323 results about "RFIC" patented technology

Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.

A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.

A fully integrated, programmable mixed-signal transceiver comprising a radio frequency integrated circuit (RFIC) which is frequency and protocol agnostic with digital inputs and outputs, the transceiver being programmable and configurable for multiple radio frequency bands and standards and being capable of connecting to many networks and service providers. The RFIC does not use spiral inductors and instead includes transmission line inductors allowing for improved scalability. Components of the transceiver are programmable to allow the transceiver to switch between different frequency bands of operating. Frequency switching can be accomplished though the content of digital registers coupled to the components.

A method for an antenna architecture may comprise receiving at a first radio frequency integrated circuit (RFIC) integrated within a mobile terminal, first signals via at least a first antenna, where the first signals may comprise signals within a 2100 MHz band. Second signals may be received at a second RFIC integrated within the mobile terminal via at least one of the first antenna and at least one other antenna, where the second signals may comprise signals within at least one of an 1800 MHz band and a 900 MHz band. Third signals may be received at at least a third RFIC integrated within the mobile terminal via at least one of the first antenna and at least one other antenna, where the third signals may comprise VHF/UHF broadcast signals within at least one of a DVB broadcast band, an ATSC broadcast band and an ISDB broadcast band.

A wireless communication device includes a resistive-element-including RFIC and an antenna coil. The resistive-element-including RFIC includes an RFIC, a capacitive element, and resistive elements. The resistive elements and a portion of a circuit in the RFIC define a variable impedance circuit. The RFIC controls the impedance of a resistive circuit added to an antenna circuit in accordance with certain IO terminals set as output ports or input ports, thus obtaining a Q value of the antenna circuit in accordance with a communication speed.

A technique to share a local oscillator signal between two radio frequency integrated circuits (RFICs). The local oscillator signal generated internally by one RFIC is ported to the other RFIC for use in transmit and/or receive operation. The local oscillator signal that is ported may be an RF local oscillator signal. Each RFIC may include a bi-directional port circuit that can be operated to make the RFIC a master, slave or may be totally disabled to disable the porting feature. This is particularly useful in RFICs that are used to communicate using MIMO radio algorithms which rely for optimum performance on phase and frequency coherency among a plurality of transmitters and a plurality of receivers.

A layout of a wireless communication circuit on a printed circuit board (PCB), which is a rectangular board wherein a first side is a Y-axis and a second side is an X-axis. The layout has a first antenna located at a corner between the first side and the second side. An antenna switch and a first filter are located at middle y-coordinate and a X-coordinate. A RF integrated circuit (RFIC) is located after the first filter. A first regulator is located near the second side and higher than the RFIC. A media access control (MAC) is located at about a middle y-coordinate and higher than the first regulator. An oscillator is located at a corner between the second side and the third side. A second regulator is located near the fourth side and above the first regulator. A power amplifier is located near the fourth side above the RFIC. A second filter and a transmitting/receiving (T/R) switch are located before the power amplifier. A second antenna is located at a corner between the first side and the fourth side.

A fully integrated, programmable mixed-signal radio transceiver comprising a radio frequency integrated circuit (RFIC) which is frequency and protocol agnostic with digital inputs and outputs, the radio transceiver being programmable and configurable for multiple radio frequency bands and standards and being capable of connecting to many networks and service providers. The RFIC includes a tunable resonant circuit that includes a transmission line having an inductance, a plurality of switchable capacitors configured to be switched into and out of the tunable resonant circuit in response to a first control signal, and at least one variable capacitor that can be varied in response to a second control signal, wherein a center resonant frequency of the resonant circuit is electronically tunable responsive to the first and second control signals that control a first capacitance value of the plurality of switchable capacitors and a second capacitance value of the at least one variable capacitor.

A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.

A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

The invention relates to a chip package structure and a device. Wafer-scale packaging structures and methods are provided for integrally packaging antenna structures with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems for millimeter wave (mmWave) and Terahertz (THz) applications. For example, a chip package includes an RFIC chip, an antenna structure and an interface layer. The RFIC chip includes a semiconductor substrate having an active surface and an inactive surface, and a BEOL (back end of line) structure formed on the active surface of the semiconductor substrate. The antenna structure includes an antenna substrate and a planar antenna radiator formed on a surface of the antenna substrate, wherein the antenna substrate is formed of a low loss semiconductor material. The interface layer connects the antenna structure to the BEOL structure of the RFIC chip.

Embodiments of the invention are concerned with configurable RFICs. In an exemplary embodiment there is provided a configurable radio-frequency integrated circuit (RFIC) including one or more configurable low noise amplifier circuits, each of said one or more configurable low noise amplifier circuits being configurable between:

an internal input impedance matching topology in which the respective low noise amplifier circuit includes one or more internal input impedance matching components adapted to match the input impedance of the respective low noise amplifier to a given input, said one or more internal input impedance matching components being located internally to the respective low noise amplifier circuit; and

a topology different from said internal input impedance matching topology.

In a video processing system, a method and system for a mobile receiver architecture for World Band cellular and broadcasting are provided. Received channels may be processed in at least one radio frequency front end (RFFE) in a mobile terminal and may comprise at least one of a VHF/UHF broadcast channel and World band cellular channels capable of carrying voice and data. The cellular channels may be WCDMA 2100, 1900, or 850 MHz and GSM 1900, 1800, 900 or 850 MHz. A single cellular/broadcast radio frequency integrated circuit (RFIC) may be utilized for processing the received channels. In another embodiment, a cellular band RFIC may process the World band cellular channels and a broadcast RFIC may process the broadcast channel. Moreover, a first RFIC may process the WCDMA channels, a second RFIC may process the GSM channels, and a broadcast RFIC may process the broadcast channel.

The invention discloses a tera-hertz silica-based quadrupler and a frequency multiplier, belonging to the field of RFIC (Radio Frequency Integrated Circuit). The quadrupler comprises transistors (M1 and M2) and transmission lines (L1, L2 and L-1), wherein the drain ends of the transistors (M1 and M2) are respectively connected to an output port through the transmission lines (L1 and L2), source ends are connected with a ground line, grid ends are respectively connected with the signal input ends of an path (I) and the path (Q) of a baseband signal (f0); the transmission line (L-1) is connected between the output port and a power supply; and the length of the transmission lines (L1 and L2) are 1/4 of that of the corresponding wavelength of a signal (2f0), the length of the transmission line (L-1) is 1/4 of that of the corresponding wavelength of a signal (4f0). The multi-frequency multiplier comprises a 2n frequency multiplier (1), a 2n frequency multiplier (2) and a transmission line (L), wherein the output ports of the 2n frequency multiplier (1) and the 2n frequency multiplier (2) are connected to be used as the output port of a 2n+1 frequency multiplier, the transmission line (L) is connected between the output port of the 2n+1 frequency multiplier and the power supply, and the length of the transmission line (L) is 1/4 of that of the corresponding wavelength of a signal (2n+1f0). The tera-hertz silica-based quadrupler and the multi-frequency multiplier, provided by invention, have the advantages of high output frequency, pure frequency spectrum, low power consumption and easiness for integration.

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

An attenuating antenna switch may be used to suppress increase in the scale and power consumption of an RFIC. The antenna switch has a first terminal, a second terminal, and an antenna terminal coupled to the first and second terminals and configured to be connected to an antenna. The first switch switches between a first state in which a high frequency signal is propagated between the first terminal and the antenna terminal, and a second state in which the high frequency signal is interrupted. A second switch switches between the first and second states between the second terminal and the antenna terminal. The first and second switches are controlled in a mutually exclusive manner such that only one of the two switches can be in the first state at any given time. When in the first state, each switch adjusts an attenuation amount of the high frequency signal.

An integrated circuit, such as a radio frequency integrated circuit (RFIC), has a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer. The third layer bears third metallization for defining an electric shield or electrostatic shield. The third metallization is patterned into a plurality of structures having shapes intended to minimize eddy currents. The electric shield is connected to further metallization that carries a ground potential. The third layer may further bear other metallization for coupling together at least two components of the integrated circuit. The integrated circuit may be fabricated by a CMOS process, and the first and second coils may be a primary coil and a secondary coil, respectively, of a radio frequency transformer. An additional electric shield may also be included, and in this case one electric shield can be coupled to a ground potential associated with the primary coil, and the second electric shield can be coupled to a ground potential associated with the secondary coil.

An apparatus for tracking patients utilizes a wristband with integrated radio frequency circuits (RFIC). The wristband may further incorporate an antenna on a flex PCB. The wristband may also be disposable and comprising means for replacing the RFIC.

A system for wireless power transmission is provided. The system comprises a speaker enclosure and a plurality of tiles positioned along the speaker enclosure. At least one of the tiles comprises an antenna and a radio frequency integrated circuit (RFIC) coupled to the antenna and the RFIC is configured to engage the antenna such that the antenna emits a plurality of wireless power waves defining a pocket of energy.

Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.