355results about "High frequency circuit adaptations" patented technology

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

A wiring board includes a base body, a signal line located at the base body, and a waveguide of a waveguide-type located at the base body. The signal line includes a first end part that is one end of the signal line in a signal transmission direction. The waveguide includes a second end part that is one end of the waveguide in the signal transmission direction, a center part in the signal transmission direction, and an intermediate part on a side of the second end part closer to the center part. The first end part and the second end part are coupled to one another. A width of the waveguide at the second end part is wider than a width of the waveguide at the intermediate part.

The antenna substrate of the embodiment includes a substrate, an antenna pattern layer on the substrate, a first insulating layer containing a resin and an inorganic filler on the substrate and the antenna pattern layer, and a second insulating layer containing a resin and an inorganic filler on the first insulating layer, wherein the second insulating layer has a greater dielectric constant and thickness than the first insulating layer.

Provided is an electronic device having an antenna. The electronic device comprises: a radiator configured by stacking metal patterns on different layers of a multi-layer structure; and an antenna module including a feeding unit disposed on a specific layer of the radiator and having a feeding line configured to be connected to the radiator, wherein the radiator includes a first pad connected to the feeding line and a second pad disposed on the first pad, and the first pad and the second pad are connected to each other by a first connection line and a second connection line.

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

A directional coupler according to various embodiment and an electronic device having the same are provided. The directional coupler includes a first layer having at least one conductive portion, a second layer disposed adjacent to the first layer in a first direction and having at least one conductive plate corresponding to the conductive portion of the first layer, a third layer disposed adjacent to the second layer in the first direction and including an RF signal transmission line, a fourth layer disposed adjacent to the third layer in the first direction and having a conductive line wound with at least one turn, and at least one conductive via electrically connecting the at least one conductive plate of the second layer and the conductive line of the fourth layer which is wound with at least one turn.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

A multilayer substrate includes a stacked body and a first conductor layer. The stacked body includes insulator layers stacked in a stacking direction. The first conductor layer is provided in the stacked body. In the stacked body, interior spaces that are not connected to a space outside the stacked body are provided. The first conductor layer includes a first principal surface and a second principal surface including an exposed portion exposed to the interior spaces. A surface roughness of the exposed portion is greater than a surface roughness of the first principal surface.

A circuit board according to an embodiment of the disclosure can include a substrate layer on a first portion of the circuit board and a second portion of the circuit board different from the first portion, a power line on the first portion of the circuit board, a signal line on the second portion of the circuit board, a shield layer spaced apart from the power line and the signal line, and a cover layer between the substrate layer and the shield layer, wherein the cover layer includes a cover substrate layer on the first portion and the second portion of the circuit board, a conductive layer on the first portion of the circuit board corresponding to the power line and between the cover substrate layer and the shield layer, and an insulating layer on the second portion of the circuit board corresponding to the signal line and disposed between the cover substrate layer and the shield layer.

Disclosed is an electronic device including a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a metal structure of which a part is connected to the side member; and a printed circuit board positioned between the metal structure and the second plate. The side member includes a first conductive portion, a second conductive portion extending from one end of the first conductive portion, a third conductive portion extending from the other end of the first conductive portion, a first segment formed between the first conductive portion and the second conductive portion, and a second segment formed between the first conductive portion and the third conductive portion. The first conductive portion is connected to a first ground part disposed on the printed circuit board through a first path, and is connected to a second ground part disposed on the metal structure through a second path spaced from the first path by a specific distance. In addition, various embodiments as understood from the specification may be also possible.

A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.

A high frequency module capable of improving heat dissipation characteristics of a power amplifier and suppressing influence of heat of the power amplifier on another electronic component is provided. A high frequency module includes a mounting substrate, a power amplifier, a switch, a plurality of external connection terminals, and a connector. The mounting substrate has a first main surface and a second main surface that are opposite to each other. The power amplifier and the switch are disposed on the second main surface of the mounting substrate. The plurality of external connection terminals are disposed on the second main surface of the mounting substrate. The connector is able to be connected to an external substrate. The plurality of external connection terminals include a first external connection terminal that is connected to the connector. The first external connection terminal is disposed between the power amplifier and the switch.

A circuit board is disclosed, and relates to the field of signal transmission technologies, to resolve a problem of signal crosstalk between different channels in the circuit board. A signal layer (41) of the circuit board may include a first dielectric layer (411), two adjacent signal channels, a first ground part (4311), and a second ground part (4312). The signal channel may include a transmission line (421) disposed on the first dielectric layer (411), and the transmission line (421), the first ground part (4311), and the second ground part (4312) are located on a surface of a same side of the first dielectric layer (411), to form a coplanar waveguide (4001). The first ground part (4311) and the second ground part (4312) are located between the two adjacent signal channels and are spaced apart. The first ground part (4311) and the second ground part (4312) are configured to provide different return paths for return signals flowing through the two adjacent signal channels, to reduce crosstalk between different return signals. An electronic device (01) including the circuit board is further provided.

The present disclosure describes an expansion card interface for a printed circuit board. The expansion card interface includes a substrate having an edge. The expansion card interface further includes a plurality of signal pins configured to communicate one or more signals to and from the printed circuit board. The expansion card interface further includes a plurality of ground pins adjacent to the plurality of signal pins configured to provide a ground. At least one signal pin of the plurality of signal pins extends closer to the edge of the substrate than at least one ground pin of the plurality of ground pins.

The invention relates to the technical field of wireless communication and national security and protection, in particular to a low-altitude detection radar circuit board made of a PPO material and a preparation method thereof, and the circuit board comprises a PPO substrate layer, a metal circuit layer, an electromagnetic shielding layer, a heat dissipation enhancement layer and a solder mask protection layer. A chemical copper plating combination layer is arranged between the PPO base material layer and the metal circuit layer, and an electromagnetic shielding layer is clamped between the PPO base material layer and the heat dissipation enhancement layer; and the solder mask protection layer covers the surface of the metal circuit layer. Through the improvement of the structural design and the preparation process, the high temperature resistance is remarkably improved, the dielectric property is optimized, the signal transmission efficiency is improved, and the damp-heat aging resistance is enhanced.

Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.

A characteristic impedance control structure includes a first and a second transmission line, a ground pattern and a ground component. The first transmission line and the ground pattern extend along a plane. The ground pattern is spaced from the first transmission line by a first distance. The second transmission line extends along a direction and electrically connects to the first transmission line. An angle between the direction and the plane is greater than zero. The second transmission line has an outer diameter. The ground component extends along the direction and is electrically connected to the ground pattern. The ground component is next to and spaced from the second transmission line by a second distance. The ground component has a length along the direction. The first distance is less than or equal to twice the length. The second distance is less than or equal to five times the outer diameter.

An electrical component includes at least one conducting trace configured for conducting radiofrequency (RF) signals. The at least one conducting trace has a broadband conductive material applied onto one or more specific locations along the at least one conducting trace. In certain embodiments, the one or more specific locations are locations detected or anticipated to have surface roughness. In certain embodiments, the presence of the broadband conductive material improves the signal integrity of RF signals conducted along the conducting trace (compared to if the broadband conductive material was not present). Certain embodiments provide methods for fabricating such electrical components.

The invention provides a printed circuit board structure and a manufacturing method thereof, and relates to the technical field of printed circuit boards, and the printed circuit board structure comprises a dielectric substrate, a signal transmission layer and a reference ground layer. A differential signal transmission pair is arranged in the structure and comprises two signal via holes used for transmitting differential signals between layers. A plurality of guard holes are symmetrically arranged around each signal via hole, and the center-to-center distance between two via holes in the same differential pair is equal to the outer diameter of a single via hole. Anti-bonding pads are arranged on the reference ground layer and correspond to the signal via holes, and projection areas of the anti-bonding pads on the signal transmission layer completely surround the via holes and guard holes of the via holes. According to the scheme, by setting the specific proportion of the distance between the via holes and the diameter and combining the collaborative design of the symmetrical guard holes and the surrounding anti-bonding pad, the electromagnetic characteristics of the via hole area are systematically optimized, so that the problem of discontinuous impedance in high-speed signal transmission is effectively solved on the premise that the cost is not obviously increased, and the signal integrity is improved.

A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

A frequency divider is disposed on a circuit board and includes a first coupling unit, a second coupling unit, a third coupling unit, a long loop unit, a short loop unit, and at least one ground plane. The first coupling unit and the second coupling unit couple the long loop unit, the first coupling unit and the third coupling unit couple the short loop unit, each of the first coupling unit, the second coupling unit, the third coupling unit, the long loop unit, and the short loop unit includes at least one signal via and is located on at least two conductive layers, and the at least one ground plane is located on another conductive layer of the circuit board. Thus, layout area can be saved. The present disclosure also relates to a circuit element.

Provided are a high-frequency multilayer printed circuit board, a millimeter-wave radar, and an antenna, which have excellent adhesion to an adhesive layer having low dielectric properties, can be laminated on a printed wiring board comprising an insulating layer formed from an epoxy glass cloth laminate, and have low transmission loss. The problem can be solved by a multilayer printed circuit board for high frequency, which is obtained by forming a multilayer printed circuit board for high frequency on one surface of a printed wiring board (P2) that is provided with at least an insulating layer formed from an epoxy glass cloth laminate, a printed wiring board (P1) in which a resin composition comprising a polyarylene sulfide resin (A) and a thermoplastic resin (B) other than a polyarylene sulfide resin having a glass transition temperature of 140 DEG C or higher or a melting point of 230 DEG C or higher is used as a low dielectric material insulating layer is laminated with an adhesive layer that is a thermosetting resin layer containing a styrene elastomer and has low dielectric properties therebetween.

The invention provides a circuit board structure. The circuit board structure comprises a substrate, a first coaxial via hole, a second coaxial via hole and a plurality of grounding via holes, the substrate has a first surface and a second surface opposite to the first surface. The first coaxial via hole and the second coaxial via hole are arranged in the substrate, and the impedance of the first coaxial via hole and the impedance of the second coaxial via hole are respectively smaller than 50 ohms. The plurality of grounding through holes are arranged around the first coaxial via hole and the second coaxial via hole. The first coaxial via and the second coaxial via are configured to transmit a signal having a frequency in a range of 50 GHz to 68 GHz.

The invention discloses a vertical transition interconnection structure for integrating a phased-array antenna. The vertical transition interconnection structure comprises a laminated structure and a plurality of quasi-coaxial structures arranged in the laminated structure, the laminated structure comprises an upper structure and a lower structure, and each of the upper structure and the lower structure comprises multiple layers of microstrip plates; the upper structure and the lower structure are connected through a BGA solder ball; each quasi-coaxial structure comprises a signal blind hole and a plurality of grounding through holes arranged around the signal blind hole, and the signal blind holes and the grounding through holes vertically penetrate through the multiple layers of microstrip plates in the upper structure or the lower structure; in the upper structure or the lower structure, two adjacent signal blind holes are connected through a strip-shaped transmission line. The vertical transition interconnection structure provided by the invention is small in size, easy to integrate and low in cost, is suitable for an application scene of high-density three-dimensional stacking in an integrated phased array, and has the transmission characteristics of wide band and low loss.

In embodiments of the present disclosure, an electronic device may be provided. The electronic device may comprise a conductive portion forming at least a portion of a side of the electronic device; wireless communication circuitry; a printed circuit board (PCB) including a plurality of layers, on which the wireless communication circuitry is disposed; a radio frequency (RF) line structure disposed in the PCB and electrically connected to the wireless communication circuitry; and a contact member disposed on the PCB to electrically connect the RF line structure and the conductive portion. The RF line structure may include a first conductive line disposed on a first layer of the plurality of layers of the PCB, a second conductive line disposed on a second layer of the plurality of layers of the PCB, a first conductive via penetrating between the first layer and the second layer and coupled to a first portion of the first conductive line and a second portion of the second conductive line, and a second conductive via penetrating between the first layer and the second layer and coupled to a third portion of the first conductive line and a fourth portion of the second conductive line.

A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing face. The differential pair unit includes two signal via holes, each signal via hole passes through the plurality of layer structures, and an anti-pad corresponding to each signal via hole is disposed on a ground layer through which the signal via hole passes. A part of metal of a ground layer is spaced between two anti-pads. Each signal corresponds to one anti-pad, and a ground layer is spaced between anti-pads.

A printed circuit board comprising a primary dielectric layer disposed underneath a microstrip trace and a secondary dielectric layer disposed above portions of the primary dielectric layer and the microstrip trace. The printed circuit board also includes a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded.