The invention discloses a surface compound strengthening process for an aluminum
alloy material, aiming to solve the problems that
chemical plating of Ni, Ni-P and Ni-W-P or
electroplating of Ni and Cr for aluminum and aluminum
alloy has good
bonding strength but low rigidity and poorer
wear resistance, and vacuum coatings of CrN,
TiN, TiAlN, TiCN or DLC for an aluminum
alloy material have high rigidity and good
wear resistance but poorer
bonding strength with a substrate. The surface compound strengthening process disclosed by the invention comprises the following steps: firstly, plating a 2-10mu m thick gradient
transition layer on the surface of an aluminum
alloy substrate, then baking for 1-2 hours at constant temperature of 75-85 DEG C in a dry environment, and finally depositing oneor multiple coatings of CrN,
TiN, TiAlN, TiCN or DLC on the aluminum
alloy substrate by a
vacuum coating technology. The surface compound strengthening process can improve the
bonding strength between the
vacuum coating and the aluminum
alloy substrate, and simultaneously the surface of the aluminum alloy substrate has higher rigidity and
wear resistance.