The utility model discloses a
millimeter wave
chip packaging
structure based on a substrate integrated
waveguide and an artificial magnetic conductor, which relates to the technical field of
millimeter wave
chip packaging, and comprises a
chip, a cover plate and a base, the cover plate is in sealing fit with the base, the chip is arranged in the base, and the cover plate comprises a
metal flat plate and a plurality of
metal columns connected below the
metal flat plate and distributed in an array. The metal column is not contacted with the base; the base comprises a frame, an SIW substrate, a
direct current feed terminal and a
heat sink, a first groove is formed in the center of the upper surface of the
heat sink, and second grooves are formed in the two sides of the first groove and communicated with the first groove. According to the utility model, the SIW substrate is adopted to replace a traditional strip line terminal to serve as the
millimeter wave input end and the millimeter wave output end of the shell, and the
conductive materials on the upper surface and the lower surface of the SIW substrate are
titanium tungsten /
nickel / gold in sequence, so that the structure is simple, the
processing technology is simple, the
assembly technology is simple, the price is low, and the like; and the cable also has the advantages of wide working
frequency band, large bearing power, small
reflection loss, small
transmission loss and the like, and also has the advantages of
static electricity prevention and
lightning protection.