The utility model discloses a
water pipe joint injection mold for
semiconductor device cleaning equipment, which comprises a mold base, an injection molding base is fixedly mounted at the top end of the mold base, an injection molding top seat is arranged right above the injection molding base, and a pressing top cover is arranged at the bottom end of the injection molding top seat. Telescopic connecting rods are symmetrically and fixedly installed in the middle of the injection molding base and the middle of the injection molding top base, and an ejection mechanism facilitating ejection of the
water pipe connector mold obtained after injection molding is completed is arranged in the mold base. The ejection mechanism comprises a through hole formed in the bottom end of the injection molding base, a cavity formed in the mold base and an empty groove formed in the top end in the cavity and located under the through hole. Through the
cam, the connecting roller, the connecting rod and the connecting block which are arranged on the ejection mechanism, the guide-out rod can be driven to automatically eject out the
water pipe connector subjected to injection molding, the situation that labor is wasted due to the fact that a worker frequently and manually rotates and removes a screw rod is reduced, and the working convenience of the worker is improved.