374 results about "Spiral inductor" patented technology

An implantable miniaturized pressure sensor integrates a capacitor and an inductor in one small chip, forming a resonant LC circuit having a Q value of 10 or greater. The capacitor has an upper capacitor plate and a lower capacitor plate disposed proximate thereof. The upper and lower capacitor plates are connected to one or more spiral inductor coils. The sensor is micromachined from silicon to form a thin and robust membrane disposed on top of the upper capacitor plate. The sensor is hermetically sealed and the membrane is deflected relative to the upper capacitor plate by an external fluid, gas, or mechanical pressure. The resonant frequency of the sensor can be remotely monitored and continuously measured with an external detector pick up coil disposed proximate the sensor. The sensor can be smaller than 2×2×0.5 mm and is particularly useful for intraocular applications.

A fully integrated, programmable mixed-signal transceiver comprising a radio frequency integrated circuit (RFIC) which is frequency and protocol agnostic with digital inputs and outputs, the transceiver being programmable and configurable for multiple radio frequency bands and standards and being capable of connecting to many networks and service providers. The RFIC does not use spiral inductors and instead includes transmission line inductors allowing for improved scalability. Components of the transceiver are programmable to allow the transceiver to switch between different frequency bands of operating. Frequency switching can be accomplished though the content of digital registers coupled to the components.

A filter for use in a coaxial cable network includes a printed circuit board having first and second opposed major surfaces, and first and second opposing sides. The opposed major surfaces are substantially parallel to a single plane, and are bisected by a longitudinal axis. The first and second opposing sides are substantially parallel to the longitudinal axis. The filter further includes an input terminal and an output terminal connected to the printed circuit board. The input terminal and the output terminal have an axis extending substantially parallel to the longitudinal axis. A signal path is disposed on the printed circuit board and extends from the input terminal toward the output terminal. The filter further includes a plurality of resonator elements fabricated upon the first opposed major surface. In one embodiment, the inductor elements are arranged in series along the signal path defining a footprint of less than 540 square millimeters. The filter passes a first range of frequencies in a provider bandwidth and attenuates a second range of frequencies in a personal data network bandwidth. In one embodiment, the resonator elements are parallel inductor elements and capacitor elements, the inductor elements being etched spiral inductors.

An integrated circuit inductor includes a spiral pattern disposed upon a substrate. The track of the spiral is divided into multiple tracks to form a multi-track inductor. The individual tracks are disposed side by side and in different layers. Tracks that are aligned vertically are coupled by feed throughs, or vias. Multiple vias are used along the length of each of the multiple tracks. Tracks disposed in the same layer are joined together at their beginning, and at their termination. A patterned shield is fabricated from conductive fingers of n+ salicided material that is separated by non conducting polysilicon that fills the gaps between the fingers. The conductive fingers are coupled together in groups, which are in turn tied to a single point ground. In tying the groups together, a gap in the conducting path is provided to prevent ground loop currents. The shield is disposed between the multi-track inductor and the substrate.

An integrated circuit (IC), IC assembly and circuit for distributing a clock signal in an integrated circuit includes a capacitive clock distribution circuit having at least one conductor therein. At least one inductor is formed in a metal layer of the integrated circuit and is coupled to the clock distribution circuit. The inductor, generally in the form of a number of spiral inductors distributed throughout the integrated circuit, provides an inductance value selected to resonate with the capacitive clock distribution circuit at resonance, power dissipation is reduced while skew and jitter performance can be improved.

A printed circuit board (PCB) having a three-dimensional spiral inductor, which includes a plurality of insulating layers and conductor layers. The PCB comprises a plurality of coil conductor patterns made of conductive material and shaped into strips, which is provided on the plurality of conductor layers, respectively, such that the plurality of coil conductor patterns are parallel to each other and positioned on the same plane perpendicular to the conductor layers, and in which each of the plurality of coil conductor patterns is longer than an adjacent inner coil conductor pattern.

A first semiconductor device includes a first conductive layer, a second conductive layer located above or below the first conductive layer, and an insulating layer interposed between the first conductive layer and the second conductive layer, a spiral inductor having a spiral pattern that is formed in the first conductive layer, and an electromagnetic wave shield formed in a plane shape in the second conductive layer. The electromagnetic wave shield is grounded or connected to a constant voltage source and is located above or below the spiral inductor. Furthermore the first semiconductor device includes an opening formed in the electromagnetic wave shield. The opening is located in a region corresponding to a region above or below a central region of the spiral pattern of the spiral inductor. A second semiconductor device includes a first conductive layer, a second conductive layer located above or below the first conductive layer, an insulating layer interposed between the first conductive layer and the second conductive layer, a spiral inductor having a spiral pattern that is formed in the first conductive layer, and an electromagnetic wave shield formed in a plane shape in the second conductive layer. The electromagnetic wave shield is grounded or connected to a constant voltage source and is located above or below the spiral inductor. Furthermore the second semiconductor includes a slit formed in the electromagnetic wave shield. The slit extends from a position of the electromagnetic wave shield, the position corresponding to a region above or below a center of the spiral inductor, to a peripheral direction of the electromagnetic wave shield.

A circuit for distributing a clock signal in an integrated circuit includes a capacitive clock distribution circuit having at least conductor therein. At least one inductor is formed in a metal layer of the integrated circuit and is coupled to the clock distribution circuit. The inductor, generally in the form of a number of spiral inductors distributed throughout the integrated circuit, provides an inductance value selected to resonate with the capacitive clock distribution circuit. By operating the clock distribution circuit at resonance, power dissipation is reduced while skew and jitter performance can be improved.

Systems, apparatus, and methods for treating a patient's tissue via electric energy delivered concurrently from a first electrode of a first handpiece and a second electrode of a second handpiece. Each of the first and second handpieces may have the same or similar structure and may be separately manipulable to different locations on the patient's skin to allow the rapid treatment of target tissue(s) at various regions of the patient's body. The first and second handpieces may each be coupled to an electrosurgical generator configured for providing first and second AC voltages of equal magnitude and opposite polarity to the first and second electrodes, respectively. The first and second electrodes may each comprise a spiral inductor.

An integrated semiconducting device comprises a semiconducting substrate, a plurality of grounding strips disposed above the substrate in a lower metal level of the semiconducting device, an inductor positioned in an upper metal level of the semiconducting device, and a plurality of conducting vias connected to and extending away from the grounding strips towards the inductor. The inductor, conducting via, ground strips structure forms a Faraday cage that acts as a shield against electromagnetic radiation. The number and placement of the conductive vias are adjustable and can be optimized based on the relative importance of maximizing the quality factor Q of the inductor or minimizing the capacitance between the inductor and ground.

The present invention realizes a miniaturized electronic device that is still capable of maintaining its high reliability even when miniaturized. To this end, the electronic device has an electronic circuit, comprising: a substrate with a circuit formation surface on which one part of the electronic circuit is formed; a polyimide layer that is formed on the circuit formation surface; and a spiral inductor constituting another part of the electronic circuit, which is formed into a pattern on the polyimide layer.

A spiral inductor comprising: a substrate; a protruding portion which is formed on the top face of the substrate and the top of which serves as a dummy element for controlling a chemical mechanical polishing process; and a conductive layer which is formed on the substrate so as to have a spiral shape and which serves as an induction element, wherein the protruding portion is formed in a region other than a region directly below the conductive layer.

A lamination of metal wire layers forms an electromagnetic isolation structure. The metal wire layers are connected with each other by vias, so that a metal fence having a laminated structure is formed. The metal fence is provided so as to surround an element (e.g. a spiral inductor) that generates an electromagnetic field in an integrated circuit. The metal wire satisfies d≦λ/8, WF≧5δ, and L≦λ/20, where δ is a skin depth of an electromagnetic wave, c is a velocity of light, f is an operating frequency of the integrated circuit, d is a lateral-direction size of a metal-fence region, WF is a surrounding-line width of the metal fence, L is an interval between the vias, and λ=c/f is a wavelength of a signal. With this arrangement, it is possible to decrease electromagnetic coupling noises and coupling noises caused via the substrate.

A method for forming a spiral inductor (11) or component of a transformer, compatible with very large scale integrated processing, that achieves a higher Q value without occupying more space by splitting at least one turn (13 51) as two or more crisscrossing or interwoven smaller-width turns (13a 13b 52 53 54 55). The at least one turn (51) may, for example, be split into four turns paired up to provide two pairs of two turns, and the turns of each pair may then be interwoven or crisscrossed, and then the two pairs may also be interwoven or crisscrossed. The splitting of a turn into two or more smaller-width turns results in the current being divided among the smaller-width turns.

A spiral inductor is provided including a substrate and an inductor dielectric layer over the substrate having a spiral opening provided therein. The spiral inductor is in the spiral opening with the spiral inductor including a plurality of parallel spiral vias connected together at center proximate and center distal ends of the spiral inductor.

The invention belongs to the technical field of pressure sensors, particularly relates to a high-temperature pressure sensor and a production method thereof and solves the problem that the existing pressure sensor fails to operate normally in environments of high temperature, moistness and the like due to the insufficiently reasonable design. The high-temperature pressure sensor comprises four layers. A planar square spiral inductor and a capacitor upper electrode are made on the first layer by pasting; a sealed pressure cavity is arranged on the second layer; a capacitor electrode is made on the fourth layer by pasting and is connected with an inner circular core of the top planar square spiral inductor. The production method includes filling the pressure cavity with carbon paste; subjecting the laminated structure to high-temperature sintering to volatilize carbon from air holes so as to form a complete cavity; and after sintering, placing glass beads at the air holes to allow for secondary sintering sealing. The high-temperature pressure sensor is capable of operating at normal temperature and high temperature more than 400 DEG C, and is simple in structure, small in size, simple in manufacture process and easy for industrial production.