1495 results about "Heat stress" patented technology

A semiconductor light emitting element of nitride compound semiconductors excellent in cleavability, heat radiation and resistance to leakage is made by epitaxially grow a nitride compound semiconductor layers on a substrate of sapphire, for example, and thereafter separating the substrate. For separating the substrate, there are a technique using a abruption mechanism susceptible to a stress such as a "lift-off layer" and a recesses on a substrate. A technique using laser light to cause a local dense heat stress at the abruption mechanism is effective. A nitride compound semiconductor obtained by separating the substrate may be used as a new substrate to epitaxially grow high-quality nitride compound semiconductors thereon.

The present invention relates to technology and apparatus with high energy beam to sinter or melt and deposit material successively to realize laminated solid manufacture. The present invention features that the electronic beam scan controller controls the electronic beam to scan fast in pattern projection mode for heating powder homogeneously. Each scanning of the electronic beam has short time in the selected area, so that the scan initiating point has no great temperature change generated during the whole scanning course. Through one or several frames of scanning, the material in the forming area has temperature synchronously raised to reach the sintering or re-melting temperature for deposition onto the forming area before synchronous cooling. The present invention has greatly reduced heat stress and raised forming precision and quality.

An efficient scalable networkable grow light system ensures that a DLI suitable for optimal plant growth without causing heat stress is met by selectively illuminating lighting elements of determined wavelengths, and adjusting intensity of the lighting elements, and adjusting the height of an assembly containing the lighting elements, if sensed ambient light is inadequate to meet the DLI. A hoist adjusts height to provide full illumination without causing heat stress, while reducing inefficiency due to excessive distance. If sensed ambient lighting is sufficient to meet the DLI, supplemental lighting is not activated.

An electric current detector is provided wherein loose arrangement of conductor 6 in opening 5 provides an air gap between the conductor 6 and plastic package 4 in opening 5 to prevent close contact of conductor 6 to plastic package 4. When heat and heat stress are produced in conductor 6 by a large electric current flowing through conductor 6 during measurement, air gap surely prevents heat and heat stress from traveling to Hall effect sensor 2 and plastic package 4 while a part of heat in conductor 6 is radiated into air in opening 5. Thus, the loose arrangement of conductor 6 can restrict or reduce deterioration of electric property in Hall sensor 2 and degradation of mechanical property in plastic package 4 by heat and heat stress in conductor 6. Also, the loose arrangement ensures and facilitates attachment of the detector 1 in position on a surface of a substrate, and enables to maintain conductor 6 at the same level as lead terminals 3 of the detector.

The invention discloses a processing method of an aluminum alloy thin-wall cylindrical part. The method comprises the following steps of blanking, tool selection, rough machining, excircle semi-finish machining, aging treatment, internal-hole semi-finish machining, internal-hole finish machining, excircle finish machining and the like. According to the method, as a special clamp is adopted to guarantee clamping precision, the clamping deformation is reduced and the internal stress of part processing is eliminated; moreover, the method is simple to operate; for a workpiece, procedures of keeping a technological chuck and removing the technological chuck are omitted, so that the material and the processing time are saved; meanwhile, the aluminum alloy thin-wall cylindrical part processed by using the method is stable in quality, low in processing cost and high in efficiency; in addition, the influence that a product generates deformation due to directly suffering three-point clamping force can also be avoided, the rotation heat stress deformation and the pressure damage can be reduced, the flexible deformation of the tools can be reduced, the raw material consumption of the product can be reduced, and the qualification rate and the production efficiency of the workpiece can be improved; moreover, the processing cost can be lowered.

Group (including, without limitation, occupational work forces) safety and wellness monitoring utilizes baseline physiology testing and vital sign monitoring and sampling technologies. Aerobic capacity of individual members of a group is determined through initial baseline testing which results in an individual health risk assessment. Thereafter non-invasively observed and monitored during incremental work and exercise is commenced. Subsequent data collected is used for advance identification of personnel at risk of injury, such as during unexpected vital sign elevations that can signal early onset of fatigue and heat stress/dehydration prior to injury.

The instant invention comprises a thermal garment system worn by a user to cool the user's upper torso and thereby reducing the incidence of heat stress related injuries. The garment comprising a plurality pockets integrally attached to adapted to receive and support at least one thermal pack therein. The thermal pack comprising a sealed container having flexible walls enclosing a thermal composition and a catalyst adapted to produce an endothermic reaction when desired. The pack includes at least one venting means therein so that the thermal container is more readily capable of being conformed to user's body. The present invention further includes a method for cooling a user's torso and/or body which includes placing the vest around a user's torso, activating the amount of thermal packs believed necessary to produce the desired amount of cooling, and placing the thermal packs into at least one pocket of the vest.

A sampling swab useful in trace analyte detection is provided. The sampling swab possesses absorption/adsorption and desorption properties suitable for use trace analyte sample collection. The sampling swab is also capable of withstanding repeated mechanical stress and heat treatment. Methods for producing a sampling swab that is substantially free of impurities that interfere with analyte detection, but which remains sufficiently resistant to degradation by mechanical and heat stress are also provided.

A system that based on changes in agricultural crop or plant characteristics or dynamics, e.g., heat stress, water deficit stress, stem growth, leaf thickness, plant turgidity, plant color, nutrient composition, etc., or changes in environmental conditions, e.g., temperature, wind, pressure, relative humidity, dew point, precipitation, soil moisture, solar radiation, etc. or a combination of both, e.g., evapotranspiration, either automatically increases or decreases the speed or rate of movement or rotation of a mechanized irrigation system, e.g., center pivot, corner, linear, or lateral move irrigation system or similar, or reports a recommended increased or decreased speed or rate of movement or rotation of a mechanized irrigation system either directly or indirectly to the end user. The system responds directly or indirectly to data outputted from monitoring systems that gather and compile environmental (non-biotic), biotic or similar information from agricultural fields and crops.

The invention relates to a cooling structure of the heated wall surface and a gas turbine blade of the cooling structure; wherein, the cooling structure comprises a compact wall surface layer, and a plurality of discrete through holes for the coolant to pass through are arranged on the compact wall surface layer; a porous coating is covered on the heated side of the compact wall surface layer to enable the porous coating and the compact wall surface layer with a plurality of discrete through holes to form a structure of double-layer superimposition, and the outlet of the discrete through hole is communicated with the porous coating. The porous coating can be continuously covered on the compact wall surface layer, and also can be covered on the local areas of the outlet of the discrete through holes. The invention has the advantages of synthesizing the characteristics of gas film cooling and transpiration cooling, fully combining the advantages of two cooling ways, effectively improving the cooling efficiency of the wall surface, reducing the geothermal gradient of the wall surface, and avoiding the continuous increase of the heat stress of materials. Simultaneously, the intensity of the cooling structure of the invention is enough to be used for common impeller machinery.

The invention discloses anti-stress feed additives. The compositions of the anti-stress feed additives are: 15 to 30 percent of astragalus polysaccharides, 15 to 30 percent of radix scutellariae glucoside, 10 to 20 percent of pennyroyal wrappage, 10 to 20 percent of honeysuckle extract, 0.5 to 5 percent of vitamin C, 0.5 to 5 percent of vitamin E, 0.001 to 0.02 percent of chromium picolinate, 0.05 to 0.3 percent of zinc oxide, 0.1 to 1 percent of arginine, 1 to 5 percent of tryptophan, 1 to 5 percent of glutamine, 1 to 5 percent of sodium sulfate, 1 to 3 percent of calcium iodate, 1 to 3 percent of sodium selenite, 1 to 3 percent of potassium dihydrogen phosphate, the balance being auxiliary materials. The anti-stress feed additives are added into poultry feed according to the ratio of 0.1 to 0.3 percent. The anti-stress feed additives have the advantages that: firstly, the anti-stress feed additives can reinforce the anti-stress capability of poultry, and are particularly suitable for reinforcing the cold stress capability and the heat stress capability; secondly, the anti-stress feed additives can quickly replenish electrolyte loss caused by dehydration, and quickly recover the osmotic pressure of cells and adjust the acid-base balance in the body; and thirdly, the anti-stress feed additives can reinforce the anti-positioning capability of water bodies of the aquatic animals.

The invention relates to a method of recovering silicon carbide from the byproducts of the cut processing of solar-grade silicon wafer and electronic-grade wafer. Concretely speaking, in the wafer cut processing, a large amount of slurry cutting liquid is required to be added to reduce mechanical stress and heat stress and make linear cutting process a stable process; thus, a large amount of byproducts comprising a great amount of organic compounds, silicon carbide and polysilicon (moncrystalline silicon) are made; the silicon carbide powder used for the cutting processing of silicon wafer can be recovered from the byproducts. According to the technical proposal provided by the invention, after separation agent is added into silicon wafer cutting byproducts, the sizing agent rich in silicon carbide can be got after mechanical separation; after second mechanical separation, the wet solid, after the processes of alkali cleaning, pickling, rinsing, mechanical separation, drying and size classification, can get the silicon carbide powder which can be used for the cutting processing of silicon wafer.

The invention discloses a graphite matrix flawless TaC coating and a manufacturing method thereof. A tie coat is deposited on a graphite matrix. A TaC main coating is deposited on the outer layer of the tie coat. The tie coat is composed of a SiC-TaC codeposition coating or compounded by two transition layers of the SiC-TaC codeposition coating and a SiC-TaC laminated coating. When the tie coat is compounded by two transition layers of the SiC-TaC codeposition coating and the SiC-TaC laminated coating, the SiC-TaC codeposition coating serves as a first transition layer, and the SiC-TaC laminated coating serves as a second transition layer; and then the deposition of the tie coat is ended; or the SiC-TaC codeposition coating and the SiC-TaC laminated coating are alternatively deposited many times. Good TaC coating which has small heat stress, no macroscopic cracking, corrosion-resistance, and good thermal stability is deposited out of the surface of the graphite material. The method is suitable for preparing graphite substrate, graphite crucible, graphite windpipe, graphite guide shell coating in the crystal and semiconductor production, protecting and cleaning coating such as antisepsis, anti-pollution, anti-infiltration, anti-oxidation of graphite parts in other various hot environments.

The invention relates to the technical field of packaging structures of power devices, in particular to a packaging part of a power device with light weight and high efficiency of thermal conductivity, which is characterized in that: an upper high thermal conductivity bonding interface layer, a heat sink thin film, a lower high thermal conductivity bonding interface layer and a radiating substrate are sequentially bonded on the back surface of a chip from top to bottom to form the packaging part; and the radiating substrate adopts high thermal conductivity graphite flake or high thermal conductivity nano-carbon tube/fiber composite material or high thermal conductivity pitch-based carbon-carbon composite material or carbon-copper or carbon-aluminum composite material, or aluminum-based or copper-based silicon carbide or boron nitride or aluminum nitride or silicon nitride ceramic composite material. Compared with the prior art, the back surface of the chip of the invention is directly bonded with the bonding film, the heat sink layer and the radiating substrate, when in work, the heat on the chip is directly guided out of a working region by the three-layer radiating structure, thus enhancing the radiation performance of the product, effectively reducing the heat stress between the chip and the radiating substrate and improving the reliability and the service life of the device.

The method of combining aluminium nitride and copper includes setting powder of eutectic alloy, which is obtained through solid pyhase reaction and contains non-oxygen compound of active metal, between AIN and CU and subsequent high temperature treatment. The eutective alloy has Ag, Cu and Ti as main components and one or several of Al, Ni Co, Zr, Hf and Mo, and the reaction temperature is 500-650 deg.c and reaction period of 1-6 hr. The ground alloy powder is painted or sprayed to AIN base board, Cu foil is then covered onto it, the combination of finally high temperature treated in vacuum Ar atmosphere or slight reduction atmosphere at 900-1200 deg.c temperature and 0-6 MPa pressure for 2-12 hr. The process can reduce the heat stress and ensure the high combination strength of AIN-Cu and excellent heat shock resistance.

The invention discloses a water and energy saving domestic animal fermentation bed and a preparation method thereof. The fermentation bed is prepared from the following materials; material 1: rice husk or peanut shell or the like; material 2: sawdust or wood shavings or the like; and material 3: corn flour or rice bran or the like and fermentation bed strains. The method is as follows: firstly mixing the material 3 with the fermentation bed strains, laying the material 2 on the ground, laying the mixture of the material 3 and the fermentation bed strains on the material 1, then laying the material 1 on the mixture of the material 3 and the fermentation bed strains, and finally mixing the materials. The thickness of the padding of the fermentation bed is 20-40cm. The invention takes the physiological habits of poulards, meat ducks, broiler breeders, egg breeders, meat type breeding ducks and pigs into full consideration, reduces the thickness of the padding of the conventional fermentation bed and the cost of the padding of the fermentation bed and relieves the heat stress in summer; the padding is thoroughly mixed with the fermentation bed strains; the fermentation bed improves the dung degradation effect; the dung of the domestic animals is unnecessary to be added and pre-accumulated for fermentation, thus saving water and energy; and the operation is simple. The fermentation bed and the preparation method thereof are suitable for chickens, ducks and pigs and the application range is expanded.

The invention discloses a method of measuring deformation of metal material in the high-temperature mechanical test. First, a support is firmly erected in a safe distance from a heating furnace, a digital camera is mounted on the support, and the video output of the digital camera is connected to a computer by an information wire; two observation holes are opened on the wall of the heating furnace; two marks are made on a test piece right to the opposite of the observation holes of the furnace wall; the two marks on the test piece in the heating furnace are regarded as reference points; the feature information of the two reference points is recorded; coordinates of the two reference points in the image are determined by scanning; the distance between the reference points at the time is calculated; when the test piece expands by heat, deforms by stress or under heat-stress coupling action, the coordinates of the two reference points in the image are determined again, and the new distance between two reference points is calculated; in this way, the axial deformation of the test piece is observed; the method and the instrument of the invention can continuously track the axial deformation of the test piece in the high-temperature test to the steel, so as to effectively improve the precision of measuring the deformation of the test piece in the high-temperature test to the steel.

A bypass duct portion is integrally provided in a casing of an EGR cooler so that heat distortion generated at a part of the casing when bypassing of an exhaust gas is rationally absorbed, and the EGR cooler body and a valve case are brazed/fixed all together so as to improve strength of the valve case, whereby, the bypass duct portion is formed between an inner surface of the casing and the core, a switch is provided for switching and guiding the exhaust gas to either of the core or the bypass duct portion, and a large number of outer ribs formed in the circumferential direction respectively are arranged side by side while being separated from each other in the longitudinal direction in the bypass duct portion of the casing so as to constitute a heat stress absorbing portion. And a cylindrical valve case is integrally formed by deep drawing of a thin metal plate by a press machine, a pair of slits are provided at the rear end of the valve case, both edges of an intra-valve partition plate are inserted into the slits, support projection portions are provided on both faces of the both edge portions of the intra-valve partition plate, and the edge of the slit is supported by the support projection portion. And an opening of the valve case is integrally brazed/fixed to an opening of a header portion of the casing.

The present invention discloses a continuous casting technology, which can greatly reduce defects of a cogged ingot of bloom continuous casting. A technical scheme of the present invention is: the continuous casting technology of the cogged ingot comprises double cooling of solidified shell, wherein the solidified shell goes through five shower cooling areas in sequence to be twice cooled. Cooling intensity in cooling direction of five shower cooling areas is as following: 151 to 1941/ (min is multiplied by m ² ), 24 to 501/ (min is multiplied by m ² ), 23 to 351/ (min is multiplied by m ² ), 12 to 191 / (min is multiplied by m ² ) and 8 to 111 / (min is multiplied by m ² ). The present invention gradually reduces the cooling intensity of the solidified shell with the solidified shell thickening, thereby effectively reducing inside and outside difference in temperature of the solidified shell, decreasing heat stress of the solidified shell and reducing defects of the bloom continuous casting. The present invention is especially suitable for the cogged ingot of bloom continuous casting with a cross of 450mm multiplied 360mm that is made up of medium-carbon ferromanganese such as 35Mn2 and 37 Mn2.

The present invention relates to method of forming nano structure and its special equipment, said method is to proceed surface treatment on metal parts, (1). apply mechanical stress or heat stress on metal parts to be treated; (2). using spherical projectite to proceed jet treatment on whole surface of metal parts to be treated, (3). repeat step 2 to make the impact points cooer all the surface of metal parts to be treated; special equipment includes spherical ball, connect metal part to treated with fixed part to form wheel surface of container, using circulating jet device to impact repeatedly the metal part surface from different incident angle, so that on same impact surface, there are many times impact from various incident angle; a recovery device for repeatedly use the ball. Said equipment can form nano scale microstructure or nano structured surface layer on surface of material treated.

The invention discloses an ultraphonic auxiliary micro-nano embossing forming device comprising a lower heating plate and an upper heating plate, wherein the lower heating plate and the upper heating plate are respectively used for placing a substrate and an embossing mould; the embossing mould acts on the substrate when the lower heating plate and the upper heating plate are mutually approached; one side of the upper heating plate, which is back on to the lower heating plate, is provided with an ultrasonic vibration generation device. Compared with the traditional embossing, the ultraphonic auxiliary micro-nano embossing molding device obviously improves the flow characteristics of a polymer by adopting ultrasonic vibration and a clamping cover and can reduce the cooling shrinkage heat stress to minimum, thereby enhancing the embossing quality of the polymer; and besides, the whole embossing process can be directly carried out in the air without carrying out vacuumizing treatment due to the addition of ultrasonic waves, thereby not only simplifying the mechanical structure, but also saving the vacuumizing process and enhancing the embossing forming efficiency.

A semiconductor device includes first and second semiconductor elements, a first metal body attached to a first side of the semiconductor elements by a first solder portion, a second metal body attached to a second side of the semiconductor elements with a second solder portion, and a resin mold sealing the semiconductor elements, the first metal body and the second metal body by encapsulating them. In the semiconductor device having the second side as an element disposition surface, strain measurement caused by heat stress is maximum at the first solder portion among soldering portions of the semiconductor elements.

The present invention discloses a plate-fin structure EGR cooler with heat-insulation function includes shell. The two ends of the shell are equipped with an air inlet flange and a discharge chamber. A water inlet pipe and a water outlet pipe are set on the shell near the air inlet flange and the discharge chamber. A cooling core assembly, an air chamber and a bellow are set in the shell. The main board at one end of the cooling core assembly is connected to the shell and the discharge chamber and the main board at another end is connected to one end of the air chamber. The other end of the air chamber is connected to one end of the bellow. The other end of the bellow is connected to the shell and the air inlet flange. A heat-insulating pipe connected to the air inlet flange is set within the bellow. Since the main board at the other side of the cooling core assembly is flexibly connected to the shell via the air chamber and the bellow, the axial deformation generated in the flat pipe unit can be transferred to and absorbed by the bellow through the air chamber and thus the axial heat stress generated from the heat deformation of the flat pipe unit is eliminated.