77 results about "Spiral inductor" patented technology

The invention relates to the technical field of radio frequency integrated circuits and advanced semiconductor packaging, in particular to a multilayer spiral inductor structure based on an RDL process and a preparation method. The preparation method comprises the steps of seed layer deposition, gradient line width coil formation through photoetching and electroplating, alternate dielectric layer deposition, through hole etching to form vertical interconnection copper columns, air bridge forming through a photoresist sacrificial layer process and silicon nitride passivation packaging. Through fan-shaped topological layout, dielectric material collaborative optimization and three-dimensional interconnection structure design, the self-resonant frequency bandwidth is effectively improved, conductor and dielectric loss is reduced, and miniaturization integration and high reliability of high-frequency inductance elements are achieved.

Spiral inductors, magnetic field sensors incorporating the spiral inductors, and methods of using the magnetic field sensors are provided. The spiral inductors include an electrically conductive spiral coil and a nitrogen vacancy (NV) diamond substrate. A thin barrier layer of a dielectric material separates the spiral coil from the surface of the NV diamond substrate and an overlayer of dielectric material is disposed over the spiral nanocoil. The integration of the spiral coil with an NV substrate in this manner creates a highly enhanced magnetic transduction and produces a simple, high-performance way to control and read out electromagnetic signals. Because the spiral inductors enable electromagnetic-to-optical signal conversion, they can be used as sensors for environmental or biomedical applications and spin-based computation.

The invention relates to the technical field of semiconductors, and discloses an axial three-dimensional spiral inductor based on a glass substrate and a manufacturing method thereof.The axial vertical spiral inductor comprises an upper surface layer, the glass substrate and a lower surface layer, and the upper surface layer comprises a plurality of first metal connecting wires; the lower surface layer comprises a plurality of second metal connecting wires and a plurality of third metal connecting wires, the glass substrate comprises a first glass through hole group and a second glass through hole group, and the first metal connecting wires and the second metal connecting wires are connected through the first glass through hole group or the second glass through hole group; the third metal connecting lines are located below the second metal connecting lines, the third metal connecting lines are parallel to the second metal connecting lines, one sides of the third metal connecting lines are electrically connected with the adjacent second metal connecting lines, and the other sides of the third metal connecting lines are grounded; the distance between the third metal connecting line and the adjacent second metal connecting line is larger than 20 microns. According to the technical scheme, the quality factor of the spiral inductor can be improved.

The invention discloses a broadband high-isolation on-chip small-size power divider applied to 5G, and the power divider comprises two branches, and the first branch and the second branch are respectively provided with a series capacitor, an on-chip grounding spiral inductor, a transmission line, an isolation capacitor, an isolation inductor and an isolation resistor. The isolation capacitor, the isolation inductor and the isolation resistor are electrically connected between the first branch circuit and the second branch circuit, and the transmission line is less than a quarter wavelength. The spiral inductors on the ground lugs connected in parallel are used for improving even mode matching of the power divider, and the isolation capacitors and the isolation resistors are used for improving odd mode matching of the power divider. By adopting the transmission line with the wavelength smaller than 1 / 4, the power divider provided by the invention effectively reduces the circuit size and can realize two-path power synthesis. The technical problem that a power divider in the prior art is difficult to adapt to the high integration level of a 5G radio frequency system can be solved, and the provided power divider also has the characteristics of wide band and high isolation.

A wireless passive resonance sensor and contact lens for intraocular pressure monitoring comprises a contact lens body which is used for packaging a sensor assembly and serves as a substrate of the sensor. The first spiral inductor is arranged in the contact lens body; the middle elastic dielectric layer covers the first spiral inductor and is used for forming a deformable dielectric medium; the second spiral inductor is arranged on the middle-layer elastic dielectric layer, is opposite to the first spiral inductor and forms an inductor assembly with the first spiral inductor; wherein the first spiral inductor, the middle elastic dielectric layer and the second spiral inductor jointly form a capacitor and equivalently form a serial L-C-L resonant circuit, and the change of intraocular pressure is responded through the change of resonant frequency of the resonant circuit, so that passive wireless monitoring is realized. The design optimizes the preparation process, reduces the cost, improves the signal stability, is suitable for 24-hour continuous monitoring, and provides a powerful tool for early diagnosis and intervention of glaucoma.

The invention discloses a method and system for generating a variable non-regular polygon spiral inductor, and belongs to the field of integrated circuit radio frequency inductor layout drawing. The generation method comprises the following steps: setting parameter values of the variable non-regular polygon spiral inductor structure; in one circle of the variable non-regular polygon spiral inductor structure, calculating the coordinates of each vertex according to the parameter values; calculating the coil width of each circle and the inductance inner diameter of each circle of the variable non-regular polygon spiral inductance structure, and calculating all vertex coordinates of the whole variable non-regular polygon spiral inductance structure based on the vertex coordinates of one circle of the variable non-regular polygon spiral inductance structure; and drawing the variable non-regular polygonal spiral inductor structure according to all the obtained vertex coordinates. The shape of the spiral inductor can be easily changed by adjusting the expansion and contraction rate of the spiral inductor, so that the spiral inductor can adapt to any rectangular area, the utilization rate of the layout area can be fully utilized, and great convenience is brought to layout work.

The invention discloses a circle temperature detection system. Comprising a plurality of LC passive temperature sensors and a reading unit, the LC passive temperature sensor comprises a spiral inductor LS and a sensing capacitor CS which are connected in series; the reading unit comprises a reading inductor L0 and an impedance analyzer; when the temperature of the surface of the wafer where the LC passive temperature sensor is located changes, capacitance and resistance of the sensor can change, so that impedance of the sensor changes, and an impedance analyzer obtains the surface temperature of the wafer by remotely monitoring and analyzing real part values of a resonant frequency value and a maximum impedance value; the precision is higher, the response time is shorter, the compatibility with the integrated circuit manufacturing technology is higher, the power consumption is lower, and the size is smaller; the wafer temperature measurement system adopts a wireless mode, and no cable or lead needs to be connected to the surface of the wafer, so that the reliability and flexibility of temperature measurement are improved.

The invention provides a heterogeneous integrated filter structure with transient voltage protection and a manufacturing method, the filter structure comprises an insulating substrate, the upper surface of the insulating substrate is provided with a mounting groove, and a semiconductor chip with a transient voltage protection function is arranged in the mounting groove. A double-layer spiral inductor is arranged on the upper surface of the insulating substrate and comprises a first plane inductance coil and a second plane inductance coil which are arranged in a stacked mode, and a first passivation layer is arranged between the semiconductor chip and the first plane inductance coil. A first passivation layer is arranged between the first planar inductance coil and the second planar inductance coil, a second passivation layer is arranged between the first planar inductance coil and the second planar inductance coil, a third passivation layer is arranged on the upper surface of the second planar inductance coil, the first passivation layer and the second passivation layer are both provided with through holes used for electrically connecting an upper layer and a lower layer, and filter pins are arranged on the third passivation layer. And the filter pin is electrically connected with the second planar inductance coil. The differential mode bandwidth index of the filter can be improved.

The invention provides a Class C inductance-capacitance voltage-controlled oscillator with a wide tuning range, which belongs to the technical field of voltage-controlled oscillators and is composed of an LC resonance circuit and a negative resistance area circuit which are connected in parallel. The LC resonant circuit comprises an on-chip symmetrical spiral inductor, a switched capacitor array, a first variable capacitance tube CV1 and a second variable capacitance tube CV2; the negative resistance area circuit comprises a tail current tube M, a first filter capacitor C1, a second filter capacitor C2, a first cross coupling triode Q0, a second cross coupling triode Q1, a first resistor R0, a second resistor R1, a first filter inductor L3 and a second filter inductor L4; the negative resistance area circuit is connected with the LC resonance circuit; through the switched capacitor array and the two variable capacitance tubes which are matched with each other, the wide tuning range frequency output is realized, and through improving the structure of the switched capacitor array, the anti-interference performance is enhanced, and the phase noise is optimized at the same time.

The invention discloses a miniaturized filtering power divider loaded with a novel isolation network, and particularly relates to the technical field of wireless microwaves, and the miniaturized filtering power divider comprises spiral inductors, chip capacitors, ports, a reference metal ground, a dielectric substrate, isolation resistors, metal through holes and gold wire connecting wires, a signal path of the filtering power divider is arranged between the first port and the second port, between the first port and the third port, and between the second port and the third port. And a novel isolation network is adopted, so that the isolation degree between the second port and the third port becomes higher. The filter has the advantages of being small in size, easy to integrate, good in isolation and the like, a passband of the filter is a broadband, three transmission poles exist in the passband, an upper stop band of the filter has a transmission zero point, a lower stop band of the filter has a transmission zero point, and the filter has the characteristics of filtering and power dividing at the same time.

This invention discloses a miniaturized, wide-stopband low-pass filter design method, covering 3D model design, simulation optimization, circuit fabrication and testing, and design verification based on dielectric integrated suspension line technology. The core of the low-pass filter design is based on dielectric integrated suspension line technology. Furthermore, the core circuit of this filter employs three layers of surface-mount capacitors and a double-layer spiral inductor to reduce circuit size, while combining a honeycomb structure to extend the stopband. Compared to traditional circuit designs, the implemented filter exhibits self-encapsulation characteristics, achieving low insertion loss and an ultra-wide stopband range, providing an important basis for filter performance optimization.

The invention provides a pattern generation method of a spiral inductor manufactured by a semiconductor process, which comprises the following steps of: setting the number of turns of a coil of the spiral inductor to be M, and setting the shape of a single-turn coil to be an N-sided polygon; the center of an N-polygon where an inner ring is located serves as an X-axis and Y-axis coordinate center original point, N areas are correspondingly divided, the first area is provided with a starting point edge and an ending point edge which are parallel to an X axis or a Y axis, and the other N-1 areas correspond to one edge of the N-polygon respectively, the difference between the distance between the starting point edge and the ending point edge and the distance between the starting point edge and the original point is S, the distance between the N + 1 sides and the original point is the following expression: r1 is the inner diameter of the N-sided coil; i = 1, 2, 3... N + 1; step is equal to S / N, and S is the sum of the line width and the line distance of the N-polygon coil; and respectively listing linear relational expressions corresponding to the areas where the N edges are located, solving an intersection point coordinate of two adjacent edges as a vertex coordinate of the N-polygon, obtaining other vertex coordinates in this way, and drawing a single-turn coil of the spiral inductor.

The invention relates to a spiral inductor integrated in an electronic assembly and an antenna. An electronic assembly having an integrated spiral inductor is disclosed. The electronic assembly includes a substrate having a through hole disposed along a side edge of the substrate. A wire of the spiral inductor is spirally wound around the side edge for several turns through the through hole. A magnetic core may be included in the spiral inductor to increase inductance. The electronic assembly may have an additional substrate, and the spiral inductor spirals around a side edge of the substrate through a through-hole of the substrate.

The present disclosure relates to an inductor assembly, an impedance matching network, and a system including the inductor assembly. An inductor assembly (100) includes: a fixed element (102) having a central core (104) and a support structure (106) coupled to and projecting outwardly from the central core, each of the support structures having an outer edge (108) having a notched profile with a recess (110) extending toward the central core; and a spiral inductor (112) having a plurality of turns located in the recesses of the at least two support structures. The support structures are spaced equidistantly from each other around the central core by air gaps (308). The inductor assembly can be incorporated into an impedance matching network (1100), and one or more impedance matching networks can be incorporated into a defrost system (100). The impedance matching network can be a single-ended network (1100) or a double-ended network (1300).

The invention relates to a radio frequency spiral inductor scalable model construction method and device based on a neural network, and the method comprises the steps: obtaining the physical size parameters of different spiral inductors; establishing a pi-type equivalent circuit model for each spiral inductor, and obtaining parameters of each element in the pi-type equivalent circuit model; taking the physical size parameter of each spiral inductor and the parameter of each element in the corresponding pi-type equivalent circuit model as a group of data to form a data set, and dividing the data set into a training set and a test set; constructing a neural network model, and training the neural network model by adopting the training set to obtain a relational expression between the physical size parameters of the spiral inductor and the parameters of each element in the pi-type equivalent circuit model; and testing the obtained relational expression by adopting a test set, and substituting the obtained relational expression into the model file after the test is passed, so as to obtain the radio frequency spiral inductor scalable model. According to the method, the parameter acquisition difficulty of the lumped element can be reduced, and the device simulation efficiency is improved.

The present invention discloses a common-mode noise suppression filter based on three-dimensional integration technology, which includes seven top RDL spiral inductors, and four TSV capacitors are connected below the seven top RDL spiral inductors. The present invention can achieve the basic performance of common-mode noise while having a compact overall structure and high integration.

A metal magnetic flexible composite inductor conductor and a preparation method thereof; the preparation method of the metal magnetic flexible composite inductor conductor comprises the following steps: S1: taking metal and magnetic material; the magnetic induction intensity of the magnetic material is greater than or equal to 1.6 T; S2: continuously attaching the metal to the magnetic material to obtain a conductive and magnetically conductive composite conductor; S3: cutting the conductive and magnetically conductive composite conductor by using a femtosecond laser processing technology to obtain a spiral flexible composite inductor conductor. The flexible composite inductor conductor prepared by the scheme can obtain a larger self-inductance value under the same size, can effectively suppress leakage magnetic flux, reduce leakage magnetic coupling to the outside world and electromagnetic interference, and can realize a more compact spiral inductor layout by reducing the number of turns or reducing the coil geometric size, thereby solving the problem that high inductance density and low power consumption cannot be simultaneously achieved in the traditional inductor conductor.

The invention discloses a terahertz single-photon detection unit and an array type detection device, the terahertz single-photon detection unit comprises a resonator, a superconductive tunnel junction and a terahertz photon absorber, and the resonator and the terahertz photon absorber are connected through a gate capacitor and the superconductive tunnel junction; the resonator comprises a circular spiral inductor and an interdigital capacitor, and a circular spiral inductor connecting part is led out from the extension position of the outer periphery of the circular spiral inductor and connected with the top of the interdigital capacitor. According to the invention, a circular spiral inductor structure is adopted, the quality factor of the resonator is effectively improved, and the sensitivity of a detector to signals causing phase shift is enhanced. The array type detection device comprises a plurality of detection units with different resonant frequencies, signals of the detection units are coupled to a central feeder line, and a reading system is simple. According to the terahertz array type detection device disclosed by the invention, terahertz detection in a wide frequency band range can be realized; the detection sensitivity is extremely high, and terahertz single photons can be detected and counted.

The invention discloses a multi-transmission-zero-point on-chip band-pass filter using a cross mutual winding transformer, and aims to solve the technical problems of high frequency selectivity and out-of-band rejection of an existing on-chip band-pass filter. A cross-wound transformer in the on-chip band-pass filter is located between a first port and a second port, the cross-wound transformer is composed of a pair of cross-wound spiral inductors, one center tap of the cross-wound transformer is connected with a first capacitor and a second capacitor, and the other center tap of the cross-wound transformer is connected with a second capacitor. The other center tap of the cross mutual winding transformer is connected with a third capacitor and a fourth capacitor; the first spiral inductor and the second spiral inductor which are parallel are located on the left side of the cross-winding transformer, and the fourth spiral inductor and the fifth spiral inductor which are parallel are located on the right side of the cross-winding transformer. Coupling capacitance is generated through electric coupling in the cross mutual winding transformer, the transmission zero point of the filter is increased under the condition that no extra circuit element is added, miniaturization is achieved, and the out-of-band rejection performance is enhanced.

A three-dimensional spiral inductor, its fabrication method, and an electronic device are disclosed. The three-dimensional spiral inductor, from bottom to top, comprises: a substrate; a first nitride dielectric layer, in which a first conductive layer is formed; a first oxide dielectric layer, in which a second conductive layer is formed; a second nitride dielectric layer, in which a third conductive layer is formed; and further comprises a first metal passivation layer and / or a second metal passivation layer, wherein the first conductive layer is located on the first metal passivation layer, and the second metal passivation layer is located on the second conductive layer. This invention forms a stacked structure of a first nitride dielectric layer, a first oxide dielectric layer, and a second nitride dielectric layer, and simultaneously forms a first metal passivation layer and / or a second metal passivation layer, which can better protect the first, second, and third conductive layers, effectively prevent device aging, thereby significantly reducing line losses and extending service life.

The invention discloses a wave beam regulation and control unit, a wave beam regulator and an antenna system, and the wave beam regulation and control unit comprises a first metal layer which comprises a first pedestal, the first pedestal is provided with four first spiral inductors, any two adjacent first spiral inductors are mutually symmetrical, and two adjacent first spiral inductors at the tail ends are connected; the second metal layer comprises a second base, four second spiral inductors are arranged on the second base, the four second spiral inductors are arranged in a central symmetry mode, and the tail ends of the second spiral inductors are connected at the central point of the second base; the third metal layer comprises a third base, four third spiral inductors are arranged on the third base, any two adjacent third spiral inductors are symmetrical to each other, and two adjacent third spiral inductors at the tail ends are connected. The deployment cost of the antenna system can be effectively reduced, and the aperture efficiency of the antenna system is improved.

A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.

The spiral inductor comprises a substrate, a groove is formed in the substrate, and the projection of the groove on the plane where the substrate is located is in a spiral shape; the seed layer is formed in the groove; and the inductor body comprises an inductor root part embedded into the groove and an inductor end part exposed on the surface of the substrate. According to the spiral inductor, the adhesive force between the inductor metal electrode and the substrate is enhanced, and the damp and hot load capacity of a product is improved.

The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: providing a substrate which comprises a capacitor region and an inductor region which are adjacent to each other; forming a plurality of layers of capacitance plates stacked from bottom to top on the substrate of the capacitance region and a dielectric layer located between two adjacent layers of capacitance plates; multiple layers of inductance coils stacked from bottom to top and dielectric layers located between every two adjacent layers of inductance coils are formed on the substrate of the inductance area, every two adjacent layers of inductance coils are electrically connected to form a spiral inductor, the inductance coils correspond to the capacitance plates one to one, and the inductance coils and the capacitance plates which are in one-to-one correspondence are located on the same layer; wherein one end of the spiral inductor is electrically connected with any layer of capacitor plate. According to the invention, the power supply circuit can obtain relatively high inductance while having relatively high capacitance, so that the performance of the power supply circuit is improved.

The invention discloses a mixed lumped distributed five-order band-pass filter based on an LTCC technology. The mixed lumped distributed five-order band-pass filter comprises a ceramic substrate and an electrode located at the bottom of the ceramic substrate. The electrodes are periodically arranged and comprise an input electrode, an output electrode and a grounding electrode; a traditional five-order Chebyshev band-pass filter structure is adopted in the ceramic substrate, and the ceramic substrate comprises a first parallel resonator, a first series resonator, a second parallel resonator, a second series resonator and a third parallel resonator. On the basis, two cross coupling inductors L13 and L35 and three cross coupling capacitors C13, C35 and C15 are introduced, the number of transmission zero points of the band-pass filter is increased, the selectivity of the band-pass filter is greatly improved, and out-of-band rejection is deepened. The problems that a traditional LTCC multi-layer spiral inductor is large in occupied space, complex in design and debugging and high in manufacturing process requirement are solved.

This invention discloses a method, system, and terminal device for reverse engineering on-chip RF spiral inductors, relating to the field of RF integrated circuit auxiliary design technology. The invention includes: constructing an inductor database containing the mapping relationship between geometric structural parameters and S-parameters; building a forward surrogate model based on the Transformer architecture, introducing reciprocity and passive physical constraint loss functions, and training the model using a low-frequency weighting strategy to establish a high-precision mapping from geometric parameters to S-parameters; constructing a cascaded reverse neural network, using the fixed-parameter forward surrogate model to calculate the reconstruction error to update the reverse network weights; and in the design phase, employing a hybrid optimization strategy coupling differential evolution algorithm and the forward surrogate model, using the output of the reverse network as the initial population, searching in the global space for geometric parameters that satisfy the target inductance value and quality factor. This invention solves the problems of long simulation time in traditional inductor design and the existence of multi-value mapping and poor physical consistency in reverse engineering.

The embodiment of the present invention provides a multilayer filter. By introducing open-circuit branches, N resonant units can generate more than N-2 zero points, and the out-of-band suppression is good. By adjusting the (electrical) length of the open-circuit branches, the position of the zero point can be flexibly controlled. Within the feasible range, the longer the line length, the weaker the low-end capacitive zero point (far away from the passband), the stronger the high-end inductive zero point (close to the passband), and vice versa. Through the connecting lines between the three-dimensional spiral inductors, on the one hand, strong coupling is achieved, and on the other hand, the difficulty of process implementation is reduced and the qualified rate of finished products is improved.

The present invention discloses a broadband multifunctional reconfigurable electromagnetic metasurface, which includes a polarization twist layer, a resistance loss layer, and a reconfigurable frequency selection layer; by loading a spiral inductor, the construction of a wide stopband in the mid-frequency band can be realized, and the lower floor is replaced with a reconfigurable gradient trapezoidal frequency selection surface. The switching of the transmission and reflection in the mid-frequency band can be realized by the switch of the PIN tube. On this basis, the equivalent circuit characterization and multi-parameter collaborative design method are used to adjust the interlayer height to realize the construction of the high-frequency stopband; the introduction of the polarization twist layer can realize the high-frequency polarization twist function, and the polarization phase cancellation can be used to realize the diffuse scattering function. The present invention can expand the adaptability and survivability of the application scenarios of traditional electromagnetic equipment, and has important academic value and application prospects in the fields of information security, anti-electromagnetic interference, radar antenna cover, electromagnetic information and system confrontation.

This invention discloses a design method for a three-dimensional passive lumped low-pass filter based on TSV (Through-Spirit Transformer). The method includes: determining the electrical parameters of each filter element in the passive lumped low-pass filter based on the performance indicators and selection results of the low-pass filter, and constructing the circuit structure diagram of the low-pass filter; determining the process parameters of the TSV three-dimensional integrated inductor using a computational model of a three-dimensional integrated spiral inductor; determining the process parameters of the coaxial TSV capacitor using a computational model of a coaxial TSV capacitor; and performing simulations based on the process parameters of the TSV three-dimensional integrated inductor and the coaxial TSV capacitor to complete the design of the three-dimensional passive lumped low-pass filter. The low-pass filter designed in this invention uses TSV technology to design a three-dimensional integrated spiral inductor and a coaxial TSV capacitor, resulting in good compatibility with integrated circuit processes and ease of three-dimensional integration. Furthermore, the use of a three-dimensional spiral inductor and coaxial TSV capacitor design significantly reduces the area of ​​the inductor and capacitor, facilitating integration and miniaturization.