23407 results about "Miniaturization" patented technology

Abstract of the Disclosure

An implantable analyte sensor including a sensing region for measuring the analyte and a non-sensing region for immobilizing the sensor body in the host. The sensor is implanted in a precisely dimensioned pocket to stabilize the analyte sensor in vivo and enable measurement of the concentration of the analyte in the host before and after formation of a foreign body capsule around the sensor. The sensor further provides a transmitter for RF transmission through the sensor body, electronic circuitry, and a power source optimized for long-term use in the miniaturized sensor body.

The present invention discloses devices and methods of performing high throughput screening of the physiological response of cells to biologically active compounds and methods of combining high-throughput with high-content spatial information at the cellular and subcellular level as well as temporal information about changes in physiological, biochemical and molecular activities. The present invention allows multiple types of cell interactions to be studied simultaneously by combining multicolor luminescence reading, microfluidic delivery, and environmental control of living cells in non-uniform micro-patterned arrays.

Abstract of the Disclosure

An implantable analyte sensor including a sensing region for measuring the analyte and a non-sensing region for immobilizing the sensor body in the host. The sensor is implanted in a precisely dimensioned pocket to stabilize the analyte sensor in vivo and enable measurement of the concentration of the analyte in the host before and after formation of a foreign body capsule around the sensor. The sensor further provides a transmitter for RF transmission through the sensor body, electronic circuitry, and a power source optimized for long-term use in the miniaturized sensor body.

An implantable miniaturized pressure sensor integrates a capacitor and an inductor in one small chip, forming a resonant LC circuit having a Q value of 10 or greater. The capacitor has an upper capacitor plate and a lower capacitor plate disposed proximate thereof. The upper and lower capacitor plates are connected to one or more spiral inductor coils. The sensor is micromachined from silicon to form a thin and robust membrane disposed on top of the upper capacitor plate. The sensor is hermetically sealed and the membrane is deflected relative to the upper capacitor plate by an external fluid, gas, or mechanical pressure. The resonant frequency of the sensor can be remotely monitored and continuously measured with an external detector pick up coil disposed proximate the sensor. The sensor can be smaller than 2×2×0.5 mm and is particularly useful for intraocular applications.

Miniaturized, high-density, bead-based arrays are provided. Methods of producing and using clonal beads and producing and using miniaturized, high density, bead-based arrays are also provided.

Implantable medical devices (IMDS) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof. An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The integrated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the RF module substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.

A self-powered medical device, for example a pacemaker uses the variations of blood pressure inside the heart or a major artery to create a mechanical resonance in an electromagnetic or piezoelectric generator. The resonance extends the time power is generated during the cardiac cycle. The pressure variations compress a bellows carrying the resonant generator. The inside of the bellows may be evacuated to a partial or full vacuum, and a spring restores the bellows to the desired equilibrium point, acting against the blood pressure. The current pulses are stored in a capacitor. Eliminating the battery allows dramatic miniaturization of the medical device to the point it can be implanted at the point of desired stimulation via a catheter.

A flash memory device includes a floating gate made of a multi-layered structure. The floating gate includes a hetero-pn junction which serves as a quantum well to store charge in the floating gate, thus increasing the efficiency of the device, allowing the device to be operable using lower voltages and increasing the miniaturization of the device. The floating gate may be used in n-type and p-type devices, including n-type and p-type fin-FET devices. The stored charge may be electrons or holes.

A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 mum and not more than 100 mum, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 mum and not more than 200 mum. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

A self-powered pacemaker uses the variations of blood pressure inside the heart or a major artery to create a periodic change in the magnetic flux inside a coil. The pressure variations compress a bellows carrying a magnet moving inside a coil. The inside of the bellows is evacuated to a partial or full vacuum, and a spring restores the bellows to the desired equilibrium point, acting against the blood pressure. The current pulses are stored in a capacitor. Eliminating the battery allows dramatic miniaturization of the pacemaker to the point it can be implanted at the point of desired stimulation via a catheter. The invention includes means of compensating for atmospheric pressure changes.

Devices and methods utilizing dielectric pumping and variable dielectric pumping to move fluids through microchannels. Two fluids having dissimilar dielectric constants form an interface that is positioned between two electrodes in order to move the interface and therefore the fluids. Dielectric pumping and variable dielectric pumping may be used to move fluids in miniaturized analytical packages containing microchannels in which forces created by surface tension predominate over the gravitational force.

A communication system includes a miniaturized palmtop computer which is information-coupled to a programmable node positioned in an instrument panel of a vehicle. The computer is removably resident in a pod or pocket of the instrument panel and communicates with a node either wirelessly or via a connectorized bus. Redundant radio and HVAC displays form at least one surface of the pod for use by vehicle operators not using the computer option.

A microarray apparatus is provided which contains at least one chip having source and drain electrodes positioned on an array of carbon nanotube transistors which allows for electronic detection of nucleic acid hybridizations, thereby affording both increased sensitivity and the capability of miniaturization.

Subtleties of advanced fabrication processes and nano-scale phenomena associated with integrated circuit miniaturization have exposed the insufficiencies of design rules. Such inadequacies have adverse impact on all parts of the integrated circuit creation flow where design rules are used. In addition, segregation of the various layout data modification steps required for deep sub-micrometer manufacturing are resulting in slack and inefficiencies. This invention describes methods to improve integrated circuit creation via the use of a unified model of fabrication processes and circuit elements that can complement or replace design rules. By capturing the interdependence among fabrication processes and circuit elements, the unified model enables efficient layout generation, resulting in better integrated circuits.

An object is to provide a semiconductor device having an antenna structure which is advantageous for miniaturization, without changing the number of steps and communication distance. One feature to achieve the above object is a semiconductor device including a substrate, a tag portion including a thin film element formed over the substrate, a first antenna, and a second antenna, in which the first antenna and the second antenna are formed in different layers separated by an insulating film, the first antenna and the second antenna are partially electrically connected to each other, the first antenna is formed of a same material and in a same layer as a source or drain wiring connected to the thin film element, and the second antenna is formed in a different layer from the source or drain wiring connected to the thin film element.