The invention discloses a three-dimensional integrated packaging structure and a packaging process thereof. The three-dimensional integrated packaging structure comprises a flip or normal
chip with a functional surface and an opposite back surface; the rewiring layer and the
chip are vertically stacked and electrically connected with each other; electrically leading the rewiring layer out of the packaging structure; the stacking direction of the
inductor and the
chip is parallel to the thickness direction of the chip, the
inductor and the chip, the rewiring layer and the lead-out structure are physically isolated through an insulating medium layer, the
inductor is of a spiral, multi-ring layer overlapping or sectional winding structure, the inductor comprises a
magnetic core, a
spiral coil surrounding the surface of the
magnetic core is formed through
etching and
electroplating processes, and the lead-out structure is arranged on the surface of the
spiral coil. The
spiral coil comprises a circuit A, a circuit B and a circuit C, and the
magnetic core and the spiral coil are encapsulated by the insulating medium layer. The inductor and the chip are stacked in an inverted or
normal mode, the three-dimensional structure saves space, reduces parasitic
inductance, resistance and the like,
signal transmission is stable,
electromagnetic interference is small, and the three-dimensional structure is suitable for the chip packaging field of
miniaturization, high integration and the like.