1280results about "High frequency circuit adaptations" patented technology

The invention provides a circuit board processing method and a circuit board, and the method comprises the steps: carrying out the first drilling of the circuit board, so as to form a plurality of through holes; acquiring horizontal position information of a target through hole in the plurality of through holes; according to the horizontal position information of the target through hole, the position of a target signal layer corresponding to the target through hole in the vertical direction is measured, the vertical position information of the target signal layer is obtained, and the target signal layer is exposed on the hole wall of the through hole; and according to the vertical position information of the target signal layer, performing second drilling at the target through hole position of the circuit board to form a back drilling hole, and enabling the stub length after the second drilling to be within a preset range. According to the method, the problems of line damage, excessive stub length and the like caused by position deviation can be effectively avoided, the stub length after back drilling can be strictly controlled within a preset range, and interference of the stub on high-frequency signals is remarkably reduced.

A device includes a package body including a central flange and an amplifier module mounted to the central flange of the surface-mount device. The amplifier module includes a module substrate mounted to the central flange. The module substrate includes a first die mount window, a first circuitry on a first surface of the module substrate, a second circuitry on the first surface of the module substrate, and a first amplifier die mounted on the central flange. The first amplifier die is at least partially disposed within the first die mount window and the first amplifier die is electrically connected to the first circuitry and the second circuitry. The first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.

The invention belongs to the technical field of high-frequency signal transfer, and particularly discloses a high-frequency signal transfer board which comprises a transfer circuit board and a connecting piece, and the connecting piece is further provided with a slot used for fixing a high-frequency connector. The switching circuit board is provided with a plurality of photosensitive board contact points, a plug hole and a high-frequency signal transmission microstrip line, the photosensitive board contact points are connected with a joint of the photosensitive board, a pin is arranged in the plug hole and used for connecting the high-frequency connector and the high-frequency signal transmission microstrip line, the other end of the high-frequency signal transmission microstrip line is connected with the photosensitive board contact points, and the other end of the high-frequency signal transmission microstrip line is connected with the photosensitive board contact points. The bottom of the pin is clamped with the high-frequency connector, and the side wall of the pin is in interference fit with the plugging hole. According to the invention, the switching circuit board is fixedly connected with the connecting piece, and the plugging hole with the circular truncated cone structure is formed in the switching circuit board, so that reliable connection between the pin and the plugging hole is ensured, and as the high-frequency signal transmission microstrip line is connected with the high-frequency connector in a plugging manner, echo is avoided, and the signal switching precision is improved.

Provide for herein is an apparatus that includes multiple printed circuit board (PCB) layers and a via assembly. The via assembly includes a signal via extending through the multiple layers, and the signal via is configured to transmit a signal between the layers. The via assembly also includes a capacitive structure connected to the signal via to adjust an impedance of the via assembly along the via assembly. The capacitive structure is physically and electrically separate from other components of the PCB.

According to an embodiment of the present disclosure, a printed circuit and a method of manufacturing the same are provided. The printed circuit board includes: a signal plane portion including a plurality of metal layers for transmitting signals; a power supply plane portion overlapping the signal plane portion through a connection layer and including a plurality of metal layers for supplying power; a plurality of power supply via holes, each extending from a surface of the signal plane portion back to the power supply plane portion, through the signal plane portion, the connection layer and the power supply plane portion, to a surface of the power supply plane portion back to the signal plane portion; and a plurality of signal vias each extending into the signal plane portion from a surface of the signal plane portion facing away from the power plane portion and not extending into the power plane portion, wherein a radial dimension of each of the plurality of signal vias is less than a radial dimension of each of the plurality of power vias.

A component carrier including: i) a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure; ii) a first metal trace comprising a rough surface; and iii) a second metal trace arranged adjacent to the first metal trace, comprising a smooth surface. The component carrier is configured to guide high-frequency and or high-speed signals through the second metal trace.

The invention discloses an optimized high-speed differential via hole structure, which is characterized in that high-speed differential via holes are arranged in each wiring layer, each wiring layer is provided with a corresponding anti-pad, and corresponding wires are laid in the high-speed differential via holes; marking the part of the wire in each suspension area outside the corresponding anti-bonding pad close to the wiring layer as a suspension wire, marking the part of the wire in the high-speed differential via hole as a via hole wire, thickening the suspension wire, and controlling the suspension wire to be thicker than the via hole wire; and reducing the size of the anti-bonding pad in each non-adjacent wiring layer, and controlling the size of the anti-bonding pad in each non-adjacent wiring layer to be smaller than the size of the anti-bonding pad in each adjacent wiring layer. According to the invention, through combined use of the thickened suspension line, reduction of the non-adjacent wiring layer anti-bonding pad and increase of the adjacent wiring layer anti-bonding pad, the impedance of each part is effectively adjusted, and the impedance requirement of high-speed signal transmission is met; and the optimized mode is high in universality, simple and efficient.

The embodiment of the invention provides a circuit board, communication equipment and a chip, the circuit board is used for connecting an electronic device, the circuit board is used for inhibiting thermal expansion coefficient mismatch between the circuit board and the electronic device, and the insertion loss of the circuit board can be effectively reduced. Along the direction perpendicular to the surface of the circuit board, the circuit board comprises M sub-boards arranged in sequence, M is any integer not less than 2, and the M sub-boards comprise a first sub-board and a second sub-board. The thermal expansion coefficient of the first daughter board is smaller than that of the second daughter board, and the dielectric loss factor of the second daughter board is smaller than that of the first daughter board.

A printed circuit board comprising a primary dielectric layer disposed underneath a microstrip trace and a secondary dielectric layer disposed above portions of the primary dielectric layer and the microstrip trace. The printed circuit board also includes a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded.

A method of making a glass article using a phase separated silicate glass comprising a silica-rich first phase and a boron-rich second phase. The phase separation silica glass is etched with an etchant to remove at least a portion of the second phase and obtain a high silica content porous glass article. Through holes may be formed in a porous glass article by first forming holes in the porous glass article and filling the holes with a conductive material. The porous glass article may be heat treated to consolidate the porous glass article, thereby closing pores of the porous glass article and obtaining a consolidated glass article having very low dielectric properties. Various glass compositions that are phase-separated via rotary knotting are disclosed.

The embodiment of the invention provides a circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for solving the problem of signal crosstalk between different channels in the circuit board. A signal layer of the circuit board can comprise a first dielectric layer, a first grounding part and a second grounding part of two adjacent signal channels. The signal channel can comprise a transmission line arranged on the first dielectric layer, and a first grounding part and a second grounding part of the transmission line are located on the same side surface of the first dielectric layer to form a coplanar waveguide. The first grounding part and the second grounding part are located between the two adjacent signal channels and are arranged at intervals. The first grounding part and the second grounding part are used for providing different backflow paths to flow backflow signals of two adjacent signal channels, so that crosstalk between different backflow signals is reduced.

RADAR sensor assemblies / modules, particularly those for vehicles. In some embodiments, the assembly may comprise a waveguide comprising a waveguide groove defined by opposing waveguide groove structures. An antenna structure may be operably coupled with the waveguide. A printed circuit board may be operably coupled with the waveguide and may comprise an electrically conductive top layer, an electrically conductive bottom layer, and a substrate positioned in between the electrically conductive top layer and the electrically conductive bottom layer. The electrically conductive top layer may comprise an opening exposing the substrate, which opening may extend along the waveguide groove in between the opposing waveguide groove structures. This configuration may allow for various parameters of the printed circuit board to be modified to tune a performance of a sensor / antenna.

A printed wiring board includes: a substrate including first and second conductor layers laminated together, and a third conductor layer laminated on an outer side of one of the first conductor layer and the second conductor layer; a first differential signal wiring provided in the first conductor layer and including first and second wirings; a second differential signal wiring provided in the second conductor layer and including third and fourth wiring; a first via provided between the first and second conductor layers to connect the first wiring and the third wiring; and a second via provided between the first and second conductor layers to connect the second wiring and the fourth wiring, wherein a first clearance is provided for each of the first, second and third conductor layers to include the first via and the second via in a plan view viewed perpendicular to the substrate.

This document describes techniques, apparatuses, and systems for an antenna-to-printed circuit board (PCB) transition. An apparatus (e.g., a radar system) may include an MMIC or other processor to generate electromagnetic signals. The apparatus can include a PCB that includes multiple layers, a first surface, and a second surface that is opposite and in parallel with the first surface. The PCB can also include a dielectric-filled portion formed between the first surface and second surface. The apparatus can also include a conductive loop located on the first surface and connected to a pair of lines. The apparatus can further include a transition channel mounted on the first surface and positioned over the dielectric-filled portion. The described transition can reduce manufacturing costs and board sizes, reduce energy losses, and support a wide bandwidth.

The present disclosure relates to a PCB arrangement for electrically connecting a microwave conductor to a waveguide device. The PCB arrangement includes at least one PCB dielectric layer a first PCB main side with a first PCB metallization where the microwave conductor is formed, a second PCB main side with a second PCB metallization having an aperture. The second PCB main side is adapted for attachment of a waveguide device via the aperture. The PCB arrangement further includes a via connection running between, and electrically connecting, a microwave conductor end portion and a radiating element in the aperture, and a first electric connection arrangement running between, and electrically connecting, the second PCB metallization and an adjacent PCB metallization included in the PCB arrangement.

Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

An antenna system comprises a driven antenna element connected to a printed circuit board (PCB), and a plurality of PCB extenders provided by electrical conductors connected to a PCB ground plane for cooperation with the driven antenna element in signal communication. In an eyewear device that incorporates the antenna system, the plurality of PCB extenders are provided by conductive structural elements incorporated in an eyewear frame.

The invention discloses a multi-layer high-frequency PCB board and a preparation method thereof, belonging to the technical field of PCB board preparation. The multi-layer high-frequency PCB board is composed of an inner layer board, a heat dissipation layer and an outer layer board, and the inner layer board, the heat dissipation layer and the outer layer board are arranged in sequence from the inside to the outside, the surface of the inner layer board is covered with a layer of composite film, the heat dissipation layer is composed of a composite aerogel material, and the layers are fixed by hot pressing technology. The multi-layer high-frequency PCB board prepared by the method has excellent high frequency and heat dissipation.

Aspects of the subject disclosure may include, for example, a flexible printed circuit (FPC) for interconnecting an optical device and an application specific integrated circuit (ASIC), wherein the FPC includes a first section that is configured with a first plurality of electrically conductive traces and a second section over which one or more components are disposed, and wherein the second section is configured with a second plurality of electrically conductive traces that extend from the first plurality of electrically conductive traces to the one or more components. Other embodiments are disclosed.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

A high-frequency signal transmission line (102) is provided with: a resin laminate part in which first resin layers (11, 12, 13) and second resin layers (21, 22) are laminated; a signal conductor pattern (4) formed on the first resin layer (11); and ground conductor layers (51, 52) that face the signal conductor pattern across the resin laminate part. Opening portions are formed in the first resin layers (11, 12) at a position along the signal conductor pattern (4) in the resin laminate part so that a hollow portion (HP) is provided in the resin laminate part at the opening portions. The second resin layers (22) in contact with the first resin layers (11, 12) having the opening portions are provided with a maximum thickness and a minimum thickness that are different in the opening portions formed in the first resin layers so that the second resin layers in contact with the first resin layers are adhered to a part of end surfaces of the first resin layers (11, 12) at the opening portions.

To increase the resonance frequency of resonance occurring upon input of a signal of a specific frequency to a chip when the chip is mounted in a sample holder.SOLUTION: A sample holder includes a pedestal and a PCB (Printed Circuit Board) 3 in contact with the pedestal. The PCB 3 has a through-hole 4. The PCB 3 has a cavity 5 at least at a part of the pedestal below the through-hole 4. The cavity 5 has a support structure which supports the surface of the chip and is in communication with the pedestal. At least a part of the portion of the support structure which supports the chip 7 is not parallel to the back surface of the chip. The support structure includes conductor posts 6 located at the four corners of the cavity 5. At least a part of the upper surface of the post 6 is not parallel to the upper surface of the pedestal.SELECTED DRAWING: Figure 10A

A layout of signal traces includes a first set of signal traces and a second set of signal traces that are used for transmitting a first differential signal and a second differential signal respectively. Each set of signal traces includes a first part, a second part, and a third part along the direction of signal transmission. Different parts of the same signal trace as a whole is not straight. All the first parts are in a first signal layer and parallel. The second parts of the two sets of signal traces are in a second signal layer and the first signal layer, respectively, and are across each other. The second part of the first / second set of signal traces is coupled with the first and third parts of the first / second set of signal traces. All the third parts are in the first signal layer and parallel.

The present disclosure relates to flexible printed circuit boards (FPCBs) for augmented reality (AR) eyewear. Disclosed examples provide an FPCB with air gaps for enhanced bending flexibility and an Electromagnetic Interference (EMI) film for consistent ground reference, enabling high-speed signal transmission with controlled impedance. The FPCB may include asymmetrical dielectric thicknesses and a crosshatch pattern in the ground reference layer to further support signal integrity and mechanical durability.

An apparatus including via structures capable of reducing crosstalk effects is provided. The apparatus includes a printed circuit board (PCB) including sequentially stacked multi-layers, a first via structure that partially penetrates the multilayers of the PCB and is connected to a first metal plate on a first layer of the multilayers, and a second via structure adjacent to the first via structure in a horizontal direction, partially penetrating the multi-layers of the PCB, and connected to a second metal plate disposed on a second layer of the multi-layers. A portion where the first metal plate and the second metal plate overlap each other is configured to provide a first mutual capacitive coupling between the first and second via structures.

A multilayer structure includes at least one insulating layer(s), at least one resin layer(s), and at least one copper foil(s) each having a smooth surface and a roughened surface, wherein the insulating layer contains an olefin-aromatic vinyl compound-aromatic polyene copolymer and a surface modifier, wherein the resin layer contains one or more selected from the group consisting of polyimide, liquid crystal polymer, polyphenylene ether, polyfunctional aromatic vinyl resin, epoxy resin, and the same composition as in the insulating layer, wherein at least one surface of the respective insulating layer(s) is bonded to a smooth surface of the copper foil, and wherein, for each respective resin layer: at least one surface of the resin layer is bonded to the roughened surface, and the resin layer is not bonded to the smooth surface; or both surfaces of the resin layer are not bonded to the copper foil.

The disclosure relates to a circuit board. A circuit board according to an embodiment of the disclosure may comprise a base layer positioned in a first portion of the circuit board and a second portion of the circuit board different from the first portion of the circuit board, a power line positioned in the first portion of the circuit board, a signal line positioned in the second portion of the circuit board, a shielding layer spaced apart from the power line and the signal line, and a cover layer disposed between the base layer and the shielding layer. The cover layer may include a cover base layer positioned in the first portion and the second portion of the circuit board, a conductive layer positioned in the first portion of the circuit board to correspond to the power line, and disposed between the cover base layer and the shielding layer, and an insulating layer positioned in the second portion of the circuit board to correspond to the signal line, and disposed between the cover base layer and the shielding layer.

The present application discloses a circuit board and a manufacturing method therefor, and an electronic device. The disclosed circuit board comprises a circuit board body (100) and via hole structures (200); hole sections (101) and back drilling holes (102) communicated with each other are formed in the circuit board body (100); hole openings of the hole sections (101) are located on a first surface of the circuit board body (100); hole openings of the back drilling holes (102) are located on a second surface of the circuit board body (100); the first surface and the second surface are opposite to each other; a metal layer is provided on the inner walls of the hole sections (101) to form the via hole structures (200); the via hole structures (200) are each filled with a first filler (300); and the back drilling holes (102) are each filled with a second filler (400), wherein the dielectric constant of the second filler (400) is less than the dielectric constant of the circuit board body (100).

An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.

The invention relates to the technical field of semiconductors, in particular to a precise circuit board with an ultrahigh-frequency multilayer memory bank, which comprises a functional circuit surface layer, a high-speed signal layer, an upper grounding layer, an upper waveguide insulating layer, a power supply layer, a lower waveguide insulating layer, a lower grounding layer and a functional circuit bottom layer, the functional circuit surface layer, the high-speed signal layer, the upper grounding layer, the upper waveguide insulating layer, the power supply layer, the lower waveguide insulating layer, the lower grounding layer and the functional circuit bottom layer are sequentially stacked from top to bottom, a conductive groove is formed in the high-speed signal layer in a penetrating mode, a conductive column is arranged in the conductive groove in a matched mode, and waveguide grooves are formed in the tops of the upper waveguide insulating layer and the lower waveguide insulating layer. And a waveguide tube is arranged in the waveguide groove. According to the scheme provided by the invention, by arranging the trapezoidal conductive columns and utilizing the function of dispersing high-frequency current distribution by the asymmetric cross sections of the conductive columns, the skin effect is reduced, the signal integrity is improved, and the effect of optimizing the high-speed signal transmission time sequence consistency is achieved through the obliquely arranged waveguide tubes.