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Wet Processing Systems and Methods with Replenishment

a technology of replenishment and wet processing, applied in the direction of semiconductor/solid-state device testing/measurement, cleaning using liquids, instruments, etc., can solve the problems of ever escalating r&d costs and inability to conduct extensive experimentation in a timely and cost-effective manner

Inactive Publication Date: 2014-09-18
INTERMOLECULAR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a system and method for processing semiconductor and solar devices using combinatorial processing. The invention aims to provide a more efficient and cost-effective way of evaluating different processing formulations for these materials. The technical effects of the invention include the ability to accurately simulate the processing conditions used in high volume manufacturing, the ability to conduct multiple experiments simultaneously in a high throughput manner, and the ability to formulate and replenish processing formulations for deposition and etching operations. The invention also includes a wet processing system that can accurately simulate the processing conditions used in high volume manufacturing, and a method for processing substrates using the system.

Problems solved by technology

This approach has resulted in ever escalating R&D costs and the inability to conduct extensive experimentation in a timely and cost effective manner.

Method used

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  • Wet Processing Systems and Methods with Replenishment
  • Wet Processing Systems and Methods with Replenishment
  • Wet Processing Systems and Methods with Replenishment

Examples

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Embodiment Construction

[0017]A detailed description of one or more embodiments is provided below along with accompanying figures. The detailed description is provided in connection with such embodiments, but is not limited to any particular example. The scope is limited only by the claims, and numerous alternatives, modifications, and equivalents are encompassed. Numerous specific details are set forth in the following description in order to provide a thorough understanding. These details are provided for the purpose of example and the described techniques may be practiced according to the claims without some or all of these specific details. For the purpose of clarity, technical material that is known in the technical fields related to the embodiments has not been described in detail to avoid unnecessarily obscuring the description.

[0018]The term “horizontal” as used herein will be understood to be defined as a plane parallel to the plane or surface of the substrate, regardless of the orientation of the...

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PUM

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Abstract

Embodiments provided herein describe systems and methods for processing substrates. A substrate having a plurality of site-isolated regions defined thereon is provided. A plurality of wet processes is simultaneously performed. Each of the plurality of wet processes is performed on one of the plurality of site-isolated regions defined on the substrate. The simultaneously performing includes exposing each of the plurality of site-isolated regions to one of a plurality of wet processing formulations. Each of the plurality of wet processing formulations includes a component. The respective component is added to at least some of the plurality of wet processing formulations during the exposing. A processing condition is varied between at least two of the plurality of wet processes in a combinatorial manner.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to U.S. Provisional Patent Application No. 61 / 780,128, filed Mar. 13, 2013, entitled “HPC Methods for Processing Materials,” which is incorporated by reference herein in its entirety.TECHNICAL FIELD[0002]The present invention relates to systems and method for processing substrates. More particularly, this invention relates to wet processing systems and methods for semiconductor devices in a manner such that the processing formulations are replenished.BACKGROUND OF THE INVENTION[0003]Combinatorial processing enables rapid evaluation of semiconductor, solar, or energy processing operations. The systems supporting the combinatorial processing are flexible and accommodate the demands for running the different processes either in parallel, serial or some combination of the two.[0004]Some exemplary processing operations include operations for adding (depositions) and removing layers (etch), defining features, pre...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/30H01L21/306
CPCH01L21/6719H01L21/30604H01L21/30H01L21/67051H01L21/67057C23C18/1682C25D17/02C23C18/1619B01J2219/00301B01J19/0046B01J2219/00283B01J2219/00286B01J2219/00313B01J2219/0038B01J2219/00382B01J2219/00416B01J2219/00418B01J2219/00527B01J2219/00585B08B3/04G11C13/0004H10B63/80H10N70/021C23C14/08C23C14/22C23C14/34H01L21/02104H01L22/10H01L22/12H01L22/14
Inventor PAYNE, MAKONNENVAN BERKEL, KIM
Owner INTERMOLECULAR
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