Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Radio frequency IC device and electronic apparatus

a radio frequency ic device and electronic device technology, applied in the direction of high frequency circuit adaptations, instruments, antenna earthings, etc., can solve the problems of increasing the number of manufacturing processes required to produce the rfid tag, increasing the manufacturing cost and the size of the rfid tag, and achieve the effect of easy impedance matching

Inactive Publication Date: 2009-01-22
MURATA MFG CO LTD
View PDF10 Cites 104 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]To overcome the problems described above, preferred embodiments of the present invention provide a small radio frequency IC device capable of easily achieving impedance matching without using a dedicated antenna and an electronic apparatus including the radio frequency IC device.
[0010]In the radio frequency IC device according to the first preferred embodiment, a radio frequency IC chip or a power supply circuit board is preferably coupled to an electrode arranged at a circuit board, for example, a ground electrode via a loop electrode. The electrode arranged on the circuit board functions as a radiation plate (an antenna) for the radio frequency IC chip. That is, the electrode receives a signal, and the radio frequency IC chip receives the signal from the electrode via the loop electrode and is operated by the received signal. A response signal output from the radio frequency IC chip is transmitted to the electrode via the loop electrode, and is then emitted from the electrode to the outside. Accordingly, a dedicated antenna is not required, and a space is not required for the dedicated antenna. The loop electrode can perform the impedance matching between the radio frequency IC chip and the electrode. Accordingly, a matching section is not necessarily required. Therefore, the efficiency of signal transmission between the radio frequency IC chip and the electrode is improved.
[0011]In a radio frequency IC device according to the second preferred embodiment, a power supply circuit board is disposed between a radio frequency IC, for example, a radio frequency IC chip and a loop electrode. This power supply circuit board includes a resonance circuit including an inductance element and / or a matching circuit. A frequency to be used is set by the resonance circuit and / or the matching circuit. If the radio frequency IC chip is changed in accordance with a frequency used by an RFID system, only a change in design of the resonance circuit and / or the matching circuit is required. It is not necessary to change the shape, size, and / or location of a radiation plate (electrode) or the state of coupling between the loop electrode and the electrode or the power supply circuit board. The resonance circuit and / or the matching circuit can also function to achieve the impedance matching between the radio frequency IC chip and the electrode. Accordingly, the efficiency of signal transmission between the radio frequency IC chip and the electrode is improved.

Problems solved by technology

However, the number of manufacturing processes required to produce the RFID tag is increased in order to prepare the dedicated antenna, and a space is required for the dedicated antenna.
This leads to increases in the manufacturing cost and size of the RFID tag.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radio frequency IC device and electronic apparatus
  • Radio frequency IC device and electronic apparatus
  • Radio frequency IC device and electronic apparatus

Examples

Experimental program
Comparison scheme
Effect test

first preferred embodiment

[0044]FIGS. 1A and 1B are diagrams illustrating a radio frequency IC device according to the first preferred embodiment of the present invention. This radio frequency IC device includes a radio frequency IC chip 5 arranged to process a transmitted / received signal of a predetermined frequency, a printed circuit board 20 on which the radio frequency IC chip 5 is mounted, and a ground electrode 21 and a loop electrode 22 which are arranged on the printed circuit board 20. Each of the ground electrode 21 and the loop electrode 22 is formed on the main surface of the printed circuit board 20 preferably by applying coating of conductive paste thereto or by etching metal foil on the printed circuit board 20.

[0045]The radio frequency IC chip 5 includes a clock circuit, a logic circuit, and a memory circuit, and stores necessary information. As illustrated in FIG. 2, input-output terminal electrodes 6 and mounting terminal electrodes 7 are provided on the undersurface of the radio frequency ...

second preferred embodiment

[0050]FIGS. 3A and 3B are diagrams illustrating a radio frequency IC device according to the second preferred embodiment of the present invention. This radio frequency IC device is substantially the same as a radio frequency IC device according to the first preferred embodiment. The ground electrode 21 and the loop electrode 22 are disposed on the bottom surface of the printed circuit board 20. Connection electrodes 24a to 24d are provided on the surface of the printed circuit board 20. The connection electrodes 24a and 24b are electrically connected through a via-hole conductor 23 to one end of the loop electrode 22 and the other end of the loop electrode 22, respectively. The connection electrodes 24a to 24d correspond to the connection electrodes 22a to 22d illustrated in FIGS. 1A and 1B. One of the input-output terminal electrodes 6 (see FIG. 2) is preferably electrically connected to the connection electrode 24a via the metal bump 8, for example, and the other one of the input-...

third preferred embodiment

[0052]FIGS. 4A to 4C are diagrams illustrating a radio frequency IC device according to the third preferred embodiment of the present invention. In this radio frequency IC device, a loop electrode 25 includes connection electrodes 25a and 25b disposed on the surface of the printed circuit board 20, via-hole conductors 28, and an internal electrode 29. The loop electrode 25 is coupled to the ground electrode 21 disposed on the bottom surface of the printed circuit board 20 by electric field coupling. The connection electrodes 25a and 25b are preferably electrically connected via the metal bump 8 to the terminal electrodes 6 (see, FIG. 2). Connection electrodes 25c and 25d are electrically connected via the metal bump 8 to the terminal electrodes 7 (see, FIG. 2).

[0053]The loop electrode 25 is arranged near the ground electrode 21 in the vertical direction, and is coupled to the ground electrode 21 by electric field coupling. That is, a magnetic flux is generated from the loop electrod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted / received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and / or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to radio frequency IC devices, and, more particularly, to a radio frequency IC device including a radio frequency IC chip used in an RFID (Radio Frequency Identification) system and an electronic apparatus including the radio frequency IC device.[0003]2. Description of the Related Art[0004]Recently, an RFID system has been developed as a product management system in which a reader / writer arranged to generate an induction field communicates with an IC chip (hereinafter also referred to as an IC tag or a radio frequency IC chip) attached to a product or a case in a non-contact manner so as to obtain predetermined information stored in the IC chip.[0005]Japanese Unexamined Patent Application Publication (Translation of PCT Application) No. 11-515094 discloses an RFID tag including an IC chip mounted on the main surface of a printed circuit board and an antenna provided in the printed circuit b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04Q5/22
CPCG06K19/07749G06K19/0775H01Q1/2225H01Q1/38H01Q1/48H01Q7/00H01L2224/16225H05K1/0239H05K1/0243H05K1/141H05K1/16H05K2201/10098H01L2224/16227H04Q2213/13095
Inventor KATAYA, TAKESHIKATO, NOBORUISHINO, SATOSHIIKEMOTO, NOBUOKIMURA, IKUHEIDOKAI, YUYA
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com