Wet Processing Systems and Methods with Replenishment

a technology of replenishment and wet processing, applied in the direction of semiconductor/solid-state device testing/measurement, cleaning using liquids, instruments, etc., can solve the problems of ever escalating r&d costs and inability to conduct extensive experimentation in a timely and cost-effective manner

Inactive Publication Date: 2014-09-18
INTERMOLECULAR
View PDF6 Cites 174 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach has resulted in ever escalating R&D costs and the inability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wet Processing Systems and Methods with Replenishment
  • Wet Processing Systems and Methods with Replenishment
  • Wet Processing Systems and Methods with Replenishment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017]A detailed description of one or more embodiments is provided below along with accompanying figures. The detailed description is provided in connection with such embodiments, but is not limited to any particular example. The scope is limited only by the claims, and numerous alternatives, modifications, and equivalents are encompassed. Numerous specific details are set forth in the following description in order to provide a thorough understanding. These details are provided for the purpose of example and the described techniques may be practiced according to the claims without some or all of these specific details. For the purpose of clarity, technical material that is known in the technical fields related to the embodiments has not been described in detail to avoid unnecessarily obscuring the description.

[0018]The term “horizontal” as used herein will be understood to be defined as a plane parallel to the plane or surface of the substrate, regardless of the orientation of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Compositionaaaaaaaaaa
Processing propertiesaaaaaaaaaa
Login to view more

Abstract

Embodiments provided herein describe systems and methods for processing substrates. A substrate having a plurality of site-isolated regions defined thereon is provided. A plurality of wet processes is simultaneously performed. Each of the plurality of wet processes is performed on one of the plurality of site-isolated regions defined on the substrate. The simultaneously performing includes exposing each of the plurality of site-isolated regions to one of a plurality of wet processing formulations. Each of the plurality of wet processing formulations includes a component. The respective component is added to at least some of the plurality of wet processing formulations during the exposing. A processing condition is varied between at least two of the plurality of wet processes in a combinatorial manner.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to U.S. Provisional Patent Application No. 61 / 780,128, filed Mar. 13, 2013, entitled “HPC Methods for Processing Materials,” which is incorporated by reference herein in its entirety.TECHNICAL FIELD[0002]The present invention relates to systems and method for processing substrates. More particularly, this invention relates to wet processing systems and methods for semiconductor devices in a manner such that the processing formulations are replenished.BACKGROUND OF THE INVENTION[0003]Combinatorial processing enables rapid evaluation of semiconductor, solar, or energy processing operations. The systems supporting the combinatorial processing are flexible and accommodate the demands for running the different processes either in parallel, serial or some combination of the two.[0004]Some exemplary processing operations include operations for adding (depositions) and removing layers (etch), defining features, pre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67H01L21/30H01L21/306
CPCH01L21/6719H01L21/30604H01L21/30H01L21/67051H01L21/67057C23C18/1682C25D17/02C23C18/1619B01J2219/00301B01J19/0046B01J2219/00283B01J2219/00286B01J2219/00313B01J2219/0038B01J2219/00382B01J2219/00416B01J2219/00418B01J2219/00527B01J2219/00585B08B3/04G11C13/0004H10B63/80H10N70/021C23C14/08C23C14/22C23C14/34H01L21/02104H01L22/10H01L22/12H01L22/14
Inventor PAYNE, MAKONNENVAN BERKEL, KIM
Owner INTERMOLECULAR
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap