141 results about "Planar substrate" patented technology

An optoelectronic apparatus (100, 500) includes a dual folding mirror (114, 510) mounted on a carrier substrate (112, 524) with first and second reflecting surfaces (520, 522) disposed at opposite angles. A plurality of identical photonic integrated circuits (PICs 108, 110, 320, 502, 504, 506, 508) are disposed on the carrier substrate. Each PIC includes an array of optical transceiver cells (314, 400) on a planar substrate with respective edge couplers (406) along an edge of the planar substrate, and an optical distribution tree (320) coupled to convey coherent radiation to the optical transceiver cells. A first PIC is disposed on the carrier substrate such that the edge of the first PIC is in proximity to the first reflecting surface, and a second PIC is rotated by 180° relative to the first PIC such that the edge of the second PIC is in proximity to the second reflecting surface.

A method for fabricating functional optical components. A detackable adhesive layer is deposited on an intermediate substrate. A curable liquid is deposited onto the detackable adhesive layer on the intermediate substrate. An imprint template is used to transfer patterns onto the curable liquid followed by curing thereby forming an imprinted patterned material on the intermediate substrate. A layer of functional material is deposited on the imprinted patterned material. Furthermore, a polymer layer is deposited on top of the functional material layer. A correlated etch of the polymer layer and the functional material layer is then performed thereby forming an etched functional material surface. The etched functional material surface is bonded to a final substrate. The imprinted patterned material is then detacked from the intermediate substrate at the detackable adhesive layer.

An antenna element comprises a planar conductive reflector plate, a first planar substrate carrying a ground plane having a slot and a feed track crossing in the slot, a plurality of further planar substrates, each carrying a respective radiator patch having a shape that has the same proportions as each other radiator patch and a width which is different from each other radiator patch, and a planar non-conductive cover. The planar conductive reflector plate, the first planar substrate, the plurality of further planar substrates, and the planar non-conductive cover are disposed as successive parallel layers. The separation between successive radiator patches is less than 0.1 wavelengths at an operating frequency of the antenna element and a separation between the radiator patch closest to the planar non-conductive cover and the planar non-conductive cover is less than 0.25 wavelengths at an operating frequency of the antenna element.

Compact inductive devices are disclosed herein. According to certain embodiments, a compact inductive device comprises a ferrite core, a ferrite body, and a first conductive column and a second conductive column, each extending from a lower surface of the ferrite body to an upper surface of the ferrite body. Furthermore, the compact inductive device comprises a planar substrate coupled to the upper surface of the ferrite body. The planar substrate includes wiring that electrically connects the first conductive column to the second conductive column.

A crystal oscillation chip including a casing and a crystal oscillation piece is provided. The crystal oscillation piece is disposed in the casing. The crystal oscillation piece includes a flat substrate, two electrodes and two conductive silver glues, the two electrodes are respectively disposed on two opposite main surfaces of the flat substrate. The flat substrate includes at least one notch. The notch is disposed at a side surface of the flat substrate and is recessed along a direction vertical from the side surface and toward an interior of the flat substrate. A height of the notch is the same as a thickness of the flat substrate, and two conductive silver glues connect the flat substrate and the casing.

According to a first aspect, the present disclosure relates to a distributed feedback (DFB) laser configured to control a wavelength of emitted light from the DFB laser, the DFB laser comprising a planar substrate, a substantially planar front facet with an anti-reflective coating, the front facet substantially perpendicular to the planar substrate, a substantially planar rear facet with a high reflectivity coating, the rear facet substantially perpendicular to the planar substrate, a laser section positioned between the rear facet and the front facet, the laser section comprising: a first ensemble of substantially planar layers configured to produce, with said planar substrate, a first PIN junction, the first ensemble of substantially planar layers comprising: a first top layer substantially parallel to the planar substrate; an active layer substantially parallel to the planar substrate and configured to emit light through the front facet, the active layer arranged between the planar substrate and the first top layer; a grating layer arranged substantially parallel to the active layer, the grating layer arranged between the planar substrate and the first top layer in proximity to the active layer; a Bragg grating arranged in said grating layer and configured to reflect light towards said front facet; and a phase section positioned between the rear facet and the laser section, the phase section comprising: a second ensemble of substantially planar layers comprising: a second top layer substantially parallel to the planar substrate, the second top layer substantially coplanar with the first top layer; an optical layer arranged between the planar substrate and the second top layer, the optical layer substantially coplanar with the active layer and optically coupled with the active layer; a non-grating layer substantially coplanar with the grating layer; and an element in electrical or thermal contact with the optical layer, the element configured, under application of a current or voltage, to change a refractive index of the optical layer so as to change the wavelength of the emitted light.

A Cassegrain antenna comprises a primary reflector dish, a sub-reflector and a first waveguide antenna element disposed as a feed for the sub-reflector. The first waveguide antenna element comprises a waveguide body having a conductive back plate electrically connected to the waveguide body, a first radiator patch, a second radiator patch, and a first planar substrate carrying a ground plane. The first radiator patch, the second radiator patch and the first planar substrate are disposed within the waveguide body and substantially parallel to the conductive back plate. The ground plane comprises a slot on a first side, the first side being disposed towards the second radiator patch, and the first planar substrate carries a feed track corresponding to the slot on an opposite side of the first planar substrate to the side carrying the ground plane.

The application relates to a forming method of an optical angle detection unit and an optical angle detector, and comprises the following steps: obtaining a substrate, the substrate having a forming surface; forming a bottom electrode layer on the substrate surface by using an inkjet printing process; forming an N-type semiconductor layer on the forming surface of the bottom electrode layer; forming a P-type semiconductor layer on the surface of the N-type semiconductor layer by using an inkjet printing process; and forming a plurality of top electrodes on the surface of the P-type semiconductor layer by using an inkjet printing process. The application forms each layer structure of the detection unit by using an inkjet printing process, so as to meet the forming requirements of the surface layer structure of a hard or flexible substrate, meet the forming requirements of the layer structure of a planar substrate or a curved surface substrate, realize a curved surface or flexible optical detection unit, expand the detection angle of the optical angle detector, and widen the application range of the photoelectric detector.

A method for repairing a roof includes identifying a compromised shingle having a void. The method includes disconnecting at least a portion of the compromised shingle from an overlapping shingle that overlaps at least a portion of the compromised shingle by breaking a length of a bond that connects the compromised shingle to the overlapping shingle that is proximate the void. The method includes inserting at least a portion of a patch between the compromised shingle and the overlapping shingle to cover the void, in which the patch includes a generally planar substrate and a patch adhesive. The method includes applying a generally downward force to a portion of at least one of the patch or the overlapping shingle to urge at least a portion of the patch adhesive into the void to seal the void.

An optical sensing device includes a planar substrate and an array of optical transceivers disposed on the planar substrate. Each optical transceiver includes a photodetector, at least one turning mirror having a reflective surface disposed diagonally relative to the substrate, and multiple waveguides disposed parallel to the substrate. The waveguides include a transmit waveguide, which is coupled to convey outgoing light from a coherent light source to the at least one turning mirror for output from the optical transceiver, and a receive waveguide, which is coupled to receive incoming light reflected by the at least one turning mirror and to convey the incoming light to the photodetector.

The invention relates to a differential calorimeter for detecting a thermodynamic characteristic variable of a sample, wherein at least one heating element (2) and at least one thermal element (3) as temperature sensor are formed in each case in the form of a coating on the surface of a planar substrate (1) which is formed from a glass, glass ceramic, glass carbon or ceramic material having a thermal conductivity of less than 20 W / (m K).

Provided is a method for automatically inspecting, classifying, and removing a defect of a flat substrate, the method comprising: a first step of photographing, using a camera unit, the surface of a flat substrate including a wafer or a mask, and inspecting a defect; a second step of determining, according to preconfigured criteria, whether the defect is removable and one of a plurality of removal methods for the defect, and automatically classifying the defect; a third step of, if the defect is a removable type, moving a defect removal module to a target position where the defect is located; a fourth step of selecting any one unit in the defect removal module according to the removal method for the defect, and removing the defect; and a fifth step of checking whether the defect has been removed.

Some embodiments are directed to a dissection tool for mechanical removal of biological material from a tissue sample on a planar substrate, such a glass slide including a platform for supporting the glass slide and a positioning system configured to move the dissection tool and platform relative to each other and control their relative positions. The dissection tool has a longitudinal axis and is arranged at an oblique angle relative to the platform and a thin-walled gouging head that has a base portion. The gouging head includes opposing side portions which extend from the base portion in a direction away from the glass slide and which at least partly enclose a cavity within the gouging head for receiving biological material that is dissected when relative movement between the platform and the dissection tool causes a front face of the gouging head to gouge a track though the tissue sample.

This invention discloses a method for preparing a composite coating on small workpieces based on substrate plating followed by forming, belonging to the field of material surface treatment technology. The method includes sequentially executed steps of substrate preparation, overall plating, precision forming, and post-processing. The substrate preparation step provides a large-size planar substrate much larger than the target workpiece. The overall plating step prepares a uniform metal-based composite coating containing second-phase reinforcing particles on the substrate surface. The precision forming step processes the plating substrate into multiple target small workpieces. This invention abandons the traditional process of forming first and then plating, fundamentally solving the problems of floating and displacement, uneven particle distribution, low clamping efficiency, and large obstruction by fixtures during the plating of small workpieces. The resulting coating exhibits good uniformity and enables efficient mass production of small workpieces.

A control system for a printing apparatus for printing in particular flat substrates, with a rack, on which a receptacle for a printing template, in particular printing screen or printing stencil, is arranged, with a camera device, which is assigned to the receptacle, and with a user interface for inputting and / or obtaining information. What is provided is an evaluation device, which is connected to the camera device, in order to receive at least one image of the printing template detected by the camera device, wherein the evaluation device is formed to classify the printing template as being reusable or as being non-reusable as a function of the received image.

The application provides a micro-channel gas-liquid two-phase discharge nitrogen fixation device, which comprises a gas supply system and a liquid supply system, further comprises a micro-fluid chip and a dielectric barrier discharge system, the micro-fluid chip comprises a planar substrate and a transverse channel and a longitudinal channel which are arranged in communication along the planar substrate and are connected with the gas supply system and the liquid supply system respectively, wherein the gas-liquid two-phase forms a two-phase region in the longitudinal channel, and the dielectric barrier discharge system comprises a positive electrode and a negative electrode which are superimposed on the micro-fluid chip along the two-phase region to form an electric field. The micro-channel discharge of the application greatly improves the DBD discharge energy density and promotes the nitrogen dissociation; the micro-channel generates a stable gas-liquid two-phase flow pattern, strengthens the interface reaction and mass transfer between the plasma gas bubble group and the liquid phase, promotes the reaction equilibrium to move to the nitrogen fixation direction, so as to realize the improvement of the plasma nitrogen fixation energy efficiency.

An assay device as well as a method of use thereof is described. The assay device includes a planar substrate having a top surface and a bottom surface. The assay device further includes one or more flow channels disposed within the planar substrate and extending along a dimension of the planar substrate between the top surface and the bottom surface. The assay device further includes an inlet fluidly coupled to the one or more flow channels and one or more vents fluidly coupled to the one or more channels which are operable to facilitate flow of a liquid sample, such as whole blood through the one or more channels. The one or more flow channels are configured to receive a liquid sample from the inlet and allow flow of the liquid sample.

A vehicular interior rearview mirror assembly includes a mirror head having a mirror casing and a mirror reflective element. The mirror casing includes a sidewall having an outer end region that circumscribes an open portion of the mirror casing. The mirror reflective element is disposed at the outer end region of the sidewall at the open portion of the mirror casing. The mirror reflective element includes at least a first glass substrate having a front surface and a rear surface and a substrate thickness spanning between the front surface of the first glass substrate and the rear surface of the first glass substrate. A circuit element is disposed within the mirror head. The circuit element includes a planar substrate having circuitry thereat. A plane of the planar substrate of the circuit element is non-parallel to a plane of the rear surface of the first glass substrate.

The invention discloses a preparation method and application of a thin-film lithium niobate / lithium tantalate photoelectric device, and belongs to the technical field of manufacturing of photoelectric devices. The preparation method comprises the following steps: providing a wafer, wherein the material of the wafer is selected from lithium niobate and / or lithium tantalate; preparing at least one layer of silicon nitride optical waveguide structure on one surface of the wafer, wherein the silicon nitride optical waveguide structure is formed by a deposited silicon nitride film through micro-nano processing preparation; bonding one surface, with the silicon nitride optical waveguide structure, of the wafer on a planar substrate; and sequentially performing grinding thinning, ion modification and polishing on one surface, deviating from the silicon nitride optical waveguide structure, of the wafer to form a thin film wafer. According to the method, an efficient and high-quality processing mode is provided for manufacturing of related photoelectric devices, ferroelectric material etching and ion implantation processes are avoided, the performance of thin-film lithium niobate and lithium tantalate photoelectric devices can be effectively improved, and the method has the advantages of being simple in process, excellent in performance, economical in manufacturing and wide in application prospect.

Microscope slide (100, 101, 102, 200, 300, 400) comprising: a transparent planar substrate (10, 30) for holding a sample (52), the substrate (10, 30) having at least one input port configured for receiving a light beam from a fiber (11, 21, 31) external to the substrate (10, 30); at least one optical circuit (12, 13, 14, 15, 16, 17, 18, 19, 20, 20', 22, 23, 23', 23'', 24, 24', 24'', 25, 25', 25'', 26, 26', 26'', 27, 27', 28, 29, 29', 29'', 31, 31', 32, 32', 33, 33', 41, 41', 42, 42', 43, 44, 45, 46, 47, 48, 49, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 170, 171, 172, 173, 174, 175) housed in the substrate (10, 30); said at least one optical circuit (12, 13, 14, 15, 16, 17, 18, 19, 20, 20', 22, 23, 23', 23'', 24, 24', 24'', 25, 25', 25'', 26, 26', 26'', 27, 27', 28, 29, 29', 29'', 31, 31', 32, 32', 33, 33', 41, 41', 42, 42', 43, 44, 45, 46, 47, 48, 49, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 170, 171, 172, 173, 174, 175) is configured for being coupled with the input port and for transforming the light beam in a structured illumination pattern outside the substrate (10, 30), the pattern having a cartesian component orthogonal to the substrate (10, 30).

The utility model discloses a plane step circuit board with high conductivity, which comprises a plane substrate, a plurality of step plates with planes of different heights are fixedly mounted at the top of the plane substrate, and radiating fins are mounted at the bottom of the plane substrate. When the electronic component works to generate heat, the heat is transmitted to the step plate in a heat conduction mode, is transmitted to the plane substrate through the step plate, is efficiently transmitted to the cooling fins through the heat conduction layer made of the graphene material and is dissipated to the outside, so that the overall efficient heat dissipation of the circuit board is realized, the heat generated when the circuit board works is quickly dissipated, and the service life of the circuit board is prolonged. The working temperature of the circuit board is ensured to be in a reasonable range, and the high-conductivity stability and reliability are maintained.

The disclosure pertains to a semiconductor device and a method of manufacturing such device, having a layered structure comprising a planar substrate (100) having a first substrate surface (110) and a second substrate surface (120) opposite to the first substrate surface, a first electrode (210) and a second electrode (220) positioned spaced apart from each other on the first substrate surface thereby exposing an exposed part of the first substrate surface. The semiconductor device further comprises a passivation layer (300) positioned on the exposed part of the first substrate surface and at least partially positioned on the first electrode and second electrode and having a planar top surface opposite to the first substrate surface, wherein partially on the passivation layer and on at least one of the first electrode and the second electrode a top metal layer (400) is provided, wherein the passivation layer comprises a first passivation sublayer (310) positioned on the exposed part of the first substrate surface, and a second passivation sublayer (320) positioned on the first passivation sublayer, such that at least a part of the first passivation sublayer is exposed (311) thereby causing an interruption of electrical conductivity between the first electrode and the second electrode.

The invention discloses an endoscope laser light source heat dissipation structure which comprises a heat sink body, the heat sink body comprises a plane substrate and a plurality of heat dissipation fins, and the heat dissipation fins are arranged at the lower end of the plane substrate at equal intervals and form a plurality of heat dissipation channels; the fluorescent glass film is arranged on the plane substrate; and the high heat conduction layer is arranged on the plane substrate. The endoscope has the beneficial effects that the technical problems that in the prior art, the heat dissipation effect in the endoscope is poor, the heat dissipation area of the fluorescent glass film high-heat-conduction substrate is small, the structure is complex, and the manufacturing cost is relatively high are solved.

One embodiment includes a blade antenna system. The system includes a ground plane and a planar substrate material extending orthogonally from the ground plane. The system also includes conductive material coupled to the planar substrate material in a coplanar or parallel manner. The conductive material can correspond to a radiating conductor. A portion of the planar substrate material between an edge of the conductive material and the ground plane can form a notch. The system further includes a magneto-dielectric material (MDM) arranged parallel with the planar substrate material to cover the notch.

The embodiment of the utility model relates to the technical field of electronics, and particularly discloses a circuit board, which comprises a substrate, a component and a first shielding cover, the base plate is provided with a mounting plane, the base plate is provided with a plurality of connecting holes, and the connecting holes are formed in the thickness direction of the base plate; the component is arranged on the mounting plane; the first shielding cover comprises a top plate and a side wall, the edge of the top plate extends towards the substrate to form the side wall, the end, away from the top plate, of the side wall is connected to the mounting plane, the top plate, the side wall and the substrate define a first shielding space used for shielding components, the end, away from the top plate, of the side wall is provided with a plurality of connecting protrusions, and one connecting protrusion is inserted into one connecting hole; and the connecting bulges are in interference fit with the connecting holes. According to the embodiment of the utility model, the shielding case is convenient to disassemble and assemble.

An antenna array assembly comprises a plurality of horn array elements, each comprising a waveguide horn and a plurality of radiator patches, a planar substrate to which the plurality of horn array elements is attached, the planar substrate having a ground plane comprising a plurality of slots on a first side and a plurality of feed tracks on the second side; and a ground conductor configured as a reflector, the ground conductor being disposed parallel to the planar substrate and behind the planar substrate with respect to the horn array elements. A plurality of conductive members is disposed such that each conductive member is between the ground conductor and a respective horn array element, each conductive member being perpendicular to the ground conductor, and each conductive member being electrically connected to the ground conductor.

The present invention relates to an optical laminate, a transparent display comprising same, and a manufacturing method therefor. The optical laminate comprises a front plane substrate and a back plane substrate. The front plane substrate comprises: a first transparent member; a metal film positioned on one surface of the first transparent member; and an adhesive film between the metal film and the first transparent member. The back plane substrate comprises: a second transparent member; a thin film transistor (TFT) positioned on one surface of the second transparent member; a passivation layer formed on one surface of the TFT; and a light-emitting diode (LED) positioned on one surface of the passivation layer. The passivation layer is formed on the back plane substrate, and therefore, even when a metal wiring having a predetermined thickness is used, the TFT can be implemented without substrate damage due to the thickness of the wiring. Furthermore, in fabrication of large-area display devices, a thick wiring can be used to increase the current and maintain high LED luminance, thereby ensuring optical reliability.

There is provided a light adjusting structure, a light adjusting module and a light adjusting device, the light adjusting structure includes one or two light adjusting functional layers stacked, each light adjusting functional layer includes functional sub-layers in different regions, first substrates and / or second substrates of the functional sub-layers constitute a full-layer planar substrate, one of first electrodes or second electrodes of the functional sub-layers are disposed at an interval, and the other one of the first electrodes or the second electrodes are disposed at an interval or constitute a full-layer planar electrode; dye liquid crystal layers of the functional sub-layers each include a sealant between the first alignment layer and the second alignment layer, and dye molecules and liquid crystal molecules in a space surrounded by the sealant; sealants of the functional sub-layers are disposed at an interval, and spaces surrounded by the sealants are isolated.

The invention provides an optical path structure and electronic equipment, and relates to the technical field of optical signal communication. The optical path structure comprises an optical chip, a circuit base plate and a substrate. The circuit base plate is provided with a window area; the active surface of the optical chip is welded at the edge of the window area on the circuit bottom plate, and the optical chip is electrically connected with the circuit bottom plate; in the arrangement direction perpendicular to the plane of the circuit base plate, part of the optical waveguide on the end face of the optical chip is located in the projection area of the window area. Wherein the signal transmission direction of the optical chip is parallel to the plane of the circuit base plate; the target surface of the substrate is bonded and fixed on the bottom surface of the optical chip. According to the invention, the optical chip is inversely welded on the edge of the window area of the windowing on the circuit base plate, so that part of the optical waveguide can perform signal transmission in the window area in the plane direction of the circuit base plate, thereby reducing the space size required in the setting direction when the grating coupler is used for coupling, effectively improving the integration level of the device, and improving the reliability of the device. And the integration difficulty of the device is reduced.

The present application relates to an electrode device for electric discharge machining and an electric discharge machining device. The electrode device for electric discharge machining comprises a planar substrate, a first electrode plate attached to one of two opposite sides of the planar substrate, the first plate shape having at least one edge, a first electrode provided on a radially outer side of the at least one edge facing the first electrode plate, the first electrode having a first electrode shape matching a shape of a first machining feature of a workpiece to be electric discharge machined, and a second electrode plate attached to the other of the two opposite sides of the planar substrate, the second plate shape having at least one edge, a second electrode provided on a radially outer side of the at least one edge facing the second electrode plate, the second electrode having a second electrode shape matching a shape of a second machining feature of the workpiece. The technical solution improves the electrode structure and allows simultaneous machining of multiple workpieces.