37 results about "Spiral inductor" patented technology

This invention discloses a miniaturized, wide-stopband low-pass filter design method, covering 3D model design, simulation optimization, circuit fabrication and testing, and design verification based on dielectric integrated suspension line technology. The core of the low-pass filter design is based on dielectric integrated suspension line technology. Furthermore, the core circuit of this filter employs three layers of surface-mount capacitors and a double-layer spiral inductor to reduce circuit size, while combining a honeycomb structure to extend the stopband. Compared to traditional circuit designs, the implemented filter exhibits self-encapsulation characteristics, achieving low insertion loss and an ultra-wide stopband range, providing an important basis for filter performance optimization.

The invention provides a pattern generation method of a spiral inductor manufactured by a semiconductor process, which comprises the following steps of: setting the number of turns of a coil of the spiral inductor to be M, and setting the shape of a single-turn coil to be an N-sided polygon; the center of an N-polygon where an inner ring is located serves as an X-axis and Y-axis coordinate center original point, N areas are correspondingly divided, the first area is provided with a starting point edge and an ending point edge which are parallel to an X axis or a Y axis, and the other N-1 areas correspond to one edge of the N-polygon respectively, the difference between the distance between the starting point edge and the ending point edge and the distance between the starting point edge and the original point is S, the distance between the N + 1 sides and the original point is the following expression: r1 is the inner diameter of the N-sided coil; i = 1, 2, 3... N + 1; step is equal to S / N, and S is the sum of the line width and the line distance of the N-polygon coil; and respectively listing linear relational expressions corresponding to the areas where the N edges are located, solving an intersection point coordinate of two adjacent edges as a vertex coordinate of the N-polygon, obtaining other vertex coordinates in this way, and drawing a single-turn coil of the spiral inductor.

A metal magnetic flexible composite inductor conductor and a preparation method thereof; the preparation method of the metal magnetic flexible composite inductor conductor comprises the following steps: S1: taking metal and magnetic material; the magnetic induction intensity of the magnetic material is greater than or equal to 1.6 T; S2: continuously attaching the metal to the magnetic material to obtain a conductive and magnetically conductive composite conductor; S3: cutting the conductive and magnetically conductive composite conductor by using a femtosecond laser processing technology to obtain a spiral flexible composite inductor conductor. The flexible composite inductor conductor prepared by the scheme can obtain a larger self-inductance value under the same size, can effectively suppress leakage magnetic flux, reduce leakage magnetic coupling to the outside world and electromagnetic interference, and can realize a more compact spiral inductor layout by reducing the number of turns or reducing the coil geometric size, thereby solving the problem that high inductance density and low power consumption cannot be simultaneously achieved in the traditional inductor conductor.

A three-dimensional spiral inductor, its fabrication method, and an electronic device are disclosed. The three-dimensional spiral inductor, from bottom to top, comprises: a substrate; a first nitride dielectric layer, in which a first conductive layer is formed; a first oxide dielectric layer, in which a second conductive layer is formed; a second nitride dielectric layer, in which a third conductive layer is formed; and further comprises a first metal passivation layer and / or a second metal passivation layer, wherein the first conductive layer is located on the first metal passivation layer, and the second metal passivation layer is located on the second conductive layer. This invention forms a stacked structure of a first nitride dielectric layer, a first oxide dielectric layer, and a second nitride dielectric layer, and simultaneously forms a first metal passivation layer and / or a second metal passivation layer, which can better protect the first, second, and third conductive layers, effectively prevent device aging, thereby significantly reducing line losses and extending service life.

The invention discloses a wave beam regulation and control unit, a wave beam regulator and an antenna system, and the wave beam regulation and control unit comprises a first metal layer which comprises a first pedestal, the first pedestal is provided with four first spiral inductors, any two adjacent first spiral inductors are mutually symmetrical, and two adjacent first spiral inductors at the tail ends are connected; the second metal layer comprises a second base, four second spiral inductors are arranged on the second base, the four second spiral inductors are arranged in a central symmetry mode, and the tail ends of the second spiral inductors are connected at the central point of the second base; the third metal layer comprises a third base, four third spiral inductors are arranged on the third base, any two adjacent third spiral inductors are symmetrical to each other, and two adjacent third spiral inductors at the tail ends are connected. The deployment cost of the antenna system can be effectively reduced, and the aperture efficiency of the antenna system is improved.

A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.

The spiral inductor comprises a substrate, a groove is formed in the substrate, and the projection of the groove on the plane where the substrate is located is in a spiral shape; the seed layer is formed in the groove; and the inductor body comprises an inductor root part embedded into the groove and an inductor end part exposed on the surface of the substrate. According to the spiral inductor, the adhesive force between the inductor metal electrode and the substrate is enhanced, and the damp and hot load capacity of a product is improved.

The invention discloses a mixed lumped distributed five-order band-pass filter based on an LTCC technology. The mixed lumped distributed five-order band-pass filter comprises a ceramic substrate and an electrode located at the bottom of the ceramic substrate. The electrodes are periodically arranged and comprise an input electrode, an output electrode and a grounding electrode; a traditional five-order Chebyshev band-pass filter structure is adopted in the ceramic substrate, and the ceramic substrate comprises a first parallel resonator, a first series resonator, a second parallel resonator, a second series resonator and a third parallel resonator. On the basis, two cross coupling inductors L13 and L35 and three cross coupling capacitors C13, C35 and C15 are introduced, the number of transmission zero points of the band-pass filter is increased, the selectivity of the band-pass filter is greatly improved, and out-of-band rejection is deepened. The problems that a traditional LTCC multi-layer spiral inductor is large in occupied space, complex in design and debugging and high in manufacturing process requirement are solved.

This invention discloses a method, system, and terminal device for reverse engineering on-chip RF spiral inductors, relating to the field of RF integrated circuit auxiliary design technology. The invention includes: constructing an inductor database containing the mapping relationship between geometric structural parameters and S-parameters; building a forward surrogate model based on the Transformer architecture, introducing reciprocity and passive physical constraint loss functions, and training the model using a low-frequency weighting strategy to establish a high-precision mapping from geometric parameters to S-parameters; constructing a cascaded reverse neural network, using the fixed-parameter forward surrogate model to calculate the reconstruction error to update the reverse network weights; and in the design phase, employing a hybrid optimization strategy coupling differential evolution algorithm and the forward surrogate model, using the output of the reverse network as the initial population, searching in the global space for geometric parameters that satisfy the target inductance value and quality factor. This invention solves the problems of long simulation time in traditional inductor design and the existence of multi-value mapping and poor physical consistency in reverse engineering.

This invention discloses a design method for a three-dimensional passive lumped low-pass filter based on TSV (Through-Spirit Transformer). The method includes: determining the electrical parameters of each filter element in the passive lumped low-pass filter based on the performance indicators and selection results of the low-pass filter, and constructing the circuit structure diagram of the low-pass filter; determining the process parameters of the TSV three-dimensional integrated inductor using a computational model of a three-dimensional integrated spiral inductor; determining the process parameters of the coaxial TSV capacitor using a computational model of a coaxial TSV capacitor; and performing simulations based on the process parameters of the TSV three-dimensional integrated inductor and the coaxial TSV capacitor to complete the design of the three-dimensional passive lumped low-pass filter. The low-pass filter designed in this invention uses TSV technology to design a three-dimensional integrated spiral inductor and a coaxial TSV capacitor, resulting in good compatibility with integrated circuit processes and ease of three-dimensional integration. Furthermore, the use of a three-dimensional spiral inductor and coaxial TSV capacitor design significantly reduces the area of ​​the inductor and capacitor, facilitating integration and miniaturization.

The application provides a heterogeneous integrated filter structure with transient voltage protection and a manufacturing method. The filter structure comprises an insulating substrate, a mounting groove is arranged on the upper surface of the insulating substrate, a semiconductor chip with transient voltage protection function is arranged in the mounting groove, a double-layer spiral inductor is arranged on the upper surface of the insulating substrate, the double-layer spiral inductor comprises a first planar inductor coil and a second planar inductor coil which are arranged in a stack mode, a first passivation layer is arranged between the semiconductor chip and the first planar inductor coil, a second passivation layer is arranged between the first planar inductor coil and the second planar inductor coil, a third passivation layer is arranged on the upper surface of the second planar inductor coil, the first passivation layer and the second passivation layer are both provided with through holes for electrically connecting the upper and lower layers, filter pins are arranged on the third passivation layer, and the filter pins are electrically connected with the second planar inductor coil. The application can improve the differential mode bandwidth index of the filter.

This invention relates to the fields of radio frequency integrated circuits and advanced semiconductor packaging technology, and particularly to a multilayer spiral inductor structure and its fabrication method based on RDL technology. The fabrication method includes seed layer deposition, photolithography and electroplating to form gradient linewidth coils, alternating dielectric layer deposition, via etching to form vertical interconnect copper pillars, photoresist sacrificial layer process to form air bridges, and silicon nitride passivation packaging. This invention effectively improves the self-resonant frequency bandwidth and reduces conductor and dielectric losses through a fan-shaped topology layout, synergistic optimization of dielectric materials, and three-dimensional interconnect structure design, achieving miniaturized integration and high reliability of high-frequency inductor components.

The application provides a pattern generation method of a spiral inductor manufactured by a semiconductor process, comprising the following steps: setting the number of turns of the spiral inductor as M, and the shape of a single-turn coil as an N-polygon; taking the center of the N-polygon where the inner coil is located as the center of the XY axis coordinate origin, and corresponding to dividing into N regions, the first region is provided with a starting edge and an ending edge parallel to the X axis or the Y axis, and the other N-1 regions correspond to one edge of the N-polygon respectively: the distance difference between the starting edge and the ending edge relative to the distance of the origin is S, and the distance between the N+1 edges relative to the origin is the following expression:, r1 is the inner diameter of the N-polygon coil; i=1, 2, 3…N+1; Step=S / N, S is the sum of the line width and the line spacing of the N-polygon coil; linear relationship formulas corresponding to the regions where N edges are located are listed respectively, the intersection coordinates of two adjacent edges are solved as a vertex coordinate of the N-polygon, other vertex coordinates are obtained in this way, and the single-turn coil of the spiral inductor is drawn.

The invention provides a three-dimensional integrated low-temperature co-fired ferrite differential band-pass filter, which is applied to the fields of radio frequency front-end modules, satellite communication, radar systems and the like, adopts a differential filter form in a symmetrical circuit form, and adopts a low-temperature co-fired ferrite LTCF process to process both capacitors and inductors. The inductor adopts a multilayer spiral inductor structure design, the capacitor adopts a multilayer laminated tile type capacitor structure design, the characteristics of the inductor are embedded into the dielectric substrate, an external discrete inductor is not needed, the parasitic effect is reduced, and the circuit stability is improved; the ferrite material has natural absorption and inhibition effects on common-mode signals, and the differential circuit design is combined, so that the filter has excellent common-mode noise inhibition capability, and the electromagnetic compatibility performance of a system can be effectively improved.

The invention relates to an intelligent screw capable of monitoring bone mechanical signals in real time. The intelligent screw is composed of one or more passive wireless pressure sensors and a screw with a sensor mounting groove. The passive wireless pressure sensor is composed of a primary loop and a secondary loop which are coupled through an inductor. The primary loop comprises an LRC circuit packaged by Gr-PDMS, and the LRC circuit is composed of a spiral inductor, a snakelike variable resistor and a capacitor which are connected in parallel. As a fracture fixture, the intelligent sensor is mounted on the fracture fixture, mechanical data displayed by the intelligent sensor is transmitted to terminal equipment through a passive signal transmission technology, and a doctor can evaluate fracture healing and mechanical conditions by using the received data, so that the dependence on traditional imaging examination is reduced, and the medical cost is reduced; the medical treatment convenience is improved, and the life quality of patients is improved.

To provide an aerosol generation device, an aerosol generation system, a method of generating an aerosol, a method of manufacturing an aerosol generation device, and an aerosol delivery device.SOLUTION: The aerosol-generating device comprises a device housing, a planar, non-helical inductor coil 21, and a power supply connected to the planar, non-helical inductor coil 21 and configured to supply an oscillating electrical current to the planar, non-helical inductor coil 21.SELECTED DRAWING: Figure 1

Disclosed are a magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips. The interface structure includes a master chip and at least one slave chip, wherein the master chip and all the slave chips are vertically stacked; the slave chip includes a clock receiving module, a data transmitting module, and a data receiving module; the master chip includes a clock transmitting module, a data transmitting module, and a data receiving module. The solution herein makes use of the magnetic coupling relationship between on-chip spiral inductors of different chips in a vertical direction to simultaneously transmit data and clock signals. The communication method herein modulates each bit of digital signal into a differential bi-directional non-return-to-zero pulse train and performs decision and data parsing at the receiving end by a high-speed dynamic comparator.

Spiral inductors, magnetic field sensors incorporating the spiral inductors, and methods of using the magnetic field sensors are provided. The spiral inductors include an electrically conductive spiral coil and a nitrogen vacancy (NV) diamond substrate. A thin barrier layer of a dielectric material separates the spiral coil from the surface of the NV diamond substrate and an overlayer of dielectric material is disposed over the spiral nanocoil. The integration of the spiral coil with an NV substrate in this manner creates a highly enhanced magnetic transduction and produces a simple, high-performance way to control and read out electromagnetic signals. Because the spiral inductors enable electromagnetic-to-optical signal conversion, they can be used as sensors for environmental or biomedical applications and spin-based computation.

The invention discloses an adjustable common mode rejection filter based on three-dimensional integration, which comprises a top dielectric RDL layer, a silicon substrate and a bottom dielectric RDL layer which are sequentially arranged from top to bottom, and is characterized in that a symmetrical spiral inductor L1, a symmetrical spiral inductor L2, a symmetrical spiral inductor L3, a symmetrical spiral inductor L4, a symmetrical spiral inductor L5 and a symmetrical spiral inductor L6 are arranged in the top dielectric RDL layer; a TSV capacitor C1, a TSV capacitor C2, a TSV capacitor C3 and a TSV capacitor C4 are arranged in the silicon substrate; and a symmetrical spiral inductor L7, a symmetrical spiral inductor L8 and an RDL inductor L9 are arranged in the bottom dielectric RDL layer. The invention further discloses a design method of the adjustable common-mode rejection filter based on three-dimensional integration. The filter can achieve high-gain and adjustable-bandwidth common-mode noise rejection at the same time.

The application discloses a high-inductance value heterogeneous three-dimensional spiral inductor based on a silicon adapter plate process and belongs to the technical field of radio frequency micro systems. The method integrates multiple planar double spiral patches on the basis of an original three-dimensional integrated inductor, so that the frequency range coverage basically reaches 0-3GHz, and the inductance value can reach 18.5nH. Compared with a traditional three-dimensional integrated inductor design, the method of the application makes the upper and lower layers of the planar double spiral patch staggered and interconnected, reduces the volume of an off-chip spiral inductor used in a traditional power amplifier application while realizing large inductance, and realizes higher inductance inductance value on a single-layer silicon substrate.

The application discloses a glass substrate-based heterogeneous integrated power amplifier and a preparation method thereof. The power amplifier comprises a passivation layer, a metal coil layer, a chip, a glass substrate, a TGV array and a heat dissipation ground layer. The metal coil layer is arranged on the front surface of the glass substrate and comprises an octagonal spiral inductor and an MIM capacitor. The passivation layer covers the surface of the octagonal spiral inductor. The heat dissipation ground layer is arranged on the back surface of the glass substrate. The TGV array is connected with the heat dissipation ground layer on the back surface through the glass substrate on the front surface. The chip is a GaAs tube core or a GaN tube core. The chip is electrically interconnected with the metal coil layer (gate and drain) and the heat dissipation ground layer (source) through gold wires of a bonding layer.

This invention relates to an interleaved silicon-based three-dimensional spiral inductor and bandpass and lowpass filters. The interleaved silicon-based three-dimensional spiral inductor includes, from top to bottom, a first inductor metal layer, a first silicon dioxide dielectric layer, an inductor silicon dielectric layer, a second silicon dioxide dielectric layer, and a second inductor metal layer. The first inductor metal layer and the second inductor metal layer each have an interleaved arrangement of several inductor metal sheets. The number of inductor metal sheets on the first and second inductor metal layers is the same, and each inductor metal sheet on the first and second inductor metal layers is connected to the other in a corresponding manner by several first metal conductor pillars. This invention reduces the area of ​​the three-dimensional spiral inductor by using an interleaved arrangement of the inductor metal sheets, achieving higher inductance density on a single-layer silicon substrate, and also simplifies the fabrication process.

The present disclosure provides a hybrid filter, a preparation method thereof, and a filtering apparatus. The hybrid filter includes a first substrate (100) and a second substrate (200) disposed oppositely, a first space (300) is disposed between the first substrate (100) and the second substrate (200), at least one of the first substrate (100) and the second substrate (200) is provided with a film bulk acoustic resonator (30), at least one of the first substrate (100) and the second substrate (200) is provided with at least one passive filter (40), the film bulk acoustic resonator (30) is disposed in the first space (300) and is connected with the passive filter (40), the passive filter (40) includes a filtering inductor and a filtering capacitor, and the filtering inductor has a three-dimensional spiral inductor structure.

The present application relates to an inductor component and an inductor component mounting substrate. A component main body (40) of an inductor component (30) has a mounting surface (41) and a top surface (42). A spiral inductor wiring (50) that advances in the direction of extension of a winding central axis is provided inside the component main body. A first external electrode (60) is connected to a first end of the inductor wiring (50). A second external electrode (70) is connected to a second end of the inductor wiring (50). The component main body has a first inclined surface (45) that is connected to a first end of a first side in the length direction of the mounting surface (41) and that is inclined in such a way that the farther from the first end, the closer to the top surface (42) side. The component main body (40) has a second inclined surface (46) that is connected to a second end of a second side in the length direction of the mounting surface (41) and that is inclined in such a way that the farther from the second end, the closer to the top surface (42) side. The winding central axis extends in a direction that is parallel to the mounting surface (41) and perpendicular to the length direction.

The embodiment of the invention provides a memory, a storage device and electronic equipment, relates to the technical field of memories, and improves the bandwidth of the memory. According to the specific scheme, the interface circuit comprises a clock input end and a plurality of cascaded amplification modules, the clock input end is coupled with the input end of the first-stage amplification module in the multiple cascaded amplification modules, the output end of the last-stage amplification module in the multiple cascaded amplification modules is coupled with a clock circuit, and the clock circuit is coupled with a storage unit array. The clock input end is used for receiving a clock signal. The first amplification module in the plurality of cascaded amplification modules comprises a power supply end, a first TSV spiral inductor and a first differential amplification circuit. The embodiment of the invention is used for the process of receiving the clock signal by the memory.

The application discloses a beam steering unit, a beam steering controller and an antenna system. The beam steering unit comprises: a first metal layer comprising a first base, four first spiral inductors arranged on the first base, any two adjacent first spiral inductors being mutually symmetrical, and two end-adjacent first spiral inductors being connected; a second metal layer comprising a second base, four second spiral inductors arranged on the second base, the four second spiral inductors being arranged in a central symmetry and the ends of each second spiral inductor being connected at a central point of the second base; and a third metal layer comprising a third base, four third spiral inductors arranged on the third base, any two adjacent third spiral inductors being mutually symmetrical, and two end-adjacent third spiral inductors being connected. The application can effectively reduce the deployment cost of the antenna system and improve the aperture efficiency of the antenna system.

The application discloses a spiral inductor assembly and a control method thereof, and relates to the technical field of inductors. The spiral inductor assembly comprises an inductor coil, a fixing assembly and a driving and adjusting assembly. The inductor coil is in a conical spiral structure, has a top end and a bottom end, and is configured as an air-core inductor structure. The fixing assembly is used for fixing the bottom end of the inductor coil. The driving and adjusting assembly is connected with the top end of the inductor coil and is configured to drive the top end of the inductor coil to move along an axial direction so as to change the pitch of the inductor coil. Based on the technical scheme disclosed by the application, the requirement of dynamic change of inductance values of different circuits under various working conditions can be met, the applicability and flexibility of the inductor assembly are greatly improved, the magnetic hysteresis loss and the eddy current loss can be effectively reduced, the occurrence of magnetic saturation can be avoided, and the quality factor can be improved.

Embodiments of the present application relate to the technical field of semiconductors, and disclose an electronic device, and a semiconductor device and a manufacturing method therefor, used for solving the problem that a radio frequency signal easily leaks to the control end of a heater when a phase change switch of a glass substrate is turned off. The semiconductor device comprises a glass substrate having a first surface and a second surface that are opposite to each other, a phase change switch module, and a spiral inductor. The phase change switch module comprises a heater and a phase change switch that are sequentially stacked on the first surface. The spiral inductor comprises a plurality of through glass vias (TGVs), a plurality of first metal interconnection lines that are distributed at intervals on the first surface, and at least one second metal interconnection line on the second surface. The plurality of first metal interconnection lines and a plurality of second metal interconnection lines are staggered to connect two adjacent TGVs among the plurality of TGVs. One first metal interconnection line connects a TGV located at one side end to the heater, and another first metal interconnection line is used for connecting a TGV located at the other side end to a heating control circuit.

This invention discloses a high-gain, miniaturized millimeter-wave low-noise amplifier. It includes an input matching network, a noise level circuit, a gain stage circuit, and an output matching network. The low-noise amplifier uses a series gate inductor for noise matching and wide-bandwidth input impedance matching. The gain stage employs a slow-wave transmission line feedback mechanism to achieve high gain and wide bandwidth, and miniaturization is achieved through a spiral inductor and a slow-wave transmission line. The output matching network uses an L-shaped matching network. Unlike traditional inductors or transmission lines, this invention uses a slow-wave transmission line for feedback, achieving high gain while also possessing foldable characteristics and allowing the same inductance value to be achieved with a shorter length, thereby reducing chip area and manufacturing costs.

The invention provides a three-dimensional spiral inductor, a preparation method thereof and a semiconductor device, and the method comprises the steps: forming a first bonding structure and a second bonding structure, the first bonding structure comprises a first dielectric layer and a plurality of first interconnection parts located in the first dielectric layer, the second bonding structure comprises a second dielectric layer and a plurality of second interconnection parts located in the second dielectric layer; the medium is bonded with the first medium layer and the second medium layer; forming a first conductive column on the first interconnection part and a second conductive column on the second interconnection part through a silicon through hole technology; a connection portion is formed to connect the first conductive pillar and the second conductive pillar. According to the preparation method of the three-dimensional spiral inductor, the interconnection parts are respectively formed in the two bonding structures, then the two bonding structures are subjected to medium bonding, and the TSV columns connected with the interconnection parts are formed in the bonded structures, so that the three-dimensional spiral inductor with high inductance density and high quality factor is formed in an ultra-thick structure.