5784 results about "Internal stress" patented technology

There is described a method of forming a fine pattern aimed at depositing a silicon-nitride-based anti-reflection film which is stable even at high temperature and involves small internal stress. The method is also intended to preventing occurrence of a footing pattern (a rounded corner) in a boundary surface between a photoresist and a substrate at the time of formation of a chemically-amplified positive resist pattern on the anti-reflection film. The method includes the steps of forming a silicon-nitride-based film directly on a substrate or on a substrate by way of another layer; and forming a photoresist directly on the silicon-nitride-based film or on the silicon-nitride-based film by way of another layer. The silicon-nitride-based film is deposited while the temperature at which the substrate is to be situated is set so as to fall within the range of 400 to 700° C., through use of a plasma CVD system. The method further includes a step of depositing a silicon-oxide-based film immediately below the photoresist. The silicon-oxide-based film is deposited while the temperature at which the substrate is to be situated is set so as to fall within the range of 400 to 700° C., through use of a plasma CVD system.

The method of designing and manufacturing the artificial joint stem, comprising steps of performing analysis of the internal stress of the artificial joint stem and bone and the adhesive stress of the artificial stem and bone, using the computer, based on the three dimension data indicating the structure of the bone formed by using plural tomographic images of the bone, the design condition involving the form and stiffness of the artificial joint stem configured by using at least one of the tomographic images and the three dimension data, wherein if the result of the analysis does not satisfy the design condition, the condition is changed to have the computer reanalyze and if the result of the analysis satisfies the design condition, the artificial joint stem is designed and manufactured with the stem data based on the result of analysis and the design condition.

Channel doping is an effective method for controlling Vth, but if Vth shifts to the order of -4 to -3 V when forming circuits such as a CMOS circuit formed from both an n-channel TFT and a P-channel TFT on the same substrate, then it is difficult to control the Vth of both TFTs with one channel dope. In order to solve the above problem, the present invention forms a blocking layer on the back channel side, which is a laminate of a silicon oxynitride film (A) manufactured from SiH4, NH3, and N2O, and a silicon oxynitride film (B)manufactured from SiH4and N2O. By making this silicon oxynitride film laminate structure, contamination by alkaline metallic elements from the substrate can be prevented, and influence by stresses, caused by internal stress, imparted to the TFT can be relieved.

A preparation (10, 11,12,13) to be fixed to a natural tooth part or tooth, in particular for the replacement of a load-bearing tooth part, is for example a filling for a drilled-out tooth (1), a crown, bridge or prosthesis to be placed on a tooth stub, or a tooth pin to be fixed in a tooth root for fastening an artificial tooth, a bridge or a prosthesis. The preparation has surface regions which consist of a material with thermoplastic properties. The preparation (10, 11, 12,13) is designed in a manner such that it has oscillation properties with such low damping losses that for a liquefaction of the material with thermoplastic properties by way of oscillations there are local stress concentrations required, and in a manner such that such stress concentrations only occur in the region of the preparation surface. The preparation is positioned on a suitably prepared natural tooth part in a manner such that the material with the thermoplastic properties is in contact or may be brought into contact with the dentin surface and/or enamel surface. The preparation is then made to mechanically oscillate and is simultaneously pressed against the natural tooth part, whereby the material with the thermoplastic properties is at least partly liquefied and brought into intimate contact with the dentin or enamel surface in a manner such that after solidification it forms a positive fit and/or material fit connection. Teeth restored with such preparations have a high stability and a long life, which in particular is attributed to the fact that the thermoplastic material, in contrast to cements used for the same purpose, shrinks less and has the ability to relieve internal stress by creeping.

Al_xGa_yIn_zN, wherein 0≦x≦1, 0≦y≦1, 0≦z≦1, and x+y+z=1, characterized by a root mean square surface roughness of less than 1 nm in a 10×10 μm² area. The Al_xGa_yIn_zN may be in the form of a wafer, which is chemically mechanically polished (CMP) using a CMP slurry comprising abrasive particles, such as silica or alumina, and an acid or a base. High quality Al_xGa_yIn_zN wafers can be fabricated by steps including lapping, mechanical polishing, and reducing internal stress of said wafer by thermal annealing or chemical etching for further enhancement of its surface quality. CMP processing may be usefully employed to highlight crystal defects of an Al_xGa_yIn_zN wafer.

The invention discloses a fast manufacturing method of three-beam laser compound scanning. The method comprises the following steps of: firstly utilizing long-wavelength laser (CO2 laser) for preheating the metal powder, then utilizing short-wavelength laser (YAG or optical fiber laser) for fusing the metal powder and finally utilizing long-wavelength laser (CO2 laser) to carry out heat treatment to the frozen metal. The fast manufacturing method uses the three beams of laser to carry out compound scanning, namely uses long-wavelength laser to preheat, short-wavelength laser to fuse and then long-wavelength laser to carry out heat treatment, can realize the compound process of preheating, fusion and heat treatment of the metal powder. The three beams of laser compound scanning mode can reduce internal stress of the metal part, avoid warping and cracking, improve organization and improve performance.

A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.

A multilayer structure with controlled internal stresses comprising, in this order, a first main layer (110a), at least a first constraint adaptation layer (130) in contact with the first main layer, at least a second stress adaptation layer (120) put into contact by adhesion with said first stress adaptation layer, and a second main layer (110b) in contact with the second stress adaptation layer, the first and second stress adaptation layers having contact stresses with the first and second main layers.Application to the realization of electronic circuits and membrane devices.

The invention relates to a wearable compound layer material for machine parts and a manufacturing method and equipment thereof. The wearable compound layer material is a metal-based wearable compound layer material which is composed of a matrix metal and lots of particles or fibers dispersed and distributed in the matrix metal, thereby having a multi-phase structure. The wearable compound layer material is manufactured by a direct-current electroplating or pulse electroplating method. The direct-current electroplating or pulse electroplating equipment is composed of parts such as an electroplating power source, an electroplating tank, a metal anode or a metal alloy anode, a machine part substrate cathode, a stirring device, a solution circulating device, a heating and temperature control device, an additive supplementing device and the like. The wearable compound layer material for machine parts provided by the invention is obviously superior in performance to good-quality cast iron wearable parts, good-quality cast steel wearable parts and wearable parts for surface heat treatment of common steel and good-quality steel commonly employed in the present product. The wearable compound layer also has high-temperature abrasive resistance and excellent corrosion resistance while having excellent abrasive performance; and the internal stress of the coating is very low.

In designing a precision monolithic structure having all discrete components with different Coefficient of Thermal Expansion (CTE) permanently bonded together, to avoid internal stress caused by changing of temperature: The Coefficient of Thermal Expansion (CTE) Adaptor must be bonded between two components having different Coefficient of Thermal Expansion (CTE); the Bonding Interfaces must be parallel; the Coefficient of Thermal Expansion (CTE) Adaptor is made of material having varied CTE, the variation must be gradual and in only one direction, which is perpendicular to the said Bonding Interfaces; at each Bonding Interface, the CTE of the CTE Adaptor must match the CTE of bonding component in certain degree.

An optical multilayer structure material has a structure such that, on a substrate, a conductive layer in contact with the substrate, a gap portion having a size that enables an interference phenomenon to occur and can be changed, and an optical thin film are formed in this order. The circumference of a movable portion in the optical thin film is uniformly supported by supporting portions, suppressing generation of strain due to an internal stress. Through holes are formed in the movable portion to allow an etchant to easily reach a sacrifice layer when forming a gap portion by etching for sacrifice layer. There is provided an optical multilayer structure material having a simple construction, which can suppress generation of strain due to an internal stress and can be advantageously used in an image display apparatus.

An improved, user-friendly silane/silica sol copolymer hardcoating composition for protecting optical plastic and other substrates (including wood, metals, glass, plastics and most coated articles) from scratching is able to be manufactured at lower costs and to provide much-improved ease of use in transportation, storage, dipbath (or other coating tank) stability, and blush resistance in ordinary cleanroom atmospheres. The silane/silica sol copolymer is formed as a direct reaction product of an acidic silica sol and monomethyltrialkoxysilane, preferably substantially monomethyltriethoxysilane, in ratios of 30:70 to 70:30, most preferably about 40:60. A tail solvent aids blush resistance, reduces internal stress and permits adhesion to unprimed polycarbonate. Optionally, colloidal silica sol dissolved in water-miscible solvent may be reacted in a second stage with acidic aqueous colloidal silica sol earlier silanized with monomethyltrialkoxysilane.

The present invention provides a method and substrate examining device that sequentially and automatically measures at least the thickness and the internal stress of the thin film at a predetermined measurement point on the surface of every manufactured semiconductor substrate to perform quality control on each substrate, and reliably recognizes the cause of defects to improve productivity. The examining device and method accurately analyzes the correlation between film thickness and stress to establish the manufacturing processes necessary for manufacturing a semiconductor substrate of higher performance, and measures the distribution of a physical quantity such as internal stress, index of refraction, and composition of the semiconductor substrate in the film thickness direction, without being influenced by change in ambient environmental temperature thereby further improving examination precision.

The invention discloses a processing method of an aluminum alloy thin-wall cylindrical part. The method comprises the following steps of blanking, tool selection, rough machining, excircle semi-finish machining, aging treatment, internal-hole semi-finish machining, internal-hole finish machining, excircle finish machining and the like. According to the method, as a special clamp is adopted to guarantee clamping precision, the clamping deformation is reduced and the internal stress of part processing is eliminated; moreover, the method is simple to operate; for a workpiece, procedures of keeping a technological chuck and removing the technological chuck are omitted, so that the material and the processing time are saved; meanwhile, the aluminum alloy thin-wall cylindrical part processed by using the method is stable in quality, low in processing cost and high in efficiency; in addition, the influence that a product generates deformation due to directly suffering three-point clamping force can also be avoided, the rotation heat stress deformation and the pressure damage can be reduced, the flexible deformation of the tools can be reduced, the raw material consumption of the product can be reduced, and the qualification rate and the production efficiency of the workpiece can be improved; moreover, the processing cost can be lowered.

A magnetic powder core comprises a molded article of a mixture of a glassy alloy powder and an insulating material. The glassy alloy comprises Fe and at least one element selected from Al, P, C, Si, and B, and has a texture primarily composed of an amorphous phase. The glassy alloy exhibits a temperature difference ΔT_x, which is represented by the equation ΔT_x=T_x−T_g, of at least 20 K in a supercooled liquid, wherein T_x indicates the crystallization temperature and T_g indicates the glass transition temperature. The magnetic core precursor is produced mixing the glassy alloy powder with the insulating material, compacting the mixture to form a magnetic core precursor, and annealing the magnetic core precursor at a temperature in the range between (T_g−170) K and T_g K to relieve the internal stress of the magnetic core precursor. The glassy alloy exhibits low coercive force and low core loss.

In a method for the manufacture of frankfurters, hot dogs and other skinless sausage products, a meat emulsion is extruded onto a flexible conveyor belt which is then conveyed through a tube whose internal diameter is equal to the desired diameter of the sausage product plus twice the thickness of the conveyor belt. In a camming type process, the conveyor belt is caused, upon its entry into the tube, to temporarily form a cylinder containing the meat emulsion. The temporary belt cylinder together with the surrounded meat emulsion extrudate is then conveyed through an ultrasonic waveform generator to cook an outer layer of the meat emulsion. The outer layer may be part of the meat emulsion or a thermoset gelling material deposited on the extruded meat emulsion. At the exit end of the tube, the conveyor belt naturally opens under internal stresses from its cylindrical shape to a flattened belt. The at least partially cooked sausage is then removed from the belt for further processing or packaging. The conveyor belt acts as a temporary skin to hold the meat emulsion during its ultrasonic processing.

The invention discloses a method for preparing a composite powder for 3D printing, and belongs to the technical field of material additive manufacturing. The method comprises the following steps: S1, executing mechanical mixing on a metal matrix phase powder and a nano-ceramic strengthening phase powder to obtain a mixed powder; and S2, executing a ball-milling process on the mixed powder to obtain an alloyed powder, wherein a ball-milling medium used in ball-milling is spherical and has a diameter of 6-10mm, a ball-to-powder ratio is 8: 1 to 10: 1, a distance from a ball-milling tank to a rotary centre is 15-30cm, a rotational speed is 150-200rpm, a ball-milling time is 6-8h, and the composite powder is obtained. The invention further provides a method for using the composite powder prepared by the above-mentioned method for 3D printing forming for parts. The composite powder prepared by the method disclosed by the invention is free from micro-cracks and the problem of supersaturated solid solution, and has no high internal stress; and the parts prepared by virtue of the composite powder disclosed by the invention through a selective laser melting forming method have good comprehensive performance.

The invention relates to the technical fields of photoelectricity and chemical industry, in particular to a low-stress epoxy/organic silicon/POSS nano hybrid material, and a preparation method and application thereof. The epoxy/organic silicon/POSS nano hybrid material comprises (a) an epoxy resin, (b) a polyorganosiloxane, (c) a cage-type polysilsesquioxane (POSS), (d) an epoxy hardener, (e) non-essential silane oxycompound and (f) non-essential assistants, wherein the polyorganosiloxane contains epoxy groups and silane oxygen groups. The cured nano hybrid system has excellent reticular cross-linked structure and does not have microphase separation. The epoxy/organic silicon/POSS nano hybrid material has the advantages of high mechanical strength, favorable heat resistance, favorable cohesive property, high chemical stability, favorable ultraviolet aging resistance, favorable optical transparency and other excellent properties, has the functions of low internal stress and pressure buffer, and can be used as an LED packaging material, optical protection material, circuit protection coating material, adhesive paint and the like.

A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over a back side of the wafer while in a rough state from backgrinding, without prior, conventional polishing or plasma etching of the back side. The thin layer or film of reinforcement material fills grooves, fractures and scratches in the back side of the wafer, enhance the rigidity of the wafer and provide a planar, smooth, back side surface layer. The reinforcement material counteracts internal stresses of the wafer tending to warp, crack and propagate lattice defects in the wafer. The reinforcement material may also be configured to act as a die attach adhesive, may provide an ionic barrier, and may remain as part of the packaging for semiconductor dice singulated from the wafer.

A current collector includes a metal foil and protrusions formed on one face or both faces of the metal foil in a predetermined arrangement. The protrusions are substantially rhombic and aligned in a zigzag. Also, both end portions of each protrusion in each of two orthogonal axial directions protrude outward. Middle portions between the end portions are recessed inward. When columnar blocks of an active material are formed on the protrusions to form an active material layer, the gaps between the protrusions can be increased at portions where the interval between the protrusions is the smallest. As a result, internal stress of the active material layer created by charge/discharge of the battery can be alleviated, and the battery life can be increased.