59 results about "RFIC" patented technology

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

According to various embodiments, an electronic device comprises: a communication processor; at least one radio frequency integrated circuit (RFIC) connected to the communication processor; and a plurality of antennas, each of which is connected to the at least one RFIC through at least one radio frequency front-end (RFFE) circuit and configured to transmit a signal corresponding to at least one communication network, wherein the communication processor may identify information related to strength of a reception signal received through each of the plurality of antennas, identify the maximum transmittable power set corresponding to a transmission path for each of the plurality of antennas, and control the electronic device such that a transmission signal to be transmitted through at least one antenna selected from among the plurality of antennas at least based on the identified information related to the strength of the reception signal and maximum transmittable power.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

A wireless communication device includes a radio-frequency integrated circuit (RFIC), one or more processors including processing circuitry, and a memory storing instructions. The instructions, when executed by the one or more processors individually or collectively, cause the wireless communication device to receive, via the RFIC, a reception signal including a plurality of subcarriers, and calculate a first log-likelihood ratio (LLR) based on a frequency domain. The plurality of subcarriers include a first subcarrier and a second subcarrier adjacent to the first subcarrier. The calculation of the first LLR includes to measure a channel variation between the first subcarrier and the second subcarrier, determine a second linear detection matrix of the second subcarrier, based on the channel variation, and calculate the first LLR based on at least one of a first linear detection matrix of the first subcarrier and the second linear detection matrix. The first subcarrier is a pivot subcarrier.

An antenna device for a vehicle and a vehicle including the same are provided. The antenna device includes a printed circuit board (PCB), a plurality of antenna arrays arranged on a first surface of the PCB, a plurality of radio frequency integrated circuits (RFICs) arranged on a second surface of the PCB and electrically connected to the plurality of antenna arrays, and an intermediate frequency integrated circuit (IFIC) arranged on the second surface of the PCB to be apart from each of the plurality of RFICs by a same distance, the IFIC being electrically connected to the plurality of RFICs.

A glass substrate architecture for mounting RF components may be configured for heat dissipation. Existing millimeter wave radiofrequency (RF) systems mount the radiofrequency integrated circuits (RFICs) on a printed circuit board on the opposite side of a heat sink, making it difficult to dissipate heat away from the RFICs during operation. This architecture mounts the RFICs directly to a back side of a glass waveguide substrate, and thermally couples the top side of the RFICs to a conductive pad on the underlying printed circuit board with a thermal pathway to the heatsink. This leads to a much more effective dissipation of heat away from the RFICs and eliminates the need for additional cooling systems or throttling the performance of the radar system.

A method for calibration of a phased array antenna system with reduced set of data points for optimized calibration. A system that identifies a constant gain circle and constant phase lines from measured results and selects a set of data points therein for testing.

An electronic device including a hybrid power amplifier unit according to an embodiment disclosed herein may comprise: a communication processor for outputting a baseband signal; a radio frequency integrated circuit (RFIC) which converts the baseband signal into a plurality of radio frequency (RF) signals; and a hybrid power amplifier unit for amplifying the RF signals. The hybrid power amplifier unit may amplify a first RF signal among the plurality of RF signals according to a low load line characteristic or a high load line characteristic on the basis of the operation mode. Various other embodiments are also possible.

Some embodiments of the invention provide an Al-enabled method for integrated circuit (IC) architecture discovery, circuit topology and parameter optimization. The method of some embodiments explores the high dimensional design space beyond human intuition and extracting circuit features, configurations and designs unidentifiable to human experts in a variety of tasks. The method of some embodiments is used for RFIC architecture discovery, circuit topology and parameter optimization. For instance, the method of some embodiments provides an automated design flow for RFICs (e.g., RF or mmWave IC) that allows: (1) architecture selection, (2) circuit topology optimization, (3) parameter optimization, and (4) inverse design EM synthesis in a non-intuitive design space. In some embodiments, the method automates the synthesis of high-performance power amplifier (PA) circuits for transmitter systems, leveraging a combination of reinforcement learning (RL) and inverse design to optimize respectively active and passive components in the design. Some embodiments of the invention provide an Al-enabled method for integrated circuit (IC) architecture discovery, circuit topology and parameter optimization. The method of some embodiments explores the high dimensional design space beyond human intuition and extracting circuit features, configurations and designs unidentifiable to human experts in a variety of tasks. The method of some embodiments is used for RFIC architecture discovery, circuit topology and parameter optimization. For instance, the method of some embodiments provides an automated design flow for RFICs (e.g., RF or mmWave IC) that allows: (1) architecture selection, (2) circuit topology optimization, (3) parameter optimization, and (4) inverse design EM synthesis in a non-intuitive design space. In some embodiments, the method automates the synthesis of high-performance power amplifier (PA) circuits for transmitter systems, leveraging a combination of reinforcement learning (RL) and inverse design to optimize respectively active and passive components in the design.

The invention provides a radio frequency remote electronic device and a circuit board matching method, and relates to the technical field of terminals. The invention provides a radio frequency remote electronic device. A first circuit board is provided with an SOC, an identification unit and a storage unit, and the storage unit stores a static parameter of a second circuit board and a first calibration parameter of the first circuit board; an RFIC and an identification circuit are installed on the second circuit board. The first mainboard is in communication connection with the second mainboard. The SOC downloads a second calibration parameter of the second circuit board from the server through the obtained RFIC identifier of the second circuit board; the identification unit obtains the model identifier of the second circuit board by obtaining the output data of the identification circuit. And under the condition that the static parameter is matched with the model identifier, the SOC performs function test on the radio frequency remote electronic equipment based on the first calibration parameter, the second calibration parameter and the static parameter. Therefore, the first circuit board and the second circuit board do not need to be matched one by one, and the production cost of a production line is reduced.

Provided is a user equipment including a plurality of antennas including at least first and second groups of antennas, each group respectively allocated to one of a plurality of component carriers according to layer allocation information of the plurality of component carriers, a radio frequency integrated circuit (RFIC) configured to transmit or receive a signal at frequencies of the plurality of component carriers through the plurality of antennas, and a processor configured to measure respective channel states of the plurality of component carriers, generate a request to change the layer allocation information of the plurality of component carriers, based on the channel states, and control the RFIC to transmit the request to change, to the base station.

As an embodiment of the present application, the radio frequency integrated circuit (RFIC) comprises: a transmitting circuit configured to acquire a plurality of transmitting signals; a plurality of low-noise amplifiers configured to amplify a plurality of receiving signals corresponding to the plurality of transmitting signals reflected from a target; a receiving switching circuit comprising a plurality of first ports and a first single port coupled to the plurality of low-noise amplifiers, and configured to couple one of the first ports and the first single port based on switching; and a receiving chain circuit coupled to the first single port and configured to process one of the plurality of receiving signals corresponding to the first port in the baseband.

An electronic device may include at least one communication processor, at least one radio frequency integrated circuit (RFIC) configured to provide a radio frequency (RF) signal based on a signal from the at least one communication processor, and a first RF circuit and a second RF circuit configured to process and provide the RF signal. The at least one communication processor may be configured to control at least part of the electronic device to allow the first RF circuit to process at least one first RF signal provided from the RFIC, in an over-temperature state, identify that a sum of times when the first RF circuit processes the at least one first RF signal is at least the value of a designated period, and based on the sum of the times when the first RF circuit processes the at least one first RF signal being at least the value of the designated period, stop use of the first RF circuit and control at least part of the electronic device to allow the second RF circuit to process at least one second RF signal provided from the RFIC. Other various embodiments are possible as well.

A radio frequency integrated circuit (RFIC) is described. The RFIC includes a switch field effect transistor (FET) including a source region, a drain region, a body region coupled to a body resistor, and a gate region coupled to a gate resistor. The RFIC also includes a dynamic bias control circuit. The dynamic bias control circuit includes at least one transistor coupled to the body region of the switch FET through the body resistor and coupled to the gate region of the switch FET through the gate resistor. The at least one transistor is an RF silicon on insulator (SOI) device. The dynamic bias control circuit also includes a capacitor coupled to the gate resistor and the body resistor and coupled in parallel with each transistor in the dynamic bias control circuit.

An electronic device according to an embodiment of the present disclosure may comprise: a processor; a memory electrically connected to the processor; a power management integrated circuit (PMIC) electrically connected to the processor; a radio frequency integrated circuit (RFIC) electrically connected to the processor; a power supply module including a power supply electrically connected to the PMIC and the processor; a front-end module including circuitry\electrically connected to the PMIC, the RFIC, and the power supply module, and is configured to modulate and amplify an RF signal received from the RFIC; a variable notch filter electrically connected to the power supply module and the front-end module, and connected to a transmission signal amplifier of the front-end module and configured to remove a harmonic frequency; and an antenna electrically connected to the front-end module, wherein the processor is configured to: control the PMIC and the power supply module to supply power to the front-end module; control a wireless communication operation to be performed using multiple frequency bands; and based on performing the wireless communication operation using the multiple frequency bands, control impedance of the variable notch filter to adjust a frequency removal band of the variable notch filter based on a parameter pre-stored in the memory.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

A system for phase alignment includes a radio frequency integrated circuit (RFIC) having a phase locked loop (PLL) circuit and a missing pulse detection circuit, the missing pulse detection circuit configured to detect a missing pulse from a reference clock source and generate a detection pulse signal, and a counter reset circuit connected to the missing pulse detection circuit, the counter reset circuit configured to generate a counter reset signal in response to the detection pulse signal, the counter reset signal configured to establish an absolute time and frequency reference for the PLL circuit.

A mobile communication device includes a processor positioned on a first printed circuit board, a radio frequency integrated circuit (RFIC), and an antenna module. The antenna module includes a second printed circuit board, a first antenna and a second antenna positioned on the second printed circuit board, and a plurality of front-end chips positioned on the second printed circuit board. The plurality of front-end chips include a first front-end chip electrically connecting the RFIC and the first antenna, and a second front-end chip electrically connecting the RFIC and the second antenna.

A method for fabricating a semiconductor device includes the steps of first providing a substrate having through-silicon vias (TSVs) therein, forming an inorganic layer on the substrate, forming an organic layer on the inorganic layer, and then bonding dies having different functionalities on the organic layer. Preferably, the dies include a radio-frequency integrated circuit (RFIC) die, a power amplifier (PA) die, and / or a high electron mobility transistor (HEMT) die.

The invention discloses a radio frequency circuit, a power regulation method and electronic equipment, relates to the field of communication, and is used for preventing the input power of a power amplifier (PA) from exceeding the input power threshold of the PA when the power detection of a radio frequency feedback path of the electronic equipment is abnormal. The radio frequency circuit comprises a modem, an RFIC, a PA, an antenna port, a radio frequency feedback path and an ADC, and the modem is used for controlling the RFIC to traverse all output power gears and obtaining calibration values, corresponding to all the output power gears, of the output power of the PA; determining the maximum output power gear of the RFIC according to the calibration value of the output power of the PA; detecting whether the power detection of the radio frequency feedback path is normal or not; and if the power detection of the radio frequency feedback path is abnormal and the output power of the PA detected by the radio frequency feedback path is less than the calibration value of the output power of the PA corresponding to the output power gear, controlling the output power gear of the RFIC to be less than or equal to the maximum output power gear.

The invention relates to a communication device. A communication device (1) is provided with: a pre-regulator circuit (30) that converts an input voltage into a regulated voltage; the high-frequency module (10) outputs a signal of a first radio frequency; and a high-frequency module (20) that outputs a signal of a second radio frequency, the high-frequency module (10) having an RFIC (71) that includes a power amplifier (13), a switched capacitor circuit (11) that generates a plurality of first discrete voltages on the basis of the adjusted voltage, and a power supply modulation circuit (12) that selectively outputs at least one of the plurality of first discrete voltages to the power amplifier (13), the high-frequency module (20) has an RFIC (72) including a power amplifier (23), a switched capacitor circuit (21) that generates a plurality of second discrete voltages on the basis of the adjusted voltage, and a power supply modulation circuit (22) that selectively outputs at least one of the plurality of second discrete voltages to the power amplifier (23).

An example portable electronic device can include: a first antenna, a second antenna, and a third antenna; a first RFFE, a second RFFE, and a third RFFE which are configured to pre-process an RF signal; a first conductive wiring; a first switch including a (1-1)th terminal connected to the first antenna, a (1-2)th terminal connected to one end of the first conductive wiring, and a (1-3)th terminal connected to the first RFFE; a second switch including a (2-1)th terminal connected to the second antenna, a (2-2)th terminal connected to the third antenna, a (2-3)th terminal connected to the second RFFE, a (2-4)th terminal connected to the third RFFE, and a (2-5)th terminal connected to the other end of the first conductive wiring; an RFIC configured to convert RF signals inputted from the first RFFE, the second RFFE, and the third RFFE into a baseband signal, and convert the baseband signal into an RF signal so as to output the RF signal to the first RFFE; and a communication processor configured to control the first switch so as to sequentially connect the (1-3)th terminal to the (1-1)th terminal and the (1-2)th terminal when the portable electronic device operates in a first transmission mode for transmitting a sounding reference signal (SRS) to the wireless communication network by using the first RFFE, and control the second switch so as to sequentially connect the (2-1)th terminal and the (2-2)th terminal to the (2-5)th terminal while the (1-2)th terminal is connected to the (1-3)th terminal.

In the present invention, an RFID inlay (30) is constituted by: an RFIC module (10) comprising an RFIC (11) and an RF circuit (12) connected to the RFIC (11); and an antenna module (20) including antenna conductor patterns (21, 22). The RFIC module (10) and the antenna module (20) are provided on the main surface (41S) side of an individual resin layer (41). Resin injection molding is performed on the individual resin layer (41), and as a result, a resin molded body (101) with built-in RFID inlay is formed, The material of the individual resin layer (41) is a resin material of the same type as the resin of an injection-molded resin layer.

An antenna module is provided. The antenna module includes a dielectric substrate, a radio frequency integrated circuit (RFIC) and a first number of first antennas. The radio frequency integrated circuit (RFIC) is disposed on the dielectric substrate, wherein the RFIC comprises a single first antenna port group and second antenna port groups to receive or transmit signals. The first number of first antennas is arranged in a first row on the dielectric substrate, wherein at least two of the first antennas are connected to the first antenna port group of the RFIC.

According to various embodiments, an electronic device may comprise a communication processor; an intermediate frequency integrated circuit (IFIC) to convert a baseband signal received from the communication processor into an intermediate frequency (IF) signal; a radio frequency integrated circuit (RFIC) convert the received IF signal into a first radio frequency (RF) signal; an ultra-wideband (UWB) integrated circuit (IC) generating a UWB signal corresponding to a first frequency; at least one UWB antenna to transmit / receive the UWB signal corresponding to the first frequency; and at least one first switch connected between the UWB IC and the UWB antenna. The at least one first switch may be controlled so that the UWB signal corresponding to the first frequency, generated by the UWB IC, is transmitted to the RFIC in a state in which a communication operation, for a signal transmitted / received from the communication processor, by the RFIC is inactivated.

Various embodiments of the disclosure disclose a method and apparatus, comprising: a communication processor; a radio frequency integrated circuit (RFIC) connected to the communication processor and outputting at least one of a first radio frequency signal, a second radio frequency signal, a third radio frequency signal, and a fourth radio frequency signal; a first circuit connected to the RFIC and including a first filter; a first radio frequency front end (RFFE) connected to the first circuit and including a first amplifier configured to amplify the first radio frequency signal and / or the third radio frequency signal; and a second RFFE including a second amplifier configured to amplify the second radio frequency signal and / or the fourth radio frequency signal output from the RFIC, wherein the communication processor is configured to control the first circuit to remove the fourth radio frequency signal induced to the first circuit through the first filter.

A transceiver is provided. The transceiver includes: a radio frequency integrated circuit (RFIC) configured to transmit and receive a signal; a main radio (MR) receiver configured to obtain a digital signal from the RFIC; and a processor configured to: control the RFIC and the MR receiver; identify information about an event for switching to a low power radio (LR) receiving mode; identify whether the event is triggered based on the information about the event; and based on the event being triggered, process a low power signal using an LR receiving circuit.

A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.

An antenna module (100) includes a radiating element including feed elements (1211, 1212) adjacent to each other, feed wirings (141, 142), a ground electrode (GND1), and filter circuits (151, 152). The ground electrode is configured to face the radiating element. The feed wirings transmit high-frequency signals from an RFIC (110) to the radiating element. The filter circuits are connected between the feed wirings and the feed circuits. The ground electrode includes a first portion (181) facing the radiating element and a second portion (182) configured on an upper side layer closer to the radiating element than the first portion. In a case where the antenna module is viewed from a normal direction, i) the second portion is configured between the 2 feed elements, and ii) the filter circuits overlap the second portion and are configured on a lower side layer closer to the radiating element than the second portion.