.2 mm is met, the filling rate of copper layers in the holes can reach 95% or above, the thickness difference between hole openings and plate surface plating layers is smaller than or equal to 5 micrometers, the overall process stability is high, and operation is easy.

This invention discloses a coating, winding, and hot-pressing production line for processing multilayer graphene films, relating to the field of graphene film processing equipment, including a coating mechanism, a winding mechanism, and an extrusion mechanism. The winding mechanism of this invention is equipped with an air pump, a take-up rod, a first hollow rod, a second hollow rod, air bladders, and ventilation holes. Before winding the graphene film, the air pump inflates the first hollow rod, causing the two air bladders to expand. The graphene film coated with the coating is then wound onto the two air bladders. A drive assembly rotates the take-up rod, further winding the graphene film onto the two air bladders. When the required thickness of the graphene film wound onto the air bladders is achieved, the graphene film is cut, and the air inside the air bladders is released. The contracted air bladders separate from the rolled graphene film, facilitating the removal of the rolled graphene film from the two second hollow rods.

This invention discloses an electroplating bath for producing medical isotopes using an accelerator, belonging to the technical field of accelerator-produced medical isotope actinium-225. In this electroplating bath, a cavity penetrating the bottom of the bath body is provided within the bath body. A pressing plate includes a front plate and a rear plate connected in a front-to-back direction. The front plate and the rear plate are detachably connected to the bottom of the electroplating bath body via front screws and rear screws distributed on opposite sides of the cavity, respectively, so that a target covering the bottom of the cavity is clamped between the bottom of the electroplating bath body and the pressing plate. A sealing ring surrounds the bottom periphery of the cavity and is sealingly disposed between the bottom of the electroplating bath body and the target. This invention enables rapid installation and removal of the target, and has the advantages of convenient maintenance, reliable sealing, and simple structure.

The application belongs to the technical field of circuit board processing machines, and relates to an electroplating device for integrated circuit board processing, which comprises a groove body, a protective cover horizontally and slidingly installed in the groove body, a drilling assembly rotatably installed on the protective cover, and a first driving assembly installed between the protective cover and the drilling assembly; the groove body has a vertical second partition plate inside, the groove body between the second partition plate and the protective cover has a vertical first partition plate, the first partition plate is provided with a clearance hole matched with the drilling, the first partition plate and the second partition plate have a polishing assembly; the protective cover and the first partition plate are provided with a collecting hopper below; the sidewall of the groove body between the first partition plate and the protective cover is provided with an air hole; the groove body is provided with a U-shaped frame, the U-shaped frame is provided with a clamping assembly, the lower portion of the U-shaped frame is provided with a drying assembly, and the groove body is provided with an electroplating assembly at the end away from the protective cover; the electroplating device can clean the circuit board in time after polishing and improve the subsequent electroplating quality. The circuit board can be dried in time after electroplating, which facilitates subsequent assembly work.

Provided are a method for circulating an iron-based electroplating solution, a method for manufacturing an iron-based electroplating solution, and a method for manufacturing an alloyed hot-dip galvanized steel sheet, which can be used to obtain an iron-based electroplating solution that is stably capable of being operated with high electrolytic efficiency without sludge contamination and is capable of being power-saved without requiring large-scale equipment. In the method for circulating the iron-based electroplating solution, an iron-based electroplating solution (P) used in an electroplating cell (10) for iron-based electroplating is circulated and adjusted. The iron-based electroplating solution (P) used in the electroplating cell (10) is caused to pass through at least a reduction tank (30), a vertical centrifugal solid-liquid separation device (40), and a final adjustment tank (50) in this order, and then is put into the electroplating cell (10). In the reduction tank (30), an iron source for reduction according to a concentration of Fe3+ (Fe trivalent ion) in the iron-based electroplating (P) solution transferred to the reduction tank (30) is put.

The invention discloses a continuous vertical electroplating system, which comprises: a frame body, an annular track is arranged on the frame body, and a plurality of carrying devices moving along the track of the track are arranged on the annular track; the electroplating tunnel module comprises an electrolytic bath and two spraying units arranged in the electrolytic bath, and an electroplating tunnel is formed between the two spraying units; the cathode hanging tool at least comprises a frame main body provided with a window for accommodating a workpiece to be electroplated, a conductive clamping structure used for clamping the workpiece and providing cathode current for the workpiece, and a shielding skirt edge arranged on the inner edge of the window of the frame main body, and the shielding skirt edge is made of a non-metal insulating material; a shielding gap with a preset distance is formed between the shielding skirt edge and the edge of the clamped and fixed workpiece; the vertical electroplating system can solve the problems that when a traditional vertical electroplating system for the PCB is used for electroplating the PCB, due to the fact that an electric field is concentrated in an edge area of a workpiece, the current density is obviously higher than that in a center area, an edge plating layer is too thick, and a center plating layer is insufficient.