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1039results about How to "Prevent surface" patented technology

Electrosurgical instrument

A system and method are disclosed for removing a uterus using a fluid enclosure inserted in the peritoneal cavity of a patient so as to enclose the uterus. The fluid enclosure includes a distal open end surrounded by an adjustable loop, that can be tightened, a first proximal opening for inserting an electrosurgical instrument into the fluid enclosure, and a second proximal opening for inserting an endoscope. The loop is either a resilient band extending around the edge of the distal open end or a drawstring type of arrangement that can be tightened and released. The fluid enclosure is partially inserted into the peritoneal cavity of a patient in a deflated condition and then manipulated within the peritoneal cavity over the body and fundus of the uterus to the level of the uterocervical junction. The loop is tightened around the uterocervical junction, after which the enclosure is inflated using a conductive fluid. The loop forms a pressure seal against the uterocervical junction to contain the conductive fluid used to fill the fluid enclosure. Endoscopically inserted into the fluid enclosure is an electrosurgical instrument that is manipulated to vaporize and morcellate the fundus and body of the uterus. The fundus and body tissue that is vaporized and morcellated is then removed from the fluid enclosure through the shaft of the instrument, which includes a hollow interior that is connected to a suction pump The fundus and body are removed after the uterus has been disconnected from the tissue surrounding uterus.
Owner:GYRUS MEDICAL LTD

Electrosurgical system and method

An electrosurgical system comprises a radio frequency generator (1), an electrosurgical instrument (E1), and a fluid enclosure (42). The generator (1) has a radio frequency output for delivery of power to the electrosurgical instrument (E1) when immersed in an electrically-conductive fluid. The electrosurgical instrument (E1) has an electrode assembly (32) at the distal end thereof, the electrode assembly comprising a tissue treatment electrode (34), and a return electrode (38) axially spaced therefrom in such a manner as to define, in use, a conductive fluid path that completes an electrical circuit between the tissue treatment electrode and the return electrode. The fluid enclosure (42) is adapted to surround an operation site on the skin of a patient or an incision leading to a cavity surgically created within the patient's body. The fluid enclosure (42) includes sealing means (44) for sealing against the patient's tissue, and the fluid enclosure includes at least one port (50a, 52a) through which the electrosurgical (E1) is insertable, and through which the electrically-conductive fluid can enter and / or leave the enclosure. The fluid enclosure device of the present invention can also be used to treat tumours within the colon. The enclosure, which includes a proximal and a distal bung, is inserted into the colon in a deflated condition and then inflated with a conductive fluid or gas. The colon can be supported against the pressure of the fluid or gas with a pressure sleeve that has been inserted to surround the region of the colon being treated. An electrosurgical instrument is then inserted into the colon and manipulated to vaporize the tumor.
Owner:GYRUS MEDICAL LTD

Electrosurgical system and method

InactiveUS7001380B2Lower impedanceMinimizing char formationCannulasDiagnosticsBenign conditionEnlarged tonsils
A method is disclosed for treating benign conditions, such as enlarged tonsils and / or adenoids located in a patient's throat or nasopharynx, or soft tissue lesions located in a patient's oropharynx or larynx. According to the method, a space containing the patient's nasopharynx, oropharynx or pharynx and larynx is isolated from the patient's trachea and lungs using an inflatable cuff tracheostomy tube or nasotracheal tube inserted in the patient's trachea. The cuff is inflated to occlude the trachea. The patient is placed in a supine position, whereupon at least a portion of the space containing the nasopharynx and / or oropharynx and larynx is filled with saline. An endoscope is then inserted into the space to view the operative site in which the tonsils or tissue lesion are to be treated. An electrosurgical instrument having an active tissue treatment electrode and a return electrode connected to an electrosurgical generator is then inserted into the space, either along side the endoscope or through the endoscope's working channel. The generator is then operated to apply a radio frequency voltage between the active and return electrodes of the electrosurgical instrument, whereby a conduction path is formed between the active and return electrodes, at least partially through the saline, whereupon the active electrode is manipulated to debulk or otherwise treat the soft tissue lesion or enlarged tonsils and / or adenoids.
Owner:GYRUS MEDICAL LTD

Hermetic wafer scale integrated circuit structure

A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor die. Each individual die formed on the wafer includes a number of bond pads that are exposed on the die surface in various locations to provide electrical connections to the circuitry created on the die. The wafer further includes a planar glass sheet that is substantially the same size as the wafer, the glass sheet being adhered to the wafer using a suitable adhesive. The glass sheet has a number of pre-formed holes in it, the arrangement of the pre-formed holes corresponding to the location of the bond pads at each of the individual semiconductor die formed as part of the wafer structure. Following adherence of the glass sheet to the semiconductor wafer utilizing the intermediate adhesive material, metal connections are made between pads formed on the glass sheet and the bond pads formed on the integrated circuit die. Solder balls are then attached to the pads on the glass sheet to provide a conductive flow between the solder balls and the bond pads. After the solder balls are attached, trenches are cut around each of the individual die on the wafer. The trenches are cut at an angle and extend through the glass sheet and the intermediate adhesive material and into the semiconductor substrate in which the integrated circuits are formed. After the trenches are cut around each individual semiconductor die, a noble metal is deposited on the sidewalls of the trench to extend over the interface between the glass sheet, the adhesive material and the semiconductor die. The wafer is then cut along the noble metal lined trenches to provide individual, hermetically sealed packaged integrated circuit die.
Owner:MICRO CHIP SCALE PACKAGING

Liquid ejection apparatus and liquid ejection surface maintenance method

A liquid ejection apparatus includes: a liquid ejection head which includes a nozzle ejecting liquid, a pressure chamber connected to the nozzle and arranged in a liquid ejection surface of the liquid ejection head, and a pressure application device applying pressure to the liquid inside the pressure chamber; an internal pressure adjustment device which adjusts an internal pressure of the liquid ejection head; and a pressure control device which controls the internal pressure adjustment device and the pressure application device so as to spread the liquid over the liquid ejection surface of the liquid ejection head. The internal pressure adjustment device adjusts the internal pressure of the liquid ejection head to a positive pressure so as to still hold the liquid on the nozzle while protruding the liquid from the liquid ejection surface. The pressure application device then applies the pressure to the liquid inside the pressure chamber for a pressure application duration so as not to cause the liquid to be ejected from the nozzle but to flow out the liquid from the nozzle onto the liquid ejection surface, while the internal pressure adjustment device is adjusting the internal pressure to the positive pressure. The pressure application device then stops applying the pressure to the liquid inside the pressure chamber after the pressure application duration, while the internal pressure adjustment device is adjusting the internal pressure to the positive pressure.
Owner:FUJIFILM CORP
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