24 results about "Electropolishing" patented technology

The invention discloses an electrochemical polishing solution for laser additive manufacturing of a tantalum material and a preparation method and process, and relates to the technical field of surface treatment of metal workpieces. According to the electrochemical polishing solution, an alcohol-salt system is adopted for electropolishing treatment, and compared with a traditional electropolishing solution, the electrochemical polishing solution has the advantages of electrochemical and chemical stability, relatively high conductivity, relatively high controllability, relatively low toxicity, low volatility, environment friendliness and the like; the electropolishing solution has the characteristics of no volatilization, no odor, low toxicity to a human body and the like by adding the inorganic solid acid formed by replacing sulfamic acid sulfuric acid hydroxyl with amino, and not only has the oxidation capacity of sulfuric acid, but also can promote dissolution and improve the material removal rate by the amino; the electrochemical polishing solution is mild in process parameter, insensitive to temperature, capable of implementing polishing at room temperature, small in corrosion to electrolysis equipment and capable of being used for a long time.

The invention relates to the technical field of surface treatment, and discloses an aluminum alloy surface treatment method and an aluminum alloy material.The aluminum alloy surface treatment method comprises the steps that S1, an aluminum alloy matrix is subjected to deoiling, alkali washing and electric polishing, and a pretreated aluminum alloy matrix is obtained; and S2, a porous aluminum oxide layer is formed on the surface of the pretreated aluminum alloy base body through laser combined machining, a boss dot matrix is formed at an orifice of the porous aluminum oxide layer through reverse dissolution and heterogeneous particle deposition, a composite aluminum alloy base body is obtained, and laser combined machining is combined machining of laser etching and anodic oxidation. According to the aluminum alloy surface treatment method and the aluminum alloy material, the meshing effect of pore channels and bosses is formed, surface energy and acid-base Lewis sites are regulated and controlled through component and crystalline phase heterogeneous sites, interface chemical compatibility and heat and humidity resistance stability are improved, meanwhile, pore blocking caused by a continuous film is avoided, and therefore the specific surface area, interface energy and stability are improved, and the service life of the aluminum alloy material is prolonged. And the aluminum alloy surface with high bonding strength is formed.

The present invention provides an electropolishing apparatus that can stably hold medical tubular materials in an electrolyte solution with minimal stress, and perform electropolishing in a suitable manner. [Solution] An electrolytic polishing apparatus 1 for medical tubular bodies comprises an electrolyte tank 3 holding an electrolyte solution 2, a medical tubular body 10 immersed in the electrolyte solution 2, a first roller 4 positioned inside the lumen of the medical tubular body 10, and a second roller 5 positioned outside the medical tubular body 10 and above the first roller 4. The medical tubular body 10 is the anode, and a cathode 6 is placed in the electrolyte solution 2. The outer diameter of the first roller 4 is smaller than the inner diameter of the medical tubular body 10, the inner surface of the medical tubular body 10 is in contact with the circumferential surface of the first roller 4, and the outer surface of the medical tubular body 10 is in contact with the circumferential surface of the second roller 5.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The single-surface silver layer composite copper foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous and dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface forms a bonding function surface; the silver layer is formed through pulse electroplating or double-pulse electroplating and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer, a bonding layer and the single-surface silver layer composite copper foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the second surface is combined with the dielectric layer through the bonding layer. The scheme can consider high-frequency low-loss transmission performance, bonding reliability with the dielectric layer and storage stability, and is suitable for 224G and 448G high-frequency data communication.

Electrolytic medium for electropolishing and electropolishing method using the electrolytic medium. The electrolytic medium includes solid particles retaining therein a water. Covering each of the solid particles that retains the water is an electrically non-conductive immiscible liquid. The non-conductive immiscible liquid is displaceable on the solid particles to allow electrical conductivity between solid particles that contact one another and to allow electrical conductivity between the solid particles and the workpiece upon the solid particles contacting the surface of the workpiece.

The invention discloses an electrochemical mechanical polishing tool and method for pressure and voltage partition regulation and control, the tool comprises a polishing head and a loading driving mechanism, and the polishing head is a partition pressurizing and electrifying polishing head. A partition pressurizing and electrifying polishing head and an external control mechanism are integrated, the partition pressurizing and electrifying polishing head is connected with all components through a loading air cylinder, and an overall partition control polishing tool is driven to feed; an air pressure controller of an external control mechanism can adjust the pressure of the air bags in different areas, and a voltage controller is used for connecting different voltages to the corresponding bottom plates. During operation, a wafer is adsorbed in a vacuum mode through the air bag and is accurately fed, then pressure and voltage of all areas are synchronously regulated and controlled according to the gradient that the middle is high and the outer ring is low, and machining is completed in cooperation with rotation of the polishing head. According to the method, accurate matching of the polishing rates of different areas of the wafer is achieved, and the surface precision, the production efficiency and the qualified rate of finished products of electrochemical mechanical polishing are greatly improved.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a PTFE / PE composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The composite silver foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface is provided with a polytetrafluoroethylene layer or a PET layer; the silver layer is formed through pulse electroplating or double-pulse electroplating, and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer and the composite silver foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the polytetrafluoroethylene layer or the PET layer of the second surface is combined with the dielectric layer. The scheme can consider high-frequency low-loss transmission performance, combination reliability with the dielectric layer and storage stability, and is suitable for 448G and above high-speed data communication.

This application provides an electropolishing method for Invar alloy substrates, specifically tailored to the surface characteristics of Invar alloy substrates thinned by ferric chloride reduction. The method involves using the Invar alloy substrate to be treated as the anode and a pure lead plate as the cathode, simultaneously immersing both the anode and cathode in an electrolytic tank containing an electrolyte for electropolishing. The electrolyte comprises phosphoric acid, sulfuric acid, malic acid, ethylene glycol, sodium dodecylbenzenesulfonate, and deionized water in a volume ratio of 6:1:1:1:0.5:0.5. Electropolishing the Invar alloy substrate thinned by ferric chloride using the above electrolyte composition and ratio yields an Invar alloy substrate with excellent surface quality. After polishing, the surface gloss of the Invar alloy substrate is increased to ≥92 GU, exhibiting a uniform and bright mirror-like effect.

An assembly for electropolishing metal surfaces by means of particles of solid electrolytes in a gaseous environment. According to one embodiment the assembly includes a container and a housing element configured to house at least two metal parts, so as to contain the parts avoiding that they can go out during the electropolish process and at the same time allowing that they can have a given movement within the housing element and at the same time endow them with electrical connectivity by means of a first electrode and a second electrode that are coupled to an electrical source 3. The assembly also includes means to produce a relative movement between the particles of solid electrolytes and the at least two metal parts.

The invention provides a dynamic progressive micro-discharge polishing method for a grid assembly of an ion thruster, and relates to the technical field of space electric propulsion. According to the method, under the normal beam extraction working condition of the ion thruster, voltage between grids and extraction beam density are gradually increased in a staged mode, the controllable micro-discharge phenomenon on the surfaces of the grids is induced, and local high-temperature plasma generated by micro-discharge is used for conducting in-situ removal on burrs on the edges and the surfaces of grid holes. By optimizing the voltage-beam collaborative loading path, uniform etching and ablation of burrs are realized, and the surface quality of the grid electrode is remarkably improved. The method can be directly implemented after the ion thruster is assembled, disassembly or chemical treatment is not needed, and the method has the advantages of being high in process compatibility, high in efficiency and free of pollution.

A method of surface treating a drill, the drill including a shaft extending along a central longitudinal axis from a proximal end to a distal end, the proximal end of the shaft including a shank adapted for connection to a rotary driver, the shaft further including, distal of the shank, a fluted section including at least one flute extending along the longitudinal length of the fluted section, the method including the steps of: acid etching at least a portion of the fluted section of the shaft in order to create a visible matted effect, subsequently electro-polishing at least the portion of the fluted section of the shaft in order to visibly reduce the matted effect and subsequently creating one or more visual marking within the portion of the fluted section of the shaft.

To provide a simple method for electropolishing titanium or titanium alloys without using organic electrolytes containing perchlorates or alcohols. [Solution] A method for producing electropolished titanium or titanium alloy is provided, which includes a step of anodic polarization of titanium or titanium alloy using a dry ionic liquid containing halide ions.

The present invention relates to a carrier foil-attached foil equipped with an ultra-thin copper foil having a low-roughness smooth surface, and a manufacturing method therefor. The present invention provides a carrier foil-attached foil in which a carrier foil, a release layer, and an ultra-thin copper foil are sequentially laminated, wherein the carrier foil includes an electrolytic polishing surface facing the release layer.

The invention belongs to the technical field of metal part surface treatment, and relates to a cathode and anode integrated conductive plate structure for an electropolishing production line and an electropolishing method, a first V-shaped seat and a second V-shaped seat with positive polarity and a third V-shaped seat with negative polarity isolated by an insulating part are integrated on the same conductive plate body, and integration of cathode and anode power supply is realized. Due to the design, the positive electrode assembly can be directly used when the outer surface of the production line is polished; when the inner surface and the outer surface need to be synchronously polished, only the auxiliary cathode needs to be connected to the tool from the lead interface of the third V-shaped seat, and the machine does not need to be stopped to replace a flying bar or switch the polarity of a power supply, so that the production flexibility and the operation efficiency of a production line are greatly improved, and rapid and seamless switching among different processes is realized; and meanwhile, the reliable isolation between positive and negative polarities is ensured by the insulating part, and the operation safety and reliability under a high-current working condition are ensured.

This method for manufacturing a pressure chamber member includes the steps of: preparing a laminate in which a first electrode layer, a piezoelectric layer, a second electrode layer, and a metal wall part for a pressure chamber are laminated in this order on a substrate; and electrolytically polishing a surface of the wall part of the laminate. The step of electrolytic polishing is performed in a state where the first electrode layer and the second electrode layer are electrically connected.

The invention discloses a brush type electrochemical polishing metal surface treatment method for a groove structure, relates to an electrochemical polishing method, and aims to solve the problem that the polishing effect is poor when an existing electropolishing method is used for coping with a narrow return groove structure. A graphite electrode is inserted into a groove of a workpiece to be polished; the graphite electrode is connected with the negative electrode of a power source, the workpiece to be polished is connected with the positive electrode of the power source, and the groove of the workpiece to be polished is brushed and polished in a reciprocating mode for 60 s to 120 s at the current density of 30 A / dm < 2 > to 70 A / dm < 2 > and the temperature of 18 DEG C to 60 DEG C; after brushing and polishing, immediately comparing a comparison sample which is made of the same material, has the same groove structure as the workpiece and is polished by the same process parameters through a roughmeter to judge whether the roughness is less than or equal to a roughness threshold value, and if so, finishing polishing; otherwise, the brushing and polishing steps are repeated. The electropolishing method has the beneficial effects that the electropolishing method is well applied to a narrow return groove structure, the polishing effect is good, the polishing precision is high, and the composite electrolyte is saved.

The embodiment of the invention provides a bonding wafer, a preparation method thereof and a filter, and the preparation method comprises the steps: providing a wafer substrate which comprises a first substrate surface and a second substrate surface; providing a piezoelectric layer and adjusting the piezoelectric layer to be located on one side of the surface of the first substrate, wherein the piezoelectric layer comprises a first piezoelectric surface and a second piezoelectric surface; bonding the piezoelectric layer and the wafer substrate and preparing a bonding unit; thinning a second piezoelectric surface of the bonding unit and preparing a second piezoelectric thinning surface, wherein the second piezoelectric thinning surface comprises a first thinning unit and a second thinning unit; polishing the second piezoelectric thinned surface and preparing a second piezoelectric polished surface; wherein the maximum distance between the surface, away from the surface of the second substrate, of the polishing unit and the surface of the second substrate is h3, the minimum distance between the surface, away from the surface of the second substrate, of the polishing unit and the surface of the second substrate is h4, and (h3-h4) is smaller than or equal to 300 nanometers. According to the bonding wafer prepared by the preparation method provided by the embodiment of the invention, the overall film thickness uniformity can be improved.

The application discloses an array closed-loop electrolytic polishing method and system for probes, and the method comprises the following steps: fixing a probe card to be electrolytically polished on a clamp, and immersing probe tips into an electrolyte in an electrolytic tank; a flat plate cathode opposite to a probe array is arranged in the electrolytic tank; a dynamic electric field is constructed to electrolytically polish the probe tips by controlling the voltage between the flat plate cathode and the probe array; electrochemical parameters between the probe array and the flat plate cathode are monitored in real time during the electrolytic polishing process, and the electrolytic polishing process is closed-loop controlled according to the monitoring result; after the electrolytic polishing is completed, the probe card is separated from the electrolyte, and then cleaning and blow-drying treatments are sequentially performed. Through real-time monitoring and closed-loop control of the electrochemical parameters, accurate end point judgment of the polishing process of the probe tips is realized, over-polishing is effectively avoided, the polishing consistency and the tip quality of the probe array are improved, and the application is suitable for batch manufacturing of high-precision probe cards.

The utility model relates to a polishing device which comprises a polishing pool, installation frames are arranged on the two sides of the top of the polishing pool respectively, lifting adjusting assemblies are arranged on the installation frames, a fixing base is further movably installed in the polishing pool, clamping assemblies are further arranged at the two ends of the fixing base, and conducting strips are arranged in the clamping assemblies. A cable is mounted at the top of the fixed seat through a sealing ring, and is electrically connected with the conducting strip; a liquid inlet pipe and a liquid discharge pipe are further arranged on the side wall of the polishing pool, and a filter part is further arranged on the liquid discharge pipe; compared with the prior art, improvement is conducted on the basis of existing polishing equipment, an electric polishing mode and an ultrasonic resonance mode are combined, meanwhile, the fixing base for assisting material changing is additionally arranged at the top of the polishing pool, auxiliary feeding and discharging operation can be effectively conducted, and the situation that due to slow feeding and discharging, the equipment downtime is long, and the production efficiency is improved is avoided. And the inner wall and the outer wall of the whole drill rod can be rapidly processed through cooperation with the polishing structure, use is more convenient, and the production efficiency is effectively improved.

Disclosed in the present invention are an electro-polishing head and a conductive system for an electrochemical mechanical planarization apparatus, and an assembly method for the conductive system. The electro-polishing head comprises: a conductive member, which passes through a polishing head carrier and is used for connecting to an external power supply unit; a conductive post, which passes through a polishing head or the polishing head carrier and at least comprises a housing, a retractable member and a conductive probe, wherein the conductive probe and the housing are separately connected to the retractable member, so that the conductive probe and the housing can slide relative to each other in the axial direction, and the outer wall of the conductive probe is in contact with the inner wall of the housing and is electrically conductive therewith, so that sliding-contact electrical conduction is formed between the conductive probe and the housing; and a conductive post connecting unit, which is provided on the polishing head and is detachably connected to the conductive post. In the present invention, a sliding contact-type conductive device is used in a limited and closed space to tightly connect conductive structures on two adjacent components, thus enabling efficient electrical energy transfer between the adjacent components.

Device for electropolishing with: - a first container (20) for receiving an electropolishing medium, wherein this first container (20) has an upwardly facing opening, - at least one component carrier (70) on which parts to be electropolished can be arranged, - a support unit on which the at least one component carrier (70) is arranged, wherein the support unit has a rotary drive by means of which the at least one component carrier (70) can be set into rotary motion about at least one axis, - a positioning device which is configured to bring the support unit into a polishing position in which the at least one component carrier (70) is at least partially inside the first container (20) and into a first raised position in which the at least one component carrier is completely above the first container (20).

An electropolishing device is described. This device comprises a first container (20), open at the top, for receiving an electropolishing medium, at least one workpiece carrier (70) on which parts to be electropolished can be arranged, and a support unit on which the at least one workpiece carrier (70) is arranged. The support unit has a rotary drive by means of which the at least one workpiece carrier (70) can be set into rotational motion about at least one axis. Furthermore, a positioning device is provided, which is configured to move the support unit into a polishing position in which the at least one workpiece carrier (70) is at least partially located within the first container (20), and into a first raised position in which the at least one workpiece carrier is completely above the first container (20).

The utility model relates to a kind of multi-station combined automatic polishing machine, including rack, manipulator being set on rack, multiple vertical in rack and with manipulator as center placement's tank;The manipulator includes rotating platform, Z-axis linear module being vertically set on rotating platform drive end, lifting frame for installing the product to be polished being set on Z-axis linear module drive end;Under the cooperation of rotating platform and Z-axis linear module, lifting frame can be driven to drive the product to be polished to transfer between multiple tanks;Multiple the tank at least includes chemical polishing tank, cleaning tank and electrolytic tank;The bottom of multiple the tank is uniformly provided with drainage pipeline, and top is uniformly provided with liquid inlet pipeline;Drainage solenoid valve is uniformly provided on the drainage pipeline;The utility model integrates chemical polishing and electro-polishing, supports single or combined process, and can shorten workpiece exposure time and improve polishing effect by automatic transfer of manipulator.

The application discloses a kind of semiconductor special gas adjusting module, comprising: bottom fixed plate, valve, the bottom fixed plate is fixedly installed with base module assembly, several valves are installed on base module assembly, valve includes pressure reducing valve, inlet air manual switch valve, check valve, outlet air manual switch valve, flow controller;Base module assembly includes base module one, base module two and base module three;Air passage is opened in base module one, base module two and base module three;The air passage in base module one and base module two is divided into two independently;Air hole, air passage, air cavity and plug-in surface in base module assembly are all treated with electro-polishing.The application occupies less space, realizes the series connection of multiple valve bodies, reduces the gas movement path, and further reduces the possibility of dust pollution, the structure is smaller, the air passage is connected after metal-to-metal sealing plug-in, reduces the connection mode of thread, welding, further reduces the possibility of gas being contaminated by dust.