The application provides a 3kV or more asymmetric high-reliability super-junction
silicon carbide VDMOS and a preparation method thereof. The method comprises the following steps: depositing
metal on the lower side of a
silicon carbide substrate to form a drain
metal layer; epitaxially growing on the upper side of the
silicon carbide substrate to form a first drift layer; forming a
barrier layer,
etching,
ion implantation, forming a P-type region and an N-type region; removing the
barrier layer, epitaxial growth, forming a second drift layer; forming a
barrier layer,
etching,
ion implantation, forming a P-type source region, a protection region, a P-type well region and an N-type source region;
etching the N-type source region, the P-type well region and the protection region to form a groove, and oxidizing to form an insulating medium layer; depositing
metal to form a gate metal layer; etching the P-type source region and the second drift layer, depositing metal to form a source metal layer, removing the barrier layer, and completing the preparation; the gate reliability of the device is improved, the
capacitive effect of the device gate to the drain is shielded, the Miller
capacitance of the device is reduced, and the switching speed of the device is improved.