Method for producing a mirror substrate (201, 301, (401), (501)) of an optical element for a projection
exposure system, in particular an EUV projection
exposure system (100), comprising a first (202, (402), (502)) and at least one second component (204, 304, (404), (504)), wherein the first component (202, (402), (502)) and the at least one second component (204, 304, (404), (504)) consist of
silicon at least on one side facing a connection (211, 308, (408), (508)), and the method comprises the steps of: providing / producing the at least two components (202, (402), (502), (204), 304, (404), (504)) of the mirror substrate (201, 301, (401), (501)), and joining the at least two components (202, (402), (502), (204), 304, (404), (504)) by heating to a joining temperature and applying a joining pressure, preferably perpendicular to a joining surface (203, (205), (403), (405), (503), (505)).