335 results about "Planar substrate" patented technology

A distributed feedback (DFB) laser includes a planar substrate; a laser section; and a mirror section optically coupled to said laser section. The laser section includes a front facet, an active layer substantially parallel to the planar substrate but not coplanar with the planar substrate and configured to emit light through the front facet, and a first Bragg grating arranged in a planar layer substantially parallel to the active layer but not coplanar with the active layer and on a side of the active layer opposite to the planar substrate. The mirror section is optically coupled to the laser section, and includes a second Bragg grating configured to reflect light towards the front facet. The second Bragg grating is arranged in a planar layer that is coplanar with the active layer.

Techniques are provided for improving antenna isolation and angle-of-arrival (AoA) performance of an antenna array. An example antenna array includes a plurality of patch antenna elements disposed on a planar substrate, and one or more resonator elements disposed on the planar substrate and between each of the plurality of patch antenna elements, wherein each of the one or more resonator elements includes a first repeating S-shaped conductor in a first orientation, and a second repeating S-shaped conductor in a second orientation that is rotated 180 degrees relative to the first orientation.

A method of manufacturing a free-standing, sheet-type solid-state electrolyte is provided. The method includes: mixing a sulfide ion conductor-containing material and a non-polar or low-polar binder in a solvent to obtain a slurry composition; disposing the slurry composition onto a planar substrate; spreading the slurry composition on the substrate to obtain a film; calendering the film to densify the film; and subsequently drying the film under vacuum. The binder may be polyisobutylene and may be present in the slurry composition in an amount of up to 10 wt. %, optionally between 1 and 5 wt. %. The sulfide ion conductor-containing material may be a lithium argyrodite having the chemical formula Li6PS5X in which X is Cl, Br, or I. The solvent may be toluene or xylene. The film may have a thickness of between 10 and 200 μm.

An optoelectronic apparatus (100, 500) includes a dual folding mirror (114, 510) mounted on a carrier substrate (112, 524) with first and second reflecting surfaces (520, 522) disposed at opposite angles. A plurality of identical photonic integrated circuits (PICs 108, 110, 320, 502, 504, 506, 508) are disposed on the carrier substrate. Each PIC includes an array of optical transceiver cells (314, 400) on a planar substrate with respective edge couplers (406) along an edge of the planar substrate, and an optical distribution tree (320) coupled to convey coherent radiation to the optical transceiver cells. A first PIC is disposed on the carrier substrate such that the edge of the first PIC is in proximity to the first reflecting surface, and a second PIC is rotated by 180° relative to the first PIC such that the edge of the second PIC is in proximity to the second reflecting surface.

An optoelectronic device (20, 50, 120, 320, 500, 540, 560, 600) includes an array (32, 72, 124) of optical transceiver cells (34, 74, 90, 126, 522) disposed on a planar substrate (30). Each transceiver cell includes an optical transducer (36) configured to couple optical radiation between the transceiver cell and a target. An optical distribution tree (122) including a network (38, 76, 428, 518, 524) of waveguides (142, 150) and switches (146, 429), is disposed on the substrate and coupled to convey coherent radiation from a radiation source (52, 128, 130, 426, 510, 606) to the optical transceiver cells. A controller (48) is configured to actuate the switches so as to select different subsets of the optical transceiver cells that are to receive the coherent radiation from the optical distribution tree and to transmit the coherent radiation toward the target at different times during a scan of the target.

Packaging for preservation of biological material, wherein, in use, the packaging is filled with one or more samples of biological material and placed in an apparatus for preserving the biological material such that a heat exchange fluid flows around the packaging, the packaging including: a substantially planar substrate including a leading edge that faces the flow of heat transfer fluid in use, a trailing edge opposing the leading edge, and opposing end edges; one or more wells defined in the substrate, each well being configured to receive a sample of biological material and including: a substantially planar base, a sidewall, a leading portion of the well and an opposing trailing portion of the well; and a sealing layer that is applied to the substrate in use, to enclose the one or more wells and respective samples of biological material contained within the one or more wells.

Disclosed are a nanopore-optical electronic device and a method for sequencing a biomolecule and modifications thereof. The nanopore-optical electronic device includes: a cis-fluidic chamber and a trans-fluidic chamber fabricated in a planar substrate; a nano-fluidic channel in between and connecting the cis-fluidic chamber and the trans-fluidic chamber; a first electrode and a second electrode sealed in the nano-fluidic channel and forming a nanogap / nanopore therebetween; a third electrode and fourth electrode disposed in the cis-fluidic chamber and the trans-fluidic chamber, respectively; an optical coupling element coupling an electromagnetic beam with the nanogap; an optical detector detecting an optical signal from the nanogap when a biomolecule translocates through the nanopore; and a current-measuring circuit concurrently measuring a tunneling current and ionic current when the biomolecule translocates through the nanopore. The recorded optical signal and tunneling current and ionic current signals are coincidental in time and colocalized in space.

The invention relates to an antenna module, a laminated assembly and a vehicle, currents on two feed branches of a dipole antenna in the antenna module go in and out respectively, so that the currents on the two feed branches of the same dipole antenna are in the same phase, and the currents on two radiation branches are in the same direction and in the same phase. The currents on the radiation branches of the plurality of dipole antennas are in the same phase and are transmitted along the same direction, an annularly distributed radiation branch is constructed, and when an excitation signal is accessed to the feed port, a current loop is formed on the plurality of radiation branches so as to support an annular current resonance mode at a target frequency band. The planar antenna can be arranged on any non-conductor planar substrate, when the antenna module is applied to a vehicle, metal arrangement such as a vehicle bumper can be avoided, a single antenna module can support omnidirectional radiation of a target frequency band, the number of the antenna modules is reduced, and the antenna cost is reduced.

A multi-modal nanopore system for biosensing and sequencing. In some embodiments, the system includes a first nanopore device, the first nanopore device including: a first chamber and a second chamber in a planar substrate; a nano-fluidic channel connecting the first chamber and the second chamber; a first electrode and a second electrode forming a nanopore between the first electrode and the second electrode; an optical coupling element configured to couple an electromagnetic beam with the nanopore; a first bias circuit for applying a bias to the first electrode and the second electrode, to form a transverse electric field in the nanopore; and a current-measuring circuit configured to measure a current between the first electrode and the second electrode.

An adjustable bed system includes a mattress and an adjustment mechanism. The mattress includes a head portion and a foot portion rearward of the head portion, and the head portion defines a cavity that is downwardly open. The adjustment mechanism includes a lower base formed of a planar substrate, an upper support formed of either a frame or another planar substrate that is movably coupled to the lower base, and an actuator operable to move the upper support relative to the lower base. The adjustment mechanism is positioned in the cavity and coupled to the mattress. When the actuator is operated, the adjustment mechanism moves the adjustable bed system between a flat and an inclined configuration. The mattress and the adjustment mechanism are configured to be positioned on a support surface with the adjustment mechanism having a higher coefficient of friction with the support surface than the mattress.

Devices and methods for detecting the presence and / or monitoring a movement of an analyte contained in a medium. More specifically, a microcapacitive sensing system is provided that includes a planar micro-capacitive sensor array for detecting the presence of an analyte in a sample media. The sensor structure for sensing recognizing or tracking material movement includes a top planar substrate having a first array non-contacting planar conductive electrodes and a bottom planar substrate having a second array of non-contacting planar conductive electrodes overlapping corresponding aligned electrodes in the first array. The overlapping conducting electrodes are triangular shaped to maximize perimeter-to-area ratio. The first and second planar substrates are parallel and sealed to define a volume therebetween for receiving a medium including the analyte to be detected or monitored. The sensing of movement accomplished by measuring a capacitance change between electrodes in the top substrate and aligned electrodes in the bottom substrate.

Systems and methods are described herein for providing a direct radiating antenna (DRA) for installation on a communication satellite. The DRA is a phased array of microstrip patch antennas implemented in a very compact profile on a planar substrate. Embodiments of array are implemented as an array of radiating element configurations, each having a microstrip radiating element (e.g., a square patch) coupled to a first side of the planar substrate, amplifiers coupled to a second side of the planar substrate, and filters (e.g., diplexers) coupled between the radiating elements and amplifiers. A thermal conduction layer (e.g., a graphoil or vapor chamber layer) is thermally coupled with the second side of the planar substrate, and a thermal radiation layer (e.g., an optical solar reflector) is thermally coupled with the thermal conduction layer.

The disclosed technology includes a magnetic location sensor which may comprise first and second spiral coils that can be disposed on a planar substrate. The first and second spiral coils may be disposed about respective first and second center axes, wherein each of the first and second coils can be configured to generate a voltage when subjected to a magnetic field. The magnetic location sensor may also comprise a high-magnetic-permeability planar member that can be disposed near one of the first and second spiral coils. The high-magnetic-permeability planar member can be disposed on the magnetic location sensor such that if the planar substrate is wrapped around a cylindrical substrate, the high-magnetic-permeability planar member may be disposed on an intersection of the first and second center axes.

Various arrangements of transmit and receive shared-aperture array antenna systems are presented herein. The arrangements can include an antenna that includes: a planar substrate; a first row of a first plurality of transmit patches arranged on the planar substrate; a second row of a plurality of receive patches arranged on the planar substrate; and a third row of a second plurality of transmit patches arranged on the planar substrate. The first row, second row, and third row can be parallel and the second row can be between the first row and the third row.

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

A method for fabricating functional optical components. A detackable adhesive layer is deposited on an intermediate substrate. A curable liquid is deposited onto the detackable adhesive layer on the intermediate substrate. An imprint template is used to transfer patterns onto the curable liquid followed by curing thereby forming an imprinted patterned material on the intermediate substrate. A layer of functional material is deposited on the imprinted patterned material. Furthermore, a polymer layer is deposited on top of the functional material layer. A correlated etch of the polymer layer and the functional material layer is then performed thereby forming an etched functional material surface. The etched functional material surface is bonded to a final substrate. The imprinted patterned material is then detacked from the intermediate substrate at the detackable adhesive layer.

Provided in the present invention is a composite dielectric layer applied to non-contact electrical detection of a wafer-level LED chip. An electrode plate is a conductive planar substrate, an array of conductive micro tips is provided on the surface of the electrode plate, and a nano composite dielectric layer is further provided on the surface of the conductive micro tips. An array of micro tips is essentially provided on a conductive plane, such that surface electric fields can be effectively concentrated, thereby reducing the voltage required when a device works. Since a nano composite dielectric layer is arranged on the surface of micro tips, charge accumulation can be generated according to the change in an external electric field, so as to further stabilize a space electric field, and an LED chip can be driven without contact, thereby realizing low-voltage and stable wafer-level LED detection.

An antenna element comprises a planar conductive reflector plate, a first planar substrate carrying a ground plane having a slot and a feed track crossing in the slot, a plurality of further planar substrates, each carrying a respective radiator patch having a shape that has the same proportions as each other radiator patch and a width which is different from each other radiator patch, and a planar non-conductive cover. The planar conductive reflector plate, the first planar substrate, the plurality of further planar substrates, and the planar non-conductive cover are disposed as successive parallel layers. The separation between successive radiator patches is less than 0.1 wavelengths at an operating frequency of the antenna element and a separation between the radiator patch closest to the planar non-conductive cover and the planar non-conductive cover is less than 0.25 wavelengths at an operating frequency of the antenna element.

The present invention relates to the field of semiconductor technology, and in particular to a patterned sapphire substrate and a preparation method thereof. The present invention includes a planar substrate, and a composite reflective layer formed on the surface of the planar substrate, wherein the composite reflective layer includes a patterned film layer, the thickness of the film layer gradually increases as it moves away from the planar substrate, and the refractive index of the film layer gradually decreases as it moves away from the planar substrate. The present invention deposits SiO2 and Na2SiF6 materials on a sapphire substrate, utilizes the reflection phenomenon between materials with different refractive indices, constructs a composite reflective layer, significantly increases the probability of light being transmitted from an LED device, and effectively improves the light extraction efficiency of the LED; the SiO2 and Na2SiF6 materials make it difficult for GaN on the side wall of the patterned substrate to adhere, thereby inhibiting the lateral growth of GaN, effectively reducing the stress generated by the lateral growth, and thereby reducing the number of defects in the LED.

Compact inductive devices are disclosed herein. According to certain embodiments, a compact inductive device comprises a ferrite core, a ferrite body, and a first conductive column and a second conductive column, each extending from a lower surface of the ferrite body to an upper surface of the ferrite body. Furthermore, the compact inductive device comprises a planar substrate coupled to the upper surface of the ferrite body. The planar substrate includes wiring that electrically connects the first conductive column to the second conductive column.

The disclosed technology includes a magnetic location sensor which may comprise first and second spiral coils that can be disposed on a planar substrate. The first and second spiral coils may be disposed about respective first and second center axes, wherein each of the first and second coils can be configured to generate a voltage when subjected to a magnetic field. The magnetic location sensor may also comprise a high-magnetic-permeability planar member that can be disposed near one of the first and second spiral coils. The high-magnetic-permeability planar member can be disposed on the magnetic location sensor such that if the planar substrate is wrapped around a cylindrical substrate, the high-magnetic-permeability planar member may be disposed on an intersection of the first and second center axes.

A crystal oscillation chip including a casing and a crystal oscillation piece is provided. The crystal oscillation piece is disposed in the casing. The crystal oscillation piece includes a flat substrate, two electrodes and two conductive silver glues, the two electrodes are respectively disposed on two opposite main surfaces of the flat substrate. The flat substrate includes at least one notch. The notch is disposed at a side surface of the flat substrate and is recessed along a direction vertical from the side surface and toward an interior of the flat substrate. A height of the notch is the same as a thickness of the flat substrate, and two conductive silver glues connect the flat substrate and the casing.

According to a first aspect, the present disclosure relates to a distributed feedback (DFB) laser configured to control a wavelength of emitted light from the DFB laser, the DFB laser comprising a planar substrate, a substantially planar front facet with an anti-reflective coating, the front facet substantially perpendicular to the planar substrate, a substantially planar rear facet with a high reflectivity coating, the rear facet substantially perpendicular to the planar substrate, a laser section positioned between the rear facet and the front facet, the laser section comprising: a first ensemble of substantially planar layers configured to produce, with said planar substrate, a first PIN junction, the first ensemble of substantially planar layers comprising: a first top layer substantially parallel to the planar substrate; an active layer substantially parallel to the planar substrate and configured to emit light through the front facet, the active layer arranged between the planar substrate and the first top layer; a grating layer arranged substantially parallel to the active layer, the grating layer arranged between the planar substrate and the first top layer in proximity to the active layer; a Bragg grating arranged in said grating layer and configured to reflect light towards said front facet; and a phase section positioned between the rear facet and the laser section, the phase section comprising: a second ensemble of substantially planar layers comprising: a second top layer substantially parallel to the planar substrate, the second top layer substantially coplanar with the first top layer; an optical layer arranged between the planar substrate and the second top layer, the optical layer substantially coplanar with the active layer and optically coupled with the active layer; a non-grating layer substantially coplanar with the grating layer; and an element in electrical or thermal contact with the optical layer, the element configured, under application of a current or voltage, to change a refractive index of the optical layer so as to change the wavelength of the emitted light.

The present invention discloses a flexible display panel, a preparation method thereof, and a flexible display device. The flexible display panel includes a flexible protective layer, on which a plurality of arc-shaped bosses arranged in sequence are formed; a flexible substrate, disposed on the flexible protective layer and the arc-shaped bosses to form an arc-shaped substrate on each arc-shaped boss, and a planar substrate is formed on the flexible protective layer between any two adjacent arc-shaped bosses; a pixel structure, which covers the upper surface of each arc-shaped substrate, and each pixel structure intersects with the planar substrate. By forming a plurality of arc-shaped bosses arranged in sequence on the flexible protective layer, disposing the flexible substrate on the arc-shaped bosses and the flexible protective layer, and disposing the pixel structure on the upper surface of the flexible substrate on the arc-shaped bosses, not only can the stretching performance of the flexible display panel be improved, but also it can be realized that when the flexible display panel is stretched / bent or not stretched / not bent, it can emit light with the maximum luminous efficiency.

A method for manufacturing a diaphragm assembly for EUV lithography, the method comprising: providing a stack comprising: at least one diaphragm layer supported by a planar substrate wherein the planar substrate comprises an inner region and a boundary region surrounding the inner region; the first sacrificial layer is positioned between the planar substrate and the diaphragm layer; selectively removing the interior region of the planar substrate, wherein the step of selectively removing the interior region of the planar substrate includes using an etchant having a similar etch rate for the diaphragm layer and its oxide and a substantially different etch rate for the first sacrificial layer; the diaphragm assembly includes: a diaphragm formed from the at least one diaphragm layer; and a boundary portion that holds the diaphragm, the boundary portion including the boundary region of the planar substrate and the first sacrificial layer between the boundary portion and the diaphragm layer.

A Cassegrain antenna comprises a primary reflector dish, a sub-reflector and a first waveguide antenna element disposed as a feed for the sub-reflector. The first waveguide antenna element comprises a waveguide body having a conductive back plate electrically connected to the waveguide body, a first radiator patch, a second radiator patch, and a first planar substrate carrying a ground plane. The first radiator patch, the second radiator patch and the first planar substrate are disposed within the waveguide body and substantially parallel to the conductive back plate. The ground plane comprises a slot on a first side, the first side being disposed towards the second radiator patch, and the first planar substrate carries a feed track corresponding to the slot on an opposite side of the first planar substrate to the side carrying the ground plane.

The application relates to a forming method of an optical angle detection unit and an optical angle detector, and comprises the following steps: obtaining a substrate, the substrate having a forming surface; forming a bottom electrode layer on the substrate surface by using an inkjet printing process; forming an N-type semiconductor layer on the forming surface of the bottom electrode layer; forming a P-type semiconductor layer on the surface of the N-type semiconductor layer by using an inkjet printing process; and forming a plurality of top electrodes on the surface of the P-type semiconductor layer by using an inkjet printing process. The application forms each layer structure of the detection unit by using an inkjet printing process, so as to meet the forming requirements of the surface layer structure of a hard or flexible substrate, meet the forming requirements of the layer structure of a planar substrate or a curved surface substrate, realize a curved surface or flexible optical detection unit, expand the detection angle of the optical angle detector, and widen the application range of the photoelectric detector.

The invention relates to a combined acoustic transducer and pressure sensor package. A combined acoustic transducer and pressure sensor package (100) is provided that includes a planar substrate (110) and a first cover (120) attached to a first substrate surface (111) with a first cavity (130) defined between the first cover (120) and the first substrate surface (111). A second cover (220) is attached to an opposing second substrate surface (112), where a second cavity (230) is defined between the second cover (220) and the second substrate surface (112), and where the second cover (220) comprises a fluid opening (240) for allowing fluid to enter the second cavity (230). A MEMS acoustic transducer (150) and a MEMS pressure sensor (250) are provided, each disposed inside opposing ones of the first and second cavities (130, 230). A transfer block for providing an electrical path between the package pad and the MEMS acoustic transducer and the MEMS pressure sensor is provided as a discrete component separate from the substrate.

A method for repairing a roof includes identifying a compromised shingle having a void. The method includes disconnecting at least a portion of the compromised shingle from an overlapping shingle that overlaps at least a portion of the compromised shingle by breaking a length of a bond that connects the compromised shingle to the overlapping shingle that is proximate the void. The method includes inserting at least a portion of a patch between the compromised shingle and the overlapping shingle to cover the void, in which the patch includes a generally planar substrate and a patch adhesive. The method includes applying a generally downward force to a portion of at least one of the patch or the overlapping shingle to urge at least a portion of the patch adhesive into the void to seal the void.