1355results about "Flexible microstructural devices" patented technology

Microelectromechanical component (100) for motion measurement, comprising: a fortified section (118); a single, central anchor (106) coupled to the attached section (118) with four sides; a first non-straight suspension element (108) coupled to the anchor (106) on one side of the anchor (106); a second non-straight suspension member (120) coupled to the anchor (106) on the same side of the anchor (106), wherein the second non-straight suspension member (120) has a shape and position that mirrors the first non-straight suspension member (108) on a plane (122) bisecting the anchor; and a test mass (104) which is planar, wherein the test mass (104) is suspended at least partially on the first non-straight suspension member (108) and the second non-straight suspension member (120) such that the test mass (104) is rotatable about the anchor (106) and displaceable in a plane which is parallel to the attached section (118), where the first and second non-straight suspension members (108, 120) are bending bearings, wherein the first non-straight suspension member (108) has a C-shape, wherein the C-shape includes an inner section (110) which is coupled to the anchor (106) and extends towards the plane (122) bisecting the anchor, a central section (114) which includes a nearby section and has a distant section, whereby the near section is coupled to the inner section (110), and the far section extends away from the anchor (106) along the plane (122) bisecting the anchor and is coupled to an outer section (112) extending away from the plane (122) bisecting the anchor.

Microelectromechanical systems (MEMS) apparatuses and processes are described that can employ a spring pillar or flexible pillar coupled to a sensing membrane to enhance deformation of the sensing membrane while providing robust MEMS sensors or devices. Described MEMS sensors or devices can comprise an exemplary spring pillar or flexible pillar between the sensing membrane structure and the backplate structure. Exemplary spring pillar or flexible pillar can facilitate adjusting stiffness of the sensing membrane to provide MEMS sensors or devices having large sensing area and compact device size.

The present disclosure, in some embodiments, relates to a MEMS (Microelectromechanical systems) structure. The MEMS structure includes a first comb structure having a first plurality of comb fingers extending outward from a first branch. A second comb structure has a second plurality of comb fingers extending outward from a second branch. The first plurality of comb fingers are laterally interleaved between the second plurality of comb fingers. The first plurality of comb fingers respectively include a weighted core material and one or more peripheral materials. The weighted core material has a larger density than the one or more peripheral materials.

The invention provides a hybrid-driven MEMS device and a preparation method thereof, and the method comprises the steps: forming a first actuating structure in a first substrate, forming a piezoelectric composite film layer on the first actuating structure, applying voltages with opposite electrical properties to a first electrode layer and a second electrode layer, enabling a piezoelectric layer to deform under the effect of an inverse piezoelectric effect, and enabling the piezoelectric composite film layer to form a piezoelectric composite film layer; the movable end of the first actuating structure is driven to move; a second cavity is formed in the second substrate, a third electrode layer is formed in the second cavity, voltage which is the same as or opposite to that of the second electrode layer is applied to the third electrode layer, and the third electrode layer and the second electrode layer serve as electrodes for electrostatic driving. According to the MEMS device, the first actuating structure and the second actuating structure are arranged, so that the deformation deflection of the movable end of the first actuating structure is further increased on the basis of displacement generated by piezoelectric driving, the hybrid-driven MEMS device is formed, the defects of independent driving of piezoelectric driving and electrostatic driving are overcome, and the MEMS device can achieve larger displacement under the same voltage during accurate deflection.

The invention provides an MEMS pressure sensor, a manufacturing method thereof and an electronic device, and the method comprises the steps: providing a first substrate and a second substrate, forming a first pressure structure on the first substrate, and forming a second pressure structure on the second substrate; bonding the first pressure structure and the second pressure structure; the first substrate is removed, the first pressure structure and the second pressure structure jointly form a third pressure structure, the third pressure structure comprises a first electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fifth electrode layer which are arranged at intervals from top to bottom, and a dielectric layer is formed between every two adjacent electrode layers; and cavities penetrating through the dielectric layers are formed in the dielectric layers. According to the scheme, the multiple electrode layers arranged from bottom to top are formed, the multiple electrode layers form the first capacitor, the second capacitor, the third capacitor and the fourth capacitor respectively, then the Wheatstone bridge is formed jointly, the measurement precision of the MEMS pressure sensor is improved, meanwhile, the plane size of the MEMS pressure sensor is reduced, and the integration level of the device is improved.

To provide an analysis element and a manufacturing method thereof that can prevent an object to be analyzed from being unable to be analyzed appropriately.SOLUTION: A manufacturing method of this analysis element 100 includes the steps of forming a mask layer 20, forming a membrane layer 30, exposing a substrate 10, forming an introduction hole 13 and forming a protrusion 14 at the inlet end 13a of the introduction hole 13, and removing the protrusion 14 by wet etching the protrusion 14.SELECTED DRAWING: Figure 13

A MEMS AE transducer system is provided that takes advantage of the low power consumption and lightweight characteristics of MEMS AE transducers, while also achieving higher sensing sensitivity. To address the problem of low sensitivity typically associated with MEMS AE transducers, electrical responses of multiple MEMS AE transducers operating at different frequency ranges are combined to increase the bandwidth and sensitivity of the MEMS AE transducer system. As the frequencies are constructive, the combined response on a single channel is the actual summation of two signals with an improved signal to noise ratio. Additionally, each frequency can be decomposed because they are well separated from each other due to the super narrowband response and high Quality factor of MEMS AE transducers.

A microelectromechanical electrostatic actuator is provided that includes a first layer and a second layer, a first set of comb fingers in the first layer aligned with a second set of comb finger in the second layer. In this aspect, the x-direction width of the comb fingers of the first set is tapered along the vertical direction, such that an electrostatic force between comb fingers is increased by tapering to thereby lower a required actuation voltage.

In accordance with an embodiment, a microelectromechanical system (MEMS) switch device includes: a substrate; a switching membrane disposed above the substrate; a pull-in electrode disposed above the switching membrane; a metal contact disposed on the switching membrane; and a pull-back electrode disposed below the switching membrane, wherein the switching membrane is movable between an open position and a closed position, and wherein in the closed position, the metal contact electrically connects two RF signal lines.

MEMS pressure transducer (1) including: a semiconductor body (2); a lower dielectric region (4,6), arranged above the semiconductor body (2); a fixed electrode region (12) and a lower anchoring region (14), which are formed by conductive material, are arranged on the lower dielectric region (4,6) and are laterally separated from each other; a membrane (55) of conductive material, which is suspended above the fixed electrode region (12), so as to delimit a cavity (39) upwardly, the fixed electrode region (12) facing the cavity, the membrane (55) being deformable as a function of pressure and forming a variable capacitor together with the fixed electrode region (12); and an upper anchoring region (37") of conductive material, which laterally delimits the cavity (39) and is interposed, in direct contact, between the membrane (55) and the lower anchoring region (14).

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The invention provides an MEMS component and a vibration cavity structure and a liquid ejection head thereof, the MEMS component comprises a piezoelectric actuator structure, and the vibration cavity structure is in contact with the piezoelectric actuator structure; the vibration cavity structure comprises a vibration cavity and a cavity wall, and the inner side wall of the cavity wall is arc-shaped; the vibration cavity structure is made of silicon and / or silicon oxide. The cavity wall of the vibration cavity structure disclosed by the invention adopts the design of the arc-shaped inner side wall, so that the deformation volume of the vibration cavity is increased on the premise that the density of the spray holes of the liquid spray head is not changed, and the size of liquid drops is effectively increased; and meanwhile, the liquid ejection head can realize ejection of liquid drops with the same size by using relatively small driving voltage, so that the energy consumption is reduced.

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

Aspects of transducers with feedback transduction are described. One aspect is a transducer system comprising an operational amplifier having an inverting input, a non-inverting input, and an output. The transducer system also includes a piezoelectric microelectromechanical system (MEMS) transducer having a first node and a second node, wherein the first node is coupled to the inverting input of the operational amplifier, and wherein the piezoelectric MEMS transducer is configured to generate an electrical signal across the first node and the second node in response to a signal incident upon the piezoelectric MEMS transducer. The transducer system also includes an attenuator having an input and an output, wherein the input of the attenuator is coupled to the output of the operational amplifier, and wherein the output of the attenuator is coupled to the second node of the piezoelectric MEMS transducer.

The invention provides an MEMS device, which increases the displacement of a movable part, reduces the stress of the MEMS device, enables the MEMS device to be miniaturized, and improves the resonance frequency. The MEMS device is provided with a frame-shaped fixed part, a movable part arranged on the inner side of the fixed part in plan view, four torsion beams for supporting the movable part, driving beams which are respectively arranged relative to the torsion beams, one ends of the driving beams are connected with the torsion beams, and the other ends of the driving beams are connected with the inner edge of the fixed part, and driving sources arranged on the driving beams. Each of the drive beams is arranged to be point-symmetric with respect to the center of the movable part in plan view, and each of the drive beams has a region in which the width in a direction parallel to a first side connected to the inner edge gradually increases toward the first side in plan view. The movable part is provided with extension parts extending radially from the center in plan view, the number of the extension parts is the same as the number of the torsion beams, each extension part comprises an upper surface, a lower surface, one end surface and two side surfaces connected with the end surface, and each torsion beam is connected with two adjacent side surfaces included in different extension parts.

An electro-acoustic transducer includes a substrate, a MEMS device disposed on the substrate, and a membrane disposed on the MEMS device. The electro-acoustic transducer further includes a pair of internal connection pads that serve as a path for a signal to be supplied to a drive source; and one or more height adjustment pads disposed in a region of an upper surface of the substrate that overlaps with a fixed portion in plan view. A lower surface of the fixed portion is bonded to the upper surface of the substrate, and the internal connection pads and the height adjustment pad are interposed between the substrate and the fixed portion.

A semiconductor device for use in a sensor device has a deformable membrane for the measurement of an acceleration, a vibration, or a pressure. The semiconductor device includes a deformable membrane having a membrane border; a structure holding the deformable membrane in correspondence of the membrane border; at least one electric contact to obtain an electric signal indicative of deformation of the deformable membrane; and mass elements suspended from the membrane.

The invention provides an MEMS device and a manufacturing method thereof. The MEMS device comprises a substrate; the conductive layer is formed on a part of the substrate; the sacrificial layer is formed on the conductive layer and the substrate, a cavity is formed in the sacrificial layer, and the cavity exposes part of the top surface of the conductive layer; the semiconductor layer is formed on the sacrificial layer, the semiconductor layer is electrically connected with the conductive layer, a release hole is formed in the semiconductor layer, and the release hole is communicated with the cavity; wherein the top surface of the conductive layer and / or the bottom surface of the semiconductor layer are / is provided with a plurality of bulges, and the longitudinal section contour of each bulge is arc-shaped. According to the technical scheme, the performance of the MEMS device is improved, and meanwhile, the MEMS device can meet the reliability test requirement proposed for coping with a severe environment.

To provide a highly reliable optical filtering device used as a spatial filter of a dark field microscope, which is capable of controlling a shutter at a desired opening angle without fully opening the shutter. The shutter configured to be open and closed by voltage control; and a substrate having a shutter opening portion serving as a movable region of the shutter are included. The substrate has a stopper provided on a side surface of the shutter opening portion and extending in a thickness direction of the substrate, any cross section of the stopper in the thickness direction of the substrate having substantially the same shape, the shutter has a cut-out portion, and when the shutter is open, the cut-out portion abuts against the stopper.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

The present disclosure relates to a method of manufacturing a layered structure for a MEMS apparatus, a layered structure manufactured by the method, and a MEMS apparatus 200 (300, 400, 500) comprising the layered structure. For the layered structure, a high-temperature curing step is provided in the manufacturing process, for example, after structuring the functional layer 3. The structured regions and trenches of the functional layer 3 and in particular the spring structure formed in the functional layer 3 have smoothened side walls and / or rounded corners in regions 3a after the curing step, so that their fracture limits can thus be increased and early fractures of the functional layer 3 during operation of the MEMS apparatus 200 (300, 400, 500) can be avoided.

The invention relates to the technical field of biology, and provides a chip assembly and a preparation method thereof. The chip assembly comprises a substrate, a circuit layer, a culture piece and a microelectrode array. The microelectrode array is located in the culture tank of the culture piece, the culture tank can be used for containing the to-be-monitored organ, and the to-be-monitored organ can make contact with the substrate and make contact with the microelectrode array when located in the culture tank. The substrate and the microelectrode array are both flexible structural members, so that the substrate and the microelectrode array can deform. Therefore, when the organoid is in the culture tank and the organoid is in contact with the microelectrode array, the microelectrode array deforms to be matched with the appearance of the organoid, so that the organoid is in more sufficient contact with the microelectrode array, the signals, collected by the microelectrode array, of the organoid are more accurate, and the damage of the microelectrode array to the organoid can be reduced. The base is also a flexible structural member, and the microelectrode array arranged on the base can move correspondingly by deforming the base so as to adjust the position of the microelectrode array.

The technology described herein is directed towards a reconfigurable intelligent surface (RIS) based on microelectromechanical systems (MEMS) technology, in which MEMS micro-actuators are integrated into unit cells of the RIS. A ring-shaped cantilever, resulting from unit cell fabrication, operates as an electrothermal actuator in the unit cell's resonating pattern. A controlled voltage is applied to the ring-shaped cantilever, deforming (bending up) the metal (e.g., aluminum) ring at its non-anchored (free) portion from its relatively straight non-actuated state via joule heating. The amount of vertical displacement of the free portion of the ring when voltage is applied changes the structure of the unit cell's geometry based on the amount of voltage, whereby analog-like tuning of the unit cell's characteristics (including phase shift) is obtained. When combined with the voltage-controlled phase shifts of other unit cells of the RIS, beamforming of a reflected incoming electromagnetic wave is achieved.

The invention relates to a micro-electro-mechanically movable element (103) for use in a micro-electro-mechanical system (100) and a corresponding micro-electro-mechanical system (100), in particular for use in semiconductor technology equipment. The micro-electro-mechanically movable element (103) comprises a base plate (104) on the side of which facing away from the base structure (101) a mirror plate (105) with a curvature geometry is arranged, wherein the mirror plate (105) is connected to the base plate (104) via a pedestal (106), wherein the geometry of the contact points (107, 108) between pedestal (106) and mirror plate (105) as well as between pedestal (106) and base plate (104) are different. The micro-electro-mechanical system (100) comprises an element (103) that is micro-electro-mechanically movable at least in at least one degree of freedom relative to a basic structure (101) by at least one actuator (102), wherein the micro-electro-mechanically movable element (103) is designed according to the invention.

An actuator of a micro-electromechanical system (MEMS) includes a semiconductor substrate. The actuator includes an array of micromechanical arms disposed over the semiconductor substrate. The actuator includes a first capping member disposed over the micromechanical arms. The actuator includes a second capping member disposed opposite the first capping member such that the micromechanical arms extend between the first capping member and the second capping member along a vertical direction.

A piezoelectric microelectromechanical systems device can include a cavity bounded by walls and an asymmetrical bimorph structure at least partially spanning the cavity that includes at least a piezoelectric layer and two electrode layers. The electrode layers can have relative thicknesses configured to compensate for expected temperature stress in the bimorph structure. Thus, metals having different thicknesses can be positioned and configured to compensate deflection due to thermal stress of any or all of the piezoelectric layer, the first metal layer, and second metal layer and a substrate. A method for making the piezoelectric microelectromechanical systems device is also provided.

A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region, elastically suspended above the cavity and having a main extension in a horizontal plane; at least one first pair of driving arms, carrying respective piezoelectric structures which can be biased to generate a driving force that causes rotation of the tiltable structure about a rotation axis parallel to a first horizontal axis of the horizontal plane; elastic suspension elements, which elastically couple the tiltable structure to the fixed structure at the rotation axis and are rigid to movements out of the horizontal plane and compliant to torsion about the rotation axis. In particular, the driving arms of the first pair are magnetically coupled to the tiltable structure to cause its rotation about the rotation axis by magnetic interaction, following biasing of the respective piezoelectric structures.