48 results about "Spiral inductor" patented technology

The invention relates to the technical field of radio frequency integrated circuits and advanced semiconductor packaging, in particular to a multilayer spiral inductor structure based on an RDL process and a preparation method. The preparation method comprises the steps of seed layer deposition, gradient line width coil formation through photoetching and electroplating, alternate dielectric layer deposition, through hole etching to form vertical interconnection copper columns, air bridge forming through a photoresist sacrificial layer process and silicon nitride passivation packaging. Through fan-shaped topological layout, dielectric material collaborative optimization and three-dimensional interconnection structure design, the self-resonant frequency bandwidth is effectively improved, conductor and dielectric loss is reduced, and miniaturization integration and high reliability of high-frequency inductance elements are achieved.

This invention discloses a miniaturized, wide-stopband low-pass filter design method, covering 3D model design, simulation optimization, circuit fabrication and testing, and design verification based on dielectric integrated suspension line technology. The core of the low-pass filter design is based on dielectric integrated suspension line technology. Furthermore, the core circuit of this filter employs three layers of surface-mount capacitors and a double-layer spiral inductor to reduce circuit size, while combining a honeycomb structure to extend the stopband. Compared to traditional circuit designs, the implemented filter exhibits self-encapsulation characteristics, achieving low insertion loss and an ultra-wide stopband range, providing an important basis for filter performance optimization.

The invention provides a pattern generation method of a spiral inductor manufactured by a semiconductor process, which comprises the following steps of: setting the number of turns of a coil of the spiral inductor to be M, and setting the shape of a single-turn coil to be an N-sided polygon; the center of an N-polygon where an inner ring is located serves as an X-axis and Y-axis coordinate center original point, N areas are correspondingly divided, the first area is provided with a starting point edge and an ending point edge which are parallel to an X axis or a Y axis, and the other N-1 areas correspond to one edge of the N-polygon respectively, the difference between the distance between the starting point edge and the ending point edge and the distance between the starting point edge and the original point is S, the distance between the N + 1 sides and the original point is the following expression: r1 is the inner diameter of the N-sided coil; i = 1, 2, 3... N + 1; step is equal to S / N, and S is the sum of the line width and the line distance of the N-polygon coil; and respectively listing linear relational expressions corresponding to the areas where the N edges are located, solving an intersection point coordinate of two adjacent edges as a vertex coordinate of the N-polygon, obtaining other vertex coordinates in this way, and drawing a single-turn coil of the spiral inductor.

The present disclosure relates to an inductor assembly, an impedance matching network, and a system including the inductor assembly. An inductor assembly (100) includes: a fixed element (102) having a central core (104) and a support structure (106) coupled to and projecting outwardly from the central core, each of the support structures having an outer edge (108) having a notched profile with a recess (110) extending toward the central core; and a spiral inductor (112) having a plurality of turns located in the recesses of the at least two support structures. The support structures are spaced equidistantly from each other around the central core by air gaps (308). The inductor assembly can be incorporated into an impedance matching network (1100), and one or more impedance matching networks can be incorporated into a defrost system (100). The impedance matching network can be a single-ended network (1100) or a double-ended network (1300).

A metal magnetic flexible composite inductor conductor and a preparation method thereof; the preparation method of the metal magnetic flexible composite inductor conductor comprises the following steps: S1: taking metal and magnetic material; the magnetic induction intensity of the magnetic material is greater than or equal to 1.6 T; S2: continuously attaching the metal to the magnetic material to obtain a conductive and magnetically conductive composite conductor; S3: cutting the conductive and magnetically conductive composite conductor by using a femtosecond laser processing technology to obtain a spiral flexible composite inductor conductor. The flexible composite inductor conductor prepared by the scheme can obtain a larger self-inductance value under the same size, can effectively suppress leakage magnetic flux, reduce leakage magnetic coupling to the outside world and electromagnetic interference, and can realize a more compact spiral inductor layout by reducing the number of turns or reducing the coil geometric size, thereby solving the problem that high inductance density and low power consumption cannot be simultaneously achieved in the traditional inductor conductor.

A three-dimensional spiral inductor, its fabrication method, and an electronic device are disclosed. The three-dimensional spiral inductor, from bottom to top, comprises: a substrate; a first nitride dielectric layer, in which a first conductive layer is formed; a first oxide dielectric layer, in which a second conductive layer is formed; a second nitride dielectric layer, in which a third conductive layer is formed; and further comprises a first metal passivation layer and / or a second metal passivation layer, wherein the first conductive layer is located on the first metal passivation layer, and the second metal passivation layer is located on the second conductive layer. This invention forms a stacked structure of a first nitride dielectric layer, a first oxide dielectric layer, and a second nitride dielectric layer, and simultaneously forms a first metal passivation layer and / or a second metal passivation layer, which can better protect the first, second, and third conductive layers, effectively prevent device aging, thereby significantly reducing line losses and extending service life.

The invention discloses a wave beam regulation and control unit, a wave beam regulator and an antenna system, and the wave beam regulation and control unit comprises a first metal layer which comprises a first pedestal, the first pedestal is provided with four first spiral inductors, any two adjacent first spiral inductors are mutually symmetrical, and two adjacent first spiral inductors at the tail ends are connected; the second metal layer comprises a second base, four second spiral inductors are arranged on the second base, the four second spiral inductors are arranged in a central symmetry mode, and the tail ends of the second spiral inductors are connected at the central point of the second base; the third metal layer comprises a third base, four third spiral inductors are arranged on the third base, any two adjacent third spiral inductors are symmetrical to each other, and two adjacent third spiral inductors at the tail ends are connected. The deployment cost of the antenna system can be effectively reduced, and the aperture efficiency of the antenna system is improved.

A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.

The spiral inductor comprises a substrate, a groove is formed in the substrate, and the projection of the groove on the plane where the substrate is located is in a spiral shape; the seed layer is formed in the groove; and the inductor body comprises an inductor root part embedded into the groove and an inductor end part exposed on the surface of the substrate. According to the spiral inductor, the adhesive force between the inductor metal electrode and the substrate is enhanced, and the damp and hot load capacity of a product is improved.

The invention discloses a mixed lumped distributed five-order band-pass filter based on an LTCC technology. The mixed lumped distributed five-order band-pass filter comprises a ceramic substrate and an electrode located at the bottom of the ceramic substrate. The electrodes are periodically arranged and comprise an input electrode, an output electrode and a grounding electrode; a traditional five-order Chebyshev band-pass filter structure is adopted in the ceramic substrate, and the ceramic substrate comprises a first parallel resonator, a first series resonator, a second parallel resonator, a second series resonator and a third parallel resonator. On the basis, two cross coupling inductors L13 and L35 and three cross coupling capacitors C13, C35 and C15 are introduced, the number of transmission zero points of the band-pass filter is increased, the selectivity of the band-pass filter is greatly improved, and out-of-band rejection is deepened. The problems that a traditional LTCC multi-layer spiral inductor is large in occupied space, complex in design and debugging and high in manufacturing process requirement are solved.

This invention discloses a method, system, and terminal device for reverse engineering on-chip RF spiral inductors, relating to the field of RF integrated circuit auxiliary design technology. The invention includes: constructing an inductor database containing the mapping relationship between geometric structural parameters and S-parameters; building a forward surrogate model based on the Transformer architecture, introducing reciprocity and passive physical constraint loss functions, and training the model using a low-frequency weighting strategy to establish a high-precision mapping from geometric parameters to S-parameters; constructing a cascaded reverse neural network, using the fixed-parameter forward surrogate model to calculate the reconstruction error to update the reverse network weights; and in the design phase, employing a hybrid optimization strategy coupling differential evolution algorithm and the forward surrogate model, using the output of the reverse network as the initial population, searching in the global space for geometric parameters that satisfy the target inductance value and quality factor. This invention solves the problems of long simulation time in traditional inductor design and the existence of multi-value mapping and poor physical consistency in reverse engineering.

This invention discloses a design method for a three-dimensional passive lumped low-pass filter based on TSV (Through-Spirit Transformer). The method includes: determining the electrical parameters of each filter element in the passive lumped low-pass filter based on the performance indicators and selection results of the low-pass filter, and constructing the circuit structure diagram of the low-pass filter; determining the process parameters of the TSV three-dimensional integrated inductor using a computational model of a three-dimensional integrated spiral inductor; determining the process parameters of the coaxial TSV capacitor using a computational model of a coaxial TSV capacitor; and performing simulations based on the process parameters of the TSV three-dimensional integrated inductor and the coaxial TSV capacitor to complete the design of the three-dimensional passive lumped low-pass filter. The low-pass filter designed in this invention uses TSV technology to design a three-dimensional integrated spiral inductor and a coaxial TSV capacitor, resulting in good compatibility with integrated circuit processes and ease of three-dimensional integration. Furthermore, the use of a three-dimensional spiral inductor and coaxial TSV capacitor design significantly reduces the area of ​​the inductor and capacitor, facilitating integration and miniaturization.

The application provides a heterogeneous integrated filter structure with transient voltage protection and a manufacturing method. The filter structure comprises an insulating substrate, a mounting groove is arranged on the upper surface of the insulating substrate, a semiconductor chip with transient voltage protection function is arranged in the mounting groove, a double-layer spiral inductor is arranged on the upper surface of the insulating substrate, the double-layer spiral inductor comprises a first planar inductor coil and a second planar inductor coil which are arranged in a stack mode, a first passivation layer is arranged between the semiconductor chip and the first planar inductor coil, a second passivation layer is arranged between the first planar inductor coil and the second planar inductor coil, a third passivation layer is arranged on the upper surface of the second planar inductor coil, the first passivation layer and the second passivation layer are both provided with through holes for electrically connecting the upper and lower layers, filter pins are arranged on the third passivation layer, and the filter pins are electrically connected with the second planar inductor coil. The application can improve the differential mode bandwidth index of the filter.

This invention relates to the fields of radio frequency integrated circuits and advanced semiconductor packaging technology, and particularly to a multilayer spiral inductor structure and its fabrication method based on RDL technology. The fabrication method includes seed layer deposition, photolithography and electroplating to form gradient linewidth coils, alternating dielectric layer deposition, via etching to form vertical interconnect copper pillars, photoresist sacrificial layer process to form air bridges, and silicon nitride passivation packaging. This invention effectively improves the self-resonant frequency bandwidth and reduces conductor and dielectric losses through a fan-shaped topology layout, synergistic optimization of dielectric materials, and three-dimensional interconnect structure design, achieving miniaturized integration and high reliability of high-frequency inductor components.

The invention discloses an ultra-wideband high-power-resistance amplitude limiting switch multifunctional chip, and relates to the technical field of amplitude limiting switches and integrated circuits. The chip comprises a PIN amplitude limiter and a single-pole four-throw PIN switch, the PIN amplitude limiter equally divides the power of a radio frequency input signal into two paths to improve the power capacity of the amplitude limiter, adjusts the amplitude limiting level through an anti-parallel diode, and transmits an amplitude limiting radio frequency input signal to the single-pole four-throw PIN switch; according to the single-pole four-throw PIN switch, a spiral inductor is adopted, resistors are introduced between coils of the spiral inductor to eliminate resonance points caused by parasitic capacitance and expand bandwidth, four corresponding branches are turned on or turned off according to four control voltages, and then an amplitude limiting radio frequency input signal is transmitted to the low-noise amplifier according to the turned-on branches. The power capacity of the amplitude limiter can be improved, the amplitude limiting level can be adjusted, and the bandwidth can be expanded while the amplitude limiting of the radio frequency input signal is realized.

The application provides a pattern generation method of a spiral inductor manufactured by a semiconductor process, comprising the following steps: setting the number of turns of the spiral inductor as M, and the shape of a single-turn coil as an N-polygon; taking the center of the N-polygon where the inner coil is located as the center of the XY axis coordinate origin, and corresponding to dividing into N regions, the first region is provided with a starting edge and an ending edge parallel to the X axis or the Y axis, and the other N-1 regions correspond to one edge of the N-polygon respectively: the distance difference between the starting edge and the ending edge relative to the distance of the origin is S, and the distance between the N+1 edges relative to the origin is the following expression:, r1 is the inner diameter of the N-polygon coil; i=1, 2, 3…N+1; Step=S / N, S is the sum of the line width and the line spacing of the N-polygon coil; linear relationship formulas corresponding to the regions where N edges are located are listed respectively, the intersection coordinates of two adjacent edges are solved as a vertex coordinate of the N-polygon, other vertex coordinates are obtained in this way, and the single-turn coil of the spiral inductor is drawn.

The invention provides a three-dimensional integrated low-temperature co-fired ferrite differential band-pass filter, which is applied to the fields of radio frequency front-end modules, satellite communication, radar systems and the like, adopts a differential filter form in a symmetrical circuit form, and adopts a low-temperature co-fired ferrite LTCF process to process both capacitors and inductors. The inductor adopts a multilayer spiral inductor structure design, the capacitor adopts a multilayer laminated tile type capacitor structure design, the characteristics of the inductor are embedded into the dielectric substrate, an external discrete inductor is not needed, the parasitic effect is reduced, and the circuit stability is improved; the ferrite material has natural absorption and inhibition effects on common-mode signals, and the differential circuit design is combined, so that the filter has excellent common-mode noise inhibition capability, and the electromagnetic compatibility performance of a system can be effectively improved.

The invention relates to an intelligent screw capable of monitoring bone mechanical signals in real time. The intelligent screw is composed of one or more passive wireless pressure sensors and a screw with a sensor mounting groove. The passive wireless pressure sensor is composed of a primary loop and a secondary loop which are coupled through an inductor. The primary loop comprises an LRC circuit packaged by Gr-PDMS, and the LRC circuit is composed of a spiral inductor, a snakelike variable resistor and a capacitor which are connected in parallel. As a fracture fixture, the intelligent sensor is mounted on the fracture fixture, mechanical data displayed by the intelligent sensor is transmitted to terminal equipment through a passive signal transmission technology, and a doctor can evaluate fracture healing and mechanical conditions by using the received data, so that the dependence on traditional imaging examination is reduced, and the medical cost is reduced; the medical treatment convenience is improved, and the life quality of patients is improved.

To provide an aerosol generation device, an aerosol generation system, a method of generating an aerosol, a method of manufacturing an aerosol generation device, and an aerosol delivery device.SOLUTION: The aerosol-generating device comprises a device housing, a planar, non-helical inductor coil 21, and a power supply connected to the planar, non-helical inductor coil 21 and configured to supply an oscillating electrical current to the planar, non-helical inductor coil 21.SELECTED DRAWING: Figure 1

Disclosed are a magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips. The interface structure includes a master chip and at least one slave chip, wherein the master chip and all the slave chips are vertically stacked; the slave chip includes a clock receiving module, a data transmitting module, and a data receiving module; the master chip includes a clock transmitting module, a data transmitting module, and a data receiving module. The solution herein makes use of the magnetic coupling relationship between on-chip spiral inductors of different chips in a vertical direction to simultaneously transmit data and clock signals. The communication method herein modulates each bit of digital signal into a differential bi-directional non-return-to-zero pulse train and performs decision and data parsing at the receiving end by a high-speed dynamic comparator.

Spiral inductors, magnetic field sensors incorporating the spiral inductors, and methods of using the magnetic field sensors are provided. The spiral inductors include an electrically conductive spiral coil and a nitrogen vacancy (NV) diamond substrate. A thin barrier layer of a dielectric material separates the spiral coil from the surface of the NV diamond substrate and an overlayer of dielectric material is disposed over the spiral nanocoil. The integration of the spiral coil with an NV substrate in this manner creates a highly enhanced magnetic transduction and produces a simple, high-performance way to control and read out electromagnetic signals. Because the spiral inductors enable electromagnetic-to-optical signal conversion, they can be used as sensors for environmental or biomedical applications and spin-based computation.

The invention discloses an adjustable common mode rejection filter based on three-dimensional integration, which comprises a top dielectric RDL layer, a silicon substrate and a bottom dielectric RDL layer which are sequentially arranged from top to bottom, and is characterized in that a symmetrical spiral inductor L1, a symmetrical spiral inductor L2, a symmetrical spiral inductor L3, a symmetrical spiral inductor L4, a symmetrical spiral inductor L5 and a symmetrical spiral inductor L6 are arranged in the top dielectric RDL layer; a TSV capacitor C1, a TSV capacitor C2, a TSV capacitor C3 and a TSV capacitor C4 are arranged in the silicon substrate; and a symmetrical spiral inductor L7, a symmetrical spiral inductor L8 and an RDL inductor L9 are arranged in the bottom dielectric RDL layer. The invention further discloses a design method of the adjustable common-mode rejection filter based on three-dimensional integration. The filter can achieve high-gain and adjustable-bandwidth common-mode noise rejection at the same time.

The application discloses a high-inductance value heterogeneous three-dimensional spiral inductor based on a silicon adapter plate process and belongs to the technical field of radio frequency micro systems. The method integrates multiple planar double spiral patches on the basis of an original three-dimensional integrated inductor, so that the frequency range coverage basically reaches 0-3GHz, and the inductance value can reach 18.5nH. Compared with a traditional three-dimensional integrated inductor design, the method of the application makes the upper and lower layers of the planar double spiral patch staggered and interconnected, reduces the volume of an off-chip spiral inductor used in a traditional power amplifier application while realizing large inductance, and realizes higher inductance inductance value on a single-layer silicon substrate.

The present invention discloses a novel spiral inductor with a star-shaped shielding mesh, comprising a substrate, an inductor body, and a shielding mesh. The substrate is a dielectric material that carries the inductor and can be divided into multiple layers, with metal layers on the upper surface of the top substrate, the lower surface of the bottom substrate, and between adjacent substrate layers. The inductor body is a set of metal patterns used to implement the inductor function, including a spiral line, input pads, and output pads. The shielding mesh is a set of metal patterns on a different metal layer from the inductor body, including a central grounding hole, a star line, and edge grounding holes. The spiral line, input pads, output pads, and star line are arranged on the metal layer. The present invention provides a simple, low-cost spiral inductor for integrated circuit design, helping to improve the shielding effect of integrated inductors, thereby reducing coupling interference and the overall cost of high-performance integrated circuits, promoting performance improvements and system capabilities of microwave monolithic integrated circuits and mixed analog-digital integrated circuits.

The application discloses a glass substrate-based heterogeneous integrated power amplifier and a preparation method thereof. The power amplifier comprises a passivation layer, a metal coil layer, a chip, a glass substrate, a TGV array and a heat dissipation ground layer. The metal coil layer is arranged on the front surface of the glass substrate and comprises an octagonal spiral inductor and an MIM capacitor. The passivation layer covers the surface of the octagonal spiral inductor. The heat dissipation ground layer is arranged on the back surface of the glass substrate. The TGV array is connected with the heat dissipation ground layer on the back surface through the glass substrate on the front surface. The chip is a GaAs tube core or a GaN tube core. The chip is electrically interconnected with the metal coil layer (gate and drain) and the heat dissipation ground layer (source) through gold wires of a bonding layer.

A humidity sensor may include a metalized substrate having a non-conductive layer and a metal layer on the non-conductive layer. The metal layer is laser ablated to define, on a surface of the metalized substrate, a non-conductive laser ablated portion and a conductive metal portion. The conductive metal portion includes a spiral inductor and an interdigitated capacitor. The interdigitated capacitor is coupled in parallel with the spiral inductor. The interdigitated capacitor is centrally positioned with respect to the spiral inductor and surrounded by spirals of the spiral inductor.

This invention relates to an interleaved silicon-based three-dimensional spiral inductor and bandpass and lowpass filters. The interleaved silicon-based three-dimensional spiral inductor includes, from top to bottom, a first inductor metal layer, a first silicon dioxide dielectric layer, an inductor silicon dielectric layer, a second silicon dioxide dielectric layer, and a second inductor metal layer. The first inductor metal layer and the second inductor metal layer each have an interleaved arrangement of several inductor metal sheets. The number of inductor metal sheets on the first and second inductor metal layers is the same, and each inductor metal sheet on the first and second inductor metal layers is connected to the other in a corresponding manner by several first metal conductor pillars. This invention reduces the area of ​​the three-dimensional spiral inductor by using an interleaved arrangement of the inductor metal sheets, achieving higher inductance density on a single-layer silicon substrate, and also simplifies the fabrication process.

The present disclosure provides a hybrid filter, a preparation method thereof, and a filtering apparatus. The hybrid filter includes a first substrate (100) and a second substrate (200) disposed oppositely, a first space (300) is disposed between the first substrate (100) and the second substrate (200), at least one of the first substrate (100) and the second substrate (200) is provided with a film bulk acoustic resonator (30), at least one of the first substrate (100) and the second substrate (200) is provided with at least one passive filter (40), the film bulk acoustic resonator (30) is disposed in the first space (300) and is connected with the passive filter (40), the passive filter (40) includes a filtering inductor and a filtering capacitor, and the filtering inductor has a three-dimensional spiral inductor structure.

The invention discloses a wide-stop-band band-pass filter based on LTCC (Low Temperature Co-Fired Ceramic). The wide-stop-band band-pass filter comprises a metal shielding cavity, a vertical interdigital capacitor and a three-dimensional vertical spiral inductor, according to the invention, eight spiral inductors and seven vertical interdigital capacitors are included, and a plurality of zero points are introduced, so that wide stop band and high rectangularity are realized. The wide-stop-band band-pass filter adopts a fourteen-layer LTCC (Low Temperature Co-Fired Ceramic) structure, so that miniaturization is realized. And meanwhile, the filter also has the characteristic of low insertion loss. And the requirements of a wireless communication system on miniaturization, low loss and wide stop band of the filter are met.

The invention discloses a TSV-based lumped distributed band-pass common-mode noise suppression filter, which comprises a top RDL, a silicon substrate and a bottom RDL which are sequentially arranged from top to bottom, two quarter-wavelength microstrip lines Line1 and Line2 are arranged in the top RDL, two ends of the two microstrip lines Line1 and Line2 are respectively connected with three TSV spiral inductors, two opposite sides of one end of the top RDL are respectively provided with a port Port1 and a port Port2, and the other end of the top RDL is provided with a TSV spiral inductor. And two opposite sides of the other end of the top RDL are respectively provided with a port 3 and a port 4. The invention further discloses a design method of the TSV-based lumped distributed band-pass common-mode noise suppression filter. The filter solves the problem that an existing filter is difficult to realize signal integrity and suppress common-mode noise at the same time.