The invention discloses a seal
welding jig and
semiconductor process equipment, and belongs to the technical field of seal
welding. The seal
welding jig comprises a base, a pressure applying
assembly and a deformation supporting piece, the base is provided with a supporting area used for containing a sample to be sealed and welded, the deformation supporting piece is arranged on the base and protrudes out of the surface, provided with the supporting area, of the base, and the deformation supporting piece is located on the periphery of the supporting area and supports the sample to be sealed and welded in the supporting area. Under the condition that the
wafer is supported by the deformation supporting piece, the sample to be sealed and welded is opposite to the
wafer, a gap is formed between the sample to be sealed and welded and the
wafer, the pressure applying
assembly can apply pressure to the wafer, and the deformation supporting piece deforms, so that the wafer is close to the sample to be sealed and welded and is bonded with the sample to be sealed and welded. The
semiconductor process equipment comprises the sealing and welding jig. Thus, the wafer is supported by the deformation supporting piece, the wafer is separated from the to-be-sealed sample, the
getter of the to-be-sealed sample has a large space to be activated, and the vacuum effect after the wafer and the to-be-sealed sample are sealed can be improved.