The invention relates to a
chip integrated heat dissipation
system and a preparation method thereof, and belongs to the technical field of heat dissipation of
semiconductor devices. The
chip integrated heat dissipation
system comprises a nano-
diamond transition layer attached to a
chip. A micro-column array supporting layer is arranged on one side, far away from the chip, of the nano-
diamond transition layer; the micro-column array supporting layer is in contact with one surface of the
diamond film, and the other surface of the diamond film is attached to the three-dimensional micro-channel heat dissipation layer. The invention also provides a preparation method of the chip integrated heat dissipation
system. The chip integrated heat dissipation system provided by the invention has the
advantage of efficient heat dissipation, and through the combination of the three-dimensional structure and the
high heat conduction characteristic of diamond, the heat dissipation
power density is remarkably improved, the
junction temperature of the chip is reduced, and the heat dissipation requirement of a high-power device is met. The heat dissipation performance reliability is high, the thermal stress is eliminated through the gradient structure design, the interlayer
binding force is improved, and the stable performance is still kept after multiple thermal cycles. And the preparation process is good in compatibility and convenient for large-scale production.