216 results about "RFIC" patented technology

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. A second patch antenna of two patch antennas of the array antenna portion is disposed to be spaced apart from a first patch antenna and is disposed on one of the plurality of layers inside the PCB. The first patch antennas disposed on an outermost surface of the PCB are disposed in a first horizontal axis direction on the outermost surface. The second patch antennas are disposed in the first horizontal axis direction on an inner layer of the PCB.

To provide an antenna module incorporating an electronic component such as an RFIC. An antenna module includes a core substrate, an outermost insulating layer, and a resin layer provided between the core substrate and the outermost insulating layer and embedding therein an RFIC. The core substrate has a core layer, insulating layers and sandwiching the core layer, a through hole conductor connecting conductor layers to, an antenna layer, and feeding patterns and, a via conductor connecting the feeding pattern and a feeding pattern, and a via conductor connecting an antenna pattern and the feeding pattern. The resin layer has a conductor layer connected to the RFIC. The conductor layer is larger in thickness than the conductor layer, which makes cracks or disconnection unlikely to occur in the conductor layer while achieving fine pitch of the conductor layer.

An antenna apparatus includes a first component layer having a plurality of RFICs arranged in a first lattice geometry (e.g., rectangular), where each RFIC comprises beamforming circuitry. A second, parallel component layer overlays the first component layer and includes a plurality of antenna elements arranged in a second, different lattice geometry (e.g., triangular). The antenna elements have respective feed points each coupled to an input / output (I / O) pad of an RFIC. Each I / O pad is aligned with the feed point coupled thereto along an axis orthogonal to the first and second layers.

An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. Each of the plurality of antenna elements may have a structure with two patch antennas, and first and second groups of second patch antennas disposed inside the PCB may be located in first and second regions with respect to a center line of an inner layer where the second patch antennas are disposed.

The utility model discloses a vector signal comprehensive test module, which consists of an internal reference clock and a VCO (Voltage Controlled Oscillator), and the reference clock has an internal and external switching function. The VCO adopts a multi-output phase adjustable device and provides local oscillation signals for the two RFICs and the six frequency conversion circuits respectively. The two RFICs are connected in parallel, and an external coherent local oscillator is provided by the VOC, so that the coherence of the two RFICs is realized. The microwave frequency conversion circuit realizes the frequency expansion function of the RFIC, expands two-path emission frequency and four-path reception frequency from tens of MHz to 9KHz, has four radio frequency test functions of vector signal generation, vector signal analysis, vector network analysis and vector transceiver, and realizes the multifunctional and multi-scene application capability of the comprehensive test instrument.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion including a plurality of antenna elements disposed on the PCB; a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB, the second surface being another outermost surface of the PCB; and a plurality of signal connection lines connected from the RFIC chip to the array antenna portion. A length of each of the plurality of signal connection lines may be a length of a connection line connected between the RFIC chip and the array antenna portion, and the plurality of signal connection lines may have the same length.

An electronic device may include: at least one communication processor, an RFIC, at least one power amplifier, and at least one converter and wherein the at least one communication processor is configured to: set a driving voltage, to be applied to a first power amplifier for amplifying a first RF signal provided from the RFIC among the at least one power amplifier, to be a first voltage, based on an APT mode, control at least part of the at least one converter to provide a first voltage, set based on the APT mode, to the first power amplifier during a transmission period of the first RF signal, and control at least part of the at least one converter to provide the first voltage to the first power amplifier during at least partial period of a remaining period in which no RF signal is transmitted, based on the occurrence of an event associated with audible noise.

The present application relates to the field of communications, and discloses a radio frequency circuit, a power regulation method, and an electronic device, for use in when a power measurement of a radio frequency feedback path of an electronic device is abnormal, preventing an input power of a PA from exceeding an input power threshold of the PA. The radio frequency circuit comprises: a modem, an RFIC, a PA, an antenna port, a radio frequency feedback path, and an ADC. The modem is configured to: control the RFIC to traverse output power levels to obtain the calibration values of output powers of the PA respectively corresponding to the output power levels; determine the maximum output power level of the RFIC on the basis of the calibration values of the output powers of the PA; detect whether the power measurement of the radio frequency feedback path is normal; and if the power measurement of the radio frequency feedback path is abnormal, and if an output power of the PA measured by the radio frequency feedback path is lower than the calibration values of the output powers of the PA corresponding to the output power levels, control the output power level of the RFIC to be lower than or equal to the maximum output power level.

A modem chip includes a radio frequency integrated circuit (RFIC) configured to receive a signal including channel state information, and a processor configured to determine a signal to interference ratio (SIR) of the received signal based on the channel state information. The processor selects a log likelihood ratio (LLR) calculation mode among at least two LLR calculation modes that differently calculate an LLR of the received signal, by comparing the SIR with at least one threshold, and decodes the received signal by calculating the LLR of the received signal based on the selected LLR calculation mode.

A radio device is provided that includes a housing having a lower surface, the housing including a radio frequency integrated circuit (RFIC). The radio device includes a plurality of millimeter wave (mmW) radios in electronic communication with the processor via the RFIC, the plurality of mmW radios detachably positioned at different locations on the housing of the radio device, each mmW radio of the plurality of mmW radios configured to establish a mmW connection with one or more nodes in a mesh network. The radio device includes a connection having a fastener positioned on the lower surface of the housing of the radio device. The radio device is removably coupled with a pole via the connection, the pole housing a second radio device including a cellular radio, the second radio device connects with the processor, via a connection to the RFIC included in the housing of the radio device.

According to various embodiments, an electronic device comprises: a communication processor; at least one radio frequency integrated circuit (RFIC) connected to the communication processor; and a plurality of antennas, each of which is connected to the at least one RFIC through at least one radio frequency front-end (RFFE) circuit and configured to transmit a signal corresponding to at least one communication network, wherein the communication processor may identify information related to strength of a reception signal received through each of the plurality of antennas, identify the maximum transmittable power set corresponding to a transmission path for each of the plurality of antennas, and control the electronic device such that a transmission signal to be transmitted through at least one antenna selected from among the plurality of antennas at least based on the identified information related to the strength of the reception signal and maximum transmittable power.

An antenna module includes antenna groups, hybrid couplers, dividers, and an RFIC. The antenna group includes radiating elements. The antenna group includes radiating elements. Each hybrid coupler has input terminals and output terminals. The RFIC supplies a high frequency signal to each radiating element. Each divider splits the high frequency signal from the RFIC in two directions. The divider splits a first signal from the RFIC to the input terminal of each hybrid coupler. The divider splits a second signal from the RFIC to the input terminal of each hybrid coupler. The output terminals of the hybrid coupler are respectively connected to the radiating elements. The output terminals of the hybrid coupler are respectively connected to the radiating elements. In each hybrid coupler, a phase difference between the high frequency signals supplied to the input terminals is set to 90°.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

An antenna module implemented in a multi-layered antenna package includes an RFIC; a first dielectric layer; a first coplanar waveguide layer disposed on a top of the first dielectric layer and configured to receive RF signals transmitted by an interface layer of the RFIC; a first antenna portion disposed on the first coplanar waveguide layer and configured to radiate signals transmitted from the first coplanar waveguide layer; a second coplanar waveguide layer disposed on a top of the third dielectric layer and configured to receive RF signals transmitted by the interface layer of the RFIC; and a second antenna portion disposed on the second coplanar waveguide layer to radiate signals transmitted from the second coplanar waveguide layer.

A radio frequency integrated circuit (RFIC) is described. The RFIC includes a switch field effect transistor (FET). The switch FET includes a source region, a drain region, a body region, and a gate region. The RFIC also includes a dynamic bias control circuit. The dynamic bias control circuit includes at least one transistor coupled between the body region and the gate region of the switch FET.

An electronic device may comprise antenna, low-noise amplifier, radio frequency integrated circuit (RFIC), and communication. The communication processor may be configured to identify a low-noise amplifier for amplifying a first RF signal and a low-noise amplifier for amplifying a second RF signal, based on the low-noise amplifier for amplifying the first RF signal differing from the low-noise amplifier for amplifying the second RF signal, set a first gain of the low-noise amplifier for amplifying the first RF signal, set a second gain of the low-noise amplifier for amplifying the second RF signal, based on the low-noise amplifier for amplifying the first RF signal being identical to the low-noise amplifier for amplifying the second RF signal, set a third gain of a low-noise amplifier of amplifying the first RF signal and the second RF signal.

An electronic device includes an antenna configured to transmit and receive signals within a plurality of frequency bands, a RFIC configured to transmit the signals within the plurality of frequency bands to the antenna, a coupler configured to transmit at least a portion of signals reflected from the antenna to the RFIC, a tuner connected to the antenna and the coupler, and a processor connected to the RFIC and the tuner, the processor configured to obtain a third reflection coefficient at a first receiving frequency based on a first reflection coefficient at a first transmission frequency and a second reflection coefficient at a second transmission frequency that is greater than the first transmission frequency, determine, based on the third reflection coefficient, a first receiving tuning code for performing impedance matching to the antenna, and control impedance of the antenna with the tuner based on the first receiving tuning code.

Disclosed is a dual-band phase shifter in which series / parallel resonance circuits are applied to a polyphase filter to implement a phase shifter, which is a core block of a multi-channel RFIC for implementing a phased array antenna system. The dual-band phase shifter may be configured by converting a capacitor (C) of an LC circuit or a CL circuit in the RFIC into a series resonance circuit and converting an inductor (L) thereof into a parallel resonance circuit, so that a signal generator operating in one frequency band can operate in a dual-band.

A wireless communication device includes a radio-frequency integrated circuit (RFIC), one or more processors including processing circuitry, and a memory storing instructions. The instructions, when executed by the one or more processors individually or collectively, cause the wireless communication device to receive, via the RFIC, a reception signal including a plurality of subcarriers, and calculate a first log-likelihood ratio (LLR) based on a frequency domain. The plurality of subcarriers include a first subcarrier and a second subcarrier adjacent to the first subcarrier. The calculation of the first LLR includes to measure a channel variation between the first subcarrier and the second subcarrier, determine a second linear detection matrix of the second subcarrier, based on the channel variation, and calculate the first LLR based on at least one of a first linear detection matrix of the first subcarrier and the second linear detection matrix. The first subcarrier is a pivot subcarrier.

An antenna device for a vehicle and a vehicle including the same are provided. The antenna device includes a printed circuit board (PCB), a plurality of antenna arrays arranged on a first surface of the PCB, a plurality of radio frequency integrated circuits (RFICs) arranged on a second surface of the PCB and electrically connected to the plurality of antenna arrays, and an intermediate frequency integrated circuit (IFIC) arranged on the second surface of the PCB to be apart from each of the plurality of RFICs by a same distance, the IFIC being electrically connected to the plurality of RFICs.

A module for use in a wireless communication apparatus for communicating with a terminal is provided. The module comprises a first printed circuit board, a PCB configured by stacking a plurality of substrates, a plurality of antennas formed on a first side of the first PCB, and a plurality of antenna modules for the plurality of antennas. Each antenna module of the plurality of antenna modules comprises a radio frequency integrated circuit, RFIC, chip, and a second PCB configured by stacking a plurality of substrates and configured to electrically connect the RFIC chip to the first PCB. A first side of the second PCB is coupled to a second side of the first PCB opposite to the first side of the first PCB via a grid array, and a second side opposite to the first side of the second PCB is coupled with the RFIC chip.

This antenna module comprises radiation elements (121, 126), an RFIC (110), a switch (105) for selecting one of the radiation elements, and power feeding wires (141, 142, 143, 145, 210). The radiation element (126) receives a high-frequency signal in a first frequency band and radiates radio waves. The radiation element (121) receives a high-frequency signal in a second frequency band higher than the first frequency band and radiates radio waves. The RFIC converts the high-frequency signal in the first frequency band into the high-frequency signal in the second frequency band. The power feeding wires (143, 210) transmit the high-frequency signal in the first frequency band to the switch. The power feeding wire (145) transmits the high-frequency signal in the first frequency band from the switch to the radiation element (126). The power feeding wire (142) transmits the high-frequency signal in the first frequency band from the switch to the RFIC. The power feeding wire (141) transmits the high-frequency signal in the second frequency band converted by the RFIC to the radiation element (121).

An antenna system for beam direction adjustment and shared use of radio-frequency integrated circuit (RFIC) units includes an array antenna module including feed antenna units for producing at least one input signal, RFIC units respectively electrically connected to the feed antenna units through switching units and less in number than the feed antenna units, a control module for controlling, based on at least one antenna configuration message, some of the switching units to be switched on and the rest thereof to be switched off, and a microwave lens module for forming at least one beam in a particular direction. A feed antenna unit electrically connected to the switched-on switching unit is in a working state, and can receive a signal from the RFIC units and radiate a corresponding input signal to the microwave lens module. The antenna system greatly reduces the number of RFIC units, thereby lowering the overall cost.

The antenna module (100) includes flat radiation elements (121, 122) and a feeding wiring (141A) that transmits a high-frequency signal to the radiation element (121). The radiation element (122) is disposed at a position different from that of the radiation element (121) in the normal direction of the radiation element (121) and has a resonance frequency different from that of the radiation element (121). The feeding wiring (141A) penetrates the radiation element (122) from the RFIC (110) and transmits the high-frequency signal to the radiation element (121). The feeding wiring (141A) includes a shift region extending in a direction orthogonal to the normal direction of the radiation element (121) at a position different from that of the radiation element (122) on the path from the RFIC (110) to the radiation element (121). When viewed from the normal direction of the radiation element (121), an opening (150) is formed in a portion of the radiation element (122) that overlaps the shift region.

A semiconductor package structure comprises a substrate with a substrate surface, a processing device electrically coupled to the substrate surface, one or more radio frequency integrated circuits (RFICs) electrically coupled to the substrate surface, and a shielding plate. The shielding plate is positioned between the one or more RFICs and the processing device and is configured to couple the one or more RFICs to a package ground via one or more conductors. The package ground has a ground voltage associated with the semiconductor package structure.

According to various embodiments, an electronic device may include: a radio frequency integrated circuit (RFIC) including a plurality of first low noise amplifiers (LNAs); at least one radio frequency front end (RFFE) operatively connected to the RFIC; and at least one communication processor operatively connected to the RFIC, wherein the at least one communication processor is configured to: based on a first RF signal within a first uplink band of a first operating band being output via the RFIC, control the RFIC to set, to be a first gain, a gain of at least one first LNA among the plurality of first LNAs configured to process a second RF signal within a first downlink band of the first operating band provided from the at least one RFFE to the RFIC, and based on the first RF signal and a third RF signal within a second uplink band of a second operating band different from the first operating band being at least concurrently output via the RFIC, control the RFIC to set, to be a second gain, the gain of the at least one first LNA configured to process the second RF signal provided from the at least one RFFE to the RFIC, wherein the second gain is less than the first gain.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion including a plurality of antenna elements disposed on the PCB; a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB, the second surface being another outermost surface of the PCB; and a plurality of signal connection lines connected from the RFIC chip to the array antenna portion. A length of each of the plurality of signal connection lines may be a length of a connection line connected between the RFIC chip and the array antenna portion, and the plurality of signal connection lines may have the same length.