71 results about "Electropolishing" patented technology

A dielectric capacitor is provided which has a reduced leakage current. The surface of a first electrode (38) of the capacitor is electropolished and a dielectric film (40) and a second electrode (37) are successively laminated on it. The convex parts pointed end (38a) existing on the surface of the first electrode is very finely polished uniformly by dissolving according to electropolishing, a spherical curved surface in which the radius of curvature has been enlarged is formed, and the surface of the first electrode is flattened. Therefore, concentration of electrolysis can be prevented during the operation at the interface of the first electrode and the dielectric film, and the leakage current can be reduced considerably.

Beginning with a smooth ground aluminum blank with a relatively thin layer of leveled Ni—P, circumferential electropolishing/texturing is carried out to achieve a smooth oriented surface. A conductive slurry is provided between the disc and a porous texturing tape which is in contact with a conducting plate or equivalent conductor. The disc serves as the anode, and the conducting plate as the cathode, while the slurry, being conductive, functions as an electrolyte. In the presence of current, a reverse electroplating occurs so that the Ni—P dissolves to form Ni²⁺, or nickel ions which are carried away by the conductive slurry. The conductive slurry further supports or carries therein abrasive material so that by moving the porous texturing tape past the disc surface, the texturing tape picks up the abrasive material in the slurry and simultaneously with the reverse electroplating, provides the desired mechanical abrasion to achieve texturing of the disc surface. The abrasive material comprises diamond particles. The circumferential electropolishing/texturing polish is achieved by spinning the disc while applying the mechanical-chemical action through the slurry system to the disc surface with electric current passing through the electrically conducting interface during processing.

The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

The present invention relates to a method of electrochemical polishing of surfaces of titanium or titanium-containing alloys, such as Nitinol. An electrolyte is used that comprises methanesulfonic acid and one or more alkanediphosphonic acids. These alkanediphosphonic acids can optionally be substituted with hydroxy and/or amino groups. A further aspect of the present invention relates to the use of said electrolyte for the electropolishing of titanium or titanium-containing alloys.

The invention discloses a polishing solution for electropolishing an austenitic stainless steel orifice. Each litre of electropolishing polishing solution contains 1000 to 1250g phosphoric acid, 200 to 260g sulfuric acid and 180 to 240g absolute ethyl alcohol. The electropolishing of the austenitic stainless steel orifice is well realized by reasonably designing the electropolishing solution and electropolishing technological parameters. The electropolishing of stainless steel orifices, deep blind holes and cross holes with relatively small aperture of more than or equal to 1mm and relatively large ratio of depth to diameter of more than or equal to 10mm is realized, The polishing effect of the invention is obviously better than that of the traditional mechanical or physical method and can be as high as the polishing effect of a mirror surface according to the surface condition of the unpolished orifice.

The invention relates to a machining technology for a small deep step hole of a high-precision medical apparatus and instrument, and belongs to the technical field of product machining of the medical apparatus and instrument. The technology mainly comprises center through hole drilling, outer circle turning, boring through a grinding head assembly, honing, step milling, electropolishing and the like. The defects that when a traditional boring cutter carries out boring, the boring cutter is likely to be broken, the boring roughness is large, the machining efficiency is low, and the machining cost is high are mainly overcome.

The invention provides full-automatic electropolishing equipment which comprises an anode plate platform, polishing cups placed on the anode plate platform and cathode bars arranged at a certain distance from the anode plate platform. In the electropolishing process, the polishing cups containing electrolyte are fixed to the anode plate platform, the cathode bars stretch into the corresponding polishing cups by a certain distance through moving devices along the axes of the polishing cups without making contact with the inner walls of cup bodies of the polishing cups, and then the anode plate platform and the cathode bars are electrified to electropolish the polishing cups. Since only the inner walls of the polishing cups are electropolished, the utilization rate of production resources is improved; and since it is ensured that the cathode bars can not make contact with the polishing cups, it is ensured that the cathode and the anode can not short-circuit, and the phenomenon that in the prior art, short-circuit occurs due to the fact that cathode bars are prone to making contact with products to be polished is avoided.

A method for avoiding using CMP for eliminating electroplated copper facets and reusing barrier layer in the back end of line (“BEOL”) manufacturing processes. Electropolishing is employed to remove the deposited surface metal, stopping at the barrier layer to form a smooth surface that may be utilized in subsequent steps. The method is suitable for the electropolishing of metal surfaces after formation of filled vias for through-silicon via processes employing metals such as copper, tungsten, aluminum, or alloys thereof. The remaining barrier layer may be reused to fabricate the redistribution layer.

The present invention relates to a method for the electropolishing of surfaces of metals and metal alloys. Said method is characterized in particular in that it can be applied to a wide range of metals. Thus, it is suitable for the electropolishing of metal surfaces comprising iron, tungsten, magnesium, aluminum or an alloy of these metals. The electrolyte used in the method comprises methanesulfonic acid and at least one alcoholic compound selected from aliphatic diols of general formula C_nH_2n(OH)₂ with n=2-6 and alicyclic alcohols of general formula C_mH_2m-1OH with m=5-8.

The invention discloses an aortic dissection vascular stent and a manufacturing method thereof. The aortic dissection vascular stent comprises a stent body and a membrane attached to the outer side of the stent body, the stent body is formed by multiple coils in a spiraling mode, and each coil is formed by multiple waves. The manufacturing method includes the steps that a spatial continuous spiral wave curve is constructed through a spatial cylindrical coordinate system; a three-dimensional model of the stent body is obtained in a scanning mode; an entity model of the stent body is made according to the three-dimensional model; a metal wire is wound around the entity model to obtain the stent body; heat shaping and electropolishing are carried out on the stent body; the membrane is arranged on the outer side of the stent body in an electrospinning or hot-pressing mode. Bending of the vascular stent in the bent lumen is uniformly distributed in the whole vascular stent, so that the fitness of the vascular stent is improved, and the situation that the vascular wall is bent or damaged is avoided. Besides, the vascular stent is specially designed for the aortic dissection and is simple in structure, convenient to operate, appropriate in supporting force and suitable for the pathological characteristics of the aortic dissection.

An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

A metallic housing forming method includes steps as follows: friction stir welding metallic members to form a metallic housing; immersing the metallic housing in an alkali solution to remove contaminants from the metallic housing, and forming a black salt layer on the metallic housing; stripping the black salt layer away from the metallic housing; electro-polishing the metallic housing to dissolve the outermost surface of the metallic housing; anode-oxiding the metallic housing; and sealing and drying the metallic housing.

The invention discloses a manufacturing method for a seamless stainless steel pipe resistant to corrosion of anions. The manufacturing method includes the first step of manufacturing of a finished pipe and the second step of electropolishing. The second step of electropolishing further comprises the first procedure of selecting electrolyte, the second procedure of electrifying treatment and the third procedure of stirring. The finished seamless pipe made of Cr, Ni and Mo at a certain mass percentage is subjected to the electropolishing process, so that the thickness of the pipe wall of the seamless stainless steel pipe is uniform, the tolerance dimension is high in precision, and the seamless stainless steel pipe can bear corrosion of chloride ions and other media and meet the use requirements in a high-cleaning complex medium environment. The finished pipe also has the effect that the inner and outer surfaces are smooth and clean.