1395results about How to "Accelerated dissipation" patented technology

A semiconductor light emitting element of nitride compound semiconductors excellent in cleavability, heat radiation and resistance to leakage is made by epitaxially grow a nitride compound semiconductor layers on a substrate of sapphire, for example, and thereafter separating the substrate. For separating the substrate, there are a technique using a abruption mechanism susceptible to a stress such as a "lift-off layer" and a recesses on a substrate. A technique using laser light to cause a local dense heat stress at the abruption mechanism is effective. A nitride compound semiconductor obtained by separating the substrate may be used as a new substrate to epitaxially grow high-quality nitride compound semiconductors thereon.

Disclosed are a variety of arcuate-shaped inserts for drill bits, and in particular, for placement in rolling cone cutters of drill bits. The arcuate inserts include 360° or ring-shaped inserts, as well as inserts of smaller arcuate length. The arcuate inserts are suitable for use in all surfaces of the rolling cone cutter, and in other locations in drill bits, and may have specialized cutting surfaces and material enhancements to enhance their cutting duty performance. Certain arcuate inserts may include stress relieving discontinuities such that, upon assembly into the cone or during drilling, the arcuate inserts may fragment in a controlled and predicted manner into shorter arcuate lengths.

A single-chip integrated LED particularly adapted for direct use with a high voltage DC or AC power sources comprises a plurality of electrically isolated LEDs on a generally transparent substrate and bonded to electrically conductive elements on a thermally conductive mount. A reflective coating may be applied to the area between LEDs.

A single-chip integrated LED particularly adapted for direct use with a high voltage DC or AC power sources comprises a plurality of electrically isolated LEDs on a generally transparent substrate and bonded to electrically conductive elements on a thermally conductive mount. A reflective coating may be applied to the area between LEDs.

A power electronics device for controlling an electric machine including a power section arranged within a housing which can be closed via a cover element. The power section has a plurality of capacitors and a plurality of power semiconductors which are connected to a power bus bar. In addition, a control device is provided for controlling the power electronics device. The capacitors, power semiconductors, and control device are cooled via a cooling device which is formed as a profile having an essentially U-shaped cross section. The cooling device has two lateral limbs and a base region through which cooling ducts are arranged. A suitable cooling medium flows through the cooling ducts and the ends of the cooling ducts opposite the housing cover are closed by a covering element. The capacitors, the power semiconductors and the control device are connected to the cooling device such that thermal exchange occurs between these components and the cooling device.

An example of this light bulb has a light emitting element (which may be an LED array) mounted on a circuit board. The circuit board is mounted on one end of a heat-conducting frame. An Edison screw or other suitable connector, for attaching the light bulb electrically and mechanically to a receptacle, is mounted on the other end of the frame. A transparent phosphor-coated ball has a flat chord face optically bonded to said array. A light-permeable globular enclosure is mounted on the frame, surrounding the ball and both homogenizing the white light output of the bulb but also concealing the yellowing unlit appearance of the remote phosphor ball centrally located within it.

A chip stack package comprising an intermediate substrate having a recess, a first chip mounted in the recess, a second chip over the intermediate substrate, a package substrate formed under the intermediate substrate and first plugs through the intermediate substrate is disclosed. The second chip is configured to be electrically connected to the first chip. The first plugs are configured to electrically connect the second chip and the package substrate.

An example of this light bulb has a light emitting element (which may be an LED array) mounted on a circuit board. The circuit board is mounted on one end of a heat-conducting frame. An Edison screw or other suitable connector, for attaching the light bulb electrically and mechanically to a receptacle, is mounted on the other end of the frame. A transparent phosphor-coated ball has a flat chord face optically bonded to said array. A light-permeable globular enclosure is mounted on the frame, surrounding the ball and both homogenizing the white light output of the bulb but also concealing the yellowing unlit appearance of the remote phosphor ball centrally located within it.

A mask for delivery of oxygen to a patient, the mask comprising a body having a peripheral portion, when in use to sit comfortably on a patient's face, a central portion, and bridge portions extending between the central portion and the peripheral portion and integral therewith, the central portion having an inner surface and an outer surface, the inner surface to be oriented towards the patient's face when the mask is in position and contoured so as to sit at a location spaced over the patient's nose and mouth, the inner surface of the central portion provided with a wall circumscribing a base, the wall and base being of generally concave configuration and circumscribing a centrally positioned oxygen delivery aperture extending through the central portion between the inner surface and the outer surface, the wall and base configured so as to act as an oxygen diffuser to direct the flow of oxygen generally towards the patient's nose and mouth when the mask is in use; and tabs on opposite sides of the peripheral portion for securing a flexible strap to extend behind the patient's head to hold the mask in position when in use; and means associated with the aperture and of the central portion releasably to receive and secure in position an oxygen delivery tube. In one embodiment, exhaled carbon dioxide may also be collected for measurement. The mask according to the present invention provides comfort, reliability and efficiency in oxygen delivery to patients.

A power supply system comprises a parallel arrangement of a linear amplifier (LA) and a DC-DC converter (CO). The linear amplifier (LA) has an amplifier output to supply a first current (II) to the load (LO). The DC-DC converter (CO) comprises: a converter output for supplying a second current (12) to the load (LO), a first inductor (L1), and a switch (SC) coupled to the first inductor (L1) for generating a current in the first inductor (L1), and a low-pass filter (FI) arranged between the first inductor (L1) and the load (LO). The low pass filter (FI) comprises a first capacitor (C1; CA) which has a first terminal coupled to the switch (SC) an a second terminal coupled to a reference voltage level (GND), and a second inductor (L2; LC) which has a first terminal coupled to the first inductor (L1) and a second terminal coupled to the load (LO). The low-pass filter further comprises, either: (i) a series arrangement of a second capacitor (C2) and a damping resistor (R2), which series arrangement is arranged in parallel with the first capacitor (C1), or (ii) a parallel arrangement of a third capacitor (CB) and a damping resistor (RB) arranged in series with the first capacitor (CA), or (iii) a series arrangement of a third inductor (L3) and a damping resistor (R3), which series arrangement is arranged in parallel with the second inductor (L2), or (iv) a parallel arrangement of a fourth inductor (LD) and a damping resistor (RD), which parallel arrangement is arranged in series with the second inductor (LC).

Methods and apparatus are described for reducing damage to items shipped in corrugated boxes, and for reducing damage to the boxes themselves and the packing material within them. Damage is limited by adding one or more planar damped panels to a box for redistributing kinetic energy absorbed by the box when it is subjected to characteristic shipping shock and vibration. Efficient coupling of redistributed kinetic energy to resilient packing material within a box allows the use of relatively less resilient padding surrounding shipped items, thus allowing use of a relatively smaller box to obtain an acceptable level of protection. Planar damped panels also limit shifting of the item(s) to be protected by acting as damped variable-rate springs.

A yarn feed system, enabling the control of individual yarns to the needles of a tufting machine, and which system can be manufactured as a substantially standardized unit or attachment that can be removably mounted to a tufting machine. The yarn feed unit includes a series of yarn feed devices for feeding each of the yarns to the needles of the tufting machine, and a series of yarn feed controllers that monitor and control the operation of the yarn feed devices to control the feeding of the yarns to the needles according to programmed pattern instructions.

A LED (light emitting diode) illumination device includes a ceramic substrate to integrate a plurality of LED dies and a control circuit together so that a volume of the LED illumination device can be reduced and the heat dissipation of the LED illumination device can be enhanced. The LED illumination device utilizes sound control to change the light emitted from each LED die, so that the illuminating light mixed from the emitting light of the LED dies of the LED illumination device can vary in color and brightness according to the tempo and volume of music, for example, to provide more cheerful and joyful feeling.

An apparatus for separating a first gas from a mixture of the first gas and at least one second gas comprises a housing having an inlet port and an outlet port and an adsorbent which is positioned in the housing. The adsorbent comprising a carbon based foam monolith that has an affinity for the first gas. Thus, as the gas mixture flows through the housing, the first gas will be adsorbed onto the adsorbent and the second gas will exit the housing through the outlet port. In this manner, the first gas is separated from the second gas.

The heat-generating components of an integrated motor system are disposed proximate the motor body, for efficient heat dissipation, and the heat-sensitive components are segregated therefrom, physically and thermally.

The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

A method for fabricating a Light Emitting Diode (LED) with increased light extraction efficiency, comprising providing a III-Nitride based LED structure comprising a light emitting active layer between a p-type layer and an n-type layer; growing a Zinc Oxide (ZnO) layer epitaxially on the p-type layer by submerging a surface of the p-type layer in a low temperature aqueous solution, wherein the ZnO layer is a transparent current spreading layer; and depositing a p-type contact on the ZnO layer. The increase in efficiency may be more than 93% with very little or no increase in cost.

The present invention discloses a thermal transfer interface having an integrally formed means for fastening and maintaining intimate thermal contact between a heat generating device and a heat-dissipating device. The interface of the present invention includes two components, a compressible thermal transfer component having a first thickness and an adhesive fastening component having a second thickness that is less than the first. The first component, the thermal transfer element, includes a base polymer matrix compound that is loaded with a thermally conducting filler that imparts thermally conductive properties to the net shape moldable material. The polymer base matrix is preferably a highly compressible material such as an elastomer. The second component of the present invention is a pressure sensitive adhesive component. The adhesive is applied adjacent to the thermal transfer element or in an alternating pattern throughout a base field of thermal transfer material. The adhesive component has a thickness that is less than the overall thickness of the thermal transfer material. When, the heat dissipating device with the present invention applied is pressed into contact with a heat generating surface the elastomer is compressed and maintained in the compressed state by the pressure sensitive adhesive material.

A cover of a conventional type, in particular for beds, which has at least one flexible layer of a light, insulating material and which is designed to the desired heat retention in the bed, is equipped in view of an improved moisture regulation and a dissipation of the moisture released by the body as well as excess heat in such a manner that the layer is provided with ventilation openings.

An electrical connector useful for both high-current and low-current applications including a first and a second conductive terminals, in which the terminals are interconnected by a plurality of substantially rigid and elongated conductive strips and apertures or gaps are disposed between at least some of the adjacent conductive strips. The connector provides enhanced heat dissipation characteristics and is particularly useful for high current applications such as for connecting batteries, accumulators, super-capacitors and the like storage power units for electric vehicle and other applications.

The objective of the present invention is to provide a heat-dissipating resin composition that is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting and is excellent in heat dissipation, electrical insulation, heat resistance and light resistance while an LED element emits light, a substrate for LED mounting and a reflector comprising the composition. The present composition comprises a thermoplastic resin such as modified PBT and a thermally conductive filler consisting of scaly boron nitride or the like, and has thermal deformation temperature of 120° C. or higher, a thermal conductivity of 2.0 W / (m·K) or higher, and a thermal emissivity of 0.7 or higher.

The present invention provides solar concentrators incorporating photovoltaic receiver assemblies with improved thermal dissipation, dielectric, encapsulation, and cell / wiring protection characteristics. The concentrators are particularly useful for photovoltaic power systems such as rooftop mounted systems. The present invention teaches that the geometry of the substrate used to support receiver assemblies can have a dramatic impact upon thermal / dielectric performance. In particular, the present invention teaches how contours incorporated into such substrates can improve thermal performance (i.e., dissipation of thermal energy from photovoltaic cells through the substrate) while still maintaining dielectric and encapsulation objectives. In the past, dielectric and encapsulation objectives have been obtained at the expense of such thermal dissipation. Also, material choice and form also impacts thermal, dielectric, and encapsulation performance. In preferred embodiments, components of receiver assemblies are provided in sheet form and laminated together in the course of making the receiver assemblies.

A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

The present invention relates a light emitting diode (LED) package. The present invention provides an LED package, wherein one cavity for defining a circumference of an LED chip and other cavities necessary for exposing lead frames are separately formed in a supporting member for supporting lead frames, and the cavity defining the circumference of the LED chip is separately filled with a resin, whereby it is possible to prevent an irregular interface between the resin portions, and when a phosphor is contained in the resin portion formed to be confined in the circumference of the LED chip, it is possible to reduce color deviation for each light directional angle and to prevent unnecessary waste of the phosphor.To this end, an LED package according to the present invention comprises first and second lead frames disposed to be spaced apart from each other; an LED chip mounted on the first lead frame and connected to the second lead frame by a bonding wire; a supporting member formed to support the first and second lead frames, the supporting member defining first and second cavities divided from each other, the first cavity being formed on the first lead frame having the LED chip positioned thereon, the second cavity being formed on the second lead frame having one end of the bonding wire positioned thereon; and a molding member including a first resin portion filled in the first cavity to cover the LED chip and a second resin portion covering the first resin portion while a portion of the second resin is filled in the second cavity.

A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material.

Filter media are provided having improved conductivity to enhance filtration efficiency and / or dissipate static charge, and methods for making the same. In one exemplary embodiment, the filter media can include a filtration substrate, and at least one conductive coating disposed on at least a portion of the filtration substrate. In use, the conductive coating is coupled to an energy source and it is effective to emit ions when energy is delivered thereto to increase the efficiency of the filtration substrate and / or to dissipate or eliminate static charge generated during filtration.

A solid-state device having: a flip-chip mounted solid-state element; a power receiving / feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving / feeding portion for sealing the solid-state element.