The utility model provides a
liquid phase epitaxy wafer taking
shovel, and relates to the technical field of
semiconductor material preparation. The
liquid phase extension slice taking
shovel comprises a bearing
shovel and a transparent shovel, the bearing shovel comprises a bearing shovel
handle and a bearing shovel support, the transparent shovel comprises a transparent shovel
handle and a transparent shovel support, the two opposite sides of the bearing shovel support are each provided with a baffle, and the two opposite sides of the transparent shovel support are rotationally connected to the two baffles respectively; the liquid-phase epitaxial
wafer taking shovel has a preparation process and an observation process in sequence, an epitaxial
wafer is placed on a transparent shovel support in the preparation process, the back face of the epitaxial wafer is attached to the transparent shovel support, a transparent shovel
handle moves towards a bearing shovel handle in the observation process, and the end, away from the transparent shovel handle, of the transparent shovel support tilts up; an observation space is formed between the transparent shovel support and the bearing shovel support, so that a user can observe whether
mother liquor remains on the back of the epitaxial wafer through the transparent shovel support. On the basis, when whether
mother liquor remains on the back face of the epitaxial wafer is observed, the risk that the epitaxial wafer is scratched and falls off can be reduced.