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766results about How to "Reduce hardness" patented technology

Annealing-free medium-high carbon steel plate making technology

ActiveCN103173598AHigh elongation after breakReduce hardnessPearliteSteel plates
The invention relates to an annealing-free medium-high carbon steel plate making technology, and belongs to the technical field of steel rolling technologies. A technical scheme adopted in the invention is characterized in that the technology comprises the operations of heating furnace heating, vertical roll rolling, roughing scale removal, roughing rolling, intermediate cooling, precision rolling scale removal, precision rolling, laminar cooling, reeler reeling and concentrated pile cooling, the intermediate cooling operation is carried out after the roughing rolling operation and before the precision rolling scale removal operation and is realized through cooling plate blanks by a cooling device, and the cooling capability of the cooling device makes the temperature of the plate blanks decrease to below 840DEG C. The technology has the following beneficial effects: the elongation rate after fracture of produced products obviously rises, the hardness of the products decreases by 7.2-21%, the proportion of ferrite in the structure of the products is above 60%, ferrite crystal grains are appropriately coarsened, the pearlite colony is small and dispersed, and the cementite sheet in pearlite is attenuated, fragmented and partially granulated. An annealing operation after rolling can be avoided because of the low hardness and high plasticity in order to reach an online softening purpose.
Owner:HEBEI IRON AND STEEL

Antiskid anti-abrasion EVA shoe sole material and preparation method thereof

The invention discloses an antiskid anti-abrasion EVA shoe sole material. The antiskid anti-abrasion EVA shoe sole material is mainly prepared from EVA, POE, EPDM, an anti-abrasion agent, talcum powder, propylenebutadiene rubber, an odorless cross-linking agent, stearic acid, active zinc oxide and a foaming agent in steps of mixing and foaming. The content of each component is as follows: 10 to 30 parts by weight of EVA, 6 to 15 parts by weight of POE, 10 to 20 parts by weight of EPDM, 0.6 to 1.2 parts by weight of anti-abrasion agent, 15 to 25 parts by weight of talcum powder, 3 to 8 parts by weight of propylenebutadiene rubber, 0.2 to 0.5 parts by weight of odorless cross-linking agent, 0.3 to 0.8 parts by weight of stearate acid, 0.4 to 0.8 parts by weight of active zinc oxide and 0.5 to 1 part by weight of foaming agent. The preparation method mainly comprises three steps of internal mixing, open mixing and oil pressing, and the EVA shoe sole material with hardness of 65 to 70 degrees is finally obtained by virtue of foaming and vulcanization. The prepared EVA shoe sole material is modified in a co-polymerization way by utilizing the rubber elastomer, and corresponding functional additives are added into the raw material formula, so that the antiskid anti-abrasion EVA shoe sole material has advantages of small hardness, high elasticity, good abrasion resistance, good antiskid performance, good dimensional stability, good mechanical performance, long service life and the like.
Owner:浙江隆源高分子科技有限公司

CMP (Chemical-Mechanical Polishing) polishing liquid with mixed grinding materials for alkaline sapphire substrate and preparation method thereof

ActiveCN103571333ASolve pollutionSolve many disadvantages such as easy gelPolishing compositions with abrasivesNano sio2SURFACTANT BLEND
The invention relates to a CMP (Chemical-Mechanical Polishing) polishing liquid with mixed grinding materials for an alkaline sapphire substrate and a preparation method thereof. The CMP polishing liquid consists of the following components in percentage by weight: 0.5-35% of a main grinding material, 0.015-0.09% of an auxiliary grinding material, 0.005-0.05% of a chelating agent, 0.005-0.05% of a surfactant, 0.01-0.5% of a pH adjustor, and the balance of deionized water, wherein the main grinding material is a nano SiO2 sol and the auxiliary grinding material is an Al2O3 sol. The auxiliary grinding material, the chelating agent, the surfactant and the alkaline pH adjustor are sequentially added into a nanosilicon sol suspension. In the polishing liquid, as the content of the main grinding material SiO2 sol is reduced, the phenomenon that the polishing liquid residue on the surface of the substrate after CMP is relatively severe is reduced to facilitate subsequent cleaning. A less amount of the auxiliary grinding material Al2O3 is added, so that the polishing speed is remarkably increased, and the roughness of the substrate after CMP is reduced.
Owner:江西伟嘉创展企业管理有限公司

Ultra-thin telephone receiver

ActiveCN103067806AReduce thicknessReduced anterior chamber spaceEarpiece/earphone attachmentsAlloyEngineering
The invention discloses an ultra-thin telephone receiver. A driving mechanism of the ultra-thin telephone receiver comprises an armature section and a coil section, wherein the armature section is E-shaped and comprises a base portion, two wing portions and a middle portion, the base portion, the two wing portions and the middle portion are formed in an integrated mode, the middle portion comprises a root part located on the base portion, the root part extends forward to form a vibrating diaphragm part, and the coil section is arranged on the root part in a sleeved mode at intervals. A shell of the ultra-thin telephone receiver comprises an upper shell and a lower shell, wherein the upper shell is arranged at the top of the driving mechanism in a covered mode, and comprises a cover plate and cover edges which are formed by extending downward from the periphery of the cover plate, a first magnet is fixedly connected to the inner wall, covered at the top of the vibrating diaphragm part, of a section of the cover plate, the upper shell is made of magnetically soft alloy, the lower shell is arranged at the bottom of the driving mechanism in a covered mode relative to the upper shell, a second magnet is fixedly connected to the inner wall of the lower shell relative to the first magnet, the lower shell is made of magnetically soft alloy, and a sounding hole is formed in the upper shell or the lower shell. According to the ultra-thin telephone receiver, the thickness of an existing telephone receiver is reduced to the largest extent, and the ultra-thin telephone receiver is more suitable for the structure of a mobile phone with a narrow frame or a mobile phone which is nearly frameless.
Owner:SUZHOU YICHUAN TECH CO LTD

Porous nano composite abrasive particle containing polishing active elements, polishing solution composition and preparation method thereof

The invention relates to a porous nano composite abrasive particle containing polishing active elements, a polishing solution composition and a preparation method thereof. The composite abrasive particle is: a. composite silicon oxide abrasive particle formed by silicon oxide and oxide containing polishing active elements; or b. composite aluminum oxide abrasive particle formed by aluminum oxide and oxide containing polishing active elements. The composite abrasive particle is in a nano pore structure, and can lower the abrasive hardness and reduce the excess collision of the inorganic compact abrasive particle onto the substrate, thereby reducing the polishing damage; the abrasive particle contains iron or copper, cerium, nickel, titanium, silver or any other polishing active element in the aspect of chemical composition, and can enhance the chemical action of the abrasive particle; and the porous structure of the abrasive particle can adsorb and store the polishing solution component to enhance the chemical activity of the abrasive particle. The enhancement of the chemical action can increase the polishing speed of the abrasive particle, and the abrasive particle designed in such a way can simultaneously achieve the goals of high speed and high precision in polishing. When being used for polishing an electronic device, such as a hard disk substrate, the polishing solution provided by the invention can effectively lower the surface roughness of the memory hard disk substrate, and has high polishing speed.
Owner:昆山捷纳电子材料有限公司
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